WO2009066950A3 - Heat-radiating substrate and method of manufacturing the same - Google Patents

Heat-radiating substrate and method of manufacturing the same Download PDF

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Publication number
WO2009066950A3
WO2009066950A3 PCT/KR2008/006865 KR2008006865W WO2009066950A3 WO 2009066950 A3 WO2009066950 A3 WO 2009066950A3 KR 2008006865 W KR2008006865 W KR 2008006865W WO 2009066950 A3 WO2009066950 A3 WO 2009066950A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
radiating
radiating plate
thin layer
copper thin
Prior art date
Application number
PCT/KR2008/006865
Other languages
French (fr)
Other versions
WO2009066950A2 (en
Inventor
Byung Chong Kim
Original Assignee
Byung Chong Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Byung Chong Kim filed Critical Byung Chong Kim
Publication of WO2009066950A2 publication Critical patent/WO2009066950A2/en
Publication of WO2009066950A3 publication Critical patent/WO2009066950A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Abstract

Provided is a method of manufacturing a heat-radiating substrate. The heat-radiating substrate includes a heat-radiating plate provided with a protruding heat sink pattern through etching, a dielectric layer and a copper thin layer, sequentially stacked on an etch region of the heat-radiating plate, and a circuit pattern disposed on the copper thin layer except for the heat sink pattern. The heat sink pattern, protruding for contacting a surface of a heating device, is formed on the metal heat-radiating plate having a high thermal conductivity, the dielectric layer and the copper thin layer are stacked on an etched rest, and then the circuit pattern is formed. The heating device directly contacts the heat-radiating plate, to improve heat-radiating performance. Since heat-radiating members such as cooling fans, heat sinks and heat-radiating resins of the related art are not used, the degree of freedom of design for miniaturization and slimness is greatly increased, and economical production is achieved according to a simple manufacturing method.
PCT/KR2008/006865 2007-11-22 2008-11-21 Heat-radiating substrate and method of manufacturing the same WO2009066950A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070119864A KR100919539B1 (en) 2007-11-22 2007-11-22 Heat-radiating substrate and manufacturing method thereof
KR10-2007-0119864 2007-11-22

Publications (2)

Publication Number Publication Date
WO2009066950A2 WO2009066950A2 (en) 2009-05-28
WO2009066950A3 true WO2009066950A3 (en) 2009-07-09

Family

ID=40668002

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/006865 WO2009066950A2 (en) 2007-11-22 2008-11-21 Heat-radiating substrate and method of manufacturing the same

Country Status (3)

Country Link
KR (1) KR100919539B1 (en)
TW (1) TW200939909A (en)
WO (1) WO2009066950A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101233086B1 (en) * 2012-09-04 2013-02-18 주식회사 썬닉스 Refelction plate of led lighting and method thereof
US10381562B1 (en) * 2018-05-17 2019-08-13 Qualcomm Incorporated Method and apparatus for cooling of an electronic device
KR20220060943A (en) 2020-11-05 2022-05-12 우리산전 주식회사 Method for manufacturing heat radiation sintered body
KR20220101523A (en) 2021-01-11 2022-07-19 (주) 미래이피 Heat radiating sheet and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391841A (en) * 1992-12-08 1995-02-21 Quick; Nathaniel R. Laser processed coatings on electronic circuit substrates
JPH10261847A (en) * 1997-03-19 1998-09-29 Matsushita Electric Ind Co Ltd Radiating substrate for mounting electronic component
KR20040086679A (en) * 2003-04-03 2004-10-12 대한민국(서울대학교 총장) Method of etching substrate for forming various steps thereon and method of manufacturing heat sink for 3-dimension microsystem
US7161806B2 (en) * 2003-09-18 2007-01-09 Fuji Electric Systems Co., Ltd. Heat sink and method for its production

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040021040A (en) * 2002-09-02 2004-03-10 박종진 Radio frequency printed circuit board manufacturing method for high output amplifier

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391841A (en) * 1992-12-08 1995-02-21 Quick; Nathaniel R. Laser processed coatings on electronic circuit substrates
JPH10261847A (en) * 1997-03-19 1998-09-29 Matsushita Electric Ind Co Ltd Radiating substrate for mounting electronic component
KR20040086679A (en) * 2003-04-03 2004-10-12 대한민국(서울대학교 총장) Method of etching substrate for forming various steps thereon and method of manufacturing heat sink for 3-dimension microsystem
US7161806B2 (en) * 2003-09-18 2007-01-09 Fuji Electric Systems Co., Ltd. Heat sink and method for its production

Also Published As

Publication number Publication date
WO2009066950A2 (en) 2009-05-28
TW200939909A (en) 2009-09-16
KR100919539B1 (en) 2009-10-01
KR20090053170A (en) 2009-05-27

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