WO2008042520B1 - Probe array wafer - Google Patents

Probe array wafer

Info

Publication number
WO2008042520B1
WO2008042520B1 PCT/US2007/076841 US2007076841W WO2008042520B1 WO 2008042520 B1 WO2008042520 B1 WO 2008042520B1 US 2007076841 W US2007076841 W US 2007076841W WO 2008042520 B1 WO2008042520 B1 WO 2008042520B1
Authority
WO
WIPO (PCT)
Prior art keywords
probes
row
probe assembly
compliant
set forth
Prior art date
Application number
PCT/US2007/076841
Other languages
French (fr)
Other versions
WO2008042520A2 (en
WO2008042520A9 (en
WO2008042520A3 (en
Inventor
Eric L Bogatin
David W Henry
Donald A Marx
Original Assignee
Interconnect Devices Inc
Eric L Bogatin
David W Henry
Donald A Marx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interconnect Devices Inc, Eric L Bogatin, David W Henry, Donald A Marx filed Critical Interconnect Devices Inc
Publication of WO2008042520A2 publication Critical patent/WO2008042520A2/en
Publication of WO2008042520A3 publication Critical patent/WO2008042520A3/en
Publication of WO2008042520A9 publication Critical patent/WO2008042520A9/en
Publication of WO2008042520B1 publication Critical patent/WO2008042520B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Abstract

A probe array wafer (20) includes a substrate (24) upon which a plurality of compliant probes (22, 28, 30) are mounted. Pairs of axially aligned probes (28) may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes (28) may be electrically connected together to probe a ground connection from the test equipment to the device under test.

Claims

AMENDED CLAIMS received by the International Bureau on 25 August 2008
1. An electrical probe assembly comprising ; an insulating substrate; and a plurality of compliant probes secured to said insulating substrate and arranged in two generally aligned rows, each of said probes having a tip extending beyond an edge of said insulating substrate, wherein at least a portion of one of said probes is in contact with a conductive element, wherein said conductive element is integral with said insulating substrate; said tips of said plurality of compliant probes in said first row for contacting a test fixture, said tips of said plurality of compliant probes in said second row for contacting one or more devices undeT test, whereas select ones of said plurality of probes in said first row are connected to select ones of said probes in said second row.
2. The electrical probe assembly as set forth in claim 1 wherein said plurality of probes are compliant spring probes.
3. The electrical probe assembly as set forth in claim 1 further comprising a housing adapted to receive and secure a plurality of said substrates in an aligned and spaced apart relationship.
4. The electrical probe assembly as set forth in claim 4 further comprising a pair of end caps fastened to said housing, each of said end caps having a plurality of spaced apart apertures axially aligned with said plurality of compliant probes extending from said substrates, said apertures adapted to receive said compliant probe tips therethrough.
5. The electrical probe assembly as set forth in claim 1 wherein said insulating substrate includes a plurality of spaced apart grooves each adapted to receive one of said compliant probes,
6. The electrical probe assembly as set forth in claim 1 wherein said insulating substrate includes two or more conducting layers.
7. The electrical probe assembly as set forth in claim 1 further comprising a passive electronic filter mounted to said substrate and in communication between one or more probes in said first row and one or more probes in said second row.
8. The electrical probe assembly as set forth in claim 1 further comprising an active electronic filter mounted to said substrate and in communication between one or more probes in said first row and one or more probes in said second row.
9. The electrical probe assembly as set forth in claim 1 further comprising a microprocessor mounted to said substrate and in communication between one or more probes of said first row and one or more probes of said second row.
10. The electrical probe assembly as set forth in claim 1 further comprising active and passive electronic components mounted to said substrate and in communication between one or more probes of said first row and one or more probes of said second row.
11. An electrical probe assembly, comprising: a housing having open ends, a plurality of insulating substrates mounted in said housing, a plurality of compliant probes secured to each of said insulating substrates and arranged in two generally aligned rows, each of said probes having a tip extending beyond an edge of said insulating substrate, said tips of said plurality of compliant probes in said first row for contacting a test fixture, said tips of said plurality of compliant probes in said second row for contacting one or more devices under test, and a pair of end caps fastened to said open ends of said housing, each of said end caps having a plurality of apertures in axial alignment with said probe tips, whereas select ones of said plurality of probes in said first row are connected to select ones of said probes in said second row, and whereas said probe tips extend through said apertures of said end caps.
12. The electrical probe assembly as set forth in claim 11 wherein said plurality of probes are compliant spring probes.
13. The electrical probe assembly as set forth in claim 11 wherein said each of said plurality of insulating substrates includes a plurality of spaced apart grooves each adapted to receive one of said compliant probes.
14. The electrical probe assembly as set forth in claim 11 wherein each of said insulating substrates includes one or more conducting layers.
15. The electrical probe assembly as set forth in claim 11 further comprising a passive electronic filter mounted to said substrate and in communication between one or more probes in said first row and one or more probes in said second row.
16. The electrical probe assembly as set forth in claim 11 further comprising an active electronic filter mounted to said substrate and in communication between one or more probes in said first row and one or more probes in said second row.
17. The electrical probe assembly as set forth in claim 11 further comprising a microprocessor mounted to said substrate and in communication between one or more probes of said first TOW and one or more probes of said second row.
18. The electrical probe assembly as set forth in claim 11 further comprising active and passive electronic components mounted to said substrate and in communication between one or more probes of said first row and one or more probes of said second row.
19. An electrical probe assembly comprising: an insulating substrate; a plurality of compliant probes secured to said insulating substrate and arranged in two generally aligned rows, each of said probes having a tip extending beyond an edge of said insulating substrate; said tips of said plurality of compliant probes in said first row for contacting a test fixture, said tips of said plurality of compliant probes in said second row for contacting one or more devices under test, whereas select ones of said plurality of probes in said first row are connected to select ones of said probes in said second row; a housing adapted to receive and secure a plurality of said substrates in an aligned and spaced apart relationship; and a pair of end caps fastened to said housing, each of said end caps having a plurality of spaced apart apertures axially aligned with said plurality of compliant probes extending from said substrates, said apertures adapted to receive said compliant probe tips therethrough.
PCT/US2007/076841 2006-08-25 2007-08-27 Probe array wafer WO2008042520A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/511,061 2006-08-25
US11/511,061 US7498826B2 (en) 2006-08-25 2006-08-25 Probe array wafer

Publications (4)

Publication Number Publication Date
WO2008042520A2 WO2008042520A2 (en) 2008-04-10
WO2008042520A3 WO2008042520A3 (en) 2008-08-07
WO2008042520A9 WO2008042520A9 (en) 2008-09-18
WO2008042520B1 true WO2008042520B1 (en) 2008-10-30

Family

ID=39187916

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/076841 WO2008042520A2 (en) 2006-08-25 2007-08-27 Probe array wafer

Country Status (2)

Country Link
US (1) US7498826B2 (en)
WO (1) WO2008042520A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008006130A1 (en) * 2008-01-25 2009-07-30 Atg Luther & Maelzer Gmbh Module for a parallel tester for testing printed circuit boards
EP2572207B1 (en) * 2010-05-21 2020-07-15 University Of Virginia Patent Foundation Micromachined on-wafer probes and related method
KR101136534B1 (en) * 2010-09-07 2012-04-17 한국기계연구원 Probe card and manufacturing method thereof
US8506307B2 (en) 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
CN109085434A (en) * 2016-07-08 2018-12-25 蓝龙飞 A kind of electric system detection communication system

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US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
US5276395A (en) * 1979-08-13 1994-01-04 Malloy James T Bed-of-pins test fixture
US4506215A (en) * 1981-06-30 1985-03-19 International Business Machines Corporation Modular test probe
DK291184D0 (en) * 1984-06-13 1984-06-13 Boeegh Petersen Allan METHOD AND DEVICE FOR TESTING CIRCUIT PLATES
US4780670A (en) * 1985-03-04 1988-10-25 Xerox Corporation Active probe card for high resolution/low noise wafer level testing
DE3638372A1 (en) * 1986-11-11 1988-05-26 Lang Dahlke Helmut DEVICE FOR TESTING ELECTRICAL BOARDS
US4931726A (en) * 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
US4862075A (en) * 1988-09-01 1989-08-29 Photon Dynamics, Inc. High frequency test head using electro-optics
US4993968A (en) * 1989-03-02 1991-02-19 Precision Interconnect Corporation Economical connector system for an array of conductors
US4993969A (en) * 1989-07-11 1991-02-19 Precision Interconnect Corporation Electrical connector assembly
US5160269A (en) * 1991-12-19 1992-11-03 Precision Interconnect Corporation Hydrostatic connector for flex circuits
JPH0653277A (en) * 1992-06-04 1994-02-25 Lsi Logic Corp Semiconductor device assembly and its assembly method
US5818248A (en) * 1996-07-29 1998-10-06 Delaware Capital Formation, Inc Loaded board test fixture with integral translator fixture for testing closely spaced test sites
US6359452B1 (en) * 1998-07-22 2002-03-19 Nortel Networks Limited Method and apparatus for testing an electronic assembly
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6265886B1 (en) * 1999-07-12 2001-07-24 Micron Technology, Inc. Conductive bump array contactors having an ejector and methods of testing using same
US6570399B2 (en) * 2000-05-18 2003-05-27 Qa Technology Company, Inc. Test probe and separable mating connector assembly
US6570339B1 (en) * 2001-12-19 2003-05-27 Chad Byron Moore Color fiber-based plasma display
US6902416B2 (en) * 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6878016B2 (en) * 2002-12-12 2005-04-12 Symbol Technologies, Inc. High cycle connector contact system

Also Published As

Publication number Publication date
WO2008042520A2 (en) 2008-04-10
US20080068034A1 (en) 2008-03-20
WO2008042520A9 (en) 2008-09-18
WO2008042520A3 (en) 2008-08-07
US7498826B2 (en) 2009-03-03

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