WO2008086282A3 - Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions - Google Patents

Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions Download PDF

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Publication number
WO2008086282A3
WO2008086282A3 PCT/US2008/050397 US2008050397W WO2008086282A3 WO 2008086282 A3 WO2008086282 A3 WO 2008086282A3 US 2008050397 W US2008050397 W US 2008050397W WO 2008086282 A3 WO2008086282 A3 WO 2008086282A3
Authority
WO
WIPO (PCT)
Prior art keywords
defect
related functions
fabricated
wafer
perform
Prior art date
Application number
PCT/US2008/050397
Other languages
French (fr)
Other versions
WO2008086282A2 (en
Inventor
Allen Park
Peter Rose
Ellis Chang
Brian Duffy
Mark Mccord
Gordon Abbott
Original Assignee
Kla Tencor Corp
Allen Park
Peter Rose
Ellis Chang
Brian Duffy
Mark Mccord
Gordon Abbott
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp, Allen Park, Peter Rose, Ellis Chang, Brian Duffy, Mark Mccord, Gordon Abbott filed Critical Kla Tencor Corp
Publication of WO2008086282A2 publication Critical patent/WO2008086282A2/en
Publication of WO2008086282A3 publication Critical patent/WO2008086282A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

Various methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions are provided. One computer-implemented method includes using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions. The one or more defect-related functions include one or more post-mask, defect-related functions.
PCT/US2008/050397 2007-01-05 2008-01-07 Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions WO2008086282A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88361707P 2007-01-05 2007-01-05
US60/883,617 2007-01-05

Publications (2)

Publication Number Publication Date
WO2008086282A2 WO2008086282A2 (en) 2008-07-17
WO2008086282A3 true WO2008086282A3 (en) 2008-09-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/050397 WO2008086282A2 (en) 2007-01-05 2008-01-07 Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions

Country Status (2)

Country Link
US (1) US8194968B2 (en)
WO (1) WO2008086282A2 (en)

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