WO2008153782A3 - Methods and apparatus for polishing a semiconductor wafer - Google Patents
Methods and apparatus for polishing a semiconductor wafer Download PDFInfo
- Publication number
- WO2008153782A3 WO2008153782A3 PCT/US2008/006690 US2008006690W WO2008153782A3 WO 2008153782 A3 WO2008153782 A3 WO 2008153782A3 US 2008006690 W US2008006690 W US 2008006690W WO 2008153782 A3 WO2008153782 A3 WO 2008153782A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- methods
- polishing
- semiconductor wafer
- substrate
- base
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010510310A JP2010527807A (en) | 2007-05-30 | 2008-05-27 | Semiconductor wafer polishing method and apparatus |
EP08767884A EP2089186B1 (en) | 2007-05-30 | 2008-05-27 | Apparatus for polishing a semiconductor wafer |
AT08767884T ATE515373T1 (en) | 2007-05-30 | 2008-05-27 | DEVICE FOR CLEANING A SEMICONDUCTOR WAFER |
CN200880017964XA CN101678529B (en) | 2007-05-30 | 2008-05-27 | Methods and apparatus for polishing a semiconductor wafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/807,783 US7824244B2 (en) | 2007-05-30 | 2007-05-30 | Methods and apparatus for polishing a semiconductor wafer |
US11/807,783 | 2007-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008153782A2 WO2008153782A2 (en) | 2008-12-18 |
WO2008153782A3 true WO2008153782A3 (en) | 2009-04-16 |
Family
ID=39692125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/006690 WO2008153782A2 (en) | 2007-05-30 | 2008-05-27 | Methods and apparatus for polishing a semiconductor wafer |
Country Status (8)
Country | Link |
---|---|
US (2) | US7824244B2 (en) |
EP (1) | EP2089186B1 (en) |
JP (1) | JP2010527807A (en) |
KR (1) | KR20100021636A (en) |
CN (1) | CN101678529B (en) |
AT (1) | ATE515373T1 (en) |
TW (1) | TWI372676B (en) |
WO (1) | WO2008153782A2 (en) |
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FR2898410B1 (en) * | 2006-03-07 | 2008-05-09 | Airbus France Sas | A METHOD OF CHARACTERIZING FATIGUE HOLDING OF A WORKPIECE FROM ITS SURFACE PROFILE |
EP2467058A4 (en) * | 2009-08-17 | 2014-08-06 | Univ California | Distributed external and internal wireless sensor systems for characterization of surface and subsurface biomedical structure and condition |
US8524035B2 (en) * | 2009-11-30 | 2013-09-03 | Corning Incorporated | Method and apparatus for conformable polishing |
US8148266B2 (en) | 2009-11-30 | 2012-04-03 | Corning Incorporated | Method and apparatus for conformable polishing |
US8463908B2 (en) * | 2010-03-16 | 2013-06-11 | Alcatel Lucent | Method and apparatus for hierarchical management of system resources |
US8956700B2 (en) | 2011-10-19 | 2015-02-17 | General Electric Company | Method for adhering a coating to a substrate structure |
US9091664B2 (en) | 2012-06-07 | 2015-07-28 | Thomas Krause | Pulsed eddy current sensor for precision measurement at-large lift-offs on metallic surfaces |
US9140578B2 (en) | 2012-12-06 | 2015-09-22 | Industrial Technology Research Institute | Measurement device |
US9134141B2 (en) | 2012-12-06 | 2015-09-15 | Industrial Technology Research Institute | Measurement device |
FR3009075B1 (en) * | 2013-07-26 | 2016-09-09 | Michelin & Cie | SYSTEM FOR MEASURING THE THICKNESS OF A GUM LAYER OF A TIRE |
US10989640B2 (en) | 2015-03-24 | 2021-04-27 | Bell Helicopter Textron Inc. | Method for defining threshold stress curves utilized in fatigue and damage tolerance analysis |
US10094751B2 (en) * | 2015-03-24 | 2018-10-09 | Bell Helicopter Textron Inc. | System and method for determining direct damage tolerance allowables |
US10732085B2 (en) | 2015-03-24 | 2020-08-04 | Bell Helicopter Textron Inc. | Notch treatment methods for flaw simulation |
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US10209223B2 (en) | 2015-05-26 | 2019-02-19 | The Boeing Company | Real-time fusion of ultrasound and eddy current data during non-destructive examination |
JP2017148931A (en) * | 2016-02-19 | 2017-08-31 | 株式会社荏原製作所 | Polishing device and polishing method |
KR101904268B1 (en) * | 2017-01-12 | 2018-10-04 | 주식회사 케이씨텍 | Substrate procesing apparatus |
US11340261B2 (en) * | 2017-02-02 | 2022-05-24 | Brigham Young University | Flexible electric probe |
US10138539B1 (en) * | 2018-04-03 | 2018-11-27 | Shiping Cheng | Method of managing coating uniformity with an optical thickness monitoring system |
US11268931B2 (en) | 2018-06-18 | 2022-03-08 | Jentek Sensors, Inc. | Segmented field eddy current sensing for dispersive property measurement and complex structures |
WO2023192887A1 (en) * | 2022-03-28 | 2023-10-05 | Jentek Sensors, Inc. | Remote current sense |
US20230408448A1 (en) * | 2022-06-20 | 2023-12-21 | Southwest Research Institute | Eddy current measurement and analysis for the detection of grinding burns on high strength steel through chrome plating |
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US20040023606A1 (en) * | 2002-01-17 | 2004-02-05 | Yuchun Wang | Advanced chemical mechanical polishing system with smart endpoint detection |
US20050054266A1 (en) * | 2003-09-09 | 2005-03-10 | Tetsuji Togawa | Pressure control system and polishing apparatus |
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-
2007
- 2007-05-30 US US11/807,783 patent/US7824244B2/en not_active Expired - Fee Related
-
2008
- 2008-05-27 WO PCT/US2008/006690 patent/WO2008153782A2/en active Application Filing
- 2008-05-27 CN CN200880017964XA patent/CN101678529B/en not_active Expired - Fee Related
- 2008-05-27 AT AT08767884T patent/ATE515373T1/en not_active IP Right Cessation
- 2008-05-27 EP EP08767884A patent/EP2089186B1/en not_active Not-in-force
- 2008-05-27 KR KR1020097027366A patent/KR20100021636A/en not_active Application Discontinuation
- 2008-05-27 JP JP2010510310A patent/JP2010527807A/en not_active Withdrawn
- 2008-05-28 TW TW097119815A patent/TWI372676B/en not_active IP Right Cessation
-
2009
- 2009-08-03 US US12/534,560 patent/US7994781B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040023606A1 (en) * | 2002-01-17 | 2004-02-05 | Yuchun Wang | Advanced chemical mechanical polishing system with smart endpoint detection |
US20050054266A1 (en) * | 2003-09-09 | 2005-03-10 | Tetsuji Togawa | Pressure control system and polishing apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP2089186A2 (en) | 2009-08-19 |
CN101678529A (en) | 2010-03-24 |
CN101678529B (en) | 2013-02-27 |
TW200911458A (en) | 2009-03-16 |
US20080299871A1 (en) | 2008-12-04 |
ATE515373T1 (en) | 2011-07-15 |
KR20100021636A (en) | 2010-02-25 |
EP2089186B1 (en) | 2011-07-06 |
US7994781B2 (en) | 2011-08-09 |
US7824244B2 (en) | 2010-11-02 |
US20090315540A1 (en) | 2009-12-24 |
TWI372676B (en) | 2012-09-21 |
WO2008153782A2 (en) | 2008-12-18 |
JP2010527807A (en) | 2010-08-19 |
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