WO2008054785A3 - Ball grid array resonator - Google Patents

Ball grid array resonator Download PDF

Info

Publication number
WO2008054785A3
WO2008054785A3 PCT/US2007/022999 US2007022999W WO2008054785A3 WO 2008054785 A3 WO2008054785 A3 WO 2008054785A3 US 2007022999 W US2007022999 W US 2007022999W WO 2008054785 A3 WO2008054785 A3 WO 2008054785A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive
grid array
ball grid
strips
Prior art date
Application number
PCT/US2007/022999
Other languages
French (fr)
Other versions
WO2008054785A8 (en
WO2008054785A2 (en
Inventor
Thomas Knecht
Original Assignee
Cts Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cts Corp filed Critical Cts Corp
Priority to CN2007900001188U priority Critical patent/CN201436697U/en
Publication of WO2008054785A2 publication Critical patent/WO2008054785A2/en
Publication of WO2008054785A3 publication Critical patent/WO2008054785A3/en
Publication of WO2008054785A8 publication Critical patent/WO2008054785A8/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00Resonators of the waveguide type
    • H01P7/08Strip line resonators
    • H01P7/082Microstripline resonators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001Internal layers
    • H01L2224/05005Structure
    • H01L2224/05009Bonding area integrally formed with a via connection of the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0556Disposition
    • H01L2224/05568Disposition the whole external layer protruding from the surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A ball grid array ceramic resonator (320) including a substrate (322) having one or more strips of conductive material (342) on opposed first and second surfaces of the substrate. One or more conductive vias (336) extend through the substrate and define termination ends in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres/balls (396) defining respective ground pads are disposed over the ends of said vias terminating in said one or more strips of conductive material on said first or second surface and another conductive sphere is disposed over one of the strips of conductive material to define an RF signal input pad (398).
PCT/US2007/022999 2006-11-02 2007-10-31 Ball grid array resonator WO2008054785A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007900001188U CN201436697U (en) 2006-11-02 2007-10-31 Ball grid array resonator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85606406P 2006-11-02 2006-11-02
US60/856,064 2006-11-02

Publications (3)

Publication Number Publication Date
WO2008054785A2 WO2008054785A2 (en) 2008-05-08
WO2008054785A3 true WO2008054785A3 (en) 2008-10-02
WO2008054785A8 WO2008054785A8 (en) 2009-07-30

Family

ID=39322358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/022999 WO2008054785A2 (en) 2006-11-02 2007-10-31 Ball grid array resonator

Country Status (3)

Country Link
US (1) US7940148B2 (en)
CN (1) CN201436697U (en)
WO (1) WO2008054785A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008063507A2 (en) * 2006-11-17 2008-05-29 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
JP5703917B2 (en) * 2011-04-08 2015-04-22 宇部興産株式会社 Dielectric resonant component
US9000851B1 (en) * 2011-07-14 2015-04-07 Hittite Microwave Corporation Cavity resonators integrated on MMIC and oscillators incorporating the same
US9123983B1 (en) 2012-07-20 2015-09-01 Hittite Microwave Corporation Tunable bandpass filter integrated circuit
CN104779952B (en) * 2015-04-22 2017-09-29 西南应用磁学研究所 Planar integration YIG frequency synthesizer architectures

Citations (3)

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EP0675539A2 (en) * 1994-03-30 1995-10-04 Plessey Semiconductors Limited Ball grid package with integrated passive circuit elements
WO1999041799A1 (en) * 1998-02-17 1999-08-19 Itron, Inc. Laser tunable thick film microwave resonator for printed circuit boards
US6127906A (en) * 1999-02-25 2000-10-03 Thin Film Technology Corp. Modular thin film distributed filter

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US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same
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US4963843A (en) * 1988-10-31 1990-10-16 Motorola, Inc. Stripline filter with combline resonators
US4940955A (en) * 1989-01-03 1990-07-10 Motorola, Inc. Temperature compensated stripline structure
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0675539A2 (en) * 1994-03-30 1995-10-04 Plessey Semiconductors Limited Ball grid package with integrated passive circuit elements
WO1999041799A1 (en) * 1998-02-17 1999-08-19 Itron, Inc. Laser tunable thick film microwave resonator for printed circuit boards
US6127906A (en) * 1999-02-25 2000-10-03 Thin Film Technology Corp. Modular thin film distributed filter

Also Published As

Publication number Publication date
US7940148B2 (en) 2011-05-10
US20080106356A1 (en) 2008-05-08
WO2008054785A8 (en) 2009-07-30
CN201436697U (en) 2010-04-07
WO2008054785A2 (en) 2008-05-08

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