WO2008153782A3 - Methods and apparatus for polishing a semiconductor wafer - Google Patents

Methods and apparatus for polishing a semiconductor wafer Download PDF

Info

Publication number
WO2008153782A3
WO2008153782A3 PCT/US2008/006690 US2008006690W WO2008153782A3 WO 2008153782 A3 WO2008153782 A3 WO 2008153782A3 US 2008006690 W US2008006690 W US 2008006690W WO 2008153782 A3 WO2008153782 A3 WO 2008153782A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
polishing
semiconductor wafer
substrate
base
Prior art date
Application number
PCT/US2008/006690
Other languages
French (fr)
Other versions
WO2008153782A2 (en
Inventor
Gregory Eisenstock
John C Thomas
Original Assignee
Corning Inc
Gregory Eisenstock
John C Thomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc, Gregory Eisenstock, John C Thomas filed Critical Corning Inc
Priority to JP2010510310A priority Critical patent/JP2010527807A/en
Priority to EP08767884A priority patent/EP2089186B1/en
Priority to CN200880017964XA priority patent/CN101678529B/en
Priority to AT08767884T priority patent/ATE515373T1/en
Publication of WO2008153782A2 publication Critical patent/WO2008153782A2/en
Publication of WO2008153782A3 publication Critical patent/WO2008153782A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.
PCT/US2008/006690 2007-05-30 2008-05-27 Methods and apparatus for polishing a semiconductor wafer WO2008153782A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010510310A JP2010527807A (en) 2007-05-30 2008-05-27 Semiconductor wafer polishing method and apparatus
EP08767884A EP2089186B1 (en) 2007-05-30 2008-05-27 Apparatus for polishing a semiconductor wafer
CN200880017964XA CN101678529B (en) 2007-05-30 2008-05-27 Methods and apparatus for polishing a semiconductor wafer
AT08767884T ATE515373T1 (en) 2007-05-30 2008-05-27 DEVICE FOR CLEANING A SEMICONDUCTOR WAFER

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/807,783 2007-05-30
US11/807,783 US7824244B2 (en) 2007-05-30 2007-05-30 Methods and apparatus for polishing a semiconductor wafer

Publications (2)

Publication Number Publication Date
WO2008153782A2 WO2008153782A2 (en) 2008-12-18
WO2008153782A3 true WO2008153782A3 (en) 2009-04-16

Family

ID=39692125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/006690 WO2008153782A2 (en) 2007-05-30 2008-05-27 Methods and apparatus for polishing a semiconductor wafer

Country Status (8)

Country Link
US (2) US7824244B2 (en)
EP (1) EP2089186B1 (en)
JP (1) JP2010527807A (en)
KR (1) KR20100021636A (en)
CN (1) CN101678529B (en)
AT (1) ATE515373T1 (en)
TW (1) TWI372676B (en)
WO (1) WO2008153782A2 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2898410B1 (en) * 2006-03-07 2008-05-09 Airbus France Sas A METHOD OF CHARACTERIZING FATIGUE HOLDING OF A WORKPIECE FROM ITS SURFACE PROFILE
AU2010284320B2 (en) * 2009-08-17 2015-02-26 The Regents Of The University Of California Distributed external and internal wireless sensor systems for characterization of surface and subsurface biomedical structure and condition
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing
US8148266B2 (en) * 2009-11-30 2012-04-03 Corning Incorporated Method and apparatus for conformable polishing
US8463908B2 (en) * 2010-03-16 2013-06-11 Alcatel Lucent Method and apparatus for hierarchical management of system resources
US8956700B2 (en) 2011-10-19 2015-02-17 General Electric Company Method for adhering a coating to a substrate structure
US9091664B2 (en) 2012-06-07 2015-07-28 Thomas Krause Pulsed eddy current sensor for precision measurement at-large lift-offs on metallic surfaces
US9140578B2 (en) 2012-12-06 2015-09-22 Industrial Technology Research Institute Measurement device
US9134141B2 (en) 2012-12-06 2015-09-15 Industrial Technology Research Institute Measurement device
FR3009075B1 (en) * 2013-07-26 2016-09-09 Michelin & Cie SYSTEM FOR MEASURING THE THICKNESS OF A GUM LAYER OF A TIRE
US10732085B2 (en) 2015-03-24 2020-08-04 Bell Helicopter Textron Inc. Notch treatment methods for flaw simulation
US10989640B2 (en) 2015-03-24 2021-04-27 Bell Helicopter Textron Inc. Method for defining threshold stress curves utilized in fatigue and damage tolerance analysis
US10094751B2 (en) * 2015-03-24 2018-10-09 Bell Helicopter Textron Inc. System and method for determining direct damage tolerance allowables
US9970325B2 (en) 2015-04-30 2018-05-15 General Electric Company Jacking assembly for rotor
US10209223B2 (en) 2015-05-26 2019-02-19 The Boeing Company Real-time fusion of ultrasound and eddy current data during non-destructive examination
JP2017148931A (en) * 2016-02-19 2017-08-31 株式会社荏原製作所 Polishing device and polishing method
KR101904268B1 (en) * 2017-01-12 2018-10-04 주식회사 케이씨텍 Substrate procesing apparatus
US11340261B2 (en) * 2017-02-02 2022-05-24 Brigham Young University Flexible electric probe
US10138539B1 (en) * 2018-04-03 2018-11-27 Shiping Cheng Method of managing coating uniformity with an optical thickness monitoring system
US11268931B2 (en) 2018-06-18 2022-03-08 Jentek Sensors, Inc. Segmented field eddy current sensing for dispersive property measurement and complex structures
WO2023192887A1 (en) * 2022-03-28 2023-10-05 Jentek Sensors, Inc. Remote current sense
US20230408448A1 (en) * 2022-06-20 2023-12-21 Southwest Research Institute Eddy current measurement and analysis for the detection of grinding burns on high strength steel through chrome plating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
US20050054266A1 (en) * 2003-09-09 2005-03-10 Tetsuji Togawa Pressure control system and polishing apparatus

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB886247A (en) 1958-05-02 1962-01-03 Secr Aviation Improvements in or relating to structures to facilitate non-destructive testing thereof
US3696290A (en) 1970-07-22 1972-10-03 Hays Corp Magnetic non-contact thickness gauge with means to compensate the effects of stray fields on the gauge
GB1567600A (en) 1975-10-15 1980-05-21 British Gas Corp Lipe line inspection equipment
US4095180A (en) 1975-12-29 1978-06-13 K. J. Law Engineers, Inc. Method and apparatus for testing conductivity using eddy currents
US4164874A (en) 1978-01-19 1979-08-21 Boeing Wichita Company Flaw growth correlator
US4271393A (en) 1978-12-29 1981-06-02 The Boeing Company Apparatus and method for eddy current detection of subsurface discontinuities in conductive bodies
US4384252A (en) 1979-05-11 1983-05-17 The Bendix Corporation Cup shaped magnetic pickoff for use with a variable reluctance motion sensing system
JPS586458A (en) 1981-07-03 1983-01-14 Nippon Steel Corp Hot eddy current flaw detecting method of steel material
EP0130940B2 (en) 1983-07-05 1993-12-01 C.A. Weidmüller GmbH & Co. Inductive sensor device and measuring device for using the same
US4644271A (en) 1985-02-25 1987-02-17 Ltv Steel Company, Inc. Method and apparatus for examining a workpiece
US4675057A (en) 1986-02-28 1987-06-23 Tocco, Inc. Method of heat treating using eddy current temperature determination
DE3643914A1 (en) * 1986-12-22 1988-06-30 Zeiss Carl Fa METHOD AND DEVICE FOR LAPPING OR POLISHING OPTICAL SURFACES
US4746858A (en) 1987-01-12 1988-05-24 Westinghouse Electric Corp. Non destructive testing for creep damage of a ferromagnetic workpiece
US4814690A (en) 1987-10-02 1989-03-21 Massachusetts Institute Of Technology Apparatus and methods for measuring permittivity in materials
US4963826A (en) 1989-07-18 1990-10-16 The United States Of America As Represented By The Secretary Of Commerce Reference standard block for use in nondestructive test probe calibration and method of manufacture thereof
US5006800A (en) 1989-11-06 1991-04-09 General Electric Company Eddy current imaging apparatus and method using phase difference detection
JPH06500170A (en) 1990-06-29 1994-01-06 エービービー　アムデータ　インコーポレイテッド Eddy current imaging system
US5227731A (en) 1991-05-24 1993-07-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of continuously determining crack length
US5453689A (en) 1991-12-06 1995-09-26 Massachusetts Institute Of Technology Magnetometer having periodic winding structure and material property estimator
US5315234A (en) 1992-04-03 1994-05-24 General Electric Company Eddy current device for inspecting a component having a flexible support with a plural sensor array
US5262722A (en) 1992-04-03 1993-11-16 General Electric Company Apparatus for near surface nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array
EP0576714B1 (en) 1992-07-03 1995-03-15 Norbert Dr. Nix Device for measuring the thickness of a layer
US5472374A (en) * 1992-08-10 1995-12-05 Sumitomo Metal Mining Co., Ltd. Polishing method and polishing device using the same
US5343146A (en) 1992-10-05 1994-08-30 De Felsko Corporation Combination coating thickness gauge using a magnetic flux density sensor and an eddy current search coil
US5698977A (en) 1993-10-12 1997-12-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Eddy current method for fatigue testing
US5549803A (en) 1994-01-14 1996-08-27 Honeywell Inc. Smart fastener
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
US5610517A (en) 1995-06-07 1997-03-11 Vanderbilt University Method and apparatus for detecting flaws below the surface of an electrically conductive object
US6657429B1 (en) 1995-08-25 2003-12-02 Jentek Sensors, Inc. Material condition assessment with spatially periodic field sensors
US5793206A (en) 1995-08-25 1998-08-11 Jentek Sensors, Inc. Meandering winding test circuit
JP3276295B2 (en) 1996-10-09 2002-04-22 三菱重工業株式会社 Eddy current flaw detector
JP2001508178A (en) 1997-01-06 2001-06-19 ジェンテク・センサーズ・インコーポレーテッド Detecting subsurface objects with magnetometers and deelectrometers
DE69814601T2 (en) 1997-03-13 2004-04-01 Jentek Sensors, Inc., Watertown MAGNETOMETRIC DETECTION OF FATIGUE DAMAGE IN AIRCRAFT
ATE256865T1 (en) 1997-10-29 2004-01-15 Jentek Sensors Inc ABSOLUTE MEASUREMENT OF PROPERTIES WITH AIR CALIBRATION
US6377039B1 (en) 1997-11-14 2002-04-23 Jentek Sensors, Incorporated Method for characterizing coating and substrates
US5969260A (en) 1998-03-30 1999-10-19 Mcdonnell Douglas Corporation Remotely interrogatable apparatus and method for detecting defects in structural members
CA2299373C (en) 1998-08-06 2003-10-14 Mitsubishi Heavy Industries, Ltd. Eddy-current testing probe
US6875085B2 (en) * 1998-11-06 2005-04-05 Mosel Vitelic, Inc. Polishing system including a hydrostatic fluid bearing support
US6325696B1 (en) * 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
WO2001022076A1 (en) 1999-09-20 2001-03-29 Jentek Sensors, Inc. Eddy-current sensor arrays
US20020072296A1 (en) * 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US20020081945A1 (en) * 2000-12-21 2002-06-27 Rod Kistler Piezoelectric platen design for improving performance in CMP applications
US6607425B1 (en) * 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
KR100434189B1 (en) * 2002-03-21 2004-06-04 삼성전자주식회사 Apparatus and method for chemically and mechanically polishing semiconductor wafer
US6769970B1 (en) * 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
US7487064B2 (en) 2003-07-18 2009-02-03 Chartered Semiconductor Manufacturing, Ltd. Method for detecting and monitoring defects
KR100685744B1 (en) * 2006-02-06 2007-02-22 삼성전자주식회사 Platen assembly, wafer polishing apparatus having the same, and wafer polishing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
US20050054266A1 (en) * 2003-09-09 2005-03-10 Tetsuji Togawa Pressure control system and polishing apparatus

Also Published As

Publication number Publication date
CN101678529A (en) 2010-03-24
US20080299871A1 (en) 2008-12-04
US7994781B2 (en) 2011-08-09
ATE515373T1 (en) 2011-07-15
EP2089186B1 (en) 2011-07-06
WO2008153782A2 (en) 2008-12-18
JP2010527807A (en) 2010-08-19
CN101678529B (en) 2013-02-27
US7824244B2 (en) 2010-11-02
KR20100021636A (en) 2010-02-25
EP2089186A2 (en) 2009-08-19
TW200911458A (en) 2009-03-16
TWI372676B (en) 2012-09-21
US20090315540A1 (en) 2009-12-24

Similar Documents

Publication Publication Date Title
WO2008153782A3 (en) Methods and apparatus for polishing a semiconductor wafer
WO2010081003A3 (en) Systems, apparatus and methods for moving substrates
WO2012166770A3 (en) Heated wafer carrier profiling
TWI373071B (en) Semiconductor wafer and method for the simultaneous double-side grinding of a plurality of semiconductor wafers
WO2010017142A3 (en) Closed loop control of pad profile based on metrology feedback
WO2008070302A3 (en) Bernoulli wand
TW200627535A (en) Semiconductor wafer, manufacturing method of semiconductor device, and semiconductor device
WO2010101423A3 (en) Lift pin, and wafer-processing apparatus comprising same
HK1144235A1 (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
WO2009114120A3 (en) Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
WO2011066491A3 (en) Methods and apparatus for edge chamfering of semiconductor wafers using chemical mechanical polishing
WO2009077201A3 (en) Method and device for treating silicon wafers
WO2007143566A3 (en) Fast substrate loading on polishing head without membrane inflation step
WO2008103331A3 (en) Wide-bandgap semiconductor devices
WO2012011005A3 (en) Device for holding wafer shaped articles
WO2009063877A1 (en) Movable element and processing stage
WO2006076088A3 (en) Multi-zone showerhead for drying single semiconductor substrate
EP1837901A4 (en) Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer
MY156911A (en) Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
GB2541146A (en) Method of manufacturing a germanium-on-insulator substrate
TW200640283A (en) Method of manufacturing an organic electronic device
TW200634918A (en) Fabrication process of semiconductor device and polishing method
WO2009063793A1 (en) Adhesive tape for processing semiconductor wafer
WO2011055960A3 (en) Apparatus and method for polishing and washing a semiconductor wafer
TW200609078A (en) Retaining ring for chemical mechanical polishing

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880017964.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08767884

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2008767884

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2010510310

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20097027366

Country of ref document: KR

Kind code of ref document: A