WO2008080515A3 - Set for creating a process reactor for forming metallic layers on at least one substrate - Google Patents

Set for creating a process reactor for forming metallic layers on at least one substrate Download PDF

Info

Publication number
WO2008080515A3
WO2008080515A3 PCT/EP2007/010739 EP2007010739W WO2008080515A3 WO 2008080515 A3 WO2008080515 A3 WO 2008080515A3 EP 2007010739 W EP2007010739 W EP 2007010739W WO 2008080515 A3 WO2008080515 A3 WO 2008080515A3
Authority
WO
WIPO (PCT)
Prior art keywords
reactor housing
fluid
reactor
substrate
housing
Prior art date
Application number
PCT/EP2007/010739
Other languages
German (de)
French (fr)
Other versions
WO2008080515A2 (en
Inventor
Dirk Habermann
Patrik Mueller
Ernst Hartmannsgruber
Original Assignee
Rena Sondermaschinen Gmbh
Dirk Habermann
Patrik Mueller
Ernst Hartmannsgruber
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen Gmbh, Dirk Habermann, Patrik Mueller, Ernst Hartmannsgruber filed Critical Rena Sondermaschinen Gmbh
Priority to KR1020087023897A priority Critical patent/KR101133085B1/en
Priority to CN2007800179912A priority patent/CN101448983B/en
Publication of WO2008080515A2 publication Critical patent/WO2008080515A2/en
Publication of WO2008080515A3 publication Critical patent/WO2008080515A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Abstract

The invention relates to a set for creating a process reactor for forming metallic layers on at least one substrate, the layers being formed by the precipitation of metal ions contained in a fluid onto the substrates. Said set essentially comprises the following structural elements: a reactor housing (3) comprising two ends (4, 5), a fluid flowing through the reactor housing from one end to the other; a device (6) which is arranged in the region of the efflux (4) from the reactor housing (3) and is used to receive the substrate; at least one overflow (8) which is arranged in the region of the efflux (4) from the reactor housing (3) and via which the fluid (F) flowing in the direction of the substrate (2) can flow out of the reactor housing (3); a collecting tank (10) for receiving the fluid (F) flowing out via the overflow (8); means for redirecting the collected fluid into the reactor housing (3); and at least one anode. In order to obtain a largely homogeneous coating, the process reactor also optionally comprises at least one of the following structural elements: at least one flow adjusting device (S) for the targeted control of the fluid (F) inside the reactor housing (3); at least one field adjusting device (E) for the targeted control of the electrical field created inside the reactor housing (3); at least one auxiliary electrode (H) that can receive either a positive or negative potential and is arranged between the substrate (2) to be coated and the opposite end (5) of the reactor housing (3); at least one diaphragm (B) for orienting the electrical field created inside the reactor hosuing (3); at least one diaphragm (B) for orienting the flow of the fluid (F) inside the reactor housing (3); and at least one ring element (R) for reducing the inner diameter (3i) of the reactor housing (3).
PCT/EP2007/010739 2006-12-29 2007-12-10 Set for creating a process reactor for forming metallic layers on at least one substrate WO2008080515A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020087023897A KR101133085B1 (en) 2006-12-29 2007-12-10 Kit for the assembly of a process reactor for the formation of metallic layers on one or more substrates, and method of using the same
CN2007800179912A CN101448983B (en) 2006-12-29 2007-12-10 Set for creating a process reactor for forming metallic layers on at least one substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06027073A EP1939329B1 (en) 2006-12-29 2006-12-29 Kit for the manufacture of a process reactor for forming metallic layers on one or more substrate
EP06027073.3 2006-12-29

Publications (2)

Publication Number Publication Date
WO2008080515A2 WO2008080515A2 (en) 2008-07-10
WO2008080515A3 true WO2008080515A3 (en) 2008-09-12

Family

ID=38284079

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/010739 WO2008080515A2 (en) 2006-12-29 2007-12-10 Set for creating a process reactor for forming metallic layers on at least one substrate

Country Status (6)

Country Link
EP (1) EP1939329B1 (en)
KR (1) KR101133085B1 (en)
CN (1) CN101448983B (en)
AT (1) ATE509144T1 (en)
TW (1) TWI378157B (en)
WO (1) WO2008080515A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2681522A1 (en) 2011-03-03 2014-01-08 Enchroma, Inc. Multi-band color vision filters and method by lp-optimization
KR101643276B1 (en) * 2015-05-12 2016-08-02 강구일 Hydrogen gas apparatus using electrolysis
KR102639119B1 (en) * 2018-12-31 2024-02-20 엘지디스플레이 주식회사 Electroplating apparatus and electroplating method using the same
CN114341404A (en) * 2019-09-03 2022-04-12 朗姆研究公司 Low angle film frame for electroplating cell
JP7356401B2 (en) * 2020-05-12 2023-10-04 株式会社荏原製作所 Plate, plating equipment, and plate manufacturing method

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
EP1031647A2 (en) * 1999-02-19 2000-08-30 Solid State Equipment Corporation Apparatus and method for plating a wafer
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US20020056636A1 (en) * 2000-09-25 2002-05-16 Yoshihiko Toyoda Electroplating apparatus
US6391168B1 (en) * 1999-04-06 2002-05-21 Nec Corporation Plating apparatus utilizing an auxiliary electrode
US20030155231A1 (en) * 2002-02-19 2003-08-21 Chao-Fu Weng Field adjusting apparatus for an electroplating bath
EP1391540A2 (en) * 2002-08-08 2004-02-25 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
US20050051425A1 (en) * 2003-09-09 2005-03-10 Chih-Cheng Wang Electroplating apparatus with functions of voltage detection and flow rectification
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
US20050284751A1 (en) * 2004-06-28 2005-12-29 Nicolay Kovarsky Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060163058A1 (en) * 2005-01-26 2006-07-27 Kiyonori Watanabe Apparatus for plating a semiconductor wafer and plating solution bath used therein
US20060201814A1 (en) * 2005-02-25 2006-09-14 Hooman Hafezi Apparatus and method for improving uniformity in electroplating

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
EP1031647A2 (en) * 1999-02-19 2000-08-30 Solid State Equipment Corporation Apparatus and method for plating a wafer
US6391168B1 (en) * 1999-04-06 2002-05-21 Nec Corporation Plating apparatus utilizing an auxiliary electrode
US20020056636A1 (en) * 2000-09-25 2002-05-16 Yoshihiko Toyoda Electroplating apparatus
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
US20030155231A1 (en) * 2002-02-19 2003-08-21 Chao-Fu Weng Field adjusting apparatus for an electroplating bath
EP1391540A2 (en) * 2002-08-08 2004-02-25 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
US20050051425A1 (en) * 2003-09-09 2005-03-10 Chih-Cheng Wang Electroplating apparatus with functions of voltage detection and flow rectification
US20050284751A1 (en) * 2004-06-28 2005-12-29 Nicolay Kovarsky Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060163058A1 (en) * 2005-01-26 2006-07-27 Kiyonori Watanabe Apparatus for plating a semiconductor wafer and plating solution bath used therein
US20060201814A1 (en) * 2005-02-25 2006-09-14 Hooman Hafezi Apparatus and method for improving uniformity in electroplating

Also Published As

Publication number Publication date
WO2008080515A2 (en) 2008-07-10
KR101133085B1 (en) 2012-04-24
TW200842210A (en) 2008-11-01
EP1939329A1 (en) 2008-07-02
KR20080102266A (en) 2008-11-24
CN101448983B (en) 2012-11-07
CN101448983A (en) 2009-06-03
TWI378157B (en) 2012-12-01
ATE509144T1 (en) 2011-05-15
EP1939329B1 (en) 2011-05-11

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