WO2008046754A3 - Mechanical stopper and method for transporting substrates in automatic placement machines - Google Patents

Mechanical stopper and method for transporting substrates in automatic placement machines Download PDF

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Publication number
WO2008046754A3
WO2008046754A3 PCT/EP2007/060644 EP2007060644W WO2008046754A3 WO 2008046754 A3 WO2008046754 A3 WO 2008046754A3 EP 2007060644 W EP2007060644 W EP 2007060644W WO 2008046754 A3 WO2008046754 A3 WO 2008046754A3
Authority
WO
WIPO (PCT)
Prior art keywords
transport
mechanical stopper
automatic placement
transporting substrates
substrates
Prior art date
Application number
PCT/EP2007/060644
Other languages
German (de)
French (fr)
Other versions
WO2008046754A2 (en
Inventor
Robert Conrad
Mohammad Mehdianpour
Werner Pfaffenberger
Stefan Dietrich
Hans Juergen Mayer
Bernd Zimmermann
Original Assignee
Siemens Ag
Robert Conrad
Mohammad Mehdianpour
Werner Pfaffenberger
Stefan Dietrich
Hans Juergen Mayer
Bernd Zimmermann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Robert Conrad, Mohammad Mehdianpour, Werner Pfaffenberger, Stefan Dietrich, Hans Juergen Mayer, Bernd Zimmermann filed Critical Siemens Ag
Publication of WO2008046754A2 publication Critical patent/WO2008046754A2/en
Publication of WO2008046754A3 publication Critical patent/WO2008046754A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Abstract

The invention relates to a substrate transport device (100), comprising a transport device (2) for transporting substrates (1, 32) in a direction of transport (x) of a transport plane (x-y) to a placement area (6) of a placement head (20), and at least one mechanical stopper (10, 30, 40) that has a protrusion (43) and can be displaced between a first position (P1) and a second position (P2). The invention is characterized in that the protrusion (43) stops the transport of the substrates (1, 32) in the first position (P1) and allows the transport of the substrates (1, 32) in the second position (P2), wherein the second position (P2) of the protrusion (43) relative to the transport plane (x-y) is located on the side of the placement head (20) and the first position (P1) can be adjusted to different distances from the transport plane (x-y).
PCT/EP2007/060644 2006-10-19 2007-10-08 Mechanical stopper and method for transporting substrates in automatic placement machines WO2008046754A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006049295.1 2006-10-19
DE102006049295 2006-10-19

Publications (2)

Publication Number Publication Date
WO2008046754A2 WO2008046754A2 (en) 2008-04-24
WO2008046754A3 true WO2008046754A3 (en) 2008-06-12

Family

ID=39203100

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/060644 WO2008046754A2 (en) 2006-10-19 2007-10-08 Mechanical stopper and method for transporting substrates in automatic placement machines

Country Status (1)

Country Link
WO (1) WO2008046754A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164197A (en) * 1992-11-27 1994-06-10 Matsushita Electric Ind Co Ltd Printed board positioning device
US6453548B1 (en) * 1998-07-03 2002-09-24 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
US20060191131A1 (en) * 2003-12-26 2006-08-31 Yasuo Takanami Electronic part mounting apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06164197A (en) * 1992-11-27 1994-06-10 Matsushita Electric Ind Co Ltd Printed board positioning device
US6453548B1 (en) * 1998-07-03 2002-09-24 Matsushita Electric Industrial Co., Ltd. Electronic component mounting method
US20060191131A1 (en) * 2003-12-26 2006-08-31 Yasuo Takanami Electronic part mounting apparatus

Also Published As

Publication number Publication date
WO2008046754A2 (en) 2008-04-24

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