WO2009113043A3 - 10g xfp compliant pcb - Google Patents
10g xfp compliant pcb Download PDFInfo
- Publication number
- WO2009113043A3 WO2009113043A3 PCT/IB2009/052730 IB2009052730W WO2009113043A3 WO 2009113043 A3 WO2009113043 A3 WO 2009113043A3 IB 2009052730 W IB2009052730 W IB 2009052730W WO 2009113043 A3 WO2009113043 A3 WO 2009113043A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- xfp
- pcb
- layer
- standard
- compliant
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020107020111A KR101167793B1 (en) | 2008-03-11 | 2009-03-02 | 10g xfp compliant pcb |
JP2010550324A JP5232878B2 (en) | 2008-03-11 | 2009-03-02 | 10GXFP compliant PCB |
EP09719200A EP2263429A2 (en) | 2008-03-11 | 2009-03-02 | 10g xfp compliant pcb |
CN200980108440.6A CN101971716B (en) | 2008-03-11 | 2009-03-02 | 10g xfp compliant pcb |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/075,375 US7746657B2 (en) | 2008-03-11 | 2008-03-11 | 10G XFP compliant PCB |
US12/075,375 | 2008-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009113043A2 WO2009113043A2 (en) | 2009-09-17 |
WO2009113043A3 true WO2009113043A3 (en) | 2009-12-23 |
Family
ID=40983478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2009/052730 WO2009113043A2 (en) | 2008-03-11 | 2009-03-02 | 10g xfp compliant pcb |
Country Status (6)
Country | Link |
---|---|
US (1) | US7746657B2 (en) |
EP (1) | EP2263429A2 (en) |
JP (1) | JP5232878B2 (en) |
KR (1) | KR101167793B1 (en) |
CN (1) | CN101971716B (en) |
WO (1) | WO2009113043A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI450657B (en) * | 2012-12-28 | 2014-08-21 | Hon Hai Prec Ind Co Ltd | Printed Circuit Board |
US9955568B2 (en) | 2014-01-24 | 2018-04-24 | Dell Products, Lp | Structure to dampen barrel resonance of unused portion of printed circuit board via |
US9433090B2 (en) | 2014-03-25 | 2016-08-30 | Microsoft Technology Licensing, Llc | Edge plated printed circuit board |
US9560737B2 (en) | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US10143090B2 (en) | 2015-10-19 | 2018-11-27 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US9904811B2 (en) | 2016-04-27 | 2018-02-27 | International Business Machines Corporation | Tamper-proof electronic packages with two-phase dielectric fluid |
US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
US11122682B2 (en) | 2018-04-04 | 2021-09-14 | International Business Machines Corporation | Tamper-respondent sensors with liquid crystal polymer layers |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6020562A (en) * | 1997-11-11 | 2000-02-01 | 3Com Corporation | Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards |
US20030107056A1 (en) * | 2001-12-08 | 2003-06-12 | National Semiconductor Corporation | Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads |
US20070194434A1 (en) * | 2006-02-20 | 2007-08-23 | Chin-Sung Lin | Differential signal transmission structure, wiring board, and chip package |
US20070222084A1 (en) * | 2006-03-22 | 2007-09-27 | Jeffrey Hall | Device for avoiding parasitic capacitance in an integrated circuit package |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2654414B2 (en) * | 1991-07-19 | 1997-09-17 | 沖電気工業株式会社 | Circuit board for high-speed signal transmission |
JPH0936504A (en) * | 1995-07-20 | 1997-02-07 | Oki Electric Ind Co Ltd | Wiring structure of signal transmitting line of printed board |
US6377464B1 (en) * | 1999-01-29 | 2002-04-23 | Conexant Systems, Inc. | Multiple chip module with integrated RF capabilities |
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US6617518B2 (en) * | 2001-11-02 | 2003-09-09 | Jds Uniphase Corporaton | Enhanced flex cable |
US7020960B2 (en) * | 2003-06-30 | 2006-04-04 | Finisar Corporation | Systems and methods for fabricating printed circuit boards |
JP2007180292A (en) * | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | Circuit board |
-
2008
- 2008-03-11 US US12/075,375 patent/US7746657B2/en not_active Expired - Fee Related
-
2009
- 2009-03-02 KR KR1020107020111A patent/KR101167793B1/en not_active IP Right Cessation
- 2009-03-02 EP EP09719200A patent/EP2263429A2/en not_active Withdrawn
- 2009-03-02 CN CN200980108440.6A patent/CN101971716B/en not_active Expired - Fee Related
- 2009-03-02 JP JP2010550324A patent/JP5232878B2/en not_active Expired - Fee Related
- 2009-03-02 WO PCT/IB2009/052730 patent/WO2009113043A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6020562A (en) * | 1997-11-11 | 2000-02-01 | 3Com Corporation | Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards |
US20030107056A1 (en) * | 2001-12-08 | 2003-06-12 | National Semiconductor Corporation | Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads |
US20070194434A1 (en) * | 2006-02-20 | 2007-08-23 | Chin-Sung Lin | Differential signal transmission structure, wiring board, and chip package |
US20070222084A1 (en) * | 2006-03-22 | 2007-09-27 | Jeffrey Hall | Device for avoiding parasitic capacitance in an integrated circuit package |
Non-Patent Citations (3)
Title |
---|
DR. ERIC BOGATIN: "16 EMC Rules", March 2007 (2007-03-01), XP002552690, Retrieved from the Internet <URL:http://www.altera.com/technology/signal/columns/2007/2007-03-mar_1.html> [retrieved on 20091026] * |
DR. LEW ARONSON (FINISAR): "XFP The Ultimate 10Gb/s Solution", October 2002 (2002-10-01), ANSOFT Empowering Profitability Workshop on September 16 - November 14, 2002, XP002552688, Retrieved from the Internet <URL:http://www.ansoft.com/EMpower/Finisar.pdf> [retrieved on 20090924] * |
XFP MSA GROUP: "10 Gigabit Small Form Factor Pluggable Module Revision 4.5", 31 August 2005 (2005-08-31), XP002552689, Retrieved from the Internet <URL:http://www.xfpmsa.org/XFP_Rev4_5_SFF_INF_8077i.pdf> [retrieved on 20091027] * |
Also Published As
Publication number | Publication date |
---|---|
JP2011514007A (en) | 2011-04-28 |
KR20100111321A (en) | 2010-10-14 |
EP2263429A2 (en) | 2010-12-22 |
US20090229859A1 (en) | 2009-09-17 |
CN101971716B (en) | 2013-02-13 |
US7746657B2 (en) | 2010-06-29 |
WO2009113043A2 (en) | 2009-09-17 |
CN101971716A (en) | 2011-02-09 |
KR101167793B1 (en) | 2012-07-25 |
JP5232878B2 (en) | 2013-07-10 |
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