WO2009043649A3 - Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures - Google Patents

Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures Download PDF

Info

Publication number
WO2009043649A3
WO2009043649A3 PCT/EP2008/061346 EP2008061346W WO2009043649A3 WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3 EP 2008061346 W EP2008061346 W EP 2008061346W WO 2009043649 A3 WO2009043649 A3 WO 2009043649A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
dimensional
board structure
structures
functional component
Prior art date
Application number
PCT/EP2008/061346
Other languages
German (de)
French (fr)
Other versions
WO2009043649A2 (en
Inventor
Andreas Bernhardt
Ulrich Deml
Carsten GÖTTE
Angelika Schingale
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2009043649A2 publication Critical patent/WO2009043649A2/en
Publication of WO2009043649A3 publication Critical patent/WO2009043649A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/047—Box-like arrangements of PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Abstract

The invention relates to a three-dimensional electrical circuit board structure comprising at least two interconnected planar, two-dimensional substrates that have contact elements and that are preferably equipped on both sides with electronic components, the substrates forming substrate walls that are arranged at an angle of <180° relative to each other, thereby defining a three-dimensional body with interspaces between the substrate walls. Electrically conducting elements expediently conduct the electric current from one substrate wall to an adjacent substrate wall. The invention also relates to a circuit board base having an electrical circuit board structure of the above type and to a three-dimensional circuit assembly that consists of at least two such three-dimensional circuit board structures.
PCT/EP2008/061346 2007-09-28 2008-08-28 Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures WO2009043649A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007046493A DE102007046493A1 (en) 2007-09-28 2007-09-28 Three-dimensional electronic circuit carrier structure, as well as circuit base carrier having the circuit carrier structure as a functional component and three-dimensional circuit arrangement consisting of at least two such three-dimensional circuit carrier structures
DE102007046493.4 2007-09-28

Publications (2)

Publication Number Publication Date
WO2009043649A2 WO2009043649A2 (en) 2009-04-09
WO2009043649A3 true WO2009043649A3 (en) 2009-10-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/061346 WO2009043649A2 (en) 2007-09-28 2008-08-28 Three-dimensional electronic circuit board structure, and circuit board base comprising said circuit board structure as a functional component and three-dimensional circuit assembly consisting of at least two such three-dimensional circuit board structures

Country Status (2)

Country Link
DE (1) DE102007046493A1 (en)
WO (1) WO2009043649A2 (en)

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DE102010062759A1 (en) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Printed circuit board arrangement e.g. high-density interconnect printed circuit board arrangement, for gear box control device of motor car, has two printed circuit boards extending adjacent to each other in common plane
DE102010062758A1 (en) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Printed circuit board arrangement for electronic control device used in motor car, has contacting element overmolded with overmold material, which is provided at end face of upper circuit board contacted with lower circuit board
DE102010062757A1 (en) 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Printed circuit board arrangement for electronic control device used in motor car, has engaging elements which are provided with discrete contacting elements for electrically contacting with complementarily formed contact areas
DE102011111488A1 (en) * 2011-08-30 2013-02-28 Schoeller-Electronics Gmbh PCB System
US8971048B2 (en) * 2013-03-06 2015-03-03 Alliant Techsystems Inc. Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package
DE102013216493A1 (en) * 2013-08-20 2015-02-26 Zf Friedrichshafen Ag Printed circuit board having a first rigid circuit board portion and a second rigid circuit board portion and method of providing the circuit board
DE102014117536B4 (en) * 2014-11-28 2019-04-18 Sick Ag Method for the lateral connection of two printed circuit boards and optoelectronic sensor with two angularly connected printed circuit boards
DE102015216419B4 (en) 2015-08-27 2022-06-15 Vitesco Technologies GmbH Electronic device having a housing with a printed circuit board arranged therein
WO2017090460A1 (en) * 2015-11-27 2017-06-01 ソニー株式会社 Substrate device and method for producing substrate device
DE102016003325B4 (en) 2016-03-21 2018-08-02 Gebr. Krallmann Gmbh Method for producing a plastic component having a plurality of carrier parts with at least one electrical conductor track and thus produced plastic component
JP2019057606A (en) * 2017-09-20 2019-04-11 株式会社村田製作所 Electronic module
RU2688581C1 (en) * 2018-06-18 2019-05-21 Юрий Борисович Соколов Method for manufacturing three-dimensional electronic module with high density of components and device
KR102337901B1 (en) * 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 Printed Circuit Board Assembly and Method for Manufacturing the Same
EP3709777A1 (en) 2019-03-11 2020-09-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Solder-free component carrier connection using an elastic element, and method
DE102021102220A1 (en) 2020-02-10 2021-08-12 Ged Gesellschaft Für Elektronik Und Design Mbh Printed circuit board and printed circuit board composite
CN111627897A (en) * 2020-05-28 2020-09-04 上海先方半导体有限公司 Three-dimensional packaging structure and preparation method thereof
US20220322532A1 (en) * 2021-04-05 2022-10-06 Indiana Integrated Circuits, LLC Three-Dimensional Printed Circuit Substrate Assembly
JP2022178257A (en) * 2021-05-19 2022-12-02 タイコエレクトロニクスジャパン合同会社 circuit board assembly
JP7057957B1 (en) 2021-07-12 2022-04-21 太陽インキ製造株式会社 Connection type three-dimensional molded circuit parts and circuit connection structure
DE202022100279U1 (en) 2022-01-19 2023-04-21 WAGO Verwaltungsgesellschaft mit beschränkter Haftung PCB assembly

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Also Published As

Publication number Publication date
WO2009043649A2 (en) 2009-04-09
DE102007046493A1 (en) 2009-04-09

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