WO2009113043A3 - 10g xfp compliant pcb - Google Patents

10g xfp compliant pcb Download PDF

Info

Publication number
WO2009113043A3
WO2009113043A3 PCT/IB2009/052730 IB2009052730W WO2009113043A3 WO 2009113043 A3 WO2009113043 A3 WO 2009113043A3 IB 2009052730 W IB2009052730 W IB 2009052730W WO 2009113043 A3 WO2009113043 A3 WO 2009113043A3
Authority
WO
WIPO (PCT)
Prior art keywords
xfp
pcb
layer
standard
compliant
Prior art date
Application number
PCT/IB2009/052730
Other languages
French (fr)
Other versions
WO2009113043A2 (en
Inventor
Dorin Ionel Oprea
Steve Driediger
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Priority to KR1020107020111A priority Critical patent/KR101167793B1/en
Priority to JP2010550324A priority patent/JP5232878B2/en
Priority to EP09719200A priority patent/EP2263429A2/en
Priority to CN200980108440.6A priority patent/CN101971716B/en
Publication of WO2009113043A2 publication Critical patent/WO2009113043A2/en
Publication of WO2009113043A3 publication Critical patent/WO2009113043A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/093Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09618Via fence, i.e. one-dimensional array of vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component

Abstract

The present invention is a specially designed PCB (11) thatallows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield (20) connecting to the EMI gasket, guard ground traces (27) in the second layer (25) surrounding the differential pair signal traces (26), openings (32) in the copper of the third layer (31) beneath the XFP cage ground shield and XFP connector pads (12), and ground vias (14) at the XFP connector and PHY connector pads (15).
PCT/IB2009/052730 2008-03-11 2009-03-02 10g xfp compliant pcb WO2009113043A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107020111A KR101167793B1 (en) 2008-03-11 2009-03-02 10g xfp compliant pcb
JP2010550324A JP5232878B2 (en) 2008-03-11 2009-03-02 10GXFP compliant PCB
EP09719200A EP2263429A2 (en) 2008-03-11 2009-03-02 10g xfp compliant pcb
CN200980108440.6A CN101971716B (en) 2008-03-11 2009-03-02 10g xfp compliant pcb

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/075,375 US7746657B2 (en) 2008-03-11 2008-03-11 10G XFP compliant PCB
US12/075,375 2008-03-11

Publications (2)

Publication Number Publication Date
WO2009113043A2 WO2009113043A2 (en) 2009-09-17
WO2009113043A3 true WO2009113043A3 (en) 2009-12-23

Family

ID=40983478

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/052730 WO2009113043A2 (en) 2008-03-11 2009-03-02 10g xfp compliant pcb

Country Status (6)

Country Link
US (1) US7746657B2 (en)
EP (1) EP2263429A2 (en)
JP (1) JP5232878B2 (en)
KR (1) KR101167793B1 (en)
CN (1) CN101971716B (en)
WO (1) WO2009113043A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450657B (en) * 2012-12-28 2014-08-21 Hon Hai Prec Ind Co Ltd Printed Circuit Board
US9955568B2 (en) 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
US9433090B2 (en) 2014-03-25 2016-08-30 Microsoft Technology Licensing, Llc Edge plated printed circuit board
US9560737B2 (en) 2015-03-04 2017-01-31 International Business Machines Corporation Electronic package with heat transfer element(s)
US10426037B2 (en) 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US10175064B2 (en) 2015-09-25 2019-01-08 International Business Machines Corporation Circuit boards and electronic packages with embedded tamper-respondent sensor
US9924591B2 (en) 2015-09-25 2018-03-20 International Business Machines Corporation Tamper-respondent assemblies
US9911012B2 (en) 2015-09-25 2018-03-06 International Business Machines Corporation Overlapping, discrete tamper-respondent sensors
US10172239B2 (en) 2015-09-25 2019-01-01 International Business Machines Corporation Tamper-respondent sensors with formed flexible layer(s)
US9894749B2 (en) 2015-09-25 2018-02-13 International Business Machines Corporation Tamper-respondent assemblies with bond protection
US10098235B2 (en) 2015-09-25 2018-10-09 International Business Machines Corporation Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US9578764B1 (en) 2015-09-25 2017-02-21 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US9591776B1 (en) 2015-09-25 2017-03-07 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s)
US10143090B2 (en) 2015-10-19 2018-11-27 International Business Machines Corporation Circuit layouts of tamper-respondent sensors
US9978231B2 (en) 2015-10-21 2018-05-22 International Business Machines Corporation Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)
US9913389B2 (en) 2015-12-01 2018-03-06 International Business Corporation Corporation Tamper-respondent assembly with vent structure
US10327343B2 (en) 2015-12-09 2019-06-18 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9555606B1 (en) 2015-12-09 2017-01-31 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9554477B1 (en) 2015-12-18 2017-01-24 International Business Machines Corporation Tamper-respondent assemblies with enclosure-to-board protection
US9916744B2 (en) 2016-02-25 2018-03-13 International Business Machines Corporation Multi-layer stack with embedded tamper-detect protection
US9904811B2 (en) 2016-04-27 2018-02-27 International Business Machines Corporation Tamper-proof electronic packages with two-phase dielectric fluid
US9913370B2 (en) 2016-05-13 2018-03-06 International Business Machines Corporation Tamper-proof electronic packages formed with stressed glass
US9881880B2 (en) 2016-05-13 2018-01-30 International Business Machines Corporation Tamper-proof electronic packages with stressed glass component substrate(s)
US9858776B1 (en) 2016-06-28 2018-01-02 International Business Machines Corporation Tamper-respondent assembly with nonlinearity monitoring
US10321589B2 (en) 2016-09-19 2019-06-11 International Business Machines Corporation Tamper-respondent assembly with sensor connection adapter
US10271424B2 (en) 2016-09-26 2019-04-23 International Business Machines Corporation Tamper-respondent assemblies with in situ vent structure(s)
US10299372B2 (en) 2016-09-26 2019-05-21 International Business Machines Corporation Vented tamper-respondent assemblies
US9999124B2 (en) 2016-11-02 2018-06-12 International Business Machines Corporation Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
US10327329B2 (en) 2017-02-13 2019-06-18 International Business Machines Corporation Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
US10306753B1 (en) 2018-02-22 2019-05-28 International Business Machines Corporation Enclosure-to-board interface with tamper-detect circuit(s)
US11122682B2 (en) 2018-04-04 2021-09-14 International Business Machines Corporation Tamper-respondent sensors with liquid crystal polymer layers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020562A (en) * 1997-11-11 2000-02-01 3Com Corporation Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards
US20030107056A1 (en) * 2001-12-08 2003-06-12 National Semiconductor Corporation Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
US20070194434A1 (en) * 2006-02-20 2007-08-23 Chin-Sung Lin Differential signal transmission structure, wiring board, and chip package
US20070222084A1 (en) * 2006-03-22 2007-09-27 Jeffrey Hall Device for avoiding parasitic capacitance in an integrated circuit package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2654414B2 (en) * 1991-07-19 1997-09-17 沖電気工業株式会社 Circuit board for high-speed signal transmission
JPH0936504A (en) * 1995-07-20 1997-02-07 Oki Electric Ind Co Ltd Wiring structure of signal transmitting line of printed board
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
US7439449B1 (en) * 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US6617518B2 (en) * 2001-11-02 2003-09-09 Jds Uniphase Corporaton Enhanced flex cable
US7020960B2 (en) * 2003-06-30 2006-04-04 Finisar Corporation Systems and methods for fabricating printed circuit boards
JP2007180292A (en) * 2005-12-28 2007-07-12 Fujitsu Ltd Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020562A (en) * 1997-11-11 2000-02-01 3Com Corporation Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards
US20030107056A1 (en) * 2001-12-08 2003-06-12 National Semiconductor Corporation Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
US20070194434A1 (en) * 2006-02-20 2007-08-23 Chin-Sung Lin Differential signal transmission structure, wiring board, and chip package
US20070222084A1 (en) * 2006-03-22 2007-09-27 Jeffrey Hall Device for avoiding parasitic capacitance in an integrated circuit package

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DR. ERIC BOGATIN: "16 EMC Rules", March 2007 (2007-03-01), XP002552690, Retrieved from the Internet <URL:http://www.altera.com/technology/signal/columns/2007/2007-03-mar_1.html> [retrieved on 20091026] *
DR. LEW ARONSON (FINISAR): "XFP The Ultimate 10Gb/s Solution", October 2002 (2002-10-01), ANSOFT Empowering Profitability Workshop on September 16 - November 14, 2002, XP002552688, Retrieved from the Internet <URL:http://www.ansoft.com/EMpower/Finisar.pdf> [retrieved on 20090924] *
XFP MSA GROUP: "10 Gigabit Small Form Factor Pluggable Module Revision 4.5", 31 August 2005 (2005-08-31), XP002552689, Retrieved from the Internet <URL:http://www.xfpmsa.org/XFP_Rev4_5_SFF_INF_8077i.pdf> [retrieved on 20091027] *

Also Published As

Publication number Publication date
JP2011514007A (en) 2011-04-28
KR20100111321A (en) 2010-10-14
EP2263429A2 (en) 2010-12-22
US20090229859A1 (en) 2009-09-17
CN101971716B (en) 2013-02-13
US7746657B2 (en) 2010-06-29
WO2009113043A2 (en) 2009-09-17
CN101971716A (en) 2011-02-09
KR101167793B1 (en) 2012-07-25
JP5232878B2 (en) 2013-07-10

Similar Documents

Publication Publication Date Title
WO2009113043A3 (en) 10g xfp compliant pcb
TW200701879A (en) Shielded electronic circuit unit and method of manufacturing the same
EP2658043A3 (en) Shielded integrated connector modules and assemblies and methods of manufacturing the same
WO2007114993A3 (en) Implantable medical device assembly and manufacturing method
WO2012058131A3 (en) Composite film for board level emi shielding
WO2008027664A3 (en) Low-profile assemblies for providing board level emi shielding for electrical components on opposite sides of printed circuit boards
WO2007109773A3 (en) Electromagnetic interference containment in a transceiver module
WO2013006499A3 (en) Transceiver and interface for ic package
EP2503861A3 (en) Printed circuit board assembly for a mobile terminal and method for fabricating the same
WO2009061655A3 (en) Electrical connector system with orthogonal contact tails
WO2007092515A3 (en) Heat sink gasket
WO2006110526A3 (en) Orthogonal backplane connector
WO2004093506A3 (en) Electomagnetic interference shielding for a printed circuit board
WO2007084764A8 (en) Selective activation of protoxins through combinatorial targeting
WO2008070873A3 (en) Electromagnetic radiation containment and heat management in an electronic module
WO2013071197A3 (en) Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission
WO2011056584A3 (en) Shielded connector
WO2011146701A3 (en) Improved emi shielding member, particularly suitable for shielding of module cages
TW200711564A (en) Apparatus for minimizing electromagnetic interference and manufacturing method thereof
WO2010045397A3 (en) Emi-shielding solutions for electronics enclosures using opposing three-dimensional shapes and channels formed in sheet metal
GB201116522D0 (en) Method for connecting printed circuit boards
WO2011112025A3 (en) Emp protection cabinet
WO2012071236A3 (en) A gasket for an emi connector
WO2008143358A1 (en) Electric device, connecting method and adhesive film
EP2028722A3 (en) Anisotropic conductive connector and anisotropic conductive connector connection structure

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980108440.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09719200

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 20107020111

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2010550324

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009719200

Country of ref document: EP