WO2010019329A2 - Improved microvalve device - Google Patents
Improved microvalve device Download PDFInfo
- Publication number
- WO2010019329A2 WO2010019329A2 PCT/US2009/050063 US2009050063W WO2010019329A2 WO 2010019329 A2 WO2010019329 A2 WO 2010019329A2 US 2009050063 W US2009050063 W US 2009050063W WO 2010019329 A2 WO2010019329 A2 WO 2010019329A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- valve element
- travel
- boss
- motion
- depth
- Prior art date
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
- F16K99/0042—Electric operating means therefor
- F16K99/0044—Electric operating means therefor using thermo-electric means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/054—Microvalves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/0074—Fabrication methods specifically adapted for microvalves using photolithography, e.g. etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
- F16K2099/008—Multi-layer fabrications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49405—Valve or choke making
Definitions
- This invention relates in general to devices for MicroElectroMechanical Systems (MEMS), and in particular to a microvalve device having improved resistance to damage when subjected to external mechanical shocks.
- MEMS MicroElectroMechanical Systems
- MEMS MicroElectroMechanical Systems
- micromachining is commonly understood to mean the production of three- dimensional structures and moving parts of MEMS devices. MEMS originally used modified integrated circuit (computer chip) fabrication techniques (such as chemical etching) and materials (such as silicon semiconductor material) to micromachine these very small mechanical devices. Today there are many more micromachining techniques and materials available.
- micromachined device as used in this application means a device having features with sizes in the micrometer range or smaller, and thus by definition is at least partially formed by micromachining.
- microvalve as used in this application means a valve having features with sizes in the micrometer range or smaller, and thus by definition is at least partially formed by micromachining.
- microvalve device as used in this application means a micromachined device that includes a microvalve, and that may include other components. It should be noted that if components other than a microvalve are included in the microvalve device, these other components may be micromachined components or standard sized (larger) components. Similarly, a micromachined device may include both micromachined components and standard sized (larger) components.
- a typical microvalve device includes a displaceable member or valve component movably supported by a body for movement between a closed position and a fully open position. When placed in the closed position, the valve component substantially blocks or closes a first fluid port that is otherwise in fluid communication with a second fluid port, thereby preventing fluid from flowing between the fluid ports. When the valve component moves from the closed position to the fully open position, fluid is increasingly allowed to flow between the fluid ports.
- U.S. Patent Nos. 6,523,560; 6,540,203; and 6,845,962 the disclosures of which are incorporated herein by reference, describe microvalves made of multiple layers of material.
- the multiple layers are micromachined and bonded together to form a microvalve body and the various microvalve components contained therein, including an intermediate mechanical layer containing the movable parts of the microvalve.
- the movable parts are formed by removing material from an intermediate mechanical layer (by known micromachined device fabrication techniques, such as, but not limited to, Deep Reactive Ion Etching) to create a movable valve element that remains attached to the rest of the part by a spring-like member.
- the material is removed by creating a pattern of slots through the material of uniform width to achieve the desired shape.
- the movable valve element will then be able to move in one or more directions an amount roughly equal to the uniform slot width.
- the invention relates to a microvalve device for controlling fluid flow in a fluid circuit.
- the microvalve device includes a body having a cavity formed therein.
- a valve element is supported by the body and movably disposed within the cavity.
- An actuator is operatively coupled to the valve element for moving the valve element in a normal range of travel to control the flow of a fluid through the microvalve device.
- the microvalve device further includes a travel limiting structure operatively cooperating with the valve element.
- the travel limiting structure is effective to limit the amount of movement of the valve element outside the normal range of travel to prevent structural failure of the valve element or the actuator due to excessive stress (exceeding failure stress limits, i.e., exceeding the yield point of the material) caused by excessive travel outside the normal range of travel.
- This invention also relates to a method of forming a microvalve with such a travel limiting structure.
- FIG. 1 is a top view of an intermediate mechanical layer of a microvalve, illustrating a normally actuated position of the valve element.
- FIG. 2 is a view similar to Fig. 1, except showing the valve element displaced by a mechanical shock to a stressed position.
- FIG. 3 is a view similar to FIG. 1, showing the provision of a travel limiting structure to limit motion of the valve element in the event the microvalve is subjected to a mechanical shock.
- FIG. 4 is an enlarged view of a portion of the valve element shown in Fig. 3.
- FIG. 5 is a view similar to FIG. 4, but showing an even more enlarged view of a portion of the valve element shown in Fig. 3.
- Fig. 6 is an enlarged plan view of a first side of a travel limiting structure as shown in Fig. 5
- Fig. 7 is an enlarged plan view of a second side of a travel limiting structure as shown in Fig. 5.
- FIG. 8 is a sectional view of the travel limiting structure taken along the line 8-8 of Fig. 7.
- Fig. 9 is a block diagram showing a method of manufacturing a travel limiting structure as embodied in this invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
- FIG. 10 an exemplary embodiment of a microvalve device, including a microvalve for controlling fluid flow is shown generally at 10.
- the microvalve 10 includes an actuator, indicated generally at 12, and a movable valve element, indicated generally at 14.
- the actuator 12 may be of any suitable type of actuator.
- the actuator 12 is a thermal actuator formed of a plurality of ribs 16 joined in a herringbone pattern to a central spine 18.
- the ribs 16 are heated, such as by passing an electrical current through the ribs 16, the ribs 16 elongate.
- Each rib 16 is fixed to the central spine 18 at one end, and to a fixed portion 21 (see Fig. 3) of the microvalve 10.
- the ribs 16 urge the central spine 18 of the actuator 12 in the direction "A", toward the valve element 14.
- the valve element 14 is operatively coupled to the central spine 18 at a first location along the length of the valve element 14.
- the valve element 14 also includes a flexible hinge 20 at a second location, spaced apart from the first location.
- the flexible hinge 20 is operatively coupled at one end to the fixed portion 21.
- movement of the central spine 18 causes the valve element 14 to bend the hinge 20, thus causing the valve element 14 to move along a path of arcuate motion indicated at "B".
- the actuator 12 moves the valve element 14 through a normal range of travel along the path of arcuate motion so as to selectively block and unblock one or more fluid ports 22 (see Fig. 4) in the microvalve 10, thus controlling fluid flow through the microvalve 10.
- the actuator 12 is deenergized, the ribs 16 contract and the bending forces in the central spine 18 and the hinge 20 return the valve element 14 back toward an unactuated position.
- the micro valve 10 may be formed of multiple layers of material bonded together to form a body.
- the body may include a top layer (not shown), a bottom layer (not shown), and an intermediate layer adjacently located between the top and bottom layers.
- the movable parts including the actuator 12, the valve element 14, the ribs 16, the central spine 18, the hinge 20, and any other movable parts of the micro valve 10) may be formed by removing material from the intermediate layer.
- the material is removed from around the moving parts to separate the moving parts from the fixed portion 21 of the body. More specifically, the material may be removed by creating a pattern of slots through the material of the intermediate layer to achieve the desired shape.
- shallow recesses (not shown) in fixed portions of the body outside of the intermediate layer that are adjacent to the moveable parts of the micro valve 10, so as to limit friction between the movable parts of the microvalve 10 and the adjacent fixed parts of the body of the microvalve 10.
- openings 24 may be formed perpendicularly (that is, perpendicular to a plane defined by the motion within which the valve element 14 is constrained to move during normal range of travel) through various portions of the valve element 14.
- One effect of such openings 24 is to help prevent or diminish pressure imbalances between the perpendicularly opposed surfaces of the valve element 14, so that the valve element 14 is not urged into "out of plane” movement so as to drag against the layers of material (not shown) adjacent to the intermediate layer from which the movable parts are fabricated.
- the micro valve 10 of the illustrated embodiment has a valve element 14 actuated by the actuator 12.
- the actuator 12 is operated by heating the ribs 16 by the application of electrical power.
- the selective heating of the ribs 16 of the micro valve 10 causes movement due to differential thermal expansion of the material.
- the stresses in the movable parts and the fixed portion 21 caused by this actuation are designed to be in a safe range (i.e., less than the failure stress limits - that is, the yield point - for the material or materials forming the movable parts and the fixed portion 21) that will not cause damage to the movable parts or fixed portion 21 even after repeated cycling of the power applied.
- the movable parts of the micro valve 10 may be caused to move by forces other than those caused intentionally by the applied power.
- a shock load due to dropping the microvalve 10 may cause the movable parts to move in an unplanned fashion outside the normal range of travel, as shown in Fig. 2.
- the movable parts may move in one or more directions an amount equal to the uniform slot width, or more (in the case of movement toward a corner, for instance). These movements may cause the movable parts, particularly the spine 18 and the hinge 20, and the parts of the fixed portion 21 to which the movable parts are attached, or come into contact with, to be stressed in ways that do not occur during normal actuation.
- the level of stress may approach or exceed the failure stress limits potentially causing failure of the movable parts or the fixed portion 21 of the microvalve 10.
- the motion of the valve element 14 is limited to a normal range of travel defined by a path of arcuate motion.
- the magnitude of movement of the valve element 14 may be limited, that is, the magnitude of travel outside the normal range of travel may be restricted to a non-zero value which, nevertheless is sufficiently restricted that the failure stress limits are not reached in the components of the micro valve 10.
- the magnitude of movement of the other movable parts e.g., the ribs 16, the central spine 18, or the hinge 20 outside their normal range of travel during normal actuation may also be limited.
- the illustrated microvalve 10 includes a travel limiting structure, indicated generally at 25.
- the travel limiting structure 25 may include one or more bosses 26 extending above the general level of a surrounding surface, or may include other suitable features (not shown), that act to limit motion of the moveable parts of the microvalve 10 outside of the normal range of travel so that failure stress limits are not exceeded, so that the movable elements and the fixed portion 21 do not fail.
- a plurality of bosses 26 may be formed on the fixed portion 21 of the body. It should be appreciated that the bosses 26 may instead, or additionally, be formed on any of the movable parts of the microvalve 10, such as the valve element 14, without departing from the scope of this invention.
- the plurality of bosses 26 are configured to limit the magnitude of travel of the microvalve in the + and - Y directions (e.g., travel in a radial direction relative to the path of arcuate motion), and in the -X direction (e.g., uncommanded overtravel in an arcuate motion to the left of the illustrated unactuated position shown in Figs. 4 and 5), while permitting motion in the +X direction, which is the direction of normal actuation.
- the plurality of bosses 26 which constitute the travel limiting structure 25 are effective to limit the magnitude of the travel of the movable valve element 14 outside the normal range of travel.
- the movement of the valve element 14 can be constrained to a relatively small range of motion outside the normal range of travel so that neither the movable parts nor the fixed portion 21 reach stress levels which could cause the movable parts or the fixed portion 21, and thus the microvalve 10, to fail.
- the exact location or locations at which it would be desirable to provide a boss 26 or other feature of the travel limiting structure 25 is dependent upon the design of a particular microvalve.
- microvalve designs may allow uncommanded movement of a moveable valve element in a direction outside of a plane defined by the normal motion of the microvalve movable element sufficient to cause a movable element or fixed portion of the microvalve to exceed the failure stress limits of the material of which it was made, and fail.
- a travel limiting structure 25 may therefore also be configured to limit movement of the movable parts outside the plane of motion as defined by the normal range of travel of the valve element 14.
- a travel limiting structure 25 may include at least one boss or other feature (not shown) formed at a suitable location on the surface (not shown) of a cavity, or on another surface, of a fixed part of the body other than the intermediate layer (for example, in an adjacent layer of a multi-layer microvalve).
- a travel limiting structure 25 could be positioned at a location to limit the magnitude of movement outside a normal range of motion of the movable elements of the microvalve to an amount which would prevent the movable elements or fixed portion 21 from failing due to exceeding failure stress limits.
- the microvalve 10 may be provided with a travel limiting structure 25 that limits the magnitude of movement occurring outside of a normal range of movement, regardless of the direction of such movement.
- a microvalve 10 may have improved robustness and shock resistance compared to a microvalve device which is otherwise the same in structure and performance but not provided with a travel limiting structure 25.
- a method of manufacturing a travel limiting structure 25, as described above, may include the following steps.
- the method includes determining a proper configuration for the travel limiting structure 25 that would be effective to limit the amount of travel of the moveable parts outside the normal range of travel.
- the proper configuration of the travel limiting structure 25 may be based on a determination of the maximum allowable range of travel of the moving parts outside the normal range of travel so that the movable parts do not reach stress limits which could cause any portion of the microvalve 10 to fail.
- the travel limiting structure 25 may be located on the fixed portion 21 of the intermediate layer, on the movable valve element 14, on a fixed part of the body other than the intermediate layer (for example, in an adjacent layer of a multi- layer microvalve), or any combination thereof.
- the travel limiting structure 25 is formed in the proper configuration.
- the bosses 26 can be formed during the process of removing material from the intermediate layer by creating slots through the intermediate layer to form the movable parts of the microvalve 10.
- the width of the slots are made thinner in strategically selected locations, thereby forming the bosses 26 that limit the undesired motion of the movable parts.
- the bosses 26 may be formed through the whole depth of the intermediate layer. However, if etching is the process being used to form the microvalve 10, a longer time is typically required to etch thinner sections of the slots formed to create movable parts of the microvalve 10.
- the slot pattern may be etched from a first side of the intermediate layer of a uniform greater width Wl (for example, about 70 microns) in portions except in a location where a boss 26 is to be formed, in which location a relatively thinner width slot of a lesser width W2 (for example, about 40 microns) is formed to define an end face 27 of the boss, as shown in Fig. 6.
- This etching process will act to form the slots part way through the depth of the material of the intermediate layer.
- a second side of the intermediate layer is etched relatively more quickly with a pattern creating a slot uniformly of the greater width Wl (i.e., about 70 microns) part way through the intermediate layer to communicate with the slot formed from the first side, as shown in Fig. 7, so that the slot formed on the first side cooperates with the slot formed on the second side of the intermediate layer to create a combined slot that extends completely through the material of the intermediate layer, freeing the movable elements to move relative to the fixed portion 21 with a boss 26 extending into the combined slot.
- Wl greater width
- the resulting bosses 26 that are formed by etching the narrow portions of the slot only need to extend part way through the depth of the portion on which the bosses 26 are formed.
- much of the material of the intermediate layer can be etched through quickly, as only a fraction of the intermediate layer must be etched through at the slower rate of etching achievable while etching the slot with narrow portions, thus reducing the amount of time required to form the bosses 26.
- Fig. 8 there is illustrated one of the bosses 26 having a depth 28 formed on a fixed portion 21 of the body. The depth 28 of the boss 26 is less than the depth 30 of a combined slot extending completely through the fixed portion 21.
- boss 26 Only material of the thickness of the depth 28 of the boss 26 need be etched at a relatively slow rate. The remaining material of the intermediate layer can be etched at a relatively fast rate. It should be appreciated that the boss 26 may be formed on the movable valve element 14 in similar fashion.
- REFERENCE NUMBERS USED IN APPLICATION A direction of motion of actuated spine 18 B direction of rotary motion of valve element on actuation C direction of axial motion of valve element subjected to external shock
- valve element 24 openings through valve element to equalize pressure, etc.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011522088A JP2011530683A (en) | 2008-08-09 | 2009-07-09 | Improved microvalve device |
US13/058,146 US8662468B2 (en) | 2008-08-09 | 2009-07-09 | Microvalve device |
CN200980137328.5A CN102164846B (en) | 2008-08-09 | 2009-07-09 | The microvalve assembly improved |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8763508P | 2008-08-09 | 2008-08-09 | |
US61/087,635 | 2008-08-09 |
Publications (2)
Publication Number | Publication Date |
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WO2010019329A2 true WO2010019329A2 (en) | 2010-02-18 |
WO2010019329A3 WO2010019329A3 (en) | 2010-05-06 |
Family
ID=41669546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/050063 WO2010019329A2 (en) | 2008-08-09 | 2009-07-09 | Improved microvalve device |
Country Status (4)
Country | Link |
---|---|
US (1) | US8662468B2 (en) |
JP (1) | JP2011530683A (en) |
CN (1) | CN102164846B (en) |
WO (1) | WO2010019329A2 (en) |
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CN102003849A (en) * | 2010-11-02 | 2011-04-06 | 广东恒基金属制品实业有限公司 | Micro electromechanical silicon expansion valve |
US8387659B2 (en) | 2007-03-31 | 2013-03-05 | Dunan Microstaq, Inc. | Pilot operated spool valve |
US8393344B2 (en) | 2007-03-30 | 2013-03-12 | Dunan Microstaq, Inc. | Microvalve device with pilot operated spool valve and pilot microvalve |
US8540207B2 (en) | 2008-12-06 | 2013-09-24 | Dunan Microstaq, Inc. | Fluid flow control assembly |
US8593811B2 (en) | 2009-04-05 | 2013-11-26 | Dunan Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
US8662468B2 (en) | 2008-08-09 | 2014-03-04 | Dunan Microstaq, Inc. | Microvalve device |
US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
US8956884B2 (en) | 2010-01-28 | 2015-02-17 | Dunan Microstaq, Inc. | Process for reconditioning semiconductor surface to facilitate bonding |
US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
US9006844B2 (en) | 2010-01-28 | 2015-04-14 | Dunan Microstaq, Inc. | Process and structure for high temperature selective fusion bonding |
US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
US9702481B2 (en) | 2009-08-17 | 2017-07-11 | Dunan Microstaq, Inc. | Pilot-operated spool valve |
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US8851117B2 (en) * | 2012-01-30 | 2014-10-07 | Gm Global Technology Operations, Llc | MEMS valve operating profile |
US9235219B2 (en) * | 2012-12-27 | 2016-01-12 | Zhejiang Dunan Hetian Metal Co., Ltd. | Microvalve with integrated flow sensing capability |
US20140374633A1 (en) * | 2013-06-24 | 2014-12-25 | Zhejiang Dunan Hetian Metal Co., Ltd. | Microvalve Having Improved Resistance to Contamination |
CN104235497B (en) * | 2013-06-24 | 2018-11-30 | 浙江盾安禾田金属有限公司 | Micro-valve with improved air clean ability |
CN104609357B (en) * | 2013-11-01 | 2017-11-07 | 浙江盾安人工环境股份有限公司 | A kind of micro-valve |
US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
EP3489557B1 (en) | 2013-12-20 | 2020-04-22 | IMI Hydronic Engineering International SA | A valve and a method of operating a valve |
US9512936B2 (en) | 2014-08-14 | 2016-12-06 | Dunan Microstaq, Inc. | Three-port microvalve with improved sealing mechanism |
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US9505608B2 (en) * | 2014-08-25 | 2016-11-29 | Dunan Microstaq, Inc. | Microvalve having a reduced size and improved electrical performance |
US9702426B2 (en) * | 2014-09-08 | 2017-07-11 | Dunan Microstaq, Inc. | Three speed adjustable shock absorber having one or more microvalves |
US9970572B2 (en) | 2014-10-30 | 2018-05-15 | Dunan Microstaq, Inc. | Micro-electric mechanical system control valve and method for controlling a sensitive fluid |
US9618140B2 (en) | 2014-11-14 | 2017-04-11 | Dunan Microstaq, Inc. | Microvalve having improved actuator |
US9885352B2 (en) * | 2014-11-25 | 2018-02-06 | Genia Technologies, Inc. | Selectable valve of a delivery system |
US10094490B2 (en) | 2015-06-16 | 2018-10-09 | Dunan Microstaq, Inc. | Microvalve having contamination resistant features |
US10196259B2 (en) | 2015-12-30 | 2019-02-05 | Mems Drive, Inc. | MEMS actuator structures resistant to shock |
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Also Published As
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CN102164846A (en) | 2011-08-24 |
WO2010019329A3 (en) | 2010-05-06 |
US8662468B2 (en) | 2014-03-04 |
JP2011530683A (en) | 2011-12-22 |
CN102164846B (en) | 2016-03-30 |
US20110127455A1 (en) | 2011-06-02 |
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