WO2008082150A3 - Test socket for semiconductor - Google Patents

Test socket for semiconductor Download PDF

Info

Publication number
WO2008082150A3
WO2008082150A3 PCT/KR2007/006878 KR2007006878W WO2008082150A3 WO 2008082150 A3 WO2008082150 A3 WO 2008082150A3 KR 2007006878 W KR2007006878 W KR 2007006878W WO 2008082150 A3 WO2008082150 A3 WO 2008082150A3
Authority
WO
WIPO (PCT)
Prior art keywords
parts
semiconductor device
contact point
test socket
test
Prior art date
Application number
PCT/KR2007/006878
Other languages
French (fr)
Other versions
WO2008082150A2 (en
Inventor
Soo Ho Lee
Original Assignee
Soo Ho Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020070126227A external-priority patent/KR100979313B1/en
Application filed by Soo Ho Lee filed Critical Soo Ho Lee
Publication of WO2008082150A2 publication Critical patent/WO2008082150A2/en
Publication of WO2008082150A3 publication Critical patent/WO2008082150A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Abstract

The present invention relates to a test socket for a semiconductor device, which may correspond to a narrow pitch of terminal interval and high speed test in a simplified structure, thereby reducing manufacturing cost thereof. The test socket for a semiconductor device includes conductive substrates (40) having contact point parts (41) exposed at upper and lower surfaces for contacting the terminals (11) of the semiconductor device (10) and the lead terminals (21) of the test board (20), and slant parts (44) connecting the contact point parts (41) and facing each other in repetitive arrangement, and an insulating elastic element (50) filled in positions where the slant parts (44) are formed as the contact point parts (41) of the conductive substrate (40) are exposed to the outside so as to fix the conductive substrates (40).
PCT/KR2007/006878 2006-12-29 2007-12-27 Test socket for semiconductor WO2008082150A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20060138364 2006-12-29
KR10-2006-0138364 2006-12-29
KR1020070126227A KR100979313B1 (en) 2006-12-29 2007-12-06 Test socket for semiconductor
KR10-2007-0126227 2007-12-06

Publications (2)

Publication Number Publication Date
WO2008082150A2 WO2008082150A2 (en) 2008-07-10
WO2008082150A3 true WO2008082150A3 (en) 2008-09-12

Family

ID=39582976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2007/006878 WO2008082150A2 (en) 2006-12-29 2007-12-27 Test socket for semiconductor

Country Status (2)

Country Link
US (1) US7579826B2 (en)
WO (1) WO2008082150A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009045911A1 (en) * 2009-10-22 2011-04-28 Robert Bosch Gmbh Coupling device, arrangement with a coupling device, method for producing an arrangement with a coupling device
US8044673B1 (en) 2010-04-28 2011-10-25 Lajos Burgyan Method and apparatus for positioning and contacting singulated semiconductor dies
US8979564B2 (en) 2013-03-15 2015-03-17 Data I/O Corporation Socket having a pin plate with a port aligned with a dimple in a pocket of a base plate
KR101482911B1 (en) * 2014-08-01 2015-01-16 (주)메리테크 Socket for semiconductor device test
US9733304B2 (en) * 2014-09-24 2017-08-15 Micron Technology, Inc. Semiconductor device test apparatuses
KR101852862B1 (en) * 2015-12-21 2018-04-30 주식회사 이노글로벌 By-directional contact module for semiconductor test and semiconductor test socket
US9977052B2 (en) * 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
KR102361639B1 (en) * 2017-07-10 2022-02-10 삼성전자주식회사 Universal test socket, semiconductor test apparatus, and method of testing a semiconductor device
JP7239730B2 (en) * 2019-11-27 2023-03-14 蘇州▲ユン▼塚電子科技股▲フン▼有限公司 crimp electrical connectors

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010019124A1 (en) * 1998-02-25 2001-09-06 Iwao Sakamoto Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same
US20050070135A1 (en) * 2001-10-05 2005-03-31 Kiyoshi Adachi Socket and contact of semiconductor package
US20050093558A1 (en) * 1998-09-03 2005-05-05 Hembree David R. Carrier for cleaning sockets for semiconductor components having contact balls

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Publication number Priority date Publication date Assignee Title
JPS5555985U (en) * 1978-10-12 1980-04-16
US4793814A (en) * 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US5309324A (en) * 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
US5324205A (en) * 1993-03-22 1994-06-28 International Business Machines Corporation Array of pinless connectors and a carrier therefor
US5385477A (en) * 1993-07-30 1995-01-31 Ck Technologies, Inc. Contactor with elastomer encapsulated probes
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US6690186B2 (en) * 1994-07-07 2004-02-10 Tessera, Inc. Methods and structures for electronic probing arrays
US6499216B1 (en) * 1994-07-07 2002-12-31 Tessera, Inc. Methods and structures for electronic probing arrays
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US6724203B1 (en) * 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
JP2002231399A (en) * 2001-02-02 2002-08-16 Fujitsu Ltd Semiconductor device testing contact and manufacturing method therefor
TW525273B (en) * 2002-02-07 2003-03-21 Via Tech Inc Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
KR101157449B1 (en) * 2004-07-07 2012-06-22 캐스케이드 마이크로테크 인코포레이티드 Probe head having a membrane suspended probe
JP4769538B2 (en) * 2005-02-22 2011-09-07 富士通セミコンダクター株式会社 Contactor for electronic parts and contact method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010019124A1 (en) * 1998-02-25 2001-09-06 Iwao Sakamoto Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same
US20050093558A1 (en) * 1998-09-03 2005-05-05 Hembree David R. Carrier for cleaning sockets for semiconductor components having contact balls
US20050070135A1 (en) * 2001-10-05 2005-03-31 Kiyoshi Adachi Socket and contact of semiconductor package

Also Published As

Publication number Publication date
US7579826B2 (en) 2009-08-25
WO2008082150A2 (en) 2008-07-10
US20080157806A1 (en) 2008-07-03

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