WO2009108311A2 - Isolated transistors and diodes and isolation and termination structures for semiconductor die - Google Patents

Isolated transistors and diodes and isolation and termination structures for semiconductor die Download PDF

Info

Publication number
WO2009108311A2
WO2009108311A2 PCT/US2009/001187 US2009001187W WO2009108311A2 WO 2009108311 A2 WO2009108311 A2 WO 2009108311A2 US 2009001187 W US2009001187 W US 2009001187W WO 2009108311 A2 WO2009108311 A2 WO 2009108311A2
Authority
WO
WIPO (PCT)
Prior art keywords
region
substrate
isolated
trench
conductivity type
Prior art date
Application number
PCT/US2009/001187
Other languages
French (fr)
Other versions
WO2009108311A3 (en
Inventor
Donald R. Disney
Richard K. Williams
Original Assignee
Advanced Analogic Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Analogic Technologies, Inc. filed Critical Advanced Analogic Technologies, Inc.
Priority to KR1020107021292A priority Critical patent/KR101303405B1/en
Priority to JP2010548708A priority patent/JP5449203B2/en
Priority to KR1020147013019A priority patent/KR101483404B1/en
Priority to KR1020137023583A priority patent/KR101456408B1/en
Priority to CN200980115026.8A priority patent/CN102037562B/en
Priority to EP09716068.3A priority patent/EP2248162A4/en
Priority to KR1020127025876A priority patent/KR101363663B1/en
Publication of WO2009108311A2 publication Critical patent/WO2009108311A2/en
Publication of WO2009108311A3 publication Critical patent/WO2009108311A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107—Substrate region of field-effect devices
    • H01L29/1075—Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107—Substrate region of field-effect devices
    • H01L29/1075—Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7809—Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
    • H01L29/7824—Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/866—Zener diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0626—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a localised breakdown region, e.g. built-in avalanching region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/063—Reduced surface field [RESURF] pn-junction structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
    • H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
    • H01L29/0856—Source regions
    • H01L29/086—Impurity concentration or distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
    • H01L29/1045—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface the doping structure being parallel to the channel length, e.g. DMOS like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/105—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with vertical doping variation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/8613—Mesa PN junction diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • LOCOS Local Oxidation Of Silicon
  • Complete electrical isolation is necessary to integrate certain types of transistors including bipolar junction transistors and various metal-oxide-semiconductor (MOS) transistors including power DMOS transistors. Complete isolation is also needed to allow CMOS control circuitry to float to potentials well above the substrate potential during operation. Complete isolation is especially important in the fabrication of analog, power, and mixed signal integrated circuits.
  • MOS metal-oxide-semiconductor
  • CMOS wafer fabrication offers high density transistor integration, it does not facilitate compete electrical isolation of its fabricated devices.
  • the NMOS transistor contained in a conventional CMOS transistor pair fabricated in a P-type substrate has its P-well "body” or “back-gate” shorted to the substrate and therefore cannot float above ground.
  • This restriction is substantial, preventing the use of the NMOS as a high-side switch, an analog pass transistor, or as a bidirectional switch. It, also makes current sensing more difficult and often precludes the use of integral source-body shorts needed to make the NMOS more avalanche rugged.
  • the P-type substrate in a conventional CMOS is normally biased to the most negative on-chip potential (defined as "ground”), every NMOS is necessarily subjected to unwanted substrate noise.
  • junction isolation While not as ideal as dielectric isolation, where oxide surrounds each device or circuit, junction isolation has historically offered the best compromise between manufacturing cost and isolation performance.
  • electrically isolating a CMOS requires a complex structure comprising the growth of an N-type epitaxial layer atop a P-type substrate surrounded by an annular ring of deep P-type isolation electrically connecting to the P-type substrate to form a completely isolated N-type epitaxial island having P- type material below and on all sides. Growth of epitaxial layers is slow and time consuming, representing the single most expensive step in semiconductor wafer fabrication.
  • NBL N-type buried layer
  • As arsenic
  • Sb antimony
  • the NBL is comprised of a slow diffuser, this pre-epitaxy diffusion process can take more than ten hours. Only after isolation is complete, can conventional CMOS fabrication commence, adding considerable time and complexity to the manufacturing of junction isolated processes compared to conventional CMOS processes.
  • junction isolation fabrication methods rely on high temperature processing to form deep diffused junctions and to grow the epitaxial layer. These high temperature processes are expensive and difficult to perform, and they are incompatible with large diameter wafer manufacturing, exhibiting substantial variation in device electrical performance and preventing high transistor integration densities.
  • Another disadvantage of junction isolation is the area wasted by the isolation structures and otherwise not available for fabricating active transistors or circuitry. As a further complication, with junction isolation, the design rules (and the amount of wasted area) depend on the maximum voltage of the isolated devices. Obviously, conventional epitaxial junction isolation, despite its electrical benefits, is too area wasteful to remain a viable technology option for mixed signal and power integrated circuits.
  • Dopants implanted through a LOCOS field oxide, form conformal isolation structures that in turn are used to enclose and isolate multi- voltage CMOS, bipolar transistors and other devices from the common P-type substrate.
  • the same process is able to integrated bipolar transistors, and a variety of double junction DMOS power devices, all tailored using conformal and chained ion implantations of differing dose and energy.
  • a fully-isolated BCD process with implants contoured to LOCOS, while easily implemented using a 0.35 micron based technology, may encounter problems when scaled to smaller dimensions and tighter line widths.
  • the narrow LOCOS bird's beak however may cause the width of the isolation sidewall to become narrowed and isolation quality may be sacrificed.
  • Embodiments according to this invention are generally formed in a semiconductor substrate of a first conductivity type that does not include an epitaxial layer.
  • An embodiment of an isolated lateral DMOS transistor (LDMOS) includes a floor isolation region of a second conductivity type and a dielectric- filled trench extending from a surface of the substrate to the floor isolation region, the trench and the floor isolation region forming an isolated pocket of the substrate.
  • LDMOS isolated lateral DMOS transistor
  • the LDMOS includes a well of the first conductivity type in the isolated pocket which serves as the body of the LDMOS, the well comprising a shallow portion and a deep portion, the shallow portion being located adjacent the surface of the substrate, the deep portion being located below the shallow portion, the shallow portion having a first doping concentration, the deep portion having a second doping concentration, the second doping concentration being greater than the first doping concentration.
  • the trench in a second embodiment of an isolated LDMOS, includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material.
  • the isolated pocket includes a drift region of the second conductivity type adjacent the drain region and a shallow trench isolation (STI) structure adjacent the surface of the substrate in the isolated pocket, the STI structure being enclosed on its sides and bottom by the drift region.
  • the isolated pocket may also include submerged snapback control regions of the first conductivity type beneath the source region and/or the drain region.
  • the trench in an isolated quasi- vertical DMOS (QVDMOS) according to the invention, includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material.
  • the isolated pocket includes a source region of the second conductivity type at the surface of the substrate. Current flows horizontally from the source region through a channel region that underlies a gate and then vertically to the floor isolation region, which is comprised in the drain of the QVDMOS.
  • the trench in an isolated junction field-effect transistor (JFET) according to the invention, the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material.
  • the isolated pocket includes source and drain regions of the first conductivity type and a top gate region of the second conductivity type at the surface of the substrate. A channel region of the first conductivity type is located between a bottom of the top gate region and the floor isolation region.
  • the isolated pocket includes source and drain regions of the second conductivity type and a top gate region of the first conductivity type at the surface of the substrate and a bottom gate region of the first conductivity type submerged in the substrate.
  • a channel region of the second conductivity type is located between a bottom of the top gate region and an upper boundary of the bottom gate region.
  • the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material.
  • the isolated pocket contains source and drain regions of a second conductivity type and the doping concentration of the channel region under the gate is substantially equal to the background doping concentration of the substrate.
  • a submerged region of the first conductivity type may be formed at least partially under the gate.
  • the isolated pocket contains an anode region of the first conductivity type.
  • the floor isolation region serves as the cathode of the diode and is contacted via the conductive material in the trench.
  • the invention also comprises termination structures for the region bordering the trench outside the isolated pocket.
  • a guard ring of the first conductivity type may be formed at a surface of the substrate outside the isolated pocket and the floor isolation region may extend laterally beyond the outside edge of the trench.
  • a submerged region of the first conductivity type may be formed below the guard ring.
  • a drift region of the second conductivity type may be formed adjacent the surface of the substrate and the trench outside the isolated pocket.
  • One or more additional trenches comprising a dielectric material may be formed in the drift region or in the substrate between the trench and the guard ring.
  • Fig. 1 illustrates a cross-sectional view of a fully isolated N-channel lateral DMOS (LDMOS).
  • LDMOS fully isolated N-channel lateral DMOS
  • Fig. 2 illustrates a cross-sectional view of an alternative embodiment of an isolated N-channel LDMOS.
  • Fig. 3 illustrates a cross-sectional view of an isolated N-channel quasi- vertical
  • Fig. 4 illustrates a cross-sectional view of an isolated P-channel JFET.
  • Fig. 5 illustrates a cross-sectional view of an isolated N-channel JFET.
  • Fig. 6 illustrates a cross-sectional view of an N-channel depletion-mode MOSFET.
  • Fig. 7 illustrates a cross-sectional view of an isolated diode.
  • Fig. 8 illustrates a cross-sectional view of an isolated Zener diode.
  • Figs. 9A-9D illustrate cross-sectional views of termination structures for controlling surface electric fields and reducing charging and other time-dependent surface-related phenomena.
  • Fig. 1 illustrates a schematic cross-section of a fully isolated N-channel lateral DMOS (LDMOS) 400 made in accordance with this invention and fabricated without the need for epitaxial deposition or high temperature diffusions.
  • the LDMOS 400 is fabricated in isolated P-type region 464.
  • P-type region 464 and the lateral DMOS 400 fabricated within P-type region 464 are isolated from P-type substrate 461 by high-energy implanted N-type floor isolation region 462 and dielectric-filled trenches 463A and 463B.
  • the N-channel LDMOS 400 comprises: N+ drain region 468B, spaced from gate 474 by implanted N-type lightly-doped drain (LDD) region 469 and spaced from trench 463B by LDD 476 region, gate 474, preferably comprising polysilicon and/or suicide, gate oxide layer 472, N+ source region 468 A, P+ body contact region 467 contacting a P- type well 465 comprising the body region of LDMOS 400.
  • P-type well 465 may include at least an upper portion 465 A and a lower portion 465B or any number of regions comprising implants of varying energy and dose.
  • the deeper portion 465B of P-type well 465 may preferably comprise a higher doping concentration than the upper portion 465A of P-type well 465.
  • Floor isolation region 462 is electrically contacted from the surface of the substrate 461 through N-type well 466 and N+ contact region 468D.
  • Well 466 is located in an area bounded by trenches 463 A and 463C.
  • trenches 463B and 463C may be parts of a single trench that is in the shape of a closed figure, and trench 463 A may divide the portion of the substrate 461 enclosed by trenches 463B and 463C into a first section containing source region 468A, drain region 468B and P-type well 465 and a second section containing well 466.
  • the DN floor isolation region 462 may be electrically biased to the potential of DMOS drain region 468B, P-type well 464, substrate 461, or some other fixed or variable potential.
  • the maximum voltage differential between floor isolation region 462 and drain region 468B is limited to N-I-N punch-through breakdown voltage between floor isolation region 462 and drain region 468B, while the maximum voltage differential between floor isolation region 462 and P-type well 465 is set by P-I-N reach-through breakdown voltage between floor isolation region 462 and P-type well 465.
  • the floor isolation region 462 and drain region 468B are electrically shorted together, eliminating the possibility of N-I-N punch-through breakdown and limiting the B V D ss of LDMOS 400 to the P-I-N avalanche breakdown voltage between P-type well 465 and DN floor isolation region 462.
  • the floor isolation region 462 and the substrate 461 are electrically shorted together so that the P-type well 465 can be biased below ground, i.e. to a potential more negative than the substrate 461.
  • Another alternative is to "float" the floor isolation region 462, in which case the potential of the floor isolation region 462 can change until N-I-N punch-through to N+ drain region 468B occurs, whereupon the potential of floor isolation region 462 will follow the potential of drain region 468B.
  • isolated N-channel LDMOS 400 is asymmetric, it may also be constructed symmetrically with the N+ drain region 468B at the center. Alternatively, LDMOS 400 could be constructed with the P-type well 465 at the center.
  • N-type termination region 478 biased at the potential of drain region 468B may surround trench 463C and increase thebreakdown voltage of LDMOS 400 relative to substrate 461. If trenches 463B ad 463C are in the ' shape of a closed figure, termination region 478 may lie adjacent the entire outer periphery of the trenches 463B and 463C. LDMOS 400 may also be surrounded by P+ substrate contact region 474 and/or by deep implanted P-type region 475.
  • Fig. 2 shows a schematic cross-section of an isolated N-channel lateral DMOS 300, fabricated in a P-type region 341B which is isolated from P-type substrate 341A by deep implanted N-type floor isolation region 360 and filled trench 361.
  • filled trench 361 surrounds the LDMOS 300 to provide lateral isolation, while the floor isolation region 360 provides vertical isolation.
  • Trench 361 comprises a conductive central portion 363 that is laterally surrounded by insulating sidewalls 364, which isolate the conductive central portion 363. The conductive central portion 363 provides electrical contact between floor isolation region 360 and the surface of the substrate 341A, for ease of interconnection.
  • the LDMOS 300 comprises a central N+ drain region 348B and N-type drift region 342 circumscribed by gate 355 disposed atop gate dielectric layer 362.
  • a dedicated implant is used to form drift region 342, in order to tailor its doping profile for optimized performance of LDMOS 300.
  • an N-type well that is shared with other CMOS devices can be substituted for dedicated drift region 342, compromising the performance of LDMOS 300 but reducing processing costs.
  • Gate 355 overlaps a portion of drift region 342 and is surrounded by N+ source region 348A and P+ body contact region 347.
  • P- type well 343 may comprise a non-monotonic doping profile including at least an upper portion 343A and a lower portion 343B or any number of regions comprising implants of varying energy and dose.
  • the lower portion 343B of P-type well 343 preferably comprises a higher doping concentration than the upper portion 343 A of P-type well 343. In the embodiment shown in Fig.
  • the end of P-type well 343 is laterally spaced apart from drift region 342.
  • the channel of LDMOS 300 has two doping concentrations, the heavier concentration of P-type well 343, which sets the threshold voltage of LDMOS 300 and prevents punch-through breakdown, and the lighter concentration of region 34 IB which determines avalanche breakdown voltage and impact ionization of LDMOS 300.
  • P-type well 343 abuts drift region 342, in which case the channel of LDMOS 300 has a single doping concentration equal to the doping concentration of P-type well 343.
  • Drift region 342 is partially disposed beneath shallow trench isolation (STI) structure 346, i.e., a shallow trench filled with silicon oxide.
  • STI shallow trench isolation
  • One benefit of including STI 346 above drift region 345 is that the net integrated charge of drift region 342 under STI 346 is reduced because dopant is removed during the formation of the trench.
  • variable ⁇ represents the percentage of the implanted normal charge in drift region 342 remaining after formation of STI 346, i.e. the dopant not removed by etching the trench which holds STI 346.
  • the reduced charge causes a reduction in surface electric fields under gate 355, and in conjunction with the field plate effect of gate 355, reduces impact ionization and the risk of hot carrier damage.
  • LDMOS 300 Controlling the location of breakdown and the magnitude of impact ionization is an important consideration in fabricating reliable and robust high voltage and power LDMOS devices. Inclusion of the body region 343 in LDMOS 300 helps prevent punch- through breakdown and reduces the sensitivity of LDMOS 300 to bipolar injection and snapback by limiting the gain of the parasitic lateral NPN bipolar transistor present in LDMOS 300, comprising the emitter represented by source region 348A, the base represented by body region 343 and region 341B, and the collector represented by drift region 342 and drain region 348B. The body of LDMOS 300 cannot, however, prevent snapback due to modulation of the background doping concentration resulting from localized impact ionization in the drift region 342.
  • an implanted deep P-type region 365 is disposed beneath the source region 348A and is used to suppress the electric field under the gate and move the high electric field location away from regions of high current density.
  • This approach is referred to herein as "subsurface shielding," and deep P-type region 365 may be referred to as a subsurface shielding region.
  • the second approach is to clamp the maximum drain voltage of LDMOS 300 to a voltage below the onset of snapback so that the snapback phenomenon does not occur. This method is referred to herein as "drain clamping" and may be implemented by the inclusion of a DP region 366 beneath drain region 348B.
  • DP region 366 concentrates the vertical electric field beneath the drain region 348B to force bulk, i.e. non-surface, avalanche breakdown far away from hot- carrier sensitive gate dielectric layer 362.
  • DP region 366 may be referred to as a drain clamping region.
  • a lateral DMOS transistor An alternative to a lateral DMOS transistor is the quasi- vertical DMOS transistor.
  • the current flows laterally, Le. parallel to the wafer surface, through its lightly doped drift region.
  • the quasi- vertical DMOS current flows laterally and vertically, i.e. substantially perpendicular to the wafer surface. The current flows from the DMOS surface channel region of the device down into a heavily doped subsurface layer where it flows laterally, and then flows vertically back up to the drain contact, hence the name "quasi-vertical”.
  • FIG. 3 A schematic cross-section of an N-channel quasi- vertical DMOS (QVDMOS) transistor 500 is shown in Fig. 3.
  • This device includes gate 510, which is preferably formed as a series of stripes or closed geometric forms, N+ source regions 506, P-type body regions 504, P+ body contact regions 505.
  • the P-body regions are formed inside N- type well 502, which comprises the drift region of the QVDMOS 500 and overlaps onto N-type floor isolation region 501, which is submerged in P-type substrate 511 and is comprised in the drain of the QVDMOS 500.
  • Filled trench 507 laterally encloses the QVDMOS 500, providing isolation from other devices fabricated in substrate 500.
  • Filled trench 507 has a conductive material 508 in a central portion that extends from the surface of substrate 500 down to floor isolation region 501.
  • the conductive material 508 is laterally surrounded by an insulating material 509 that lines the sidewalls of the trench 507, such that the conductive material 508 is electrically isolated from N- well 502 and substrate 511.
  • N+ source regions 506 laterally through channels formed at the surface of P-body regions 504, vertically down through N- well 502, laterally through floor isolation region 501, and vertically up through the conductive material 508 in filled trench 507.
  • contact to the source regions 506 and the drain (floor isolation region 501) are easily achieved from the surface of the substrate 511.
  • P-body regions 504 may be implanted prior to the formation of gate 510 in which case they will not be self- aligned to gate 510.
  • P-body regions 504 may be implanted using a large angle tilt implantation, after gate 510 is formed, with the result that P-body regions 504 are self-aligned to the edges of gate 510.
  • Large angle tilt implantation allows the formation of a relatively large overlap of P-body regions 504 with gates 510, without the need for high-temperature diffusions.
  • sidewall spacers and N- type lightly doped source regions may be formed at each edge of gate 505, as an artifact of CMOS fabrication using the same gate layer. If a dedicated gate layer is used to form gate 505, as shown in Fig. 3, the sidewall spacers will not be present in the device. In such a case the N+ source regions will self align to the gate 510; otherwise, the N+ source regions self-align to the sidewall spacers and the N- source extensions self align to the gate.
  • Such devices are convenient in forming current sources for start-up circuitry when other transistors are not yet operational, since the transistors are normally "on".
  • the threshold voltage In a depletion-mode N-channel field effect transistor, the threshold voltage must be less than zero volts, so that even at a zero volt or greater gate bias condition V GS ⁇ 0, the device is in its conducting state.
  • An N-channel JFET is also "on" at a zero volt gate drive, although the threshold voltage of a JFET is referred to as its "pinch-off voltage, or V pn .
  • N-channel depletion-mode devices and JFETs can only be turned off by biasing their gates to a negative potential. Conversely, a positive gate bias increases the drain bias of an N-channel device.
  • N-channel JFETs are limited in their maximum gate drive to the forward biased voltage of the gate-to-source P-N diode.
  • P-channel JFETs also conduct at a zero- volt gate drive, but a positive gate drive, i.e. the gate biased to a potential more positive than the source, is required to turn them off.
  • P-channel JFET 100 includes P+ drain region 107, P-type channel region 111, an N-type top gate comprising N+ region 106 and optional N-type region 108, a bottom gate comprising N-type floor isolation region 102, and P+ source region 105.
  • the length L G of the N-type gate is preferably 1 to 20 microns and is defined by the length of the top gate - N+ region 106 or N-type region 108, whichever is longer.
  • JFET 100 is isolated from P-type substrate 101 vertically by floor isolation region 102 and laterally by filled trench 104.
  • the floor isolation region 102 serves as the bottom gate of the JFET 100.
  • Electrical contact from the surface of the substrate 101 is provided by conductive material 112 at the central portion of the filled trench 104.
  • Insulating material 113 laterally surrounds the conductive material 112 to insulate conductive material 112 from substrate 101 and P-channel region 111.
  • the bottom gate (floor isolation region 102) is electrically biased at a potential "BG,” and this bottom gate bias BG may vary in proportion with the potential "TG" of the top gate (N+ region and N-type region 108), or BG may be set at a fixed potential.
  • the pinch-off voltage of JFET 100 is determined by the doping concentration of channel region 111 and the vertical dimension of channel region 111 between NB region 108 and floor isolation region 102.
  • the doping concentration of region 111 is substantially the same as the doping concentration of substrate 101.
  • the doping concentration of region 111 is increased by implanting additional dopant to tailor the pinch-off voltage of JFET 100.
  • Shallow trenches 110 may be disposed around N-type region 108 to isolate N- type region 108 from source 105 and drain 107.
  • trenches 110 are shallower and narrower than trench 104, since trenches 110 should not contact floor isolation region 102.
  • Trenches 107 are preferably filled completely with a dielectric material.
  • JFET 200 includes N+ drain region 203, N-type channel region 204, a P-type top gate comprising P+ region 205 and optional P-type region 206, a bottom gate comprising isolated P-type pocket 207 and optional deep implanted P-type region 208, and P+ source region 209.
  • the bottom gate is electrically biased at a potential "BG" through P-type well 210 and P+ bottom gate contact region 211.
  • the bottom gate bias BG may vary in potential in proportion with the potential "TG" of the top gate, or BG may be set at a fixed potential.
  • the pinch-off voltage of JFET 200 is determined by the doping concentration and thickness of N-channel region 204.
  • JFET 200 is isolated from P-type substrate 201 vertically by N-type floor isolation region 202 and laterally by filled trench 214. Electrical contact from the surface of the substrate is provided by conductive material 212 in a central portion of the filled trench
  • Insulating material 213 laterally surrounds the conductive material 212 to insulate conductive material 212 from substrate 201 and P-type regions 210, 208, and 207.
  • Shallow trenches 210 may be disposed around P-tyep region 206 to isolate the top gate 206 from source region 209 and drain region 203.
  • shallow trenches 215 may be used to laterally isolate P+ bottom gate contact region 211 from channel region
  • trenches 210 and 215 are shallower and narrower than trench 214, since trenches 210 and 215 should not contact floor isolation region 202.
  • Trenches 210 and 215 are preferably filled completely with a dielectric material.
  • the floor isolation region 202 may be eliminated, such that the bottom gate of the N-channel JFET 200 comprises the P-type substrate 201 and/or the optional deep P-type region 208.
  • MOSFET 600 is constructed similarly to the isolated N-channel lateral DMOS transistor 400 shown in Fig. 1, but without a well comparable to P-type well 465 present in the isolated pocket 664. Without the P-type well in isolated pocket 664, the threshold voltage of MOSFET 600 is set by the thickness of gate oxide layer 672 and the doping concentration of the isolated P-type pocket 664, which is substantially equal to the background doping concentration of substrate 661. This threshold voltage may vary from approximately -0.3V to +0.3V. Even if the threshold voltage is slightly positive, the
  • the depletion- mode MOSFET 600 of Fig. 6 comprises an N+ drain region 668B with an N-type LDD drift region 669 between gate 674 and drain 668B. Gate 674 sits atop gate dielectric layer 672. LDD region 678 extends from drain 668B to filled trench 663. Lightly-doped source (LDS) region 671, an artifact of the CMOS process, is present under sidewall spacer 673 A.
  • LDS Lightly-doped source
  • N+ source region 668A self aligns to sidewall spacer 673 A.
  • Deep P-type region 675 is disposed beneath at least a portion of gate 674 and may extend laterally beyond gate 674 to underlap LDD drift region 669, to reduce impact ionization and suppress snapback. Deep P-type region 675 is electrically tied to the surface of substrate 661 through P+ body contact region 667. The concentration of P-type pocket 664 in channel region 676 beneath gate 674 is substantially the same as that of P-type substrate 661.
  • the upper portion of DP region 675 is sufficiently deep to avoid doping channel region 676, such that the threshold voltage of MOSFET 600 is minimized.
  • the doping and depth of deep P-type region 675 may be adjusted to allow its doping profile to supplement the doping in channel region 676, in order to increase the threshold voltage to a desired value.
  • the depletion- mode MOSFET of Fig. 6 is isolated from P-type substrate 661 vertically by N-type floor isolation region 602 and laterally by filled trench 663, which laterally encloses isolated pocket 664. Electrical contact from the surface of substrate 661 to floor isolation region 662 is provided by conductive material 680 in a central portion of the filled trench 663. Insulating material 681 laterally surrounds the conductive material 680 to insulate conductive material from substrate 661 and isolated pocket 664.
  • depletion-mode MOSFETs may be made similar to the LDMOS 300 of Fig. 2 but without P-body region 343, such that the threshold voltage is low and is set by the doping of isolated pocket 34 IB and possibly the upper portion ofdeep P-type region 365.
  • FIG. 7 illustrates one embodiment of an isolated diode 700 comprising an N-type buried region 702, which serves as the cathode of diode 700, and one or more P+ contact regions 707 enclosed within isolated P-type regions 706, which serve as the anode of diode 700.
  • Filled trench 705 laterally surrounds the diode 700, providing lateral isolation, while N-type buried region 702 provides vertical isolation from P-type substrate 701. Electrical contact from the surface of the substrate 701 to N-type buried region 702 is provided by conductive material 712 at a central portion of the filled trench 705.
  • Insulating material 713 laterally surrounds the conductive material 712 to insulate conductive material from substrate 701 and P-type regions 706.
  • a dielectric layer 715 is formed on the surface of substrate 701 and patterned to form openings for anode contacts 716 and cathode contacts 717.
  • Additional filled trenches 708 may be included to divide the diode into smaller P- type regions and to provide a lower resistance contact to buried region 702.
  • isolated P-type regions 706 may have substantially the same doping concentration as P-type substrate 701. This provides the lowest possible doping at the cathode-anode junction, allowing the highest breakdown voltage BV.
  • an additional P-type well implant may be introduced to increase the doping concentration in regions 706, providing decreased resistance in the anode region and offering the ability to customize the BV to a lower value.
  • the additional P-type well 706 has a non-monotonic doping profile comprising at least an upper portion 706 A and a lower portion 706B, which is preferably formed using a boron chain implant of differing energies and doses.
  • the lower portion 706B has a higher doping concentration than the upper portion 706A.
  • a Zener voltage clamp i.e. a P-N diode meant to normally operate in reverse bias, and frequently in avalanche breakdown mode, to clamp a circuit voltage to maximum value.
  • Zener diodes must often exhibit well controlled breakdown voltages between 6V and 20V, and this requires the use of P-N junctions with relatively high doping concentrations to produce such low BVs.
  • Surface junctions such as a junction formed by overlapping shallow N+ to P+ regions, do not make reliable Zener diode clamps because their cross sectional area is too thin, and avalanche breakdown occurs near a silicon-oxide interface.
  • Fig. 8 illustrates an isolated Zener diode 800 comprising heavily-doped buried N- type cathode region 802 and heavily-doped P-type anode region 803.
  • P-type anode region 803 is preferably formed by a high-dose, high-energy implant.
  • Contact from the surface of substrate 801 to anode region 803 is provided by P+ contact region 805 and optional P- well 804. If P- well 804 is not included, the doping in this region will be substantially the same as the doping of substrate 801.
  • Electrical contact from the surface of the substrate to cathode region 802 is provided by conductive material 812 at a central portion of filled trench 806.
  • Insulating material 813 laterally surrounds the conductive material 812 to insulate conductive material from substrate 801 and P-type regions 803 and 804.
  • a dielectric layer 815 is formed on the surface of substrate 801 and patterned to form openings for anode contacts 816 and cathode contacts 817. Additional filled trenches 807 may be included to divide the diode 800 into smaller anode regions 803 and to provide a lower resistance contact to cathode region 802.
  • the cathode region 802 is biased at a potential equal to or above that of grounded substrate 801.
  • the anode region 803 may be reverse biased relative to the cathode, up to the breakdown voltage set by the doping on each side of the anode-cathode junction.
  • This BV may be adjusted by the depth and dose of the high- energy implants that are preferably used to form the buried anode and cathode regions.
  • the buried anode region may be formed by an implant of phosphorous with a dose in the range of 1E13 to 1E14 cm '2 and energy of 2000 to 3000 keV
  • the cathode region may be formed by an implant of boron with a dose in the range of 1E13 to 1E14 cm “2 and energy in the range of 400 to 2000 keV.
  • High-Voltage Termination of Type-I Isolated Devices Another desirable feature of power integrated circuits is the ability to allow isolated devices to "float" to high voltages above the substrate potential. The maximum voltage of a floating device or isolated pocket does not depend on what is inside the isolated pocket, but instead depends on the way the pocket is terminated, i.e. what features border the exterior of the trench isolation sidewall.
  • One approach is to terminate isolated regions with filled trenches and constrain the lateral extent of the floor isolation region to the outer edge of the trenches.
  • these trenches may be filled entirely with dielectric material or the trenches may comprise conductive material in the center and dielectric material laterally enclosing the conductive material. While this approach is capable of supporting high voltages, it does not control surface electric fields and may be subject to charging and other time-dependent surface-related phenomena.
  • Another approach is to surround or border the exterior of the sidewall isolation trenches with one or more implanted junctions, field relief regions, and channel stops, collectively comprising a high- voltage "termination," as illustrated in a series of cross sections shown in Figs. 9A-9D.
  • a P-type pocket is isolated laterally from the surrounding substrate by a filled trench and is isolated vertically by an implanted floor isolation region.
  • the filled trenches are shown to comprise conductive material in their centers, completely dielectrically filled trenches may be used in other embodiments.
  • the isolated P-type pockets shown in the cross sections of Figs. 9A-9D may contain any combination of CMOS, DMOS transistors, JFETs and depletion-mode MOSFETs, NPN and PNP bipolar transistors, Zener and rectifier diodes, or even passive components such as resistors and capacitors, all constructed and made in accordance with this invention.
  • Each figure includes a "CL" center-line marking, indicating an axis of rotation, such that the P-type pocket is enclosed on all sides by an isolating trench having an annular or closed geometry.
  • the DN floor isolation region is shown to extend beyond the trench by a distance L DN , a dimension which may be varied parametrically from zero to tens of microns in length.
  • the lateral edge of the DN floor isolation region is coincident with the outer edge of the trench.
  • the DN floor isolation region is assumed to be electrically biased either through contact to an overlapping N-type well (as shown, for example, in Fig. 1) or by the conductive material in the filled trench.
  • the outer edge of the termination is identified by a P+ guard ring, preventing surface inversion and functioning as a channel stop. Dimensions are referenced to the trench's outer edge and to the inner edge of the P+ guard ring.
  • the P+ guard ring may include an optional deep P-type DP layer beneath it to contain minority carriers laterally and may also include an intervening P-type well as part of the guard ring structure.
  • FIG. 9A shows an edge termination structure including N-type floor isolation region 902 and filled trench 904, which together isolate P-type pocket 903, and any device it may contain, from P-type substrate 901.
  • Floor isolation region 902 extends beyond trench 904 by a distance L DN -
  • L DN When floor isolation region 902 is biased to a more positive potential than substrate 901, a depletion region spreads into the portion of substrate 901 above the extended portion of floor isolation region 902, and this depletion region reduces the electric field at the silicon surface.
  • the lateral distance between the edge of floor isolation region 902 and P+ guard ring 905 and underlying submerged P- type region 906 is labeled by the dimension L SUB and may range from one micron to tens- of- microns.
  • FIG. 9B shows an edge termination structure including floor isolation region 912 and filled trench 914, which together isolate P-type pocket 913, and any device it may contain, from P-type substrate 911.
  • Floor isolation region 912 extends beyond trench 914 by a distance L DN - Deep implanted N-type drift region 917 of length L D3 is contacted by N+ region 918.
  • Drift region 917 may be biased at the same potential as floor isolation region 912, or may be biased to a fixed potential.
  • the outer edge of drift region 917 is spaced from P+ guard ring 915 and underlying deep P-type region 916 by a space L SUB -
  • drift region 917 The function of drift region 917 is to suppress surface electric fields by exhibiting two-dimensional depletion spreading effects. Provided that drift region 917 has sufficiently low integrated charge Q D , typically in the range of IxIO 12 cm “2 to 5xlO 12 cm “ 2 , increasing the applied voltage on the P-N junction formed by drift region 917 and P- type substrate 911 results in depletion spreading into drift region 917 and eventually the complete depletion of drift region 917. Under such conditions, drift region 917 behaves similar to intrinsic material in a P-I-N diode, and the surface electric field drops substantially in accordance with the well-known RESURF principle of two-dimensional electrically- induced P-I-N junctions. Furthermore, the vertical overlap of drift region 917 above floor isolation region 912 enhances the depletion of P-type substrate 911 in the intervening region between the regions 917 and 912, further reducing the surface electric fields within the termination.
  • Fig. 9C shows an edge termination structure including floor isolation region 922 and filled trench 924, which together isolate P-type pocket 923, and any device it may contain, from P-type substrate 921.
  • Floor isolation region 922 extends beyond trench 924 by a distance L DN and spaced from trench 927 by a distance L SUB -
  • the gap between floor isolation region 922 and trench 927 i.e. a gap of dimension L SUB
  • the potential of P-type region 928 begins to float. Cut off from the substrate potential, the surface electric field drops.
  • a P+ guard ring 925 circumscribes the device and may include underlying deep P-type region 926.
  • Fig. 9D shows an edge termination structure including floor isolation region 932 and filled trench 934, which together isolate P-type pocket 933, and any device it may contain, from P-type substrate 931.
  • Floor isolation region 932 extends beyond trench 934.
  • Deep implanted N-type drift region 937 is contacted by N+ region 938.
  • Drift region 937 may be biased at the same potential as floor isolation region 932, or may be biased to a fixed potential.
  • one or more filled trenches 939 are formed. Each of trenches 939 reduce the local doping concentration in drift region 937, which allows the adjacent portion of drift region 937 to be depleted more easily, further lowering the local electric field.
  • trenches 939 are narrower and shallower than trench 934 and are completely filled with dielectric material.
  • the device is designed such that the proportion of the surface area of trenches 939 to the surface area of drift region 937 changes increases as the lateral distance from trench 934 increases. This allows the portions of drift region 937 that are farthest away from isolated pocket 933 to deplete more easily than the portions that are closer to pocket 933, thus providing an effect similar to a graded junction termination, which is effective in minimizing the lateral distance required to support a given BV.
  • drift region 937 is spaced from P+ guard ring 935 and underlying deep P-type region 936 by a space LSUB-
  • the embodiments described herein are intended to be illustrative and not limiting. Many alternative embodiments within the broad scope of this invention will be obvious to persons of skill in the art from the descriptions herein.

Abstract

Various integrated circuit devices, in particular a transistor, are formed inside an isolation structure which includes a floor isolation region and a trench extending from the surface of the substrate to the floor isolation region. The trench may be filled with a dielectric material or may have a conductive material in a central portion with a dielectric layer lining the walls of the trench. Various techniques for terminating the isolation structure by extending the floor isolation region beyond the trench, using a guard ring, and a forming a drift region are described.

Description

ISOLATED TRANSISTORS AND DIODES AND ISOLATION AND TERMINATION STRUCTURES FOR SEMICONDUCTOR DIE
CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation- in-part of Application No. 12/069,941, filed
February 14, 2008.
This application is a continuation- in-part of Application No. 11/890,993, filed
August 8, 2007. Application No. 11/890,993 is a continuation of Application No.
11/444,102, filed May 31, 2006, and a continuation- in-part of the following applications: (a) Application No.10/918,316, filed August 14, 2004, which is a divisional of
Application No. 10/218,668, filed August 14, 2002, now U.S. Patent No. 6,900,091, and
(b) Application No. 11/204,215, filed August 15, 2005, which is a divisional of
Application No. 10/218,678, filed August 14, 2002, now U.S. Patent No. 6,943,426.
Each of the foregoing applications and patents is incorporated herein by reference in its entirety.
BACKGROUND OF THE INVENTION
In the fabrication of semiconductor integrated circuit (IC) chips, it is frequently necessary to electrically isolate different devices from the semiconductor substrate and from each other. One method of providing lateral isolation among devices is the well- known Local Oxidation Of Silicon (LOCOS) process, wherein the surface of the chip is masked with a relatively hard material such as silicon nitride and a thick oxide layer is grown thermally in an opening in the mask. Another way is to etch a trench in the silicon and then fill the trench with a dielectric material such as silicon oxide, also known as trench isolation. While both LOCOS and trench isolation can prevent unwanted surface conduction between devices, they do not facilitate complete electrical isolation.
Complete electrical isolation is necessary to integrate certain types of transistors including bipolar junction transistors and various metal-oxide-semiconductor (MOS) transistors including power DMOS transistors. Complete isolation is also needed to allow CMOS control circuitry to float to potentials well above the substrate potential during operation. Complete isolation is especially important in the fabrication of analog, power, and mixed signal integrated circuits.
Although conventional CMOS wafer fabrication offers high density transistor integration, it does not facilitate compete electrical isolation of its fabricated devices. In particular, the NMOS transistor contained in a conventional CMOS transistor pair fabricated in a P-type substrate has its P-well "body" or "back-gate" shorted to the substrate and therefore cannot float above ground. This restriction is substantial, preventing the use of the NMOS as a high-side switch, an analog pass transistor, or as a bidirectional switch. It, also makes current sensing more difficult and often precludes the use of integral source-body shorts needed to make the NMOS more avalanche rugged. Moreover since the P-type substrate in a conventional CMOS is normally biased to the most negative on-chip potential (defined as "ground"), every NMOS is necessarily subjected to unwanted substrate noise.
Complete electrical isolation of integrated devices has typically been achieved using triple diffusions, epitaxial junction isolation, or dielectric isolation. The most common form of complete electrical isolation is junction isolation. While not as ideal as dielectric isolation, where oxide surrounds each device or circuit, junction isolation has historically offered the best compromise between manufacturing cost and isolation performance. With conventional junction isolation, electrically isolating a CMOS requires a complex structure comprising the growth of an N-type epitaxial layer atop a P-type substrate surrounded by an annular ring of deep P-type isolation electrically connecting to the P-type substrate to form a completely isolated N-type epitaxial island having P- type material below and on all sides. Growth of epitaxial layers is slow and time consuming, representing the single most expensive step in semiconductor wafer fabrication. The isolation diffusion is also expensive, performed using high temperature diffusion for extended durations (up to 18 hours). To be able to suppress parasitic devices, a heavily-doped N-type buried layer (NBL) must also be masked and selectively introduced prior to epitaxial growth. To minimize up-diffusion during epitaxial growth and isolation diffusion, a slow diffuser such as arsenic (As) or antimony (Sb) is chosen to form the N-type buried layer (NBL). Prior to epitaxial growth however, this NBL layer must be diffused sufficiently deep to reduce its surface concentration, or otherwise the concentration control of the epitaxial growth will be adversely impacted. Because the NBL is comprised of a slow diffuser, this pre-epitaxy diffusion process can take more than ten hours. Only after isolation is complete, can conventional CMOS fabrication commence, adding considerable time and complexity to the manufacturing of junction isolated processes compared to conventional CMOS processes.
Junction isolation fabrication methods rely on high temperature processing to form deep diffused junctions and to grow the epitaxial layer. These high temperature processes are expensive and difficult to perform, and they are incompatible with large diameter wafer manufacturing, exhibiting substantial variation in device electrical performance and preventing high transistor integration densities. Another disadvantage of junction isolation is the area wasted by the isolation structures and otherwise not available for fabricating active transistors or circuitry. As a further complication, with junction isolation, the design rules (and the amount of wasted area) depend on the maximum voltage of the isolated devices. Obviously, conventional epitaxial junction isolation, despite its electrical benefits, is too area wasteful to remain a viable technology option for mixed signal and power integrated circuits.
An alternative method for isolating integrated circuit devices is disclosed in United States Patent No. 6,855,985, which is incorporated herein by reference. The modular process disclosed therein for integrating fully-isolated CMOS, bipolar and DMOS (BCD) transistors can be achieved without the need for high temperature diffusions or epitaxy. This modular BCD process uses high-energy (MeV) ion implantation through contoured oxides to produce self-forming isolation structures with virtually no high temperature processing required. This low-thermal budget process benefits from "as-implanted" dopant profiles that undergo little or no dopant redistribution since no high temperature processes are employed.
Dopants, implanted through a LOCOS field oxide, form conformal isolation structures that in turn are used to enclose and isolate multi- voltage CMOS, bipolar transistors and other devices from the common P-type substrate. The same process is able to integrated bipolar transistors, and a variety of double junction DMOS power devices, all tailored using conformal and chained ion implantations of differing dose and energy.
While this "epi-less" low thermal budget technique has many advantages over non- isolated and epitaxial junction isolation processes, in some cases its reliance on LOCOS may impose certain limitations on its ability to scale to smaller dimensions and higher transistor densities. The principle of conformal ion implantation in the LOCOS based modular BCD process is that by implanting through a thicker oxide layer dopant atoms will be located closer to the silicon surface and by implanting through a thinner oxide layer, the implanted atoms will be located deeper in the silicon, away from the surface.
As described, a fully-isolated BCD process with implants contoured to LOCOS, while easily implemented using a 0.35 micron based technology, may encounter problems when scaled to smaller dimensions and tighter line widths. To improve CMOS transistor integration density, it may be preferable to reduce the bird's beak taper of the field oxide layer to a more vertical structure so that the devices can placed more closely for higher packing densities. The narrow LOCOS bird's beak however may cause the width of the isolation sidewall to become narrowed and isolation quality may be sacrificed.
In situations where these problems are significant, it would be desirable to have a new strategy for fully isolating integrated circuit devices, particularly high- voltage devices, that uses a low-thermal-budget, epi-less integrated circuit process, but one that eliminates the narrow sidewall problem described above to allow more compact isolation structures.
BRIEF SUMMARY OF THE INVENTION Embodiments according to this invention are generally formed in a semiconductor substrate of a first conductivity type that does not include an epitaxial layer. An embodiment of an isolated lateral DMOS transistor (LDMOS) includes a floor isolation region of a second conductivity type and a dielectric- filled trench extending from a surface of the substrate to the floor isolation region, the trench and the floor isolation region forming an isolated pocket of the substrate. The LDMOS includes a well of the first conductivity type in the isolated pocket which serves as the body of the LDMOS, the well comprising a shallow portion and a deep portion, the shallow portion being located adjacent the surface of the substrate, the deep portion being located below the shallow portion, the shallow portion having a first doping concentration, the deep portion having a second doping concentration, the second doping concentration being greater than the first doping concentration.
In a second embodiment of an isolated LDMOS, the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material. The isolated pocket includes a drift region of the second conductivity type adjacent the drain region and a shallow trench isolation (STI) structure adjacent the surface of the substrate in the isolated pocket, the STI structure being enclosed on its sides and bottom by the drift region. The isolated pocket may also include submerged snapback control regions of the first conductivity type beneath the source region and/or the drain region.
In an isolated quasi- vertical DMOS (QVDMOS) according to the invention, the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material. The isolated pocket includes a source region of the second conductivity type at the surface of the substrate. Current flows horizontally from the source region through a channel region that underlies a gate and then vertically to the floor isolation region, which is comprised in the drain of the QVDMOS. In an isolated junction field-effect transistor (JFET) according to the invention, the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material. The isolated pocket includes source and drain regions of the first conductivity type and a top gate region of the second conductivity type at the surface of the substrate. A channel region of the first conductivity type is located between a bottom of the top gate region and the floor isolation region.
In a second embodiment of an isolated junction field-effect transistor (JFET), the isolated pocket includes source and drain regions of the second conductivity type and a top gate region of the first conductivity type at the surface of the substrate and a bottom gate region of the first conductivity type submerged in the substrate. A channel region of the second conductivity type is located between a bottom of the top gate region and an upper boundary of the bottom gate region. In a depletion-mode MOSFET according to the invention, the trench includes a conductive material at a central portion and the walls of the trench are lined with a dielectric material. The isolated pocket contains source and drain regions of a second conductivity type and the doping concentration of the channel region under the gate is substantially equal to the background doping concentration of the substrate. To reduce impact ionization and suppress snapback, a submerged region of the first conductivity type may be formed at least partially under the gate.
In an isolated diode according to the invention, the isolated pocket contains an anode region of the first conductivity type. The floor isolation region serves as the cathode of the diode and is contacted via the conductive material in the trench.
The invention also comprises termination structures for the region bordering the trench outside the isolated pocket. A guard ring of the first conductivity type may be formed at a surface of the substrate outside the isolated pocket and the floor isolation region may extend laterally beyond the outside edge of the trench. A submerged region of the first conductivity type may be formed below the guard ring. A drift region of the second conductivity type may be formed adjacent the surface of the substrate and the trench outside the isolated pocket. One or more additional trenches comprising a dielectric material may be formed in the drift region or in the substrate between the trench and the guard ring.. BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
Fig. 1 illustrates a cross-sectional view of a fully isolated N-channel lateral DMOS (LDMOS).
Fig. 2 illustrates a cross-sectional view of an alternative embodiment of an isolated N-channel LDMOS. Fig. 3 illustrates a cross-sectional view of an isolated N-channel quasi- vertical
DMOS.
Fig. 4 illustrates a cross-sectional view of an isolated P-channel JFET.
Fig. 5 illustrates a cross-sectional view of an isolated N-channel JFET.
Fig. 6 illustrates a cross-sectional view of an N-channel depletion-mode MOSFET.
Fig. 7 illustrates a cross-sectional view of an isolated diode. Fig. 8 illustrates a cross-sectional view of an isolated Zener diode.
Figs. 9A-9D illustrate cross-sectional views of termination structures for controlling surface electric fields and reducing charging and other time-dependent surface-related phenomena. DETAILED DESCRIPTION OF THE INVENTION
Fig. 1 illustrates a schematic cross-section of a fully isolated N-channel lateral DMOS (LDMOS) 400 made in accordance with this invention and fabricated without the need for epitaxial deposition or high temperature diffusions. The LDMOS 400 is fabricated in isolated P-type region 464. P-type region 464 and the lateral DMOS 400 fabricated within P-type region 464 are isolated from P-type substrate 461 by high-energy implanted N-type floor isolation region 462 and dielectric-filled trenches 463A and 463B. The N-channel LDMOS 400 comprises: N+ drain region 468B, spaced from gate 474 by implanted N-type lightly-doped drain (LDD) region 469 and spaced from trench 463B by LDD 476 region, gate 474, preferably comprising polysilicon and/or suicide, gate oxide layer 472, N+ source region 468 A, P+ body contact region 467 contacting a P- type well 465 comprising the body region of LDMOS 400. P-type well 465 may include at least an upper portion 465 A and a lower portion 465B or any number of regions comprising implants of varying energy and dose. The deeper portion 465B of P-type well 465 may preferably comprise a higher doping concentration than the upper portion 465A of P-type well 465.
Sidewall spacers 473 and lightly-doped source extension 471 are artifacts of CMOS fabrication and are not beneficially required for proper operation of the LDMOS 400. Because of its relatively high doping concentration, the effect of source extension 471 on the LDMOS 400 is negligible. Floor isolation region 462 is electrically contacted from the surface of the substrate 461 through N-type well 466 and N+ contact region 468D. Well 466 is located in an area bounded by trenches 463 A and 463C. As will be apparent, trenches 463B and 463C may be parts of a single trench that is in the shape of a closed figure, and trench 463 A may divide the portion of the substrate 461 enclosed by trenches 463B and 463C into a first section containing source region 468A, drain region 468B and P-type well 465 and a second section containing well 466. The DN floor isolation region 462 may be electrically biased to the potential of DMOS drain region 468B, P-type well 464, substrate 461, or some other fixed or variable potential. The maximum voltage differential between floor isolation region 462 and drain region 468B is limited to N-I-N punch-through breakdown voltage between floor isolation region 462 and drain region 468B, while the maximum voltage differential between floor isolation region 462 and P-type well 465 is set by P-I-N reach-through breakdown voltage between floor isolation region 462 and P-type well 465. In one embodiment, the floor isolation region 462 and drain region 468B are electrically shorted together, eliminating the possibility of N-I-N punch-through breakdown and limiting the B VDss of LDMOS 400 to the P-I-N avalanche breakdown voltage between P-type well 465 and DN floor isolation region 462. In another embodiment, the floor isolation region 462 and the substrate 461 are electrically shorted together so that the P-type well 465 can be biased below ground, i.e. to a potential more negative than the substrate 461. Another alternative is to "float" the floor isolation region 462, in which case the potential of the floor isolation region 462 can change until N-I-N punch-through to N+ drain region 468B occurs, whereupon the potential of floor isolation region 462 will follow the potential of drain region 468B.
While the isolated N-channel LDMOS 400 is asymmetric, it may also be constructed symmetrically with the N+ drain region 468B at the center. Alternatively, LDMOS 400 could be constructed with the P-type well 465 at the center.
While the outer edge of the LDMOS 400 can coincide with trenches 463B and 463C, in an alternative embodiment, N-type termination region 478 biased at the potential of drain region 468B may surround trench 463C and increase thebreakdown voltage of LDMOS 400 relative to substrate 461. If trenches 463B ad 463C are in the ' shape of a closed figure, termination region 478 may lie adjacent the entire outer periphery of the trenches 463B and 463C. LDMOS 400 may also be surrounded by P+ substrate contact region 474 and/or by deep implanted P-type region 475.
Fig. 2 shows a schematic cross-section of an isolated N-channel lateral DMOS 300, fabricated in a P-type region 341B which is isolated from P-type substrate 341A by deep implanted N-type floor isolation region 360 and filled trench 361. In a preferred embodiment, filled trench 361 surrounds the LDMOS 300 to provide lateral isolation, while the floor isolation region 360 provides vertical isolation. Trench 361 comprises a conductive central portion 363 that is laterally surrounded by insulating sidewalls 364, which isolate the conductive central portion 363. The conductive central portion 363 provides electrical contact between floor isolation region 360 and the surface of the substrate 341A, for ease of interconnection.
The LDMOS 300 comprises a central N+ drain region 348B and N-type drift region 342 circumscribed by gate 355 disposed atop gate dielectric layer 362. In a preferred embodiment, a dedicated implant is used to form drift region 342, in order to tailor its doping profile for optimized performance of LDMOS 300. In another embodiment, an N-type well that is shared with other CMOS devices can be substituted for dedicated drift region 342, compromising the performance of LDMOS 300 but reducing processing costs.
Gate 355 overlaps a portion of drift region 342 and is surrounded by N+ source region 348A and P+ body contact region 347. P-type well 343, preferably comprising a boron chain implanted region having a non-Gaussian or non-monotonic doping concentration profile, underlaps gate 355 and forms the body region of LDMOS 300. P- type well 343 may comprise a non-monotonic doping profile including at least an upper portion 343A and a lower portion 343B or any number of regions comprising implants of varying energy and dose. The lower portion 343B of P-type well 343 preferably comprises a higher doping concentration than the upper portion 343 A of P-type well 343. In the embodiment shown in Fig. 2, the end of P-type well 343 is laterally spaced apart from drift region 342. As a result, the channel of LDMOS 300 has two doping concentrations, the heavier concentration of P-type well 343, which sets the threshold voltage of LDMOS 300 and prevents punch-through breakdown, and the lighter concentration of region 34 IB which determines avalanche breakdown voltage and impact ionization of LDMOS 300. In another embodiment, P-type well 343 abuts drift region 342, in which case the channel of LDMOS 300 has a single doping concentration equal to the doping concentration of P-type well 343.
Drift region 342 is partially disposed beneath shallow trench isolation (STI) structure 346, i.e., a shallow trench filled with silicon oxide. One benefit of including STI 346 above drift region 345 is that the net integrated charge of drift region 342 under STI 346 is reduced because dopant is removed during the formation of the trench. The net integrated charge of drift region 342, measured in units of atoms / cm2 is the integral of the dopant concentration of drift region 342 from the silicon oxide interface at the bottom of STI 346 to the bottom of the drift region 342, namely x,(dnft) QDtrench =
Figure imgf000011_0001
≡ (X ■ QD "ircnch
The variable α represents the percentage of the implanted normal charge in drift region 342 remaining after formation of STI 346, i.e. the dopant not removed by etching the trench which holds STI 346. The reduced charge causes a reduction in surface electric fields under gate 355, and in conjunction with the field plate effect of gate 355, reduces impact ionization and the risk of hot carrier damage.
Controlling the location of breakdown and the magnitude of impact ionization is an important consideration in fabricating reliable and robust high voltage and power LDMOS devices. Inclusion of the body region 343 in LDMOS 300 helps prevent punch- through breakdown and reduces the sensitivity of LDMOS 300 to bipolar injection and snapback by limiting the gain of the parasitic lateral NPN bipolar transistor present in LDMOS 300, comprising the emitter represented by source region 348A, the base represented by body region 343 and region 341B, and the collector represented by drift region 342 and drain region 348B. The body of LDMOS 300 cannot, however, prevent snapback due to modulation of the background doping concentration resulting from localized impact ionization in the drift region 342.
In accordance with this invention, two methods are used to control snapback. First, referring again to Fig. 2, an implanted deep P-type region 365 is disposed beneath the source region 348A and is used to suppress the electric field under the gate and move the high electric field location away from regions of high current density. This approach is referred to herein as "subsurface shielding," and deep P-type region 365 may be referred to as a subsurface shielding region. The second approach is to clamp the maximum drain voltage of LDMOS 300 to a voltage below the onset of snapback so that the snapback phenomenon does not occur. This method is referred to herein as "drain clamping" and may be implemented by the inclusion of a DP region 366 beneath drain region 348B. DP region 366 concentrates the vertical electric field beneath the drain region 348B to force bulk, i.e. non-surface, avalanche breakdown far away from hot- carrier sensitive gate dielectric layer 362. DP region 366 may be referred to as a drain clamping region.
An alternative to a lateral DMOS transistor is the quasi- vertical DMOS transistor. In a lateral DMOS, the current flows laterally, Le. parallel to the wafer surface, through its lightly doped drift region. In the quasi- vertical DMOS current flows laterally and vertically, i.e. substantially perpendicular to the wafer surface. The current flows from the DMOS surface channel region of the device down into a heavily doped subsurface layer where it flows laterally, and then flows vertically back up to the drain contact, hence the name "quasi-vertical".
A schematic cross-section of an N-channel quasi- vertical DMOS (QVDMOS) transistor 500 is shown in Fig. 3. This device includes gate 510, which is preferably formed as a series of stripes or closed geometric forms, N+ source regions 506, P-type body regions 504, P+ body contact regions 505. The P-body regions are formed inside N- type well 502, which comprises the drift region of the QVDMOS 500 and overlaps onto N-type floor isolation region 501, which is submerged in P-type substrate 511 and is comprised in the drain of the QVDMOS 500.
Filled trench 507 laterally encloses the QVDMOS 500, providing isolation from other devices fabricated in substrate 500. Filled trench 507 has a conductive material 508 in a central portion that extends from the surface of substrate 500 down to floor isolation region 501. The conductive material 508 is laterally surrounded by an insulating material 509 that lines the sidewalls of the trench 507, such that the conductive material 508 is electrically isolated from N- well 502 and substrate 511. When the QVDMOS 500 is in the on-state, electron current flows from N+ source regions 506, laterally through channels formed at the surface of P-body regions 504, vertically down through N- well 502, laterally through floor isolation region 501, and vertically up through the conductive material 508 in filled trench 507. Thus contact to the source regions 506 and the drain (floor isolation region 501) are easily achieved from the surface of the substrate 511.
P-body regions 504 may be implanted prior to the formation of gate 510 in which case they will not be self- aligned to gate 510. Alternatively, P-body regions 504 may be implanted using a large angle tilt implantation, after gate 510 is formed, with the result that P-body regions 504 are self-aligned to the edges of gate 510. Large angle tilt implantation allows the formation of a relatively large overlap of P-body regions 504 with gates 510, without the need for high-temperature diffusions.
In another embodiment of the QVDMOS (not shown), sidewall spacers and N- type lightly doped source regions may be formed at each edge of gate 505, as an artifact of CMOS fabrication using the same gate layer. If a dedicated gate layer is used to form gate 505, as shown in Fig. 3, the sidewall spacers will not be present in the device. In such a case the N+ source regions will self align to the gate 510; otherwise, the N+ source regions self-align to the sidewall spacers and the N- source extensions self align to the gate.
The techniques of subsurface shielding and drain clamping, described above, can be combined with any variety of drain and drain extension structure made in accordance with this invention. JFETs and Depletion-Mode MOSFETs
Unlike conventional enhancement- mode MOSFETs which are "normally-off ' devices, JFETs and depletion- mode MOSFETs conduct drain current even when their gate is biased to their source potential, i.e. they conduct at VGS = 0. Such devices are convenient in forming current sources for start-up circuitry when other transistors are not yet operational, since the transistors are normally "on".
In a depletion-mode N-channel field effect transistor, the threshold voltage must be less than zero volts, so that even at a zero volt or greater gate bias condition VGS ≥ 0, the device is in its conducting state. An N-channel JFET is also "on" at a zero volt gate drive, although the threshold voltage of a JFET is referred to as its "pinch-off voltage, or Vpn. N-channel depletion-mode devices and JFETs can only be turned off by biasing their gates to a negative potential. Conversely, a positive gate bias increases the drain bias of an N-channel device. N-channel JFETs, however, are limited in their maximum gate drive to the forward biased voltage of the gate-to-source P-N diode. P-channel JFETs also conduct at a zero- volt gate drive, but a positive gate drive, i.e. the gate biased to a potential more positive than the source, is required to turn them off.
A schematic cross-section of an isolated P-channel JFET 100 is shown in Fig. 4. P-channel JFET 100 includes P+ drain region 107, P-type channel region 111, an N-type top gate comprising N+ region 106 and optional N-type region 108, a bottom gate comprising N-type floor isolation region 102, and P+ source region 105. The length LG of the N-type gate is preferably 1 to 20 microns and is defined by the length of the top gate - N+ region 106 or N-type region 108, whichever is longer.
JFET 100 is isolated from P-type substrate 101 vertically by floor isolation region 102 and laterally by filled trench 104. The floor isolation region 102 serves as the bottom gate of the JFET 100. Electrical contact from the surface of the substrate 101 is provided by conductive material 112 at the central portion of the filled trench 104. Insulating material 113 laterally surrounds the conductive material 112 to insulate conductive material 112 from substrate 101 and P-channel region 111. The bottom gate (floor isolation region 102) is electrically biased at a potential "BG," and this bottom gate bias BG may vary in proportion with the potential "TG" of the top gate (N+ region and N-type region 108), or BG may be set at a fixed potential.
The pinch-off voltage of JFET 100 is determined by the doping concentration of channel region 111 and the vertical dimension of channel region 111 between NB region 108 and floor isolation region 102. In one embodiment, the doping concentration of region 111 is substantially the same as the doping concentration of substrate 101. In another embodiment, the doping concentration of region 111 is increased by implanting additional dopant to tailor the pinch-off voltage of JFET 100.
Shallow trenches 110 may be disposed around N-type region 108 to isolate N- type region 108 from source 105 and drain 107. In a preferred embodiment, trenches 110 are shallower and narrower than trench 104, since trenches 110 should not contact floor isolation region 102. Trenches 107 are preferably filled completely with a dielectric material.
A schematic cross-section of an isolated N-channel JFET 200 is shown in Fig. 5. JFET 200 includes N+ drain region 203, N-type channel region 204, a P-type top gate comprising P+ region 205 and optional P-type region 206, a bottom gate comprising isolated P-type pocket 207 and optional deep implanted P-type region 208, and P+ source region 209. The bottom gate is electrically biased at a potential "BG" through P-type well 210 and P+ bottom gate contact region 211. The bottom gate bias BG may vary in potential in proportion with the potential "TG" of the top gate, or BG may be set at a fixed potential. The pinch-off voltage of JFET 200 is determined by the doping concentration and thickness of N-channel region 204.
JFET 200 is isolated from P-type substrate 201 vertically by N-type floor isolation region 202 and laterally by filled trench 214. Electrical contact from the surface of the substrate is provided by conductive material 212 in a central portion of the filled trench
214. Insulating material 213 laterally surrounds the conductive material 212 to insulate conductive material 212 from substrate 201 and P-type regions 210, 208, and 207.
Shallow trenches 210 may be disposed around P-tyep region 206 to isolate the top gate 206 from source region 209 and drain region 203. In addition, shallow trenches 215 may be used to laterally isolate P+ bottom gate contact region 211 from channel region
204, source region 209 and drain region 203. In a preferred embodiment, trenches 210 and 215 are shallower and narrower than trench 214, since trenches 210 and 215 should not contact floor isolation region 202. Trenches 210 and 215 are preferably filled completely with a dielectric material. In another embodiment, the floor isolation region 202 may be eliminated, such that the bottom gate of the N-channel JFET 200 comprises the P-type substrate 201 and/or the optional deep P-type region 208.
A schematic cross-section of an N-channel depletion-mode MOSFET 600 is shown in Fig. 6. MOSFET 600 is constructed similarly to the isolated N-channel lateral DMOS transistor 400 shown in Fig. 1, but without a well comparable to P-type well 465 present in the isolated pocket 664. Without the P-type well in isolated pocket 664, the threshold voltage of MOSFET 600 is set by the thickness of gate oxide layer 672 and the doping concentration of the isolated P-type pocket 664, which is substantially equal to the background doping concentration of substrate 661. This threshold voltage may vary from approximately -0.3V to +0.3V. Even if the threshold voltage is slightly positive, the
MOSFET 600 will still conduct sufficient current at VGS = 0 to be used in start-up circuitry.
Snapback effects in depletion-mode N-channel MOSFETs are similar to those in enhancement mode MOSFETs. The structures to prevent snapback in the LDMOS 300 shown in Fig. 2 may be applied to depletion-mode devices in any combination. The depletion- mode MOSFET 600 of Fig. 6 comprises an N+ drain region 668B with an N-type LDD drift region 669 between gate 674 and drain 668B. Gate 674 sits atop gate dielectric layer 672. LDD region 678 extends from drain 668B to filled trench 663. Lightly-doped source (LDS) region 671, an artifact of the CMOS process, is present under sidewall spacer 673 A. N+ source region 668A self aligns to sidewall spacer 673 A. Deep P-type region 675 is disposed beneath at least a portion of gate 674 and may extend laterally beyond gate 674 to underlap LDD drift region 669, to reduce impact ionization and suppress snapback. Deep P-type region 675 is electrically tied to the surface of substrate 661 through P+ body contact region 667. The concentration of P-type pocket 664 in channel region 676 beneath gate 674 is substantially the same as that of P-type substrate 661. In a preferred embodiment, the upper portion of DP region 675 is sufficiently deep to avoid doping channel region 676, such that the threshold voltage of MOSFET 600 is minimized. In other embodiments, the doping and depth of deep P-type region 675 may be adjusted to allow its doping profile to supplement the doping in channel region 676, in order to increase the threshold voltage to a desired value.
The depletion- mode MOSFET of Fig. 6 is isolated from P-type substrate 661 vertically by N-type floor isolation region 602 and laterally by filled trench 663, which laterally encloses isolated pocket 664. Electrical contact from the surface of substrate 661 to floor isolation region 662 is provided by conductive material 680 in a central portion of the filled trench 663. Insulating material 681 laterally surrounds the conductive material 680 to insulate conductive material from substrate 661 and isolated pocket 664.
Other embodiments of depletion-mode MOSFETs may be made similar to the LDMOS 300 of Fig. 2 but without P-body region 343, such that the threshold voltage is low and is set by the doping of isolated pocket 34 IB and possibly the upper portion ofdeep P-type region 365. Isolated Diodes
In many power applications, an isolated high voltage rectifier diode is desirable, for example, to re-circulate inductor current during the break-before-make interval in switching converters. Fig. 7 illustrates one embodiment of an isolated diode 700 comprising an N-type buried region 702, which serves as the cathode of diode 700, and one or more P+ contact regions 707 enclosed within isolated P-type regions 706, which serve as the anode of diode 700. Filled trench 705 laterally surrounds the diode 700, providing lateral isolation, while N-type buried region 702 provides vertical isolation from P-type substrate 701. Electrical contact from the surface of the substrate 701 to N-type buried region 702 is provided by conductive material 712 at a central portion of the filled trench 705. Insulating material 713 laterally surrounds the conductive material 712 to insulate conductive material from substrate 701 and P-type regions 706. A dielectric layer 715 is formed on the surface of substrate 701 and patterned to form openings for anode contacts 716 and cathode contacts 717.
Additional filled trenches 708 may be included to divide the diode into smaller P- type regions and to provide a lower resistance contact to buried region 702. In a preferred embodiment, isolated P-type regions 706 may have substantially the same doping concentration as P-type substrate 701. This provides the lowest possible doping at the cathode-anode junction, allowing the highest breakdown voltage BV. Alternatively, an additional P-type well implant may be introduced to increase the doping concentration in regions 706, providing decreased resistance in the anode region and offering the ability to customize the BV to a lower value. In one embodiment, the additional P-type well 706 has a non-monotonic doping profile comprising at least an upper portion 706 A and a lower portion 706B, which is preferably formed using a boron chain implant of differing energies and doses. In one embodiment the lower portion 706B has a higher doping concentration than the upper portion 706A. In power integrated circuits, there is often a need to form a Zener voltage clamp, i.e. a P-N diode meant to normally operate in reverse bias, and frequently in avalanche breakdown mode, to clamp a circuit voltage to maximum value. To provide proper protection, Zener diodes must often exhibit well controlled breakdown voltages between 6V and 20V, and this requires the use of P-N junctions with relatively high doping concentrations to produce such low BVs. Surface junctions, such as a junction formed by overlapping shallow N+ to P+ regions, do not make reliable Zener diode clamps because their cross sectional area is too thin, and avalanche breakdown occurs near a silicon-oxide interface. Thus, it is preferable to form Zener diode clamps using buried P-N junctions to achieve subsurface avalanche breakdown.
Fig. 8 illustrates an isolated Zener diode 800 comprising heavily-doped buried N- type cathode region 802 and heavily-doped P-type anode region 803. P-type anode region 803 is preferably formed by a high-dose, high-energy implant. Contact from the surface of substrate 801 to anode region 803 is provided by P+ contact region 805 and optional P- well 804. If P- well 804 is not included, the doping in this region will be substantially the same as the doping of substrate 801. Electrical contact from the surface of the substrate to cathode region 802 is provided by conductive material 812 at a central portion of filled trench 806. Insulating material 813 laterally surrounds the conductive material 812 to insulate conductive material from substrate 801 and P-type regions 803 and 804. A dielectric layer 815 is formed on the surface of substrate 801 and patterned to form openings for anode contacts 816 and cathode contacts 817. Additional filled trenches 807 may be included to divide the diode 800 into smaller anode regions 803 and to provide a lower resistance contact to cathode region 802.
In typical operation, the cathode region 802 is biased at a potential equal to or above that of grounded substrate 801. The anode region 803 may be reverse biased relative to the cathode, up to the breakdown voltage set by the doping on each side of the anode-cathode junction. This BV may be adjusted by the depth and dose of the high- energy implants that are preferably used to form the buried anode and cathode regions. By way of example, the buried anode region may be formed by an implant of phosphorous with a dose in the range of 1E13 to 1E14 cm'2 and energy of 2000 to 3000 keV, and the cathode region may be formed by an implant of boron with a dose in the range of 1E13 to 1E14 cm"2 and energy in the range of 400 to 2000 keV. High-Voltage Termination of Type-I Isolated Devices Another desirable feature of power integrated circuits is the ability to allow isolated devices to "float" to high voltages above the substrate potential. The maximum voltage of a floating device or isolated pocket does not depend on what is inside the isolated pocket, but instead depends on the way the pocket is terminated, i.e. what features border the exterior of the trench isolation sidewall.
One approach, illustrated throughout this disclosure, is to terminate isolated regions with filled trenches and constrain the lateral extent of the floor isolation region to the outer edge of the trenches. As discussed previously, these trenches may be filled entirely with dielectric material or the trenches may comprise conductive material in the center and dielectric material laterally enclosing the conductive material. While this approach is capable of supporting high voltages, it does not control surface electric fields and may be subject to charging and other time-dependent surface-related phenomena. Another approach is to surround or border the exterior of the sidewall isolation trenches with one or more implanted junctions, field relief regions, and channel stops, collectively comprising a high- voltage "termination," as illustrated in a series of cross sections shown in Figs. 9A-9D. In each illustration, a P-type pocket is isolated laterally from the surrounding substrate by a filled trench and is isolated vertically by an implanted floor isolation region. Although the filled trenches are shown to comprise conductive material in their centers, completely dielectrically filled trenches may be used in other embodiments.
The isolated P-type pockets shown in the cross sections of Figs. 9A-9D may contain any combination of CMOS, DMOS transistors, JFETs and depletion-mode MOSFETs, NPN and PNP bipolar transistors, Zener and rectifier diodes, or even passive components such as resistors and capacitors, all constructed and made in accordance with this invention. Each figure includes a "CL" center-line marking, indicating an axis of rotation, such that the P-type pocket is enclosed on all sides by an isolating trench having an annular or closed geometry. In each example, the DN floor isolation region is shown to extend beyond the trench by a distance LDN, a dimension which may be varied parametrically from zero to tens of microns in length. When LDN is zero, the lateral edge of the DN floor isolation region is coincident with the outer edge of the trench. The DN floor isolation region is assumed to be electrically biased either through contact to an overlapping N-type well (as shown, for example, in Fig. 1) or by the conductive material in the filled trench. The outer edge of the termination is identified by a P+ guard ring, preventing surface inversion and functioning as a channel stop. Dimensions are referenced to the trench's outer edge and to the inner edge of the P+ guard ring. The P+ guard ring may include an optional deep P-type DP layer beneath it to contain minority carriers laterally and may also include an intervening P-type well as part of the guard ring structure. Fig. 9A shows an edge termination structure including N-type floor isolation region 902 and filled trench 904, which together isolate P-type pocket 903, and any device it may contain, from P-type substrate 901. Floor isolation region 902 extends beyond trench 904 by a distance LDN- When floor isolation region 902 is biased to a more positive potential than substrate 901, a depletion region spreads into the portion of substrate 901 above the extended portion of floor isolation region 902, and this depletion region reduces the electric field at the silicon surface. The lateral distance between the edge of floor isolation region 902 and P+ guard ring 905 and underlying submerged P- type region 906 is labeled by the dimension LSUB and may range from one micron to tens- of- microns. Fig. 9B shows an edge termination structure including floor isolation region 912 and filled trench 914, which together isolate P-type pocket 913, and any device it may contain, from P-type substrate 911. Floor isolation region 912 extends beyond trench 914 by a distance LDN- Deep implanted N-type drift region 917 of length LD3 is contacted by N+ region 918. Drift region 917 may be biased at the same potential as floor isolation region 912, or may be biased to a fixed potential. The outer edge of drift region 917 is spaced from P+ guard ring 915 and underlying deep P-type region 916 by a space LSUB-
The function of drift region 917 is to suppress surface electric fields by exhibiting two-dimensional depletion spreading effects. Provided that drift region 917 has sufficiently low integrated charge QD, typically in the range of IxIO12 cm"2 to 5xlO12 cm" 2, increasing the applied voltage on the P-N junction formed by drift region 917 and P- type substrate 911 results in depletion spreading into drift region 917 and eventually the complete depletion of drift region 917. Under such conditions, drift region 917 behaves similar to intrinsic material in a P-I-N diode, and the surface electric field drops substantially in accordance with the well-known RESURF principle of two-dimensional electrically- induced P-I-N junctions. Furthermore, the vertical overlap of drift region 917 above floor isolation region 912 enhances the depletion of P-type substrate 911 in the intervening region between the regions 917 and 912, further reducing the surface electric fields within the termination.
Fig. 9C shows an edge termination structure including floor isolation region 922 and filled trench 924, which together isolate P-type pocket 923, and any device it may contain, from P-type substrate 921. Floor isolation region 922 extends beyond trench 924 by a distance LDN and spaced from trench 927 by a distance LSUB- In this embodiment, the gap between floor isolation region 922 and trench 927, i.e. a gap of dimension LSUB, controls the potential of P-type substrate 921 in the surface region between trenches 924 and 927, i.e. in the area labeled 928. When the gap between floor isolation region 922 and trench 927 becomes fully depleted, the potential of P-type region 928 begins to float. Cut off from the substrate potential, the surface electric field drops. A P+ guard ring 925 circumscribes the device and may include underlying deep P-type region 926.
Fig. 9D shows an edge termination structure including floor isolation region 932 and filled trench 934, which together isolate P-type pocket 933, and any device it may contain, from P-type substrate 931. Floor isolation region 932 extends beyond trench 934. Deep implanted N-type drift region 937 is contacted by N+ region 938. Drift region 937 may be biased at the same potential as floor isolation region 932, or may be biased to a fixed potential. Within drift region 937, one or more filled trenches 939 are formed. Each of trenches 939 reduce the local doping concentration in drift region 937, which allows the adjacent portion of drift region 937 to be depleted more easily, further lowering the local electric field. In a preferred embodiment, trenches 939 are narrower and shallower than trench 934 and are completely filled with dielectric material. In one embodiment, the device is designed such that the proportion of the surface area of trenches 939 to the surface area of drift region 937 changes increases as the lateral distance from trench 934 increases. This allows the portions of drift region 937 that are farthest away from isolated pocket 933 to deplete more easily than the portions that are closer to pocket 933, thus providing an effect similar to a graded junction termination, which is effective in minimizing the lateral distance required to support a given BV. The outer edge of drift region 937 is spaced from P+ guard ring 935 and underlying deep P-type region 936 by a space LSUB- The embodiments described herein are intended to be illustrative and not limiting. Many alternative embodiments within the broad scope of this invention will be obvious to persons of skill in the art from the descriptions herein.

Claims

CLAIMSWe claim:
1. An isolated transistor formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated transistor comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a first trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region of the second conductivity type at the surface of the substrate in the isolated pocket; a drain region of the second conductivity type spaced apart from the source region at the surface of the substrate in the isolated pocket; a gate located above the surface of the substrate between the source region and the drain region; a channel region adjacent the surface of the substrate under the gate; and a drift region of the second conductivity type in the isolated pocket between the drain region and the channel region.
2. The isolated transistor of Claim 1 comprising a second trench extending from the surface of the substrate at least to the floor isolation region, the second trench being filled with a dielectric material and dividing the isolated pocket into a first section and a second section, the source, drain and drift regions and the well being located in the first section, the second section comprising a second well of the second conductivity type extending from the surface of the substrate to the floor isolation region.
3. The isolated transistor of Claim 1 wherein the first trench comprises a conductive central portion, the conductive central portion being isolated from the substrate and the isolated pocket by the dielectric material.
4. The isolated transistor of Claim 1 wherein a doping concentration of the isolated pocket is substantially the same as a doping concentration of the substrate.
5. The isolated transistor of claim 4 wherein the isolated transistor has a threshold voltage in the range of -0.3 to +0.3 volts.
6. The isolated transistor of Claim 1 comprising a well of the first conductivity type in the isolated pocket, the well comprising the channel region.
7. The isolated transistor of Claim 6 wherein the well comprises a shallow portion and a deep portion, the deep portion being located below the shallow portion, a doping concentration of the deep portion being greater than a doping concentration of the shallow portion.
8. The isolated transistor of Claim 1 comprising a subsurface shielding region of the first conductivity type disposed beneath the source region and having a doping concentration greater than a doping concentration of the isolated pocket.
9. The isolated transistor of Claim 1 comprising a drain clamping region of the first conductivity type disposed beneath the drain region and having a doping concentration greater than a doping concentration of the isolated pocket.
10. The isolated transistor of Claim 1 comprising a second trench disposed at the surface of the substrate above at least a portion of the drift region.
11. The isolated transistor of Claim 10 wherein the second trench comprises the dielectric material and has a depth less than a depth of the first trench.
12. An isolated lateral DMOS transistor formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated
DMOS transistor comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a central conductive portion and a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate, the dielectric material isolating the conductive portion from the isolated pocket and the substrate; a source region of the second conductivity type at the surface of the substrate in the isolated pocket; a drain region of the second conductivity type spaced apart from the source region at a surface of the substrate in the isolated pocket; a gate located atop a gate dielectric layer above an area of the surface of the substrate between the source region and the drain region; a drift region of the second conductivity type adjacent the surface of the substrate in the isolated pocket and the drain region, the drift region having a doping concentration less than the drain region; and a shallow trench isolation (STI) structure adjacent the surface of the substrate in the isolated pocket, the STI structure being enclosed on its sides and bottom by the drift region.
13. The isolated lateral DMOS transistor of Claim 12 wherein the drain region is surrounded laterally by the gate and the source region.
14. The isolated lateral DMOS transistor of Claim 13 comprising a well of the first conductivity type in the isolated pocket, the well extending under the gate.
15. The isolated lateral DMOS transistor of Claim 14 wherein the well is spaced apart from the drift region.
16. The isolated lateral DMOS transistor of Claim 14 wherein the well abuts the drift region.
17. The isolated lateral DMOS transistor of Claim 12 comprising a subsurface shielding region of the first conductivity type submerged in the isolated pocket underneath the source region, the snapback control region having a doping concentration greater than a doping concentration of the isolated pocket.
18. The isolated lateral DMOS transistor of Claim 12 comprising a drain clamping region of the first conductivity type submerged in the isolated pocket underneath the drain region, the second snapback control region having a doping concentration greater than a doping concentration of the isolated pocket.
19. An isolated lateral depletion- mode transistor formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated depletion-mode transistor comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region of the second conductivity type at the surface of the substrate in the isolated pocket; a drain region of the second conductivity type spaced apart from the source region at the surface of the substrate in the isolated pocket; a gate located atop a gate dielectric layer above an area of the surface of the substrate between the source region and the drain region; and a channel region of the first conductivity type adjacent the surface of the substrate below the gate; wherein the substrate has a background doping concentration, the background doping concentration and a doping concentration of the channel region being substantially equal.
20. The isolated lateral depletion-mode transistor of Claim 19 comprising a submerged region of the first conductivity type in the isolated pocket, the submerged region having a doping concentration greater than the background doping concentration of the substrate, at least a portion of the submerged region being located below the gate.
21. The isolated lateral depletion- mode transistor of Claim 20 comprising a contact region of the first conductivity type extending from the surface of the substrate to the submerged region, the contact region having a doping concentration greater than the background doping concentration of the substrate.
22. The isolated lateral depletion-mode transistor of Claim 19 wherein the trench has a central portion filled with a conductive material and the dielectric material lines the walls of the trench.
23. An isolated quasi- vertical DMQS (QVDMOS) transistor formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated QVDMOS transistor comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench having a central conductive portion and a dielectric material lining the walls of the trench, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region of the second conductivity type at the surface of the substrate in the isolated pocket; a gate located atop a gate dielectric layer above an area of the surface of the substrate adjacent the source region; a body region of the first conductivity type in the isolated pocket, the body region extending under the gate; and a drift region of the second conductivity type in the isolated pocket extending between the floor isolation region and the body region.
24. The isolated QVDMOS transistor of Claim 23 wherein a drain of the QVSMOS transistor comprises the floor isolation region.
25. The isolated QVDMOS transistor of Claim 23 wherein the central conductive portion provides contact from the floor isolation region to the surface of the substrate.
26. junction field-effect transistor (JFET) formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated JFET comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region at the surface of the substrate in the isolated pocket; a drain region spaced apart from the source region at the surface of the substrate in the isolated pocket; a top gate region at the surface of the substrate between the source region and the drain region; and a channel region extending between the source region and the drain region and located below the top gate region and above the floor isolation region.
27. The isolated JFET of Claim 26 comprising a first dielectric- filled trench between the source region and the top gate region and a second dielectric-filled trench between the drain region and the top gate region.
28. The isolated JFET of Claim 26 wherein the trench has a central portion filled with a conductive material and a dielectric material lining the walls of the trench.
29. The isolated JFET of Claim 26 wherein the source, drain, and channel regions are of the first conductivity type, and the top gate is of the second conductivity type.
30. The isolated JFET of Claim 26 wherein the source, drain, and channel regions are of the second conductivity type, and the top gate is of the first conductivity type.
31. An isolated junction field-effect transistor (JFET) formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated JFET comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region of the second conductivity type at the surface of the substrate in the isolated pocket; a drain region of the second conductivity type spaced apart from the source region at the surface of the substrate in the isolated pocket; a top gate region of the first conductivity type disposed between the source region and the drain region in the isolated pocket; a bottom gate region of the first conductivity type submerged in the isolated pocket below the top gate region; and a channel region of the second conductivity type extending between the source region and the drain region, the channel region located below the top gate region and above the bottom gate region.
32. The isolated JFET of Claim 31 comprising a first dielectric-filled trench between the source region and the top gate region and a second dielectric-filled trench between the drain region and the top gate region.
33. The isolated JFET of Claim 31 comprising a well of the first conductivity type in the isolated pocket extending from the surface of the substrate to the bottom gate region.
34. The isolated JFET of Claim 33 wherein the well comprises a bottom gate contact region adjacent the surface of the substrate, the bottom gate contact region having a doping concentration greater than a doping concentration of a remaining portion of the well, and wherein the isolated junction field-effect transistor (JFET) comprises a third dielectric- filled trench adjacent the surface of the substrate and the bottom gate contact region.
35. The isolated JFET of Claim 31 wherein the trench has a central portion filled with a conductive material and a dielectric material lining the walls of the trench.
36. An isolated junction field-effect transistor (JFET) formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated JFET comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a source region of the first conductivity type at the surface of the substrate in the isolated pocket; a drain region of the first conductivity type spaced apart from the source region at the surface of the substrate in the isolated pocket; a top gate region of the second conductivity type disposed between the source region and the drain regions at the surface of the substrate in the isolated pocket; and a channel region of the first conductivity type extending between the source region and the drain region, the channel region located below the top gate region and above the floor isolation region.
37. The isolated JFET of Claim 36 comprising a first dielectric-filled trench between and adjacent to the source region and the top gate region and a second dielectric- filled trench between and adjacent to the drain region and the top gate region.
38. The isolated JFET of Claim 36 wherein the trench has a central portion filled with a conductive material and a dielectric material lining the walls of the trench, the conductive material provide contact from the floor isolation region to the surface of the substrate.
39. The isolated JFET of Claim 36 wherein the floor isolation region comprises a bottom gate of the JFET.
40. An isolated diode formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolated diode comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench having a central portion filled with a conductive material and a dielectric material lining the walls of the trench, the conductive material providing electrical contact from the floor isolation region to the surface of the substrate, the trench and the floor isolation region together forming an isolated pocket of the substrate; and an anode region of the first conductivity type in the isolated pocket, the anode region extending from the surface of the substrate to the floor isolation region.
41. The isolated diode of Claim 40 comprising: a dielectric layer above the surface of the substrate, the dielectric layer having a first opening above the anode region and a second opening above the conductive material; an anode contact in the first opening in contact with the anode region; and a cathode contact in the second opening in contact with the conductive material.
42. The isolated diode of Claim 40 wherein the anode region comprises a shallow portion and a deep portion, the shallow portion being located adjacent the surface of the substrate, the deep portion being located below the shallow portion, the shallow portion having a first doping concentration, the deep portion having a second doping concentration, the second doping concentration being greater than the first doping concentration.
43. An isolation structure formed in a semiconductor substrate of a first conductivity type, the substrate not comprising an epitaxial layer, the isolation structure comprising: a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate; a trench extending from a surface of the substrate at least to the floor isolation region, the trench comprising a dielectric material, the trench and the floor isolation region together forming an isolated pocket of the substrate; a guard ring of the first conductivity type at the surface of the substrate outside the isolated pocket, the guard ring having a doping concentration greater than a doping concentration of the substrate; wherein the floor isolation region extends a predetermined distance beyond an outside edge of the trench in a direction towards the guard ring.
44. The isolation structure of Claim 43 comprising a submerged region of the first conductivity type below the guard ring, the submerged region having a doping concentration greater than the doping concentration of the substrate.
45. The isolation structure of Claim 43 comprising a drift region of the second conductivity type adjacent the surface of the substrate and the trench outside the isolated pocket, the drift region being spaced apart from the guard ring.
46. The isolation structure of Claim 45 comprising at least a second trench, the second trench comprising a dielectric material and extending from the surface of the substrate into the drift region, a floor of the second trench being located in the drift region.
47. The isolation structure of Claim 43 comprising a second trench extending from the surface of the substrate, the second trench being located between the first trench and the guard ring and being spaced apart from a lateral edge of the floor isolation region.
PCT/US2009/001187 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die WO2009108311A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020107021292A KR101303405B1 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die
JP2010548708A JP5449203B2 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor dies
KR1020147013019A KR101483404B1 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die
KR1020137023583A KR101456408B1 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die
CN200980115026.8A CN102037562B (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die
EP09716068.3A EP2248162A4 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die
KR1020127025876A KR101363663B1 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/072,615 2008-02-27
US12/072,615 US7667268B2 (en) 2002-08-14 2008-02-27 Isolated transistor

Publications (2)

Publication Number Publication Date
WO2009108311A2 true WO2009108311A2 (en) 2009-09-03
WO2009108311A3 WO2009108311A3 (en) 2009-10-22

Family

ID=41016649

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/001187 WO2009108311A2 (en) 2008-02-27 2009-02-25 Isolated transistors and diodes and isolation and termination structures for semiconductor die

Country Status (8)

Country Link
US (3) US7667268B2 (en)
EP (1) EP2248162A4 (en)
JP (1) JP5449203B2 (en)
KR (4) KR101363663B1 (en)
CN (2) CN102867843B (en)
HK (1) HK1176462A1 (en)
TW (1) TWI415262B (en)
WO (1) WO2009108311A2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161108A (en) * 2009-01-06 2010-07-22 Oki Semiconductor Co Ltd Semiconductor device and process of fabricating same
US8169007B2 (en) 2009-02-19 2012-05-01 International Business Machines Corporation Asymmetric junction field effect transistor
JP2012099679A (en) * 2010-11-03 2012-05-24 Denso Corp Semiconductor device and method of manufacturing the same
US9722097B2 (en) 2015-09-16 2017-08-01 Vanguard International Semiconductor Corporation Semiconductor device and method for manufacturing the same
TWI594334B (en) * 2015-11-12 2017-08-01 世界先進積體電路股份有限公司 Semiconductor device and method of manufacturing the same

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080197408A1 (en) * 2002-08-14 2008-08-21 Advanced Analogic Technologies, Inc. Isolated quasi-vertical DMOS transistor
US7902630B2 (en) * 2002-08-14 2011-03-08 Advanced Analogic Technologies, Inc. Isolated bipolar transistor
US7812403B2 (en) * 2002-08-14 2010-10-12 Advanced Analogic Technologies, Inc. Isolation structures for integrated circuit devices
US8513087B2 (en) * 2002-08-14 2013-08-20 Advanced Analogic Technologies, Incorporated Processes for forming isolation structures for integrated circuit devices
US7956391B2 (en) 2002-08-14 2011-06-07 Advanced Analogic Technologies, Inc. Isolated junction field-effect transistor
US7825488B2 (en) * 2006-05-31 2010-11-02 Advanced Analogic Technologies, Inc. Isolation structures for integrated circuits and modular methods of forming the same
US7667268B2 (en) * 2002-08-14 2010-02-23 Advanced Analogic Technologies, Inc. Isolated transistor
US7939420B2 (en) * 2002-08-14 2011-05-10 Advanced Analogic Technologies, Inc. Processes for forming isolation structures for integrated circuit devices
US8089129B2 (en) * 2002-08-14 2012-01-03 Advanced Analogic Technologies, Inc. Isolated CMOS transistors
US7834421B2 (en) * 2002-08-14 2010-11-16 Advanced Analogic Technologies, Inc. Isolated diode
KR100867977B1 (en) 2006-10-11 2008-11-10 한국과학기술원 Machine to analyze tissue perfusion using concentration of indocyanine green in blood and a method for analysing tissue perfusion using the same
US8030731B2 (en) * 2007-03-28 2011-10-04 Advanced Analogic Technologies, Inc. Isolated rectifier diode
US7737526B2 (en) * 2007-03-28 2010-06-15 Advanced Analogic Technologies, Inc. Isolated trench MOSFET in epi-less semiconductor sustrate
KR101035596B1 (en) * 2007-12-28 2011-05-19 매그나칩 반도체 유한회사 Semiconductor device with deep trench structure
US8298889B2 (en) * 2008-12-10 2012-10-30 Semiconductor Components Industries, Llc Process of forming an electronic device including a trench and a conductive structure therein
CN101521203B (en) * 2009-04-07 2010-08-04 电子科技大学 Semiconductor transverse device and high-voltage device
TWI405332B (en) * 2010-03-10 2013-08-11 Macronix Int Co Ltd Junction-field-effect-transistor devices
US9293577B2 (en) * 2010-03-30 2016-03-22 Volterra Semiconductor LLC LDMOS with no reverse recovery
CN102270580A (en) * 2010-06-04 2011-12-07 和舰科技(苏州)有限公司 Method for manufacturing high voltage N-channel metal oxide semiconductor (NMOS) tube
WO2011155105A1 (en) * 2010-06-07 2011-12-15 パナソニック株式会社 Semiconductor device and method for manufacturing same
US8462477B2 (en) * 2010-09-13 2013-06-11 Analog Devices, Inc. Junction field effect transistor for voltage protection
US8629026B2 (en) * 2010-11-12 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Source tip optimization for high voltage transistor devices
JP5504187B2 (en) * 2011-01-26 2014-05-28 株式会社東芝 Semiconductor device and manufacturing method thereof
US8618583B2 (en) * 2011-05-16 2013-12-31 International Business Machines Corporation Junction gate field effect transistor structure having n-channel
JP5743831B2 (en) * 2011-09-29 2015-07-01 株式会社東芝 Semiconductor device
US8518764B2 (en) * 2011-10-24 2013-08-27 Freescale Semiconductor, Inc. Semiconductor structure having a through substrate via (TSV) and method for forming
JP5739826B2 (en) * 2012-01-23 2015-06-24 株式会社東芝 Semiconductor device
JP5964091B2 (en) * 2012-03-12 2016-08-03 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
JP6001309B2 (en) * 2012-04-17 2016-10-05 エスアイアイ・セミコンダクタ株式会社 Semiconductor device
US9236472B2 (en) * 2012-04-17 2016-01-12 Freescale Semiconductor, Inc. Semiconductor device with integrated breakdown protection
US8853780B2 (en) * 2012-05-07 2014-10-07 Freescale Semiconductor, Inc. Semiconductor device with drain-end drift diminution
US20130313650A1 (en) * 2012-05-25 2013-11-28 Microsemi Soc Corp. Tid hardened mos transistors and fabrication process
US9093517B2 (en) 2012-05-25 2015-07-28 Microsemi SoC Corporation TID hardened and single event transient single event latchup resistant MOS transistors and fabrication process
US9231083B2 (en) * 2012-06-29 2016-01-05 Freescal Semiconductor Inc. High breakdown voltage LDMOS device
US8921934B2 (en) * 2012-07-11 2014-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. FinFET with trench field plate
JP6132539B2 (en) * 2012-12-13 2017-05-24 ルネサスエレクトロニクス株式会社 Semiconductor device
US8890250B2 (en) * 2012-12-28 2014-11-18 United Microelectronics Corporation Electrostatic discharge protection structure
US9378958B2 (en) 2012-12-28 2016-06-28 United Microelectronics Corporation Electrostatic discharge protection structure and fabricating method thereof
CN103050541B (en) * 2013-01-06 2015-08-19 上海华虹宏力半导体制造有限公司 A kind of radio frequency LDMOS device and manufacture method thereof
US9490322B2 (en) 2013-01-23 2016-11-08 Freescale Semiconductor, Inc. Semiconductor device with enhanced 3D resurf
JP2014170831A (en) 2013-03-04 2014-09-18 Seiko Epson Corp Circuit device and electronic apparatus
JP2014203851A (en) * 2013-04-01 2014-10-27 株式会社東芝 Semiconductor device and manufacturing method of the same
CN104241354B (en) * 2013-06-09 2018-03-06 中芯国际集成电路制造(上海)有限公司 Ldmos transistor and forming method thereof
JP6295444B2 (en) * 2013-07-16 2018-03-20 パナソニックＩｐマネジメント株式会社 Semiconductor device
US9076863B2 (en) * 2013-07-17 2015-07-07 Texas Instruments Incorporated Semiconductor structure with a doped region between two deep trench isolation structures
US9059278B2 (en) 2013-08-06 2015-06-16 International Business Machines Corporation High voltage lateral double-diffused metal oxide semiconductor field effect transistor (LDMOSFET) having a deep fully depleted drain drift region
CN104425344B (en) * 2013-08-28 2017-06-13 中芯国际集成电路制造(上海)有限公司 Semiconductor structure and forming method thereof
US9006825B1 (en) * 2013-09-27 2015-04-14 Mediatek Inc. MOS device with isolated drain and method for fabricating the same
US9177952B2 (en) * 2013-10-15 2015-11-03 Freescale Semiconductor, Inc. ESD protection with asymmetrical bipolar-based device
CN104638003B (en) * 2013-11-14 2019-04-09 上海华虹宏力半导体制造有限公司 Radio frequency LDMOS device and process
WO2015077361A1 (en) * 2013-11-21 2015-05-28 Microsemi SoC Corporation High voltage device fabricated using low-voltage processes
CN104701365B (en) * 2013-12-05 2018-02-16 中芯国际集成电路制造(上海)有限公司 Semiconductor devices and forming method thereof
US9543379B2 (en) 2014-03-18 2017-01-10 Nxp Usa, Inc. Semiconductor device with peripheral breakdown protection
JP2016001671A (en) * 2014-06-12 2016-01-07 サンケン電気株式会社 Semiconductor device
TWI578537B (en) * 2014-08-01 2017-04-11 旺宏電子股份有限公司 High voltage semiconductor device
US9425304B2 (en) * 2014-08-21 2016-08-23 Vishay-Siliconix Transistor structure with improved unclamped inductive switching immunity
JP6355481B2 (en) * 2014-08-25 2018-07-11 ルネサスエレクトロニクス株式会社 Semiconductor device
US10121889B2 (en) 2014-08-29 2018-11-06 Macronix International Co., Ltd. High voltage semiconductor device
KR102143520B1 (en) * 2014-09-17 2020-08-11 삼성전자 주식회사 Pumping capacitor
CN105720098B (en) * 2014-12-02 2019-01-29 中芯国际集成电路制造(上海)有限公司 NLDMOS and preparation method thereof
CN105810583B (en) * 2014-12-30 2019-03-15 无锡华润上华科技有限公司 The manufacturing method of landscape insulation bar double-pole-type transistor
KR102354463B1 (en) 2015-01-09 2022-01-24 삼성전자주식회사 Semiconducor devices having retrograde channels and methods for fabricating the same
US9806148B2 (en) 2015-04-07 2017-10-31 Texas Instruments Incorporated Device isolator with reduced parasitic capacitance
CN106298768B (en) * 2015-06-10 2019-03-19 联华电子股份有限公司 The operating method of semiconductor element and semiconductor element
KR101692625B1 (en) * 2015-06-18 2017-01-03 주식회사 동부하이텍 Semiconductor device and radio frequency module formed on high resistivity substrate
KR101666753B1 (en) * 2015-06-18 2016-10-14 주식회사 동부하이텍 Semiconductor device and radio frequency module formed on high resistivity substrate
JP2017045884A (en) * 2015-08-27 2017-03-02 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of semiconductor device
US10217860B2 (en) * 2015-09-11 2019-02-26 Nxp Usa, Inc. Partially biased isolation in semiconductor devices
US10446695B2 (en) * 2015-10-21 2019-10-15 United Silicone Carbide, Inc. Planar multi-implanted JFET
CN107026082B (en) * 2016-02-02 2019-11-19 璟茂科技股份有限公司 The preparation method of power rectifier diode
JP6591312B2 (en) 2016-02-25 2019-10-16 ルネサスエレクトロニクス株式会社 Semiconductor device
US9871135B2 (en) 2016-06-02 2018-01-16 Nxp Usa, Inc. Semiconductor device and method of making
TWI693713B (en) * 2016-07-22 2020-05-11 立積電子股份有限公司 Semiconductor structure
CN107785366B (en) * 2016-08-31 2020-04-14 无锡华润上华科技有限公司 Device integrated with junction field effect transistor and manufacturing method thereof
US10032766B2 (en) * 2016-09-16 2018-07-24 Globalfoundries Singapore Pte. Ltd. VDMOS transistors, BCD devices including VDMOS transistors, and methods for fabricating integrated circuits with such devices
US10347621B2 (en) 2016-10-12 2019-07-09 Texas Instruments Incorporated Electrostatic discharge guard ring with snapback protection
US9905687B1 (en) 2017-02-17 2018-02-27 Nxp Usa, Inc. Semiconductor device and method of making
JP6416969B2 (en) * 2017-04-13 2018-10-31 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
CN107359208A (en) * 2017-04-24 2017-11-17 杭州立昂微电子股份有限公司 A kind of Schottky-barrier diode and its manufacture method
US10043826B1 (en) * 2017-07-26 2018-08-07 Qualcomm Incorporated Fully depleted silicon on insulator integration
CN108039361A (en) * 2017-12-08 2018-05-15 深圳市晶特智造科技有限公司 The terminal structure and preparation method thereof of semiconductor power device, semiconductor power device
TWI667788B (en) * 2018-03-23 2019-08-01 世界先進積體電路股份有限公司 Semiconductor structures and fabrication method thereof
CN110350018B (en) * 2018-04-02 2023-05-26 世界先进积体电路股份有限公司 Semiconductor structure and manufacturing method thereof
US10607880B2 (en) * 2018-08-30 2020-03-31 Nxp Usa, Inc. Die with buried doped isolation region
US11069804B2 (en) * 2018-08-31 2021-07-20 Alpha And Omega Semiconductor (Cayman) Ltd. Integration of HVLDMOS with shared isolation region
JP6937281B2 (en) * 2018-09-14 2021-09-22 株式会社東芝 Semiconductor device
CN109616518B (en) * 2018-12-13 2022-08-23 中国科学院微电子研究所 MOS grid-controlled thyristor
JP7195167B2 (en) * 2019-02-08 2022-12-23 ルネサスエレクトロニクス株式会社 Semiconductor device and method for manufacturing semiconductor device
TWI732182B (en) * 2019-02-23 2021-07-01 世界先進積體電路股份有限公司 Semiconductor devices and methods for forming the same
CN110024134B (en) 2019-02-28 2020-06-26 长江存储科技有限责任公司 High voltage semiconductor device with increased breakdown voltage and method of manufacturing the same
US10892320B2 (en) 2019-04-30 2021-01-12 Vanguard International Semiconductor Corporation Semiconductor devices having stacked trench gate electrodes overlapping a well region
JP7227110B2 (en) * 2019-09-18 2023-02-21 株式会社東芝 semiconductor equipment
US11552190B2 (en) * 2019-12-12 2023-01-10 Analog Devices International Unlimited Company High voltage double-diffused metal oxide semiconductor transistor with isolated parasitic bipolar junction transistor region
US11049957B1 (en) * 2020-04-16 2021-06-29 Monolithic Power Systems, Inc. LDMOS device with sinker link
TWI730814B (en) * 2020-06-16 2021-06-11 力晶積成電子製造股份有限公司 Insulated gate bipolar transistor structure and manufacturing method thereof
TWI773254B (en) * 2021-04-19 2022-08-01 立錡科技股份有限公司 High voltage device and manufacturing method thereof
CN114744049B (en) * 2022-06-13 2022-09-27 瑞能半导体科技股份有限公司 Silicon carbide MOSFET semiconductor device and manufacturing method thereof
CN115188832B (en) * 2022-07-11 2023-04-14 东莞市金誉半导体有限公司 High-voltage JFET device and preparation method thereof
CN114975601A (en) * 2022-07-28 2022-08-30 合肥晶合集成电路股份有限公司 Semiconductor device and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163052A (en) 1997-04-04 2000-12-19 Advanced Micro Devices, Inc. Trench-gated vertical combination JFET and MOSFET devices
US6835627B1 (en) 2000-01-10 2004-12-28 Analog Devices, Inc. Method for forming a DMOS device and a DMOS device
US20060125045A1 (en) 2004-10-07 2006-06-15 Hamza Yilmaz Process of fabricating semiconductor devices with isolation and sinker regions containing trenches filled with conductive material

Family Cites Families (113)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4269636A (en) * 1978-12-29 1981-05-26 Harris Corporation Method of fabricating self-aligned bipolar transistor process and device utilizing etching and self-aligned masking
JPS5824018B2 (en) * 1979-12-21 1983-05-18 富士通株式会社 Bipolar IC manufacturing method
FR2498812A1 (en) * 1981-01-27 1982-07-30 Thomson Csf STRUCTURE OF TRANSISTORS IN AN INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
US4454647A (en) 1981-08-27 1984-06-19 International Business Machines Corporation Isolation for high density integrated circuits
JPS58100441A (en) 1981-12-10 1983-06-15 Toshiba Corp Manufacture of semiconductor device
US4655875A (en) * 1985-03-04 1987-04-07 Hitachi, Ltd. Ion implantation process
US6740958B2 (en) 1985-09-25 2004-05-25 Renesas Technology Corp. Semiconductor memory device
US4980747A (en) * 1986-12-22 1990-12-25 Texas Instruments Inc. Deep trench isolation with surface contact to substrate
US4819052A (en) * 1986-12-22 1989-04-04 Texas Instruments Incorporated Merged bipolar/CMOS technology using electrically active trench
JPS63173360A (en) * 1987-01-13 1988-07-16 Nec Corp Semiconductor storage device
US5156989A (en) 1988-11-08 1992-10-20 Siliconix, Incorporated Complementary, isolated DMOS IC technology
US5410175A (en) 1989-08-31 1995-04-25 Hamamatsu Photonics K.K. Monolithic IC having pin photodiode and an electrically active element accommodated on the same semi-conductor substrate
JP2662446B2 (en) 1989-12-11 1997-10-15 キヤノン株式会社 Printhead and printhead element substrate
JP3093771B2 (en) 1990-03-22 2000-10-03 沖電気工業株式会社 Semiconductor storage device
US5386136A (en) 1991-05-06 1995-01-31 Siliconix Incorporated Lightly-doped drain MOSFET with improved breakdown characteristics
KR100292851B1 (en) 1991-09-27 2001-09-17 스콧 티. 마이쿠엔 Complementary bipolar transistor with high early voltage, high frequency performance and high breakdown voltage characteristics and manufacturing method
EP0537684B1 (en) * 1991-10-15 1998-05-20 Texas Instruments Incorporated Improved performance lateral double-diffused MOS transistor and method of fabrication thereof
JPH05109886A (en) * 1991-10-17 1993-04-30 N M B Semiconductor:Kk Semiconductor device of field shield isolation structure and its manufacture
US5856695A (en) 1991-10-30 1999-01-05 Harris Corporation BiCMOS devices
US5374569A (en) 1992-09-21 1994-12-20 Siliconix Incorporated Method for forming a BiCDMOS
US5324973A (en) 1993-05-03 1994-06-28 Motorola Inc. Semiconductor SRAM with trench transistors
US5420061A (en) * 1993-08-13 1995-05-30 Micron Semiconductor, Inc. Method for improving latchup immunity in a dual-polysilicon gate process
US5892264A (en) * 1993-10-04 1999-04-06 Harris Corporation High frequency analog transistors, method of fabrication and circuit implementation
JP3252569B2 (en) 1993-11-09 2002-02-04 株式会社デンソー Insulating separation substrate, semiconductor device using the same, and method of manufacturing the same
US5498554A (en) * 1994-04-08 1996-03-12 Texas Instruments Incorporated Method of making extended drain resurf lateral DMOS devices
US5438005A (en) 1994-04-13 1995-08-01 Winbond Electronics Corp. Deep collection guard ring
US5506431A (en) * 1994-05-16 1996-04-09 Thomas; Mammen Double poly trenched channel accelerated tunneling electron (DPT-CATE) cell, for memory applications
US5684305A (en) * 1995-06-07 1997-11-04 Harris Corporation Pilot transistor for quasi-vertical DMOS device
WO1997004488A2 (en) * 1995-07-19 1997-02-06 Philips Electronics N.V. Semiconductor device of hv-ldmost type
FR2744285B1 (en) 1996-01-25 1998-03-06 Commissariat Energie Atomique METHOD FOR TRANSFERRING A THIN FILM FROM AN INITIAL SUBSTRATE TO A FINAL SUBSTRATE
JPH09252049A (en) * 1996-03-15 1997-09-22 Mitsubishi Electric Corp Multilayer embedded trench isolation
JP3575908B2 (en) * 1996-03-28 2004-10-13 株式会社東芝 Semiconductor device
US5807783A (en) * 1996-10-07 1998-09-15 Harris Corporation Surface mount die by handle replacement
KR100205609B1 (en) 1997-01-06 1999-07-01 윤종용 An electrostatic protection device
US6011297A (en) 1997-07-18 2000-01-04 Advanced Micro Devices,Inc. Use of multiple slots surrounding base region of a bipolar junction transistor to increase cumulative breakdown voltage
US6171982B1 (en) 1997-12-26 2001-01-09 Canon Kabushiki Kaisha Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
US5914523A (en) 1998-02-17 1999-06-22 National Semiconductor Corp. Semiconductor device trench isolation structure with polysilicon bias voltage contact
KR100282710B1 (en) 1998-03-12 2001-02-15 윤종용 Method for manufacturing bipolar transistor and its structure
US6331456B1 (en) * 1998-05-04 2001-12-18 Texas Instruments - Acer Incorporated Fipos method of forming SOI CMOS structure
US6013936A (en) 1998-08-06 2000-01-11 International Business Machines Corporation Double silicon-on-insulator device and method therefor
US20010013636A1 (en) 1999-01-22 2001-08-16 James S. Dunn A self-aligned, sub-minimum isolation ring
US6316336B1 (en) 1999-03-01 2001-11-13 Richard A. Blanchard Method for forming buried layers with top-side contacts and the resulting structure
US6225674B1 (en) 1999-04-02 2001-05-01 Motorola, Inc. Semiconductor structure and method of manufacture
EP1043775B1 (en) 1999-04-06 2006-06-14 STMicroelectronics S.r.l. Power integrated circuit with vertical current flow and related manufacturing process
US6225181B1 (en) 1999-04-19 2001-05-01 National Semiconductor Corp. Trench isolated bipolar transistor structure integrated with CMOS technology
US6144086A (en) 1999-04-30 2000-11-07 International Business Machines Corporation Structure for improved latch-up using dual depth STI with impurity implant
KR100300069B1 (en) 1999-05-10 2001-09-26 김영환 Semiconductor device and fabrication method of thereof
US6798024B1 (en) 1999-07-01 2004-09-28 Intersil Americas Inc. BiCMOS process with low temperature coefficient resistor (TCRL)
JP2001135719A (en) * 1999-11-01 2001-05-18 Denso Corp Element isolation structure for semiconductor device
US6448124B1 (en) 1999-11-12 2002-09-10 International Business Machines Corporation Method for epitaxial bipolar BiCMOS
US6489653B2 (en) 1999-12-27 2002-12-03 Kabushiki Kaisha Toshiba Lateral high-breakdown-voltage transistor
US6399990B1 (en) 2000-03-21 2002-06-04 International Business Machines Corporation Isolated well ESD device
IT1316871B1 (en) * 2000-03-31 2003-05-12 St Microelectronics Srl MONOLITHICALLY INTEGRATED ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS
IT1317516B1 (en) * 2000-05-11 2003-07-09 St Microelectronics Srl INTEGRATED DEVICE WITH TRENCH INSULATION STRUCTURE AND RELATIVE PROCESS OF REALIZATION.
US6663167B2 (en) * 2000-05-15 2003-12-16 Jeffrey O. Phillips Collapsible shelter/camper/storage unit with a suspended floor
JP4984345B2 (en) * 2000-06-21 2012-07-25 富士電機株式会社 Semiconductor device
SE518797C2 (en) * 2000-07-19 2002-11-19 Ericsson Telefon Ab L M Power LDMOS transistor comprising a plurality of parallel-connected transistor segments with different threshold voltages
JP2002094063A (en) * 2000-09-11 2002-03-29 Toshiba Corp Semiconductor device
US6849871B2 (en) 2000-10-20 2005-02-01 International Business Machines Corporation Fully-depleted-collector silicon-on-insulator (SOI) bipolar transistor useful alone or in SOI BiCMOS
JP2002198436A (en) 2000-12-25 2002-07-12 Sanyo Electric Co Ltd Semiconductor integrated circuit device and its fabrication method
JP2002198439A (en) 2000-12-26 2002-07-12 Sharp Corp Semiconductor device and portable electronic apparatus
US6600199B2 (en) 2000-12-29 2003-07-29 International Business Machines Corporation Deep trench-buried layer array and integrated device structures for noise isolation and latch up immunity
EP1220323A3 (en) * 2000-12-31 2007-08-15 Texas Instruments Incorporated LDMOS with improved safe operating area
JP2002237575A (en) * 2001-02-08 2002-08-23 Sharp Corp Semiconductor device and its manufacturing method
US20020117714A1 (en) * 2001-02-28 2002-08-29 Linear Technology Corporation High voltage MOS transistor
TW475250B (en) 2001-03-14 2002-02-01 Taiwan Semiconductor Mfg ESD protection circuit to be used in high-frequency input/output port with low capacitance load
JP4811895B2 (en) 2001-05-02 2011-11-09 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
JP2003100862A (en) 2001-09-21 2003-04-04 Mitsubishi Electric Corp Semiconductor device and method of manufacturing the same
US6563181B1 (en) 2001-11-02 2003-05-13 Motorola, Inc. High frequency signal isolation in a semiconductor device
KR100456691B1 (en) 2002-03-05 2004-11-10 삼성전자주식회사 Semiconductor device having dual isolation structure and method of fabricating the same
JP2004039866A (en) 2002-07-03 2004-02-05 Toshiba Corp Semiconductor device and its manufacturing method
US7179691B1 (en) 2002-07-29 2007-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method for four direction low capacitance ESD protection
US6867462B2 (en) 2002-08-09 2005-03-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device using an SOI substrate and having a trench isolation and method for fabricating the same
US7956391B2 (en) * 2002-08-14 2011-06-07 Advanced Analogic Technologies, Inc. Isolated junction field-effect transistor
US8089129B2 (en) 2002-08-14 2012-01-03 Advanced Analogic Technologies, Inc. Isolated CMOS transistors
US7825488B2 (en) 2006-05-31 2010-11-02 Advanced Analogic Technologies, Inc. Isolation structures for integrated circuits and modular methods of forming the same
US7902630B2 (en) 2002-08-14 2011-03-08 Advanced Analogic Technologies, Inc. Isolated bipolar transistor
US7939420B2 (en) 2002-08-14 2011-05-10 Advanced Analogic Technologies, Inc. Processes for forming isolation structures for integrated circuit devices
US7834421B2 (en) * 2002-08-14 2010-11-16 Advanced Analogic Technologies, Inc. Isolated diode
US20080197408A1 (en) * 2002-08-14 2008-08-21 Advanced Analogic Technologies, Inc. Isolated quasi-vertical DMOS transistor
US6900091B2 (en) 2002-08-14 2005-05-31 Advanced Analogic Technologies, Inc. Isolated complementary MOS devices in epi-less substrate
US7741661B2 (en) * 2002-08-14 2010-06-22 Advanced Analogic Technologies, Inc. Isolation and termination structures for semiconductor die
US7667268B2 (en) 2002-08-14 2010-02-23 Advanced Analogic Technologies, Inc. Isolated transistor
US6943426B2 (en) * 2002-08-14 2005-09-13 Advanced Analogic Technologies, Inc. Complementary analog bipolar transistors with trench-constrained isolation diffusion
US6855985B2 (en) * 2002-09-29 2005-02-15 Advanced Analogic Technologies, Inc. Modular bipolar-CMOS-DMOS analog integrated circuit & power transistor technology
US7719054B2 (en) * 2006-05-31 2010-05-18 Advanced Analogic Technologies, Inc. High-voltage lateral DMOS device
US7576388B1 (en) 2002-10-03 2009-08-18 Fairchild Semiconductor Corporation Trench-gate LDMOS structures
SE0303099D0 (en) * 2003-11-21 2003-11-21 Infineon Technologies Ag Method in the fabrication of a monolithically integrated high frequency circuit
US7205584B2 (en) 2003-12-22 2007-04-17 Micron Technology, Inc. Image sensor for reduced dark current
US20050179111A1 (en) 2004-02-12 2005-08-18 Iwen Chao Semiconductor device with low resistive path barrier
US8093633B2 (en) 2004-02-17 2012-01-10 Nanyang Technological University Method and device for wavelength-sensitive photo-sensing
US7304354B2 (en) 2004-02-17 2007-12-04 Silicon Space Technology Corp. Buried guard ring and radiation hardened isolation structures and fabrication methods
JP4429036B2 (en) 2004-02-27 2010-03-10 富士通マイクロエレクトロニクス株式会社 Manufacturing method of semiconductor device
TWI231986B (en) 2004-03-22 2005-05-01 Sunplus Technology Co Ltd ESD protection device for high voltage and negative voltage tolerance
TWI256676B (en) * 2004-03-26 2006-06-11 Siliconix Inc Termination for trench MIS device having implanted drain-drift region
US7009271B1 (en) 2004-04-13 2006-03-07 Advanced Micro Devices, Inc. Memory device with an alternating Vss interconnection
US7183610B2 (en) 2004-04-30 2007-02-27 Siliconix Incorporated Super trench MOSFET including buried source electrode and method of fabricating the same
JP4592340B2 (en) 2004-06-29 2010-12-01 三洋電機株式会社 Manufacturing method of semiconductor device
JP2006074012A (en) * 2004-08-06 2006-03-16 Renesas Technology Corp Bidirectional type electrostatic discharge protection element
US7335948B2 (en) 2004-08-23 2008-02-26 Enpirion, Inc. Integrated circuit incorporating higher voltage devices and low voltage devices therein
JP4959140B2 (en) 2005-02-04 2012-06-20 株式会社日立超エル・エス・アイ・システムズ Semiconductor device
CN2821868Y (en) * 2005-05-19 2006-09-27 崇贸科技股份有限公司 Mos field effect transisitor with isolation structure
JP4519716B2 (en) 2005-06-02 2010-08-04 富士通セミコンダクター株式会社 Semiconductor device having diode for rectifier circuit
US7719080B2 (en) 2005-06-20 2010-05-18 Teledyne Scientific & Imaging, Llc Semiconductor device with a conduction enhancement layer
TWI256673B (en) * 2005-09-05 2006-06-11 United Microelectronics Corp High voltage metal oxide semiconductor and fabricating method thereof
US20070132056A1 (en) * 2005-12-09 2007-06-14 Advanced Analogic Technologies, Inc. Isolation structures for semiconductor integrated circuit substrates and methods of forming the same
US20070158779A1 (en) 2006-01-12 2007-07-12 International Business Machines Corporation Methods and semiconductor structures for latch-up suppression using a buried damage layer
US7718481B2 (en) 2006-04-17 2010-05-18 International Business Machines Corporation Semiconductor structure and method of manufacture
US7626243B2 (en) 2006-08-04 2009-12-01 Advanced Analogic Technologies, Inc. ESD protection for bipolar-CMOS-DMOS integrated circuit devices
US7737526B2 (en) * 2007-03-28 2010-06-15 Advanced Analogic Technologies, Inc. Isolated trench MOSFET in epi-less semiconductor sustrate
US8030731B2 (en) * 2007-03-28 2011-10-04 Advanced Analogic Technologies, Inc. Isolated rectifier diode
US7541247B2 (en) 2007-07-16 2009-06-02 International Business Machines Corporation Guard ring structures for high voltage CMOS/low voltage CMOS technology using LDMOS (lateral double-diffused metal oxide semiconductor) device fabrication
US7683427B2 (en) * 2007-09-18 2010-03-23 United Microelectronics Corp. Laterally diffused metal-oxide-semiconductor device and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163052A (en) 1997-04-04 2000-12-19 Advanced Micro Devices, Inc. Trench-gated vertical combination JFET and MOSFET devices
US6835627B1 (en) 2000-01-10 2004-12-28 Analog Devices, Inc. Method for forming a DMOS device and a DMOS device
US20060125045A1 (en) 2004-10-07 2006-06-15 Hamza Yilmaz Process of fabricating semiconductor devices with isolation and sinker regions containing trenches filled with conductive material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2248162A4

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161108A (en) * 2009-01-06 2010-07-22 Oki Semiconductor Co Ltd Semiconductor device and process of fabricating same
US8169007B2 (en) 2009-02-19 2012-05-01 International Business Machines Corporation Asymmetric junction field effect transistor
JP2012099679A (en) * 2010-11-03 2012-05-24 Denso Corp Semiconductor device and method of manufacturing the same
US9722097B2 (en) 2015-09-16 2017-08-01 Vanguard International Semiconductor Corporation Semiconductor device and method for manufacturing the same
TWI594334B (en) * 2015-11-12 2017-08-01 世界先進積體電路股份有限公司 Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
KR20130103640A (en) 2013-09-23
CN102037562A (en) 2011-04-27
EP2248162A4 (en) 2015-08-12
KR101363663B1 (en) 2014-02-14
CN102037562B (en) 2014-11-26
KR20110007109A (en) 2011-01-21
TW200945589A (en) 2009-11-01
KR101483404B1 (en) 2015-01-15
JP2011514675A (en) 2011-05-06
KR101456408B1 (en) 2014-11-04
US20100133611A1 (en) 2010-06-03
JP5449203B2 (en) 2014-03-19
KR20120115600A (en) 2012-10-18
US8664715B2 (en) 2014-03-04
US7667268B2 (en) 2010-02-23
EP2248162A2 (en) 2010-11-10
KR20140065485A (en) 2014-05-29
TWI415262B (en) 2013-11-11
US20110260246A1 (en) 2011-10-27
US20080191277A1 (en) 2008-08-14
WO2009108311A3 (en) 2009-10-22
CN102867843A (en) 2013-01-09
CN102867843B (en) 2015-05-20
HK1176462A1 (en) 2013-07-26
US8659116B2 (en) 2014-02-25
KR101303405B1 (en) 2013-09-05

Similar Documents

Publication Publication Date Title
US7741661B2 (en) Isolation and termination structures for semiconductor die
US8664715B2 (en) Isolated transistor
US7956391B2 (en) Isolated junction field-effect transistor
US7834421B2 (en) Isolated diode
US20080197408A1 (en) Isolated quasi-vertical DMOS transistor
US7514329B2 (en) Robust DEMOS transistors and method for making the same
US10910472B2 (en) Integrated circuit, LDMOS with bottom gate and ballast drift
EP2264772B1 (en) Method of fabricating a high-voltage field-effect transistor
US7187033B2 (en) Drain-extended MOS transistors with diode clamp and methods for making the same
US7238987B2 (en) Lateral semiconductor device and method for producing the same
EP1946378B1 (en) Method of manufacturing a semiconductor device
US7649225B2 (en) Asymmetric hetero-doped high-voltage MOSFET (AH2MOS)
US20080061367A1 (en) High-voltage bipolar-CMOS-DMOS integrated circuit devices and modular methods of forming the same
WO1998020562A1 (en) High-voltage transistor with multi-layer conduction region and method of making the same
US20090206397A1 (en) Lateral Trench MOSFET with Conformal Depletion-Assist Layer

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980115026.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09716068

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2010548708

Country of ref document: JP

Ref document number: 2009716068

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107021292

Country of ref document: KR

Kind code of ref document: A