WO2009057075A3 - Optoelectronic device with light directing arrangement and method of forming the arrangement - Google Patents
Optoelectronic device with light directing arrangement and method of forming the arrangement Download PDFInfo
- Publication number
- WO2009057075A3 WO2009057075A3 PCT/IB2008/054534 IB2008054534W WO2009057075A3 WO 2009057075 A3 WO2009057075 A3 WO 2009057075A3 IB 2008054534 W IB2008054534 W IB 2008054534W WO 2009057075 A3 WO2009057075 A3 WO 2009057075A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- arrangement
- optoelectronic device
- forming
- light directing
- directing arrangement
- Prior art date
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/1812—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System including only AIVBIV alloys, e.g. SiGe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/34—Materials of the light emitting region containing only elements of group IV of the periodic system
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08846163.7A EP2218113B1 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
US12/740,597 US8729582B2 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
CN2008801235261A CN101911320B (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
JP2010531626A JP5550558B2 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device having a light guiding mechanism and method for forming the mechanism |
ZA2010/02944A ZA201002944B (en) | 2007-11-01 | 2010-04-28 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
US14/278,181 US8969112B2 (en) | 2007-11-01 | 2014-05-15 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ZA200709436 | 2007-11-01 | ||
ZA2007/09436 | 2007-11-01 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/740,597 A-371-Of-International US8729582B2 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
US14/278,181 Division US8969112B2 (en) | 2007-11-01 | 2014-05-15 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009057075A2 WO2009057075A2 (en) | 2009-05-07 |
WO2009057075A3 true WO2009057075A3 (en) | 2010-03-18 |
Family
ID=40591580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2008/054534 WO2009057075A2 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
Country Status (7)
Country | Link |
---|---|
US (2) | US8729582B2 (en) |
EP (1) | EP2218113B1 (en) |
JP (1) | JP5550558B2 (en) |
CN (1) | CN101911320B (en) |
TW (1) | TWI467789B (en) |
WO (1) | WO2009057075A2 (en) |
ZA (1) | ZA201002944B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8759845B2 (en) * | 2008-01-21 | 2014-06-24 | Insiava (Pty) Limited | Semiconductor light emitting device utilising punch-through effects |
WO2009095886A2 (en) * | 2008-02-01 | 2009-08-06 | Insiava (Pty) Limited | Semiconductor light emitting device comprising heterojunction |
US8237832B2 (en) * | 2008-05-30 | 2012-08-07 | Omnivision Technologies, Inc. | Image sensor with focusing interconnections |
CN102292834A (en) | 2008-12-15 | 2011-12-21 | 因西亚瓦(控股)有限公司 | Silicon light emitting device utilising reach-through effects |
EP2526571B1 (en) | 2010-01-22 | 2019-05-01 | Insiava (Pty) Limited | Silicon light emitting device and method of fabricating same |
US9515227B2 (en) | 2011-09-16 | 2016-12-06 | Insiava (Pty) Limited | Near infrared light source in bulk silicon |
DE102012107794B4 (en) | 2012-08-23 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic device |
JP2016133510A (en) * | 2015-01-16 | 2016-07-25 | パーソナル ジェノミクス タイワン インコーポレイテッドPersonal Genomics Taiwan,Inc. | Optical sensor having light guiding function, and manufacturing method of the same |
KR102385941B1 (en) * | 2015-06-15 | 2022-04-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light Emitting Device Package |
KR20210023459A (en) * | 2019-08-23 | 2021-03-04 | 에스케이하이닉스 주식회사 | Image sensing device |
Citations (9)
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GB2326525A (en) * | 1997-05-20 | 1998-12-23 | Hewlett Packard Co | Concentrators for light sensor arrays |
US20030063204A1 (en) * | 2001-08-31 | 2003-04-03 | Canon Kabushiki Kaisha | Image pickup apparatus |
EP1473780A2 (en) * | 2003-04-28 | 2004-11-03 | STMicroelectronics, Inc. | Microlens integration |
US20050274871A1 (en) * | 2004-06-10 | 2005-12-15 | Jin Li | Method and apparatus for collecting photons in a solid state imaging sensor |
US20060001055A1 (en) * | 2004-02-23 | 2006-01-05 | Kazuhiko Ueno | Led and fabrication method of same |
US20060115230A1 (en) * | 2002-12-13 | 2006-06-01 | Tetsuya Komoguchi | Solid-state imaging device and production method therefor |
US20070145394A1 (en) * | 2005-12-22 | 2007-06-28 | Tatsuo Shimizu | Semiconductor light-emitting material and light emitting device |
US20070200054A1 (en) * | 2006-02-24 | 2007-08-30 | Tower Semiconductor Ltd. | Via wave guide with curved light concentrator for image sensing devices |
US20080079106A1 (en) * | 2006-10-02 | 2008-04-03 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device |
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US6111271A (en) * | 1996-03-28 | 2000-08-29 | University Of Pretoria | Optoelectronic device with separately controllable carrier injection means |
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JP4120543B2 (en) | 2002-12-25 | 2008-07-16 | ソニー株式会社 | Solid-state imaging device and manufacturing method thereof |
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-
2008
- 2008-10-31 WO PCT/IB2008/054534 patent/WO2009057075A2/en active Application Filing
- 2008-10-31 JP JP2010531626A patent/JP5550558B2/en not_active Expired - Fee Related
- 2008-10-31 US US12/740,597 patent/US8729582B2/en active Active
- 2008-10-31 EP EP08846163.7A patent/EP2218113B1/en not_active Not-in-force
- 2008-10-31 TW TW97142312A patent/TWI467789B/en not_active IP Right Cessation
- 2008-10-31 CN CN2008801235261A patent/CN101911320B/en not_active Expired - Fee Related
-
2010
- 2010-04-28 ZA ZA2010/02944A patent/ZA201002944B/en unknown
-
2014
- 2014-05-15 US US14/278,181 patent/US8969112B2/en not_active Expired - Fee Related
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GB2326525A (en) * | 1997-05-20 | 1998-12-23 | Hewlett Packard Co | Concentrators for light sensor arrays |
US20030063204A1 (en) * | 2001-08-31 | 2003-04-03 | Canon Kabushiki Kaisha | Image pickup apparatus |
US20060115230A1 (en) * | 2002-12-13 | 2006-06-01 | Tetsuya Komoguchi | Solid-state imaging device and production method therefor |
EP1473780A2 (en) * | 2003-04-28 | 2004-11-03 | STMicroelectronics, Inc. | Microlens integration |
US20060001055A1 (en) * | 2004-02-23 | 2006-01-05 | Kazuhiko Ueno | Led and fabrication method of same |
US20050274871A1 (en) * | 2004-06-10 | 2005-12-15 | Jin Li | Method and apparatus for collecting photons in a solid state imaging sensor |
US20070145394A1 (en) * | 2005-12-22 | 2007-06-28 | Tatsuo Shimizu | Semiconductor light-emitting material and light emitting device |
US20070200054A1 (en) * | 2006-02-24 | 2007-08-30 | Tower Semiconductor Ltd. | Via wave guide with curved light concentrator for image sensing devices |
US20080079106A1 (en) * | 2006-10-02 | 2008-04-03 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device |
Non-Patent Citations (2)
Title |
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DU PLESSIS M ET AL: "Low-voltage light emitting devices in silicon IC technology", PROCEEDINGS OF THE IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS (IEEE CAT. NO.05TH8778), vol. 3, 2005, IEEE PISCATAWAY, NJ, USA, pages 1145 - 1149, XP002563006, ISBN: 0-7803-8738-4 * |
SNYMAN L W ET AL: "Optical sources, integrated optical detectors, and optical waveguides in standard silicon CMOS integrated circuitry", PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING SPIE-INT. SOC. OPT. ENG USA, vol. 3953, 2000, pages 20 - 36, XP002563005, ISSN: 0277-786X * |
Also Published As
Publication number | Publication date |
---|---|
ZA201002944B (en) | 2010-12-29 |
CN101911320B (en) | 2012-11-21 |
US8969112B2 (en) | 2015-03-03 |
EP2218113A2 (en) | 2010-08-18 |
WO2009057075A2 (en) | 2009-05-07 |
US20140248728A1 (en) | 2014-09-04 |
CN101911320A (en) | 2010-12-08 |
TWI467789B (en) | 2015-01-01 |
TW200943569A (en) | 2009-10-16 |
EP2218113B1 (en) | 2016-04-27 |
JP2011503842A (en) | 2011-01-27 |
JP5550558B2 (en) | 2014-07-16 |
US8729582B2 (en) | 2014-05-20 |
US20110042701A1 (en) | 2011-02-24 |
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