WO2008102694A1 - 表示装置、表示装置用の製造装置、及び表示装置の製造方法 - Google Patents

表示装置、表示装置用の製造装置、及び表示装置の製造方法 Download PDF

Info

Publication number
WO2008102694A1
WO2008102694A1 PCT/JP2008/052501 JP2008052501W WO2008102694A1 WO 2008102694 A1 WO2008102694 A1 WO 2008102694A1 JP 2008052501 W JP2008052501 W JP 2008052501W WO 2008102694 A1 WO2008102694 A1 WO 2008102694A1
Authority
WO
WIPO (PCT)
Prior art keywords
display device
luminescent part
inorganic film
film
heat
Prior art date
Application number
PCT/JP2008/052501
Other languages
English (en)
French (fr)
Inventor
Toshio Negishi
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to JP2009500158A priority Critical patent/JPWO2008102694A1/ja
Priority to CN2008800055651A priority patent/CN101617564B/zh
Priority to EP08711331A priority patent/EP2120510A4/en
Publication of WO2008102694A1 publication Critical patent/WO2008102694A1/ja
Priority to US12/544,665 priority patent/US7857673B2/en
Priority to US12/926,437 priority patent/US20110069473A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/54—Screens on or from which an image or pattern is formed, picked-up, converted, or stored; Luminescent coatings on vessels
    • H01J1/62—Luminescent screens; Selection of materials for luminescent coatings on vessels
    • H01J1/70—Luminescent screens; Selection of materials for luminescent coatings on vessels with protective, conductive, or reflective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02376—Carbon, e.g. diamond-like carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Abstract

　発光効率が低下しない表示装置を提供する。本発明の表示装置１は、発光部１５が位置する凹部１３が充填膜２７で充填されてから無機膜２８が形成されるので、無機膜２８に亀裂が生じない。無機膜２８はダイヤモンドライクカーボンやＡｌＮのように、気密性と熱伝導性が高い材料で構成されているので、発光部１５に水や酸素が進入し難いだけでなく、発光部１５の熱は無機膜２８に伝達され、発光部１５が高温にならない。更に、第一、第二のパネル１０、２０の間の隙間は樹脂膜２９で充填されているので、外部から大気が進入しない。発光部１５は水や酸素や熱によってダメージを受けないので、本発明の表示装置１は寿命が長い。
PCT/JP2008/052501 2007-02-21 2008-02-15 表示装置、表示装置用の製造装置、及び表示装置の製造方法 WO2008102694A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009500158A JPWO2008102694A1 (ja) 2007-02-21 2008-02-15 表示装置、表示装置用の製造装置、及び表示装置の製造方法
CN2008800055651A CN101617564B (zh) 2007-02-21 2008-02-15 显示装置、用于制造显示装置的装置、以及显示装置的制造方法
EP08711331A EP2120510A4 (en) 2007-02-21 2008-02-15 DISPLAY DEVICE, APPARATUS, AND METHOD FOR MANUFACTURING DISPLAY DEVICE
US12/544,665 US7857673B2 (en) 2007-02-21 2009-08-20 Display device, apparatus for producing display device, and method for producing display device
US12/926,437 US20110069473A1 (en) 2007-02-21 2010-11-18 Display device, apparatus for producing display device, and method for producing display device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-040867 2007-02-21
JP2007040867 2007-02-21
JP2007040866 2007-02-21
JP2007-040866 2007-02-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/544,665 Continuation US7857673B2 (en) 2007-02-21 2009-08-20 Display device, apparatus for producing display device, and method for producing display device

Publications (1)

Publication Number Publication Date
WO2008102694A1 true WO2008102694A1 (ja) 2008-08-28

Family

ID=39709971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052501 WO2008102694A1 (ja) 2007-02-21 2008-02-15 表示装置、表示装置用の製造装置、及び表示装置の製造方法

Country Status (7)

Country Link
US (2) US7857673B2 (ja)
EP (2) EP2120510A4 (ja)
JP (2) JPWO2008102694A1 (ja)
KR (1) KR101098859B1 (ja)
CN (1) CN101617564B (ja)
TW (1) TW200904237A (ja)
WO (1) WO2008102694A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009245734A (ja) * 2008-03-31 2009-10-22 Rohm Co Ltd 有機ｅｌ素子
WO2014065171A1 (ja) * 2012-10-23 2014-05-01 シャープ株式会社 貼合基板の製造方法
WO2017018265A1 (ja) * 2015-07-27 2017-02-02 東レエンジニアリング株式会社 封止膜形成装置および封止膜形成方法
JP2020123585A (ja) * 2014-01-21 2020-08-13 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5870330B2 (ja) * 2011-06-30 2016-02-24 株式会社Ｊｏｌｅｄ 表示パネル及び表示パネルの製造方法
FR2985076B1 (fr) * 2011-12-23 2014-08-29 Valeo Systemes Thermiques Module de commande et d'affichage pour vehicule automobile et procede de fabrication
KR101188748B1 (ko) * 2012-07-18 2012-10-09 지스마트 주식회사 투명전광판 및 그 제조방법
JP6253923B2 (ja) * 2013-08-30 2017-12-27 株式会社ジャパンディスプレイ タッチセンサ内蔵有機エレクトロルミネッセンス装置
KR102080296B1 (ko) * 2013-12-03 2020-02-21 엘지디스플레이 주식회사 유기 발광 장치
JP6684564B2 (ja) * 2015-10-14 2020-04-22 株式会社ジャパンディスプレイ 有機ｅｌ表示装置
KR20170071779A (ko) * 2015-12-16 2017-06-26 주식회사 트레이스 반구형 터치센서 판넬의 진공 열성형 장치
JP6932910B2 (ja) * 2016-10-27 2021-09-08 船井電機株式会社 表示装置
CN109830181A (zh) 2017-11-23 2019-05-31 群创光电股份有限公司 显示装置
CN110571354B (zh) * 2019-09-09 2022-03-01 云谷（固安）科技有限公司 封装结构、显示面板及显示装置
CN113571435B (zh) * 2021-07-02 2024-02-27 矽磐微电子(重庆)有限公司 芯片封装结构的形成方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176655A (ja) 1999-12-16 2001-06-29 Nec Corp 有機エレクトロルミネッセンス素子
JP2002093586A (ja) * 2000-09-19 2002-03-29 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP2002324667A (ja) * 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd 発光装置、電子機器およびそれらの作製方法
JP2004119086A (ja) * 2002-09-25 2004-04-15 Sony Corp 表示装置
JP2004327272A (ja) * 2003-04-25 2004-11-18 Semiconductor Energy Lab Co Ltd 製造装置および発光装置
JP2005123089A (ja) * 2003-10-17 2005-05-12 Fuji Electric Holdings Co Ltd カラー有機ｅｌディスプレイおよびその製造方法
JP2005209631A (ja) * 2003-12-26 2005-08-04 Semiconductor Energy Lab Co Ltd 発光装置、電子機器、および発光装置の作製方法
JP2005251721A (ja) * 2003-09-24 2005-09-15 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法、及び電子機器
JP2006286211A (ja) 2005-03-31 2006-10-19 Pioneer Electronic Corp 有機ｅｌパネルの製造方法
JP2007128741A (ja) * 2005-11-04 2007-05-24 Seiko Epson Corp 有機ｅｌ発光装置および電子機器、有機ｅｌ発光装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100365590B1 (ko) 2000-09-01 2002-12-26 삼성전자 주식회사 듀얼클럭으로 작동하는 전자레인지
JP4632337B2 (ja) * 2000-11-10 2011-02-16 株式会社半導体エネルギー研究所 発光装置
JP4567282B2 (ja) * 2001-07-16 2010-10-20 株式会社半導体エネルギー研究所 発光装置の作製方法
JP4515060B2 (ja) * 2002-08-30 2010-07-28 株式会社半導体エネルギー研究所 製造装置および有機化合物を含む層の作製方法
JP2004103337A (ja) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP4561201B2 (ja) * 2003-09-04 2010-10-13 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
JP4329740B2 (ja) * 2004-10-22 2009-09-09 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法、及び有機エレクトロルミネッセンス装置
JP4631683B2 (ja) * 2005-01-17 2011-02-16 セイコーエプソン株式会社 発光装置、及び電子機器
JP2006222071A (ja) * 2005-01-17 2006-08-24 Seiko Epson Corp 発光装置、発光装置の製造方法、及び電子機器
CN100581304C (zh) * 2005-03-24 2010-01-13 双叶电子工业株式会社 干燥剂和使用该干燥剂的场致发光装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176655A (ja) 1999-12-16 2001-06-29 Nec Corp 有機エレクトロルミネッセンス素子
JP2002093586A (ja) * 2000-09-19 2002-03-29 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP2002324667A (ja) * 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd 発光装置、電子機器およびそれらの作製方法
JP2004119086A (ja) * 2002-09-25 2004-04-15 Sony Corp 表示装置
JP2004327272A (ja) * 2003-04-25 2004-11-18 Semiconductor Energy Lab Co Ltd 製造装置および発光装置
JP2005251721A (ja) * 2003-09-24 2005-09-15 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法、及び電子機器
JP2005123089A (ja) * 2003-10-17 2005-05-12 Fuji Electric Holdings Co Ltd カラー有機ｅｌディスプレイおよびその製造方法
JP2005209631A (ja) * 2003-12-26 2005-08-04 Semiconductor Energy Lab Co Ltd 発光装置、電子機器、および発光装置の作製方法
JP2006286211A (ja) 2005-03-31 2006-10-19 Pioneer Electronic Corp 有機ｅｌパネルの製造方法
JP2007128741A (ja) * 2005-11-04 2007-05-24 Seiko Epson Corp 有機ｅｌ発光装置および電子機器、有機ｅｌ発光装置の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2120510A4

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009245734A (ja) * 2008-03-31 2009-10-22 Rohm Co Ltd 有機ｅｌ素子
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
WO2014065171A1 (ja) * 2012-10-23 2014-05-01 シャープ株式会社 貼合基板の製造方法
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
JP2020123585A (ja) * 2014-01-21 2020-08-13 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
WO2017018265A1 (ja) * 2015-07-27 2017-02-02 東レエンジニアリング株式会社 封止膜形成装置および封止膜形成方法
JP2017025395A (ja) * 2015-07-27 2017-02-02 東レエンジニアリング株式会社 封止膜形成装置および封止膜形成方法

Also Published As

Publication number Publication date
KR101098859B1 (ko) 2011-12-26
EP2120510A1 (en) 2009-11-18
JPWO2008102694A1 (ja) 2010-05-27
CN101617564A (zh) 2009-12-30
TW200904237A (en) 2009-01-16
EP2560459A3 (en) 2013-04-10
US7857673B2 (en) 2010-12-28
KR20090117742A (ko) 2009-11-12
JP2012109248A (ja) 2012-06-07
CN101617564B (zh) 2013-02-06
US20110069473A1 (en) 2011-03-24
US20100013385A1 (en) 2010-01-21
EP2120510A4 (en) 2012-05-30
EP2560459A2 (en) 2013-02-20

Similar Documents

Publication Publication Date Title
WO2008102694A1 (ja) 表示装置、表示装置用の製造装置、及び表示装置の製造方法
WO2009060742A1 (ja) 有機エレクトロルミネッセンス素子、表示装置及び照明装置
TW200704746A (en) Anthrylarylene derivative, material for organic electroluminescent device, and organic electroluminescent device using the same
TW200715909A (en) Blue organic electroluminescent device
EP2034538A4 (en) MATERIAL FOR AN ORGANIC ELECTROLUMINESCENE ELEMENT AND THE MATERIAL USING THE ELECTROLUMINESCENCE ELECTRONIC ELEMENT
TW200639231A (en) Aromatic triamine compound and organic electroluminescent device using the same
WO2009008099A1 (ja) 有機エレクトロルミネッセンス素子用材料及びそれを用いた有機エレクトロルミネッセンス素子
TW200640837A (en) Aromatic amine derivative and organic electroluminescence device utilizing the same
TW200728431A (en) Pyrene derivatives and organic electroluminescence device made of the same
TW200717893A (en) Light-emitting device, and method for the manufacture thereof
WO2009060757A1 (ja) 有機エレクトロルミネッセンス素子、表示装置及び照明装置
TW200740866A (en) Insulated glass unit with sealant composition having reduced permeability to gas
WO2008132965A1 (ja) 白色有機エレクトロルミネッセンス素子、及び照明装置
TW200620731A (en) Organic electroluminescent device
EP1698679A4 (en) FABRIC FOR ORGANIC ELECTROLUMINESCENZING DEVICE AND BASED ORGANIC ELECTROLUMINESCENSE DEVICE
WO2007070251A3 (en) Electroluminescent device containing an anthracene derivative
TW201613137A (en) Light-emitting element, light-emitting device, electronic device, and lighting device
TW200740967A (en) Insulated glass unit with sealant composition having reduced permeability to gas
TW200744969A (en) Insulated glass unit with sealant composition having reduced permeability to gas
EP2202821A3 (en) Organic light emitting apparatus and method of manufacturing the same
MY151538A (en) Light-emitting device with improved electrode structures
WO2008142966A1 (ja) 有機ｅｌ装置の製造装置
WO2008120788A1 (ja) ヒータ内蔵バルブ
TW200702334A (en) Transition metal complex compound and organic electroluminescence element using the same
NO20065262L (no) Utplassering av en sammenstilling i en bronn

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880005565.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08711331

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009500158

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097017161

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008711331

Country of ref document: EP