WO2009043649A2

WO2009043649A2 - Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures

Info

Publication number: WO2009043649A2
Application number: PCT/EP2008/061346
Authority: WO
Inventors: Andreas Bernhardt; Ulrich Deml; Carsten GÖTTE; Angelika Schingale
Original assignee: Continental Automotive Gmbh
Priority date: 2007-09-28
Filing date: 2008-08-28
Publication date: 2009-04-09
Also published as: DE102007046493A1; WO2009043649A3

Abstract

The invention relates to a three-dimensional electrical circuit board structure comprising at least two interconnected planar, two-dimensional substrates that have contact elements and that are preferably equipped on both sides with electronic components, the substrates forming substrate walls that are arranged at an angle of <180° relative each other, thereby defining a three-dimensional body with interspaces between the substrate walls. Electrically conducting elements expediently conduct the electric current from one substrate wall to an adjacent substrate wall. The invention also relates to a circuit board base having an electrical circuit board structure of the above type and to a three-dimensional circuit assembly that consists of at least two such three-dimensional circuit board structures.

Description

description

Three-dimensional electronic circuit carrier structure, as well as circuit base carrier comprising the circuit carrier construction as a functional component and three-dimensional circuit arrangement consisting of at least two such three-dimensional circuit carrier structures

The invention relates to a three-dimensional circuit carrier structure in which at least two interconnected, planar two-dimensional substrate plates such as printed circuit boards, ceramic circuit carriers (LTCC, DCB, thick film), partially flexible circuit carriers or the like having contacting elements and are equipped at least on one side with electronic components, <180 ° angled, in particular 90 ° to each other angled, in particular on adjacent edges, are composed. The invention further relates to a heat dissipation device for power losses of components of this circuit carrier structure, as well as a circuit base carrier having at least one such three-dimensional circuit carrier structure as a functional component. Furthermore, the invention relates to a three-dimensional circuit arrangement, which consists of at least two such three-dimensional circuit carrier structures.

Particularly in the computer and automotive sectors, increasingly smaller and smaller applications are being developed, so that the circuit carriers must always be more space-saving. This can only be achieved by means of an even higher component density on the circuit carriers, the miniaturization being limited by the number and size of the components which are necessarily to be used and the space available on the surfaces. It is known, multilayer circuit substrate to run as a multilayer circuit boards in which individual, consisting of insulating substrate material and provided with electrical components and conductors and the like layers are bonded together via prepregs. The electrical contacting of the individual layers of the carrier material with one another takes place, for example, via plated-through holes.

Furthermore, it is known to use two-dimensional, ie plate-shaped circuit carriers, in particular substrate plates, which are equipped with the components on the upper side and / or on the lower side. The assembly, however, requires a lot of space. For this reason, it is known to use a plurality of plate-shaped and populated circuit carriers, to arrange them one above the other at a distance from one another and to connect them mechanically and electrically conductively with one another. The connection of the circuit carriers with each other takes place, for example, via connectors or jumpers, e.g. according to DE 103 13 622 B3 by the use of pins. But the connection can also be achieved by a known rigid-flex arrangement.

In particular, DE 44 27 516 A1 discloses surface-saving, three-dimensional multilayer circuit arrangements of conventional design, in which at least two substrate plates, each comprising electronic components and contacting elements such as printed conductors, plated-through holes, pads and the like, are arranged one above the other. Due to the high packing density, increased heat occurs due to power dissipation, which is to be carried away by metal surfaces arranged between adjacent substrates, the metal surfaces being soldered together in addition to the mechanical connection of the substrate plates. Such three-dimensional, multilayer circuit arrangements require complex manufacturing processes and elaborate vias to be made from substrate plate to substrate plate (DE 44 27 515 C1, DE 44 00 985 C1). In addition, the heat dissipation is not sufficient because the metal surfaces, which must also serve for the mechanical connection between adjacent substrate plates, can not be optimally adjusted to the heat dissipation.

In the so-called planar technology with two-dimensional circuit carriers, it is known for thermal management with power components or power components, z. B. power semiconductors stocked planar, ie plate-shaped substrates, eg. As printed circuit boards, the circuit board directly on a heat sink, z. B. to laminate a metal plate, so that discrete heat sink can be omitted.

The object of the present invention is to provide three-dimensional electrical circuit carrier assemblies which can be produced easily and which also enable effective and simple thermal management.

In addition, an object of the present invention is to provide a plate-shaped circuit carrier with high component density, which is simple and inexpensive to produce, and is flexibly adaptable to different requirements.

These objects are achieved by a circuit carrier assembly according to claim 1 and a circuit base carrier with the

Characteristics of claim 16 solved. Advantageous developments of the invention are characterized in the respective subsequent subclaims.

The invention provides a new configuration of three-dimensional circuit arrangements or circuit board structures in which planar or plate-shaped, or plate-shaped, electronic components bearing and contacting elements, such as printed conductors, vertical vias Pads od. Like. Elements comprising two-dimensional substrates, in particular substrate plates, not in layers to each other (so-called stacks), but in angled arrangements as a substrate plate walls with each other. The angles are <180 ° and, for example, 60, 90 or 120 °, so that different spatial shaped bodies are formed, wherein free spaces between the substrate plates are expediently filled with a heat-conducting, electrically insulating filling material (Thermais Interface Material) at least partially.

Contacting elements are provided which can conduct electrical current from one substrate plate wall to the adjacent substrate plate wall. The substrate plates are expediently joined together or arranged at an angle to one another via their edges, with regular or irregular three-dimensional bodies, in particular hollow bodies, being formed.

The invention further provides, according to a preferred embodiment, a spatial combination of the means for mechanical fixation with the means of electrical connection to the adjacent edges of the substrate plates.

The inventive plate-shaped circuit base support with high component density has as a functional component on his

Trägerplattenober- and / or -Unterseite at least one mechanically and electrically conductively connected inventive three-dimensional circuit carrier structure.

In the following the invention will be explained by way of example with reference to a drawing. Show it: Fig. Ia to Ih: Schematically in cross-section different three-dimensional circuit arrangements

Fig. 2: A cross-shaped substrate configuration for

Production of a cube-shaped spatial form of a circuit arrangement;

Fig. 3: In cross section a cuboid circuit arrangement according to the invention

FIGS. 4a to d: Schematic and perspective examples of fastening devices according to the invention between two substrate plates of a three-dimensional circuit carrier structure according to the invention

5a to c: schematically in cross section a plurality of inventive circuit base carrier with a cuboid, frontally open circuit carrier structure according to several embodiments

FIGS. 6a to c show schematically in cross section a plurality of circuit base carriers according to the invention with a parallelepiped-shaped circuit carrier structure according to the invention which is open at the end side according to further embodiments

7 shows a schematic side view of a circuit base carrier according to the invention with a parallelepiped circuit carrier structure according to a further embodiment

8 shows a top view of the circuit base carrier according to FIG. 7 Fig. 9: Schematically a perspective view of a portion of a contact rail with plugged cuboid circuit carrier structure

Fig. 10a / b: Schematically each edge region of the section along the line A-A in Fig. 7 without

Ceiling wall according to various embodiments

Fig. 11: Schematically two connection possibilities of a contact rail to the circuit base support

1 a and 1 b each show two substrate plates, namely a base substrate plate as a substrate plate bottom wall 1 and an attached or angled substrate plate as a substrate plate side wall 2, which are perpendicular, ie 90 ° to each other, with free spaces 3 or interiors between see adjacent Substrate plate walls 1; 2 remain. Even acute angles (not shown) may equally be provided. The components and the Kontaktierungsele- elements that z. B. in particular on both sides of the substrate plate walls 1; 2 are applied or arranged, are not shown in the illustrated in FIGS. Ia to Ih Raumformbeispielen reasons of simplification. In the context of the invention, the components, also called components or components in the subject area, are for example integrated circuits (ICTs), sensor / actuator arrangements and / or passive components and / or plugs and / or optical components. Planar or planar or two-dimensional substrate plates in the context of the invention are z. B. printed circuit boards of insulating support material, preferably from impregnated with phenolic resin paper fibers (FRl or FR2) and / or impregnated with epoxy resin paper fibers (FR3) and / or impregnated with epoxy glass fiber mats (FR4 or FR5) and / or polyamide / polyimide Fibers and / or Kevlar Fiber mats and / or ceramic and / or Teflon, or LCP (liquid crystalline polymers). Furthermore, they may also be known per se multilayer printed circuit boards (multilayer printed circuit boards), which consist of several, preferably two to six, arranged parallel to each other and superimposed inner layers of the insulating support material, by means of interposed adhesive layers, in particular Prepregs, are interconnected (not shown).

It is also within the scope of the invention to use several e.g. side wall substrate plates 2 arranged parallel to each other are mounted side by side on a substrate plate bottom wall 1, so that free spaces or internal spaces 3 in the form of channels or grooves are formed between the side wall substrate plates 2 (FIG. 1c).

In addition, a substrate plate can expediently be fastened as a covering substrate plate cover wall 4, so that a cylinder which is open on the end side is formed (FIG. 1 d), wherein further sidewall substrate plates 2 according to FIG. 1 c can also be present in the interior (not shown). ,

According to a particular embodiment of the invention, a generally closed moldings is constructed, which in addition to a substrate plate bottom wall 1, substrate plate side walls 2 and a substrate plate top wall 4 substrate plate end walls 5 and z. B. cuboid or cube-shaped (Fig. Ie) is.

In Examples Ia to Ie, the substrate plate walls 1; 2; 4; 5 each arranged at right angles or parallel to each other. It is within the scope of the invention to use substrate plate walls 1, 2, 4, 5, in particular substrate plate side walls 2 with obtuse or acute angles. to set or zuwinke each other and to attach to each other, from which z. For example, cylinders having eight substrate plate sidewalls 2 (FIG. 1) or six substrate plate sidewalls 2 (FIG. 1e) or three substrate plate sidewalls 2 (FIG. 1h), which also conveniently have substrate plate end walls 5. In addition, a variety of other configurations can be put together without departing from the spirit of the invention, such as tetrahedra, octahedra, etc.

Conveniently carries at least one Substratplatten- wall 1; 2; 4; 5 at least one component inside, d. H. the device is on the inside surface of the substrate plate wall 1; 2; 4; 5 attached. Preferably carries at least one wall 1; 2; 4; 5 also at least one component outside.

The schematically depicted spatial forms are regular and symmetrical bodies. It is within the scope of the invention, irregular and asymmetrical body of Substratplatten- walls 1; 2; 4; 5 to form, with components inside and preferably also arranged on the outside.

The structure of the three-dimensional molded body according to the invention can be achieved by assembling individual substrate plate walls 1; 2; 4; 5 done. However, the shaped bodies can also be formed from one-piece substrate plates (blanks) by bending on predetermined bending lines. An example shows the Fig. 2. A one-piece substrate base plate 6, the z. B. on both sides of the components and contacting elements (not shown), has a cross shape, wherein bending lines 7 six substrate plate fields 8 narrow. In the bending lines 7, the substrate base plate 6 is bent in such a way that a cube-shaped molded body is created from the substrate base plate 6. Others can use this technology as well one-piece moldings, such as open and closed cylinders are created from appropriate circuit boards. In order to be able to bend the substrate base plate 6, it is thinned out in the region of the bending lines 7 in each case or is partially designed as a flexible strip conductor (rigid-flex design).

In any case, one strives to high component density both outside and inside of the Substratplatten- walls 1; 2; 4; 5 to select the space moldings, so that the circuit carrier structure according to the invention can be designed to save space. The high component density leads in particular in the interior of the body with appropriate use to excessive heating with the known disadvantages such as influencing the life of the components by thermal effects or hot spots.

Accordingly, an effective Entwärmungskonzept with thermal interfaces in the interior of the moldings is provided according to the invention, especially if components with power losses in the interior on the substrate plate walls 1; 2; 4; 5 of the moldings are arranged.

The invention provides to fill the free space 3 of the moldings with a heat-conducting, electrically insulating material and this material with at least one with respect to the room molding outside lying active or passive heat sink, for. B. made of metal, for. B. from a metal plate, to contact. It is expedient if the heat sink forms a substrate plate side wall 2 of the room shaped body.

Thermally conductive and electrically insulating materials of this type are known in the art as a thermal interface material in different compositions, eg. B. as films, gels, pastes, polymers, silicones or TIM (Thermal Interface Material) known. Likewise, those skilled in the active and passive heat sinks are known.

As a free space 3 in the context of the invention, in addition to the closed, free-lying interiors of the hollow body, the free spaces 3, which in the outwardly open space moldings, for. B. the examples of FIG. Ia, Ib, Ic between the substrate plate walls 1; 2 are formed. The heat-conducting and electrically insulating material for discharging heat generated by the components is also expediently introduced into these spaces (not shown).

In combination with the heat-conducting and electrically insulating material, the invention provides according to a particular embodiment, in the thermal interface material, a further heat sink z. B. in the form of a passive, thermally conductive body, for. B. metal body, or in the form of an active heat sink (heat pipe) to be arranged, in particular, the metal body is contacted with a provided on a Formkörperwandung heat sink. In this case, the two heat sinks may be integrally formed. In the case of an active, z. B. working with water cooling heat sink embedded in the thermal interface material heat sink may be sufficient, so that more Wärmesenkeanordnungen can be omitted.

3 shows in cross-section by way of example a three-dimensional circuit carrier structure according to the invention in the form of a cuboid 10. The cuboid 10 has a substrate plate bottom wall or base wall 1, two substrate plate side walls 2, two substrate plate end walls, not shown, and one covering substrate plate. Ceiling wall 4 on. The substrate plate side walls 2 and in particular also the substrate plate end walls bear outside electrical components or components 13 and on the inside electrical components or components 14. The contacting elements such as printed conductors, printed circuit boards, plated-through holes, solder pins, plug-in contacts od. Like. are not shown, so as not to disturb the clarity.

The inside components 14 are embedded in a thermal interface material (TIM) 15, which expediently fills the free interior of the cuboid 10. In the thermal interface material 15 protrudes as a heat sink, in particular a metallic body 16 which is in communication with the substrate plate top wall 4, wherein the substrate plate top wall 4 is also acting as a heat sink metal plate, which also thermal interface Material 15 contacted electrically conductive.

According to the invention, the z. B. by dissipation heat-generating components 14, preferably arranged in the interior of the moldings, because while the heat management can be optimized by the heat-conducting material selected accordingly and the heat sinks can be dimensioned accordingly.

Fastening techniques according to the invention between two substrate plates of the above-indicated specific structures of the three-dimensional circuit arrangements, which space-saving and spatially combined both the means for ensuring the mechanical strength of the respective structure and the means for the electrical power line, are in Figs. 4a to 4d shown.

A first embodiment of the invention (FIG. 4 a) provides a fixing mechanical so-called toothed corner connection between a first substrate plate wall 11 and a second substrate plate wall 12, in which the substrate plate at the two adjacent edges to be joined. Walls 11; 12 spatially matched to each other, z. B. cuboid prongs or teeth 20, 21 and tooth gaps 20a, 21a are arranged between the teeth. In this case, the teeth 20 of the first substrate plate wall 11 z. B. in the tooth gaps 21a of the second substrate plate wall 12 and the teeth 21 of the second Substratplatten- wall 12 in the tooth gaps 20a of the first Substratplatten- wall 11. Between the flanks of at least one tooth pair 20, 21 is at least one electrically conductive, for example, by edge metallization deposited metal layer 22 is provided, which provides an electrical connection between the substrate plate walls 11; 12 can produce. Thus, some pairs of teeth 20, 21 also cause only a mechanical fixation.

The metal layer 22 may be unilaterally, multiply or alligitig in the space between the teeth 20; 21 and the tooth spaces 20a; 21a, as FIG. 4 illustrates. It is expedient, in each case a metal layer 22 on opposite flanks of adjacent teeth 20; 21 to arrange and for fixing the two substrate plates 11; 12 to solder the metal layers 22 together, to adhere electrically conductive or together by pressing fit together. In addition, it is expedient, even opposing, non-metallized edges with each other z. B. by gluing or press-fit to connect.

Fig. 4a shows various possibilities of metallization on the tooth flanks. Instead of a pictured Fingerzinkung z. As well as a trapezoidal zincation or open zincing can be used.

4b shows three examples B1, B2 and B3 for the realization of the electrical edge contact between two substrate plate walls 11; 12 using the metal layers 22. According to example Bl on the left side of Fig. 4b, the metal layer 22 is on the one hand with an arranged on the second substrate plate wall 12 conductor 23 in electrically conductive connection. On the other hand, an electrical connection to the metal layer 22 is ensured by an electrically conductive, cylindrical, seated in a recess 25 of a tooth 20 of the first substrate plate wall 11 mass 24, which is connected to the metal layer 22 by at least one laser welding point (not shown).

According to Example B2 in the middle of Fig. 4b inserted in a recess 26 of the tooth 20, which passes through the metal layer 22 and ends as a blind hole in the second substrate plate wall 12, an electrically conductive wire 27, the one-e lectrically conductive the metal layer 22 is in communication and the other end protrudes from the first substrate plate wall 11, so that components or conductors can be connected there (not shown). The metal layer 22 is connected to an existing on the substrate plate wall 12 conductor 23 in connection, to which an arranged on the substrate plate wall 12 electrical component 28 is connected.

Example B3 on the right side of FIG. 4b shows a triangular edge metallization provided on both the tooth 20 of the first substrate plate wall 11 and the tooth space 21a of the second substrate plate wall 12 and an electrical connection between one on the second substrate plate -Wandung 12 arranged conductor 23 and one arranged on the first substrate plate wall 11 conductor 23a ensures, said conductor 23a an arranged on the first substrate plate wall 11 electronic component 28 contacted. Further combinations according to the invention of a fixing mechanical connection with an electrical connection can be seen from the examples B1, B2 and B3 of FIG. 4c, wherein on the left side two embodiments in section (example Bl, B2) and on the right side an embodiment in the view (example B3) are shown.

According to example Bl of FIG. 4c, inner layer pads 29 are provided in the second substrate plate wall 12 in the edge region, which are in contact with inner layers of conductor tracks 30 for electrical connections on the second substrate plate wall 12. Appropriately screwed and / or glued or pressed metallized sleeves or metal sleeves

31 stuck in the first substrate plate wall 11 and extend into the second substrate plate wall 12 into the pads 29. They connect the two Substratplatten- walls 11; 12 mechanically fixed to each other. At least one metallized sleeve 31 expediently opens in a pedestal

32 on the surface of the first substrate plate wall 11, wherein in the sleeve 31 electrically contacting a piece of wire 33 or z. B. a bolt or a screw od. Like. can sit for an electrical connection on the first Substratplatten- wall 11 and the pads 32 can be connected to arranged on the first substrate plate wall 11 traces 23a in combination. In this case, an inner layer conductor 23b in the first substrate plate wall 11 can also be connected to the metallic sleeve 31.

The embodiment according to example B2 of FIG. 4c corresponds to the embodiment according to example B1, wherein, instead of the inner layer pad, a metal path 34 projects into the sleeve 31, which is contacted with the wire or the bolt or the screw 33. In the embodiment according to example B3 of FIG. 4 c, the metal path 34 leads to a conductor track 23 on the second substrate plate wall 12, the conductor track 23 contacting an electrical component 28. Likewise, the conductor track 23 a on the first substrate plate wall 11 is connected to an electrical component 28.

FIG. 4 d shows three examples B 1, B 2, B 3 of electrical angle plug-in connectors, which comprise both the fixing mechanical connection of the substrate plate walls 11; 12 as well as the electrical connection between the substrate plate walls 11; 12 ensure.

In the example Bl in Fig. 4d is a kind of connector housing 40 made of insulating material, for. B. plastic, which has a first metallized slot 41 for the first substrate plate wall 11 and at right angles to a second metallized slot 42 for the second Substratplatten- wall 12. The grooves 41, 42 are connected to each other in the interior of the connector housing 40 via an electrical conductor 43.

Instead of the grooves 41, 42 z. B. individual metallized plug holes may be provided in the at the edges of the substrate plate walls 11; 12 arranged correspondingly shaped, possibly provided with contacting elements or metallized teeth 20, 21 and projections of the Substratplatten- walls 11; 12 intervene.

According to example B2 of FIG. 4d, an angle connector 45 is used which has plug-in pins 44 which engage in corresponding edges in the region of the substrate plate walls 11; 12 arranged, z. B. metallized plug holes z. B. with press-fit or soldered or welded, with the pins 44, which engage in the first substrate plate wall 11, with the pins 44, which engage in the two substrate plate wall 12, are integrally formed or electrically conductively connected. Also in this embodiment, the angle connector ensures the fixing fixing the substrate plate walls 11; 12 together.

Example B3 in Figure 4d shows a mechanical and electrical connection of the two substrate plate walls 11; 12, after which a folding connection 70 is provided. The folding joint 70 comprises substrate sheet material which is thinned, in particular deep-milled or free-milled in this region, or a flexible strip conductor as part of a rigid-flex plate.

In Fig. 5, an inventive circuit base support 50 is now shown. The circuit base support 50 is plate-shaped and has a carrier plate upper side 51 and a carrier plate underside 52 which is preferably parallel thereto.

The circuit base support 50 is, for example, a multilayer printed circuit board (not shown) which consists of several, preferably two to six, inner layers arranged parallel to one another and above one another, which are connected to one another by means of adhesive layers, in particular prepregs, arranged therebetween to a simple circuit board. The inner layers or the printed circuit board consist of insulating carrier material, preferably of paper fibers impregnated with phenolic resin (FR1 or FR2) and / or of paper fibers (FR3) impregnated with epoxy resin and / or of glass fiber mats (FR4 or FR5) impregnated with epoxy resin and / or of polyamide / polyimide fibers and / or Kevlar fiber mats and / or ceramic and / or Teflon. The prepregs known per se are each a semi-finished product consisting of continuous fibers and an uncured thermoset material. see plastic matrix, wherein the continuous fibers, for example, as knitted fabric or scrim present.

Furthermore, the circuit base support 50 on the support plate bottom side 52 and on the support plate top 51 arranged electrical components (not shown). The components are, for example, per se known wired and / or applied by means of thick film technology and / or surface mounted devices (surface mount devices) and / or printed components. The components are in particular ICs (integrated circuits) and / or transistors and / or diodes and / or resistors and / or capacitors. For the electrically conductive connection of the components to one another, the circuit base carrier 50 has conductor tracks (not shown), which are known per se on the carrier plate underside 52 and / or on the carrier plate top side 51, in the form of metallizations or plated-through vias. In the case of a multilayer plate, the printed conductors and components are preferably also provided on inner layer upper and / or lower sides (not shown) of the circuit substrate 50 parallel to one another and to the upper side 51 of the carrier plate.

In addition, the circuit base support 50 according to the invention comprises at least one circuit carrier structure according to the invention, e.g. in the form of a cuboid 10 as a functional component. The electrical contacting and mechanical fixation of the cuboid 10 to the circuit base support 50 takes place, for example, in this case. using surface mount technology (SMT = Surface-Mounting Technology) or through-hole mounting (THT = Through Hole Technology) and press fit technology (FIGS. 5a-c). For example, the surface mounted component (SMD = Surface

Mounted Device) running parallelepiped 10 on its bottom wall outside or bottom electrical contact surfaces 53, in particular solder pads in the form of metallization or adhesive pads of conductive adhesive, on and the circuit base support 50 has on its support plate top 51 Gegenkontakt- surfaces 54, in particular solder pads or adhesive pads on (Fig. 5a). The contact surfaces 53 and the mating contact surfaces 54 are each connected by soldering or adhesive technology. According to a further embodiment (FIG. 5b), the cuboid 10 has on its underside substrate plate bottom wall 1 small solder balls 55 in the form of a ball grid arrangement (BGA = ball grid array) which are provided with solder pads (not shown) provided on the carrier plate top 51. are soldered. According to a further embodiment (FIG. 5 c), the cuboid 10 has small contact pins 56 on its substrate plate bottom wall 1, in particular in a grid arrangement (PGA = Pin Grid Array), which are provided by contact holes 57, in particular vias, provided in the circuit base carrier 50 , are inserted or plugged through this and are soldered to this example by wave soldering and / or reflow soldering (reflow) or other known soldering or glued or welded or pressed with these (Pressfit technique). Furthermore, it is possible to connect the cuboid 10 by means of welding (bonding) and / or gluing and / or crimping and / or riveting to the circuit base support 50 in an electrically conductive manner and to mechanically fix it.

In addition, it is expedient, the cuboid 10 within a in the Trägerplattenober- or -Unterseite 51; 52, in particular a cuboid-shaped recess 58, in particular a trough-like depression, preferably a cutout, to be arranged (FIGS. 6a and 6b). This serves to minimize the installation height. The cuboid 10 is, for example, electrically conductively connected to one of the techniques described above at a bottom 59 of the recess 58 and mechanically driven. nically fixed (Fig. 6a). Furthermore, according to a preferred embodiment (FIG. 6b), the cuboid has additional contact surfaces 53 on the outside at its substrate plate side walls 2, and the circuit base carrier 50 has corresponding mating contact surfaces 54 on side walls 60 of the recess 58. The cuboid 10 is inserted into the recess 58 in such a form-fitting manner that the lateral contact surfaces 53 make contact with the lateral mating contact surfaces 54 and are connected to them, for example, by soldering or adhesively bonding. Alternatively, the cuboid 10 is merely pressed into the recess 58, so that no more solder or adhesive is necessary for secure contact. Furthermore, the cutout 58 can also be a cutout 58 passing through from the carrier plate upper side 51 to the carrier plate lower side 52 (FIG. 6c), in which the cuboid 10 is received in a form-fitting manner and the, preferably roughened, lateral contact surfaces 53, preferably roughened , side mating contact surfaces 54 or the cuboid 10 may be laterally disposed between a plurality of circuit substrates 50 and contact side contact surfaces of the other circuit substrates with its contact surfaces 53 (not shown).

The pressing in of the cuboid 10 causes it to be additionally stabilized laterally and thus withstands mechanical stresses, in particular vibrations, to which the circuit base support 50 is exposed during operation. An advantage of the recess 58 is that more surface, namely additionally the side walls 60, is available for electrical connection. In addition, a better heat dissipation from the circuit base support 50 due to the thinning of the circuit substrate 50 in the region of the recess 58 is possible. According to a further preferred embodiment (FIGS. 7 to 10), the circuit base support 50 has four contact rails 61 for the mechanical and electrically conductive connection of the cuboid 10. The elongated contact rails 61 extend perpendicularly to the carrier plate upper side 51 and / or to the carrier plate underside 52 away from these and are mechanically fixed to the support plate top 51 and / or the support plate bottom 52 and electrically connected. The contact rails 61 preferably have an angle profile with two rail legs 62, which enclose an angle of 90 ° with each other. For fixing and contacting the cuboid 10 is inserted into the contact rails 61 such that it is guided with its edge regions between the two rail limbs 62, in particular form-fitting, and is thus mechanically fixed in these. For the electrically conductive connection of the cuboid 10 to the contact rails 61, these also have on their inside guide surfaces 63, so the side surfaces facing the cuboid 10, where the cuboid 10 is guided, electrical contact surfaces 64, in particular solder pads in the form of metallizations or adhesive pads of conductive adhesive (FIGS. 9, 10a, b). The contact surfaces 64 are electrically conductively connected to electrical lines 65, in particular conductor tracks, pins, lead frames (lead frames), metal rails and / or plated-through holes, which run in the interior of the contact rails 61 and lead to further contact surfaces 64 and / or outer conductor tracks 69 , The cuboid 10 is arranged in the contact rails 61 in such a way that outer corner surfaces of the cuboid 10 (not shown) provided in the edge region contact the contact surfaces 64 of the rails 61 and are connected to them, for example, by soldering or adhesive technology. Alternatively, the cuboid 10 is merely pressed into the contact rails 61 in such a way that no solder or adhesive is required for secure contacting. In In this case, it is particularly advantageous if the corner contact surfaces of the cuboid 10 and the contact surfaces 64 of the contact rails 61 are roughened. To avoid corrosion and to ensure a tight connection, it is also expedient to use a known laminating film, which is arranged between the contact rails 61 and the cuboid 10 and is recessed at the areas where the contact surfaces 64 are located ,

The contact rails 61 are also preferably made of synthetic material and / or ceramic.

For the electrically conductive connection and mechanical fixing of the contact rails 61 to the circuit base support 50 (Figure 11), the contact rails 61 are e.g. attached directly to the support plate top 51 and / or the support plate bottom 52 and connected electrically conductive or inserted positively into a recess in the support plate top 51 and / or in the support plate bottom 52. The attachment to the carrier plate upper side 51 and / or the carrier plate underside 52 is preferably carried out by means of an electrically conductive binder 66, in particular solder and / or conductive adhesive, e.g. using surface mounting technology. For electrical connection, the inserted contact rails 61 have electrical contact surfaces 67 on the outside, in particular solder pads in the form of metallizations or conductor tracks or adhesive pads of conductive adhesive (FIG. 9, 10a, b), which contact the contact surfaces 68 provided in the recess.

The contact rails 61 provide a very easy-to-install way of connecting the cuboid 10 to the circuit base support 50. In addition, they can additionally depending on the course of the conductors 65 for electrically conductive and mechanical connection of two substrate plate walls 1; 2; 4; 5 of the cuboid 10 with one another (FIGS. 9, 10, b). Due to the positive guidance of the cuboid 10 in the contact rails 61, it is sufficient if the individual Substratplatten- walls 1; 2; 4; 5 are merely inserted into one another by means of grooves (FIG. 10 a) or only adjoining one another (FIG. 10 b).

Of course, the contact rails 61 can also be used for other three-dimensional circuit carrier construction. The number of contact rails 61 and the angular orientation of the rail legs 62 to each other only needs to be adapted in each case so that the circuit carrier structure is mounted positively and firmly in the contact rails 61.

With the invention it is possible to ensure a three-dimensional circuit carrier structure which resists the required mechanical stresses and which is designed to be electrically conductive on all sides. This structure offers the possibility of realizing a closed coil, can be used as a closed EMC shield and increases the number of connections between the individual pages.

In addition, a high component density is achieved on a space-saving three-dimensional circuit carrier, in particular because the substrate plate walls are equipped both on its inside and on its outside with components. Thus, an equal number of two-dimensionally built components can be installed more space saving using the third dimension.

Furthermore, the following advantages in particular result from the invention:

The use of a three-dimensional circuit carrier concept can increase the total surface area of the component Integration density can be achieved. This saves total area. The two-sided assembly costs are saved.

By suitable component arrangement can hot spots in the Geo- metry interior for z. B. active heat dissipation. As a result, other hot spots on the overall circuit carrier structure can be avoided, which has a positive effect on the overall reliability.

Furthermore, the heat connection is optimized.

The circuit base according to the invention is simple in construction and has a high component density due to the highly integrated three-dimensional circuit carrier structures. An inventive three-dimensional circuit carrier structure is a highly integrated functional component, ie a self-contained module on which a specific, well-defined function is realized. As a result, the circuit base carrier can be adapted to the respective requirements in a simple manner by standardizing the interfaces by exchanging or omitting individual three-dimensional circuit carrier assemblies. The three-dimensional circuit arrangements are also very flexible, e.g. Substrate plates of various technologies, e.g. Thick-film and printed circuit board technology (PCB) and / or low-temperature co-fired ceramic (LTCC) and printed circuit board technology and / or direct copper bonding (DCB) and punched grid technology can be combined with one another, which is why, in principle, any functions on the circuit arrangements can be realized in comparison to chips.

Furthermore, it is within the scope of the invention to provide a three-dimensional circuit arrangement which has at least two of the three-dimensional circuit carrier structures according to the invention as functional components, wherein the circuit carrier structures are electrically conductive and mechanical, in particular by means of surface mounting technology (SMT) and / or throughput. Plug-in mounting (THT = Through-Hole Technology) and preferably Pressfit technology are interconnected.

Claims

claims

1. Three-dimensional electrical circuit carrier structure having at least two interconnected planar, two-dimensional substrate plates (11; 12), the contacting elements and, preferably on both sides, with electronic components (13; 14) are equipped, characterized in that the substrate plates substrate plate walls (1; 2; 4; 5; 11; 12), which are arranged at an angle of less than 180 ° to each other, resulting in a three-dimensional space form body with free spaces (3) between the substrate plate walls (1; 2; 4; 5 11; 12) and wherein at least one electrical conductor means (22; 31; 41; 42; 43; 44) is provided for directing electrical current from a substrate plate wall (1; 2; 4; 5; 11; 12) an adjacent substrate plate wall (1, 2, 4, 5, 11, 12).

2. Circuit carrier structure according to claim 1, characterized in that the substrate plate walls (1; 2; 4; 5; 11; 12) are joined or plugged together on the edge side or formed in one piece and angled in bending lines on the edge side.

3. The circuit carrier structure according to claim 1 and / or 2, characterized in that more than two substrate plate walls (1; 2; 4; 5; 11; 12) are present, the front side open or closed, a free space (3) forming , in particular symmetrical, hollow body with Substratplatten- side walls (2) and possibly Substratplatten- Forming end walls (5) and optionally a Substratplatten-ceiling wall (4) and optionally a substrate plate bottom wall (1), wherein the angle between the substrate plate walls (1, 2; 4; 5; 11; 12) a sharp, 90 ° or is an obtuse angle.

4. Circuit carrier structure according to claim 3, characterized in that the free space (3) of the three-dimensional molded body with thermal interface material (15) is at least partially completely filled in particular.

5. The circuit carrier structure according to claim 4, characterized in that at least one heat sink (16) is embedded in the thermal interface material (15).

6. Circuit carrier structure according to one or more of claims 3 to 5, characterized in that at least one substrate plate wall (1; 2; 4; 5) of the hollow body is a heat sink or is in communication with a heat sink.

7. The circuit carrier structure according to claim 5 and / or 6, characterized in that the heat sink (16) embedded in the interface material (15) contacts the heat sink according to claim (6) for heat conduction or is formed integrally therewith.

8. circuit carrier assembly according to one or more of the preceding claims, characterized in that the substrate plate walls (1; 2; 4; 5; 11; 12) are arranged to form the three-dimensional three-dimensional shape on adjacent edges, using mechanical fastening means (20; 21; 20a; 21a; 31; 40; 45) for fixing the spatial shape are combined with the substrate plate walls (1; 2; 4; 5; 11; 12) electrically connecting electrical edge-side conductor means (22; 31; 41; 42; 43; 44).

9. The circuit carrier structure according to claim 8, characterized in that the fastening means is a gezinkte corner joint (20; 21; 20a; 21a) and at least one flank of at least one tooth pair (20; 21) is metallized, wherein the metal layer (22) of the metallization with at least one contacting element (23; 23a; 24; 27) of the substrate plate walls (1; 2; 4; 5; 11; 12) is electrically conductively connected.

10. The circuit carrier structure according to claim 8 and / or 9, characterized in that the fastening means and / or the electrical conductor means, in particular the metallizations of the substrate plate walls (1; 2; 4; 5; 11; 12) pressed together and / or glued and / or soldered and / or welded.

11. The circuit carrier structure according to claim 8, characterized in that the attachment between two substrate plate walls (11; 12) takes place with preferably metallized sleeves (31) which also function as electrical conductor means and with contacting elements (23a, 23b, 32, 33). the first substrate plate wall (11) on the one hand and with con On the other hand, the clocking elements (23, 29, 30, 34) of the second substrate plate wall (12) are in electrical connection with one another.

12. The circuit carrier structure according to claim 11, characterized in that the sleeve (31) is screwed in or pressed or welded or soldered or glued.

13. The circuit carrier structure according to claim 8, characterized in that the fastening means is designed as an angle plug connector (40; 45) which has electrical conductor means (40; 41; 42; 44).

14. Circuit support structure according to claim 13, characterized in that the housing having an angle connector (40) in the housing a first metallizations having plug-in groove (40) or plug holes for the first Substratplatten- wall (11) and preferably at right angles to a second metallizations having plug-in groove ( 42) or plug holes for the second substrate plate wall (12) and the metallizations of the grooves (41, 42) o- of the plug holes in the interior of the connector housing

(40) via electrical conductors (43) are interconnected.

15. Circuit board structure according to claim 13, characterized in that the angle plug connector (45) has electrically conductive plug-in pins (44) which are arranged in corresponding edge regions of the substrate plate walls (11; B. metallized plug-in holes with press fit or a soldered or welded, engage, expediently the pins (44) which engage in the first substrate plate wall (11), with the pins (44) which engage in the second substrate plate wall (12), are integrally formed or electrically conductively communicate.

16. Panel-shaped circuit base carrier (50) provided on top and / or bottom side with electronic components and provided with electrical contacting elements, characterized in that the circuit base support (50) is designed as a functional component on its carrier plate top and / or bottom side (51; ) has at least one mechanically and electrically conductive to the circuit base support (50) connected to three-dimensional circuit carrier structure according to one or more of the preceding claims.

17. Circuit base according to claim 16, characterized in that the three-dimensional circuit carrier structure by means of surface mount technology (SMT = Surface-Mounting Technology) or by through-hole mounting (THT = Through-Hole Technology) and pressfit technique on the circuit base support (50) electrically conductive and mechanically linked.

18. Circuit base according to claim 16, characterized in that the three-dimensional circuit carrier structure within a in the Trägerplattenober- or -Unterseite (51; 52) provided recess (58), in particular a trough-like depression or a continuous recess (58) is arranged and connected to a bottom (59) of the recess and / or on side walls (60) of the recess (58) electrically conductively connected and mechanically fixed.

19. Circuit base according to claim 18, characterized in that there is a press fit between the recess (58) and the three-dimensional circuit carrier structure.

20. The circuit base according to claim 16, characterized in that the circuit base carrier (50) has contact rails (61) for the mechanical and electrically conductive connection of the three-dimensional circuit carrier structure.

21. Circuit base according to claim 20, characterized in that the contact rails (61) are elongate and perpendicular to the carrier plate top side (51) and / or the carrier plate underside (52) extending away from the latter and on the carrier plate top side (51) and / or Support plate underside (52) fixed mechanically and / or electrically connected.

22. The circuit base support according to claim 20 and / or 21, characterized in that the contact rails (61) have an angle profile with two rail limbs (62).

23. Circuit base according to one or more of claims 20 to 22, characterized in that the circuit carrier structure in the contact rails (61) is guided positively and is preferably pressed into this.

24. Circuit base according to one or more of claims 20 to 23, characterized in that the contact rails (61) on the inside at their guide surfaces (63), ie the side facing the circuit support structure side electrical contact surfaces (64) and the circuit carrier structure outside corresponding Eckkontaktflächen has, contact the contact surfaces (64).

25. Three-dimensional circuit arrangement having at least two three-dimensional circuit carrier structures according to one or more of claims 1 to 15 as functional components, wherein the circuit carrier structures with each other mechanically and electrically conductive, in particular by means of surface mounting technology (SMT) and / or

Through-Hole Technology (THT) and preferably Pressfit technology are interconnected.