WO2008054785A3 - Ball grid array resonator - Google Patents
Ball grid array resonator Download PDFInfo
- Publication number
- WO2008054785A3 WO2008054785A3 PCT/US2007/022999 US2007022999W WO2008054785A3 WO 2008054785 A3 WO2008054785 A3 WO 2008054785A3 US 2007022999 W US2007022999 W US 2007022999W WO 2008054785 A3 WO2008054785 A3 WO 2008054785A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- conductive
- grid array
- ball grid
- strips
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/08—Strip line resonators
- H01P7/082—Microstripline resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05005—Structure
- H01L2224/05009—Bonding area integrally formed with a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Abstract
A ball grid array ceramic resonator (320) including a substrate (322) having one or more strips of conductive material (342) on opposed first and second surfaces of the substrate. One or more conductive vias (336) extend through the substrate and define termination ends in the respective substrate surfaces. In one embodiment, a plurality of conductive spheres/balls (396) defining respective ground pads are disposed over the ends of said vias terminating in said one or more strips of conductive material on said first or second surface and another conductive sphere is disposed over one of the strips of conductive material to define an RF signal input pad (398).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007900001188U CN201436697U (en) | 2006-11-02 | 2007-10-31 | Ball grid array resonator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85606406P | 2006-11-02 | 2006-11-02 | |
US60/856,064 | 2006-11-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2008054785A2 WO2008054785A2 (en) | 2008-05-08 |
WO2008054785A3 true WO2008054785A3 (en) | 2008-10-02 |
WO2008054785A8 WO2008054785A8 (en) | 2009-07-30 |
Family
ID=39322358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/022999 WO2008054785A2 (en) | 2006-11-02 | 2007-10-31 | Ball grid array resonator |
Country Status (3)
Country | Link |
---|---|
US (1) | US7940148B2 (en) |
CN (1) | CN201436697U (en) |
WO (1) | WO2008054785A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008063507A2 (en) * | 2006-11-17 | 2008-05-29 | Cts Corporation | Voltage controlled oscillator module with ball grid array resonator |
JP5703917B2 (en) * | 2011-04-08 | 2015-04-22 | 宇部興産株式会社 | Dielectric resonant component |
US9000851B1 (en) * | 2011-07-14 | 2015-04-07 | Hittite Microwave Corporation | Cavity resonators integrated on MMIC and oscillators incorporating the same |
US9123983B1 (en) | 2012-07-20 | 2015-09-01 | Hittite Microwave Corporation | Tunable bandpass filter integrated circuit |
CN104779952B (en) * | 2015-04-22 | 2017-09-29 | 西南应用磁学研究所 | Planar integration YIG frequency synthesizer architectures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0675539A2 (en) * | 1994-03-30 | 1995-10-04 | Plessey Semiconductors Limited | Ball grid package with integrated passive circuit elements |
WO1999041799A1 (en) * | 1998-02-17 | 1999-08-19 | Itron, Inc. | Laser tunable thick film microwave resonator for printed circuit boards |
US6127906A (en) * | 1999-02-25 | 2000-10-03 | Thin Film Technology Corp. | Modular thin film distributed filter |
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US4431977A (en) * | 1982-02-16 | 1984-02-14 | Motorola, Inc. | Ceramic bandpass filter |
US4551696A (en) * | 1983-12-16 | 1985-11-05 | Motorola, Inc. | Narrow bandwidth microstrip filter |
US4609892A (en) * | 1985-09-30 | 1986-09-02 | Motorola, Inc. | Stripline filter apparatus and method of making the same |
US4785271A (en) * | 1987-11-24 | 1988-11-15 | Motorola, Inc. | Stripline filter with improved resonator structure |
US4963843A (en) * | 1988-10-31 | 1990-10-16 | Motorola, Inc. | Stripline filter with combline resonators |
US4940955A (en) * | 1989-01-03 | 1990-07-10 | Motorola, Inc. | Temperature compensated stripline structure |
US5057803A (en) * | 1990-08-01 | 1991-10-15 | Motorola, Inc. | Stripline split ring resonator bandpass filter |
US5153542A (en) * | 1991-06-05 | 1992-10-06 | Motorola Inc. | Multidielectric microstrip filter |
US5160906A (en) * | 1991-06-24 | 1992-11-03 | Motorola, Inc. | Microstripe filter having edge flared structures |
FI88440C (en) * | 1991-06-25 | 1993-05-10 | Lk Products Oy | Ceramic filter |
US5160905A (en) * | 1991-07-22 | 1992-11-03 | Motorola, Inc. | High dielectric micro-trough line filter |
JPH05315807A (en) * | 1992-05-08 | 1993-11-26 | Oki Electric Ind Co Ltd | Strip line filter and antenna multicoupler using the filter |
JP3356312B2 (en) * | 1992-10-08 | 2002-12-16 | 株式会社村田製作所 | Stripline filter |
US5357218A (en) * | 1993-05-03 | 1994-10-18 | Motorola, Inc. | Self-shielding microstrip assembly |
US5487211A (en) * | 1993-08-19 | 1996-01-30 | Motorola, Inc. | Method for fabricating a surface-mountable crystal resonator |
US5416454A (en) * | 1994-03-31 | 1995-05-16 | Motorola, Inc. | Stripline filter with a high side transmission zero |
US5642265A (en) * | 1994-11-29 | 1997-06-24 | Sgs-Thomson Microelectronics, Inc. | Ball grid array package with detachable module |
DK0718906T3 (en) * | 1994-12-22 | 1999-11-01 | Siemens Matsushita Components | Micro Strip Filter |
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US5977863A (en) * | 1998-08-10 | 1999-11-02 | Cts Corporation | Low cross talk ball grid array resistor network |
DE19837266A1 (en) * | 1998-08-17 | 2000-02-24 | Philips Corp Intellectual Pty | Dielectric resonator antenna |
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US6329890B1 (en) * | 1999-02-25 | 2001-12-11 | Thin Film Technology Corp. | Modular thin film distributed filter |
US6218729B1 (en) * | 1999-03-11 | 2001-04-17 | Atmel Corporation | Apparatus and method for an integrated circuit having high Q reactive components |
US6194979B1 (en) * | 1999-03-18 | 2001-02-27 | Cts Corporation | Ball grid array R-C network with high density |
US6362525B1 (en) * | 1999-11-09 | 2002-03-26 | Cypress Semiconductor Corp. | Circuit structure including a passive element formed within a grid array substrate and method for making the same |
JP3610861B2 (en) * | 2000-01-31 | 2005-01-19 | 三菱電機株式会社 | Low pass filter |
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JP3649183B2 (en) * | 2001-12-27 | 2005-05-18 | ソニー株式会社 | Filter circuit device and manufacturing method thereof |
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US6856516B2 (en) * | 2002-08-20 | 2005-02-15 | Cts Corporation | Ball grid array resistor capacitor network |
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US6825734B2 (en) * | 2002-11-13 | 2004-11-30 | Phasor Technologies Corporation | Oscillator module incorporating spiral looped-stub resonator |
US6897761B2 (en) * | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
US6882266B2 (en) * | 2003-01-07 | 2005-04-19 | Cts Corporation | Ball grid array resistor network having a ground plane |
US6791403B1 (en) * | 2003-03-19 | 2004-09-14 | Raytheon Company | Miniature RF stripline linear phase filters |
US6946733B2 (en) * | 2003-08-13 | 2005-09-20 | Cts Corporation | Ball grid array package having testing capability after mounting |
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US7724109B2 (en) * | 2005-11-17 | 2010-05-25 | Cts Corporation | Ball grid array filter |
-
2007
- 2007-10-30 US US11/980,181 patent/US7940148B2/en not_active Expired - Fee Related
- 2007-10-31 CN CN2007900001188U patent/CN201436697U/en not_active Expired - Fee Related
- 2007-10-31 WO PCT/US2007/022999 patent/WO2008054785A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0675539A2 (en) * | 1994-03-30 | 1995-10-04 | Plessey Semiconductors Limited | Ball grid package with integrated passive circuit elements |
WO1999041799A1 (en) * | 1998-02-17 | 1999-08-19 | Itron, Inc. | Laser tunable thick film microwave resonator for printed circuit boards |
US6127906A (en) * | 1999-02-25 | 2000-10-03 | Thin Film Technology Corp. | Modular thin film distributed filter |
Also Published As
Publication number | Publication date |
---|---|
US7940148B2 (en) | 2011-05-10 |
US20080106356A1 (en) | 2008-05-08 |
WO2008054785A8 (en) | 2009-07-30 |
CN201436697U (en) | 2010-04-07 |
WO2008054785A2 (en) | 2008-05-08 |
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