WO2010025228A3 - Method and apparatus for extended temperature pyrometry - Google Patents

Method and apparatus for extended temperature pyrometry Download PDF

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Publication number
WO2010025228A3
WO2010025228A3 PCT/US2009/055162 US2009055162W WO2010025228A3 WO 2010025228 A3 WO2010025228 A3 WO 2010025228A3 US 2009055162 W US2009055162 W US 2009055162W WO 2010025228 A3 WO2010025228 A3 WO 2010025228A3
Authority
WO
WIPO (PCT)
Prior art keywords
extended temperature
systems
radiation detector
methods
pyrometry
Prior art date
Application number
PCT/US2009/055162
Other languages
French (fr)
Other versions
WO2010025228A8 (en
WO2010025228A2 (en
Inventor
Aaron M. Hunter
Jiping Li
Rajesh S. Ramanujam
Original Assignee
Applied Materials, Inc.
Haw, Thomas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc., Haw, Thomas filed Critical Applied Materials, Inc.
Priority to JP2011525188A priority Critical patent/JP5665744B2/en
Priority to KR1020117007278A priority patent/KR101699341B1/en
Priority to CN200980134141.XA priority patent/CN102217048B/en
Publication of WO2010025228A2 publication Critical patent/WO2010025228A2/en
Publication of WO2010025228A3 publication Critical patent/WO2010025228A3/en
Publication of WO2010025228A8 publication Critical patent/WO2010025228A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Abstract

Embodiments of the invention are directed to methods and apparatus for rapid thermal processing of a substrate over an extended temperature range, including low temperatures. Systems and methods for using an extended temperature pyrometry system employing a transmitted radiation detector system are disclosed. Systems combining transmitted radiation detector systems and emitted radiation detector systems are also described.
PCT/US2009/055162 2008-08-29 2009-08-27 Method and apparatus for extended temperature pyrometry WO2010025228A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011525188A JP5665744B2 (en) 2008-08-29 2009-08-27 Method and apparatus for extended temperature high temperature measurement
KR1020117007278A KR101699341B1 (en) 2008-08-29 2009-08-27 Method and apparatus for extended temperature pyrometry
CN200980134141.XA CN102217048B (en) 2008-08-29 2009-08-27 Method and apparatus for extended temperature pyrometry

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US9296408P 2008-08-29 2008-08-29
US61/092,964 2008-08-29
US11247708P 2008-11-07 2008-11-07
US61/112,477 2008-11-07
US12/547,605 US8254767B2 (en) 2008-08-29 2009-08-26 Method and apparatus for extended temperature pyrometry
US12/547,605 2009-08-26

Publications (3)

Publication Number Publication Date
WO2010025228A2 WO2010025228A2 (en) 2010-03-04
WO2010025228A3 true WO2010025228A3 (en) 2010-04-15
WO2010025228A8 WO2010025228A8 (en) 2011-04-07

Family

ID=41722259

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/055162 WO2010025228A2 (en) 2008-08-29 2009-08-27 Method and apparatus for extended temperature pyrometry

Country Status (5)

Country Link
US (1) US8254767B2 (en)
JP (1) JP5665744B2 (en)
KR (1) KR101699341B1 (en)
CN (1) CN102217048B (en)
WO (1) WO2010025228A2 (en)

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US9245777B2 (en) * 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
CN105441909B (en) * 2014-07-08 2018-06-26 中微半导体设备(上海)有限公司 A kind of system and method for detecting temperature and the MOCVD device equipped with the system
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US11171023B2 (en) * 2015-10-09 2021-11-09 Applied Materials, Inc. Diode laser for wafer heating for EPI processes
CN106500853B (en) * 2016-10-09 2019-05-07 南京理工大学 A kind of wide-range high-accuracy infrared double color temperature measurer based on multisensor
JP7158133B2 (en) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド Atmosphere-controlled transfer module and processing system
US11004704B2 (en) 2017-03-17 2021-05-11 Applied Materials, Inc. Finned rotor cover
WO2018218201A1 (en) * 2017-05-26 2018-11-29 Applied Materials, Inc. Continuous spectra transmission pyrometry
US10571337B2 (en) 2017-05-26 2020-02-25 Applied Materials, Inc. Thermal cooling member with low temperature control
US10281335B2 (en) * 2017-05-26 2019-05-07 Applied Materials, Inc. Pulsed radiation sources for transmission pyrometry
SG10201705708YA (en) * 2017-05-26 2018-12-28 Applied Materials Inc Detector for low temperature transmission pyrometry
WO2019147405A1 (en) 2018-01-23 2019-08-01 Applied Materials, Inc. Methods and apparatus for wafer temperature measurement
US11545375B2 (en) * 2019-06-17 2023-01-03 Applied Materials, Inc. Hybrid control system for workpiece heating
US11342209B2 (en) * 2019-12-09 2022-05-24 Applied Materials, Inc. Methods and apparatus for measuring edge ring temperature
WO2022036091A1 (en) * 2020-08-12 2022-02-17 Watlow Electric Manufacturing Company Method and system for providing variable ramp-down control for an electric heater
US20220136772A1 (en) * 2020-11-05 2022-05-05 Applied Materials, Inc. Rtp substrate temperature one for all control algorithm
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JP2007183207A (en) * 2006-01-10 2007-07-19 Yamatake Corp Radiation temperature sensor and radiation temperature measuring device

Also Published As

Publication number Publication date
WO2010025228A8 (en) 2011-04-07
JP2012501548A (en) 2012-01-19
US20100054720A1 (en) 2010-03-04
KR101699341B1 (en) 2017-01-24
KR20110046578A (en) 2011-05-04
WO2010025228A2 (en) 2010-03-04
CN102217048A (en) 2011-10-12
CN102217048B (en) 2014-05-21
US8254767B2 (en) 2012-08-28
JP5665744B2 (en) 2015-02-04

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