WO2010030307A1 - A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material - Google Patents
A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material Download PDFInfo
- Publication number
- WO2010030307A1 WO2010030307A1 PCT/US2008/088461 US2008088461W WO2010030307A1 WO 2010030307 A1 WO2010030307 A1 WO 2010030307A1 US 2008088461 W US2008088461 W US 2008088461W WO 2010030307 A1 WO2010030307 A1 WO 2010030307A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- graphite
- metal complex
- aluminum
- heat
- heat sink
- Prior art date
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 title claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 26
- 239000010439 graphite Substances 0.000 claims abstract description 26
- 238000000465 moulding Methods 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 238000009716 squeeze casting Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 150000004696 coordination complex Chemical class 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011365 complex material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C37/00—Cast-iron alloys
- C22C37/04—Cast-iron alloys containing spheroidal graphite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Graphite-based metal complex materials are known wherein metal is dispersed in a graphite molding sintered from a molding by unidirectional pressure using a metal complex material, extruded molding, or cold isostatic pressure molding wherein a metal matrix and graphite particles or graphite fibers have been dispersed as a material in a graphite-metal complex incorporating a graphite material.
- Japanese Patent Application Hl 1-321828, Patent Application 2001135551 Japanese Patent Application Hl 1-321828, Patent Application 2001135551
- Fig. 1 is a diagram of a graphite-metal complex and aluminum heat sink (flat board type).
- Fig. 2 is a diagram of a graphite-metal complex and aluminum heat sink (column type).
- Fig 3 is a diagram of a graphite-metal complex aluminum heat sink (prism type)
- Fig. 1 of Fig-1 is a flat board type metal complex (2) and aluminum heat sink (3).
- Fig. 2 and Fig 3 are respectively a column type and graphite-metal complex (2) and aluminum heat sink (3).
- the invention relates to a heat radiator composed of a combination of a suitable graphite-iron complex and aluminum extruded material on an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and fails at high temperatures.
- the purpose of the invention is to take into account the aforementioned problems and provide a heat radiator that, while maintaining the properties of good thermal diffusivity of graphite metal complexes, reinforces the weak mechanical properties that are a drawback thereof, and furthermore, is lower in cost.
- a heat radiator wherein a graphite-metal complex obtained by pressure-impregnating aluminum, copper or an alloy thereof into a graphite molding incorporating a 50-92 volume % of graphite powder by squeeze casting is cut into board shapes or column shapes, etc., which are aligned and arrayed into the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.
- a heat radiator wherein aluminum, copper or an alloy thereof is pressure-impregnated by squeeze casting into a molding incorporating a 50-92% combination of short fiber material of chopped graphite fibers and man-made graphite, and the obtained graphite-metal complex is cut and arrayed so that it properly conforms to the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.
- the molding method of the molding graphite powder of copped graphite fibers incorporating graphite powder is one of molding by unidirectional pressure, using an extruded molding or cold.
- the invention enables the utilization of the good heat diffusivity of a graphite-metal complex, with the weakness in mechanical strength of a graphite- metal complex reinforced by bringing it into contact with an aluminum or aluminum alloy metal extruded material.
- low cost is achieved by preparing everything with a graphite-metal complex.
- an economically superior heat radiator wherein the heat generated by an LED package, high-load semiconductor, high-load capacitor or integrated circuit board is efficiently diffused by the graphic-metal complex, and the heat is radiated by a heat sink of strong aluminum alloy from fins having a large surface area.
- the manufacturing method of the graphite-metal complex is pressure- impregnation by squeeze casting.
- the graphite used during this may be one in which man-made graphite is extruded with tar, pitch or an organic resin, one made by cold isostatic molding or one molded by unidirectional pressure with a die, which is then ultimately heat-treated at 2500 0 C or more, and consequentially close to 100% forms a graphite system.
- chopped graphite fiber may be incorporated.
- the obtained graphite-metal complex is superior for machining, and can be easily worked into board, column or prism shapes, etc.
- Fig. 1 is a heat radiator
- 2 is a graphite-metal complex
- 3 is a heat sink of aluminum extruded material
- 2 is a board in contact with 3.
- the 2 graphite-metal complex is column- shaped, the outer surface thereof coming into contact with the inner surface of the 3 aluminum extruded material.
- the 2 graphite-metal complex is prism-shaped, the four-sided surface thereof coming into contact with the inside surface of the 3 aluminum extruded material.
- connection method of the graphite-metal complex and heat sink may be a shrink-fit method, as the thermal expansion rate of the graphite-metal complex is 7 x 10 "6 1/K, and that of the aluminum is 23 x 10 "6 1/K in Fig. 2 and Fig. 3, for example.
- a set screw with silicon grease between the graphite-metal complex and heat sink, or plating and soldering, on both sides, may be used with the embodiment in Fig 1.
- the aluminum heat sink used in the invention is not limited to an extruded material, and a die-cast, casted or forged materials, etc. may be utilized.
- the substance may be an aluminum alloy, but a JIS A 1000 or JIS A 6000 series alloy is more suitable as it is both workable and high in thermal conductivity.
- the types of graphite used in the invention are natural graphite and man-made graphite, and commercially-available graphite blocks are acceptable.
- a 50%-95% volume fraction may be used for the graphite in the graphite-metal complex. If it is 50% or less, the heat diffusivity rate is low, and so is not suitable for the heat radiator in the invention.
- the metal used in the graphite-metal complex is aluminum, an aluminum alloy, copper or a copper alloy.
- the aluminum alloy used may be of a JIS wrought material series or a JIS cast metal material series, etc. However, an alloy with a low melting point is preferred.
- copper alloy a JIS C 1000 series-7000 series wrought copper materials, etc. may be used.
- a heat radiator obtained as described above achieves a more efficient heat radiator, by using a graphite-metal complex superior in heat diffusivity at the position that makes contact with a heat source, and combining an aluminum heat sink of large heat radiating surface area at the position that makes contact with the graphite-metal complex.
- the aforementioned heat radiator is capable of functioning as a structure by reinforcing the weak mechanical strength of the graphite-metal complex with an aluminum heat sink.
- the size of an electrode graphite block remains at 150 mm x 200 mm x 250 mm at 700 0 C in an argon atmosphere, while a JIS-AC3 A aluminum alloy melts at 700 0 C. These are introduced into a die for squeeze casting, and casting is completed at a pressure of 60 Mpa.
- a graphite-metal complex was obtained from the casting, which was then cut into boards 2 mm thick in length and had sides 20 mm in size, and, after 4W LED had been mounted on top of these, they were brought into contact with the 30 mm x 25 mm of an aluminum (JIS A 6063 extruded material) heat sink with 10 fins that are 10 mm in length, and when they were energized 333 mA with 12 V and the temperature was measured after one hour, the LED tops were 38°C and the heat sink fins were 26 0 C. Furthermore, the room temperature was 22 0 C.
- Example 1 a JIS A 1050 board of the same size was used, in reverse, a heat sink was prepared of the same shape as the aluminum heat sink in Working Example 1 by processing a graphite-metal complex, and when the same test was performed, the LED tops were 98°C and the heat sink tins were 54°C.
- a 150 mm x 200 mm board 3 mm thick was prepared from the graphite-metal complex in the above example, and then screwed onto the 2 mm thickness of the flat board section of an aluminum heat sink with the same 150 mm x 200 mm size with 30 fins that are 30 mm tall.
- a 120 W heat discharge integrated circuit board was disposed on a graphite-metal complex board, and when a temperature measurement was taken after two hours, the graphite-metal complex board was 45 0 C, and the fins of the aluminum heat sink were 35 0 C.
- the heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material, etc. in the invention combines those that have superior heat diffusivity and those in which a low-cost aluminum heat sink have a large heat radiating surface area, and therefore is effective in radiating the heat of an LED package, high-load capacitor or an integrated circuit board composed of a combination thereof, and is useful in a wide range of industrial fields.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08876944A EP2324074A4 (en) | 2008-09-11 | 2008-12-29 | A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
US13/063,568 US20110259570A1 (en) | 2008-09-11 | 2008-12-29 | Heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-233604 | 2008-09-11 | ||
JP2008233604A JP5335339B2 (en) | 2008-09-11 | 2008-09-11 | A heat radiator composed of a combination of a graphite-metal composite and an aluminum extruded material. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010030307A1 true WO2010030307A1 (en) | 2010-03-18 |
Family
ID=42005380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/088461 WO2010030307A1 (en) | 2008-09-11 | 2008-12-29 | A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110259570A1 (en) |
EP (1) | EP2324074A4 (en) |
JP (1) | JP5335339B2 (en) |
KR (1) | KR20110085978A (en) |
WO (1) | WO2010030307A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102114495A (en) * | 2010-11-25 | 2011-07-06 | 深圳市天电光电科技有限公司 | Method for manufacturing LED radiator |
WO2013030001A1 (en) * | 2011-08-26 | 2013-03-07 | Robert Bosch Gmbh | Semiconductor component with a heat sink |
CN106531874A (en) * | 2016-11-30 | 2017-03-22 | 南京劲峰洋光电科技有限公司 | Novel heat dissipation insulating composite material and preparation method therefor |
CN107022690A (en) * | 2017-05-03 | 2017-08-08 | 合肥工业大学 | A kind of method that aluminium/C-base composte material is prepared by Pressure Infiltration aluminium alloy |
Families Citing this family (13)
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US20110027603A1 (en) * | 2008-12-03 | 2011-02-03 | Applied Nanotech, Inc. | Enhancing Thermal Properties of Carbon Aluminum Composites |
US20100310447A1 (en) * | 2009-06-05 | 2010-12-09 | Applied Nanotech, Inc. | Carbon-containing matrix with functionalized pores |
US20110147647A1 (en) * | 2009-06-05 | 2011-06-23 | Applied Nanotech, Inc. | Carbon-containing matrix with additive that is not a metal |
JP5622465B2 (en) * | 2010-07-22 | 2014-11-12 | ローム株式会社 | LED bulb and manufacturing method of LED bulb |
CN203594979U (en) * | 2011-01-19 | 2014-05-14 | 格拉弗技术国际控股有限公司 | Electric light bulb |
JP2014047127A (en) | 2012-09-04 | 2014-03-17 | Toyo Tanso Kk | Metal-carbon composite material, manufacturing method of metal-carbon composite material, and sliding member |
JP6164632B2 (en) * | 2013-01-11 | 2017-07-19 | 株式会社アカネ | Method for producing carbon-based metal composite material |
US10914539B2 (en) | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
KR101301624B1 (en) * | 2013-07-05 | 2013-08-29 | (주) 동양에이.케이코리아 | Manufacturing method of including carbon aluminium or aluminium alloy extrusion and using included carbon aluminium or aluminium alloy extrusion |
CN105916348A (en) * | 2016-03-25 | 2016-08-31 | 华为技术有限公司 | Electronic device middle frame fitting and manufacturing method thereof |
WO2021125196A1 (en) * | 2019-12-17 | 2021-06-24 | 宇部興産株式会社 | Graphite-copper composite material, heating member using same, and method for manufacturing graphite-copper composite material |
KR102298678B1 (en) * | 2020-04-22 | 2021-09-07 | 부경대학교 산학협력단 | Method for manufacturing cooling pipe for electric vehicle powertrain and cooling pipe manufactured thereby |
JP7156586B1 (en) | 2022-03-17 | 2022-10-19 | 三菱電機株式会社 | Semiconductor device manufacturing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6050332A (en) * | 1997-12-11 | 2000-04-18 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
US20060091532A1 (en) * | 2002-10-11 | 2006-05-04 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
US7311140B2 (en) * | 2000-02-01 | 2007-12-25 | Cool Options, Inc. | Heat sink assembly with overmolded carbon matrix |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
US5520976A (en) * | 1993-06-30 | 1996-05-28 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
EP1187199A2 (en) * | 2000-08-28 | 2002-03-13 | Alcan Technology & Management AG | Heatsink for Semiconductor Device, Method of Mannufacturing the same, as well as Molding Die therefore |
JP2002184922A (en) * | 2000-12-12 | 2002-06-28 | Ntt Advanced Technology Corp | Composite heat dissipating member |
US20030024611A1 (en) * | 2001-05-15 | 2003-02-06 | Cornie James A. | Discontinuous carbon fiber reinforced metal matrix composite |
US6691768B2 (en) * | 2001-06-25 | 2004-02-17 | Sun Microsystems, Inc. | Heatsink design for uniform heat dissipation |
US6758263B2 (en) * | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
WO2003051552A1 (en) * | 2001-12-19 | 2003-06-26 | Showa Denko K.K. | Extrusion tool, method for manufacturing shaped article with fins, and heat sink |
US20030131970A1 (en) * | 2002-01-17 | 2003-07-17 | Carter Daniel P. | Heat sinks and method of formation |
US20050189647A1 (en) * | 2002-10-11 | 2005-09-01 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
US20040190245A1 (en) * | 2003-03-31 | 2004-09-30 | Murli Tirumala | Radial heat sink with skived-shaped fin and methods of making same |
US6779593B1 (en) * | 2003-04-30 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | High performance cooling device with heat spreader |
US7282265B2 (en) * | 2003-05-16 | 2007-10-16 | Hitachi Metals, Ltd. | Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods |
JP4344934B2 (en) * | 2003-05-16 | 2009-10-14 | 日立金属株式会社 | High thermal conductivity / low thermal expansion composite material, heat dissipation substrate and manufacturing method thereof |
US20050238835A1 (en) * | 2004-04-24 | 2005-10-27 | Chien-Min Sung | Graphite composite thermal sealants and associated methods |
JP4015146B2 (en) * | 2004-10-12 | 2007-11-28 | 古河電気工業株式会社 | Heat sink with fins and method for manufacturing the same |
JP4940883B2 (en) * | 2005-10-31 | 2012-05-30 | 豊田合成株式会社 | Light emitting device |
US20080073070A1 (en) * | 2006-09-26 | 2008-03-27 | Chin-Hu Kuo | Highly efficient heat dissipating composite material and a heat dissipating device made of such material |
US20080085403A1 (en) * | 2006-10-08 | 2008-04-10 | General Electric Company | Heat transfer composite, associated device and method |
US20080128067A1 (en) * | 2006-10-08 | 2008-06-05 | Momentive Performance Materials Inc. | Heat transfer composite, associated device and method |
-
2008
- 2008-09-11 JP JP2008233604A patent/JP5335339B2/en not_active Expired - Fee Related
- 2008-12-29 WO PCT/US2008/088461 patent/WO2010030307A1/en active Application Filing
- 2008-12-29 EP EP08876944A patent/EP2324074A4/en not_active Withdrawn
- 2008-12-29 US US13/063,568 patent/US20110259570A1/en not_active Abandoned
- 2008-12-29 KR KR1020117008073A patent/KR20110085978A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6050332A (en) * | 1997-12-11 | 2000-04-18 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
US7311140B2 (en) * | 2000-02-01 | 2007-12-25 | Cool Options, Inc. | Heat sink assembly with overmolded carbon matrix |
US20060091532A1 (en) * | 2002-10-11 | 2006-05-04 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102114495A (en) * | 2010-11-25 | 2011-07-06 | 深圳市天电光电科技有限公司 | Method for manufacturing LED radiator |
WO2013030001A1 (en) * | 2011-08-26 | 2013-03-07 | Robert Bosch Gmbh | Semiconductor component with a heat sink |
CN106531874A (en) * | 2016-11-30 | 2017-03-22 | 南京劲峰洋光电科技有限公司 | Novel heat dissipation insulating composite material and preparation method therefor |
CN107022690A (en) * | 2017-05-03 | 2017-08-08 | 合肥工业大学 | A kind of method that aluminium/C-base composte material is prepared by Pressure Infiltration aluminium alloy |
Also Published As
Publication number | Publication date |
---|---|
EP2324074A1 (en) | 2011-05-25 |
JP2010067842A (en) | 2010-03-25 |
US20110259570A1 (en) | 2011-10-27 |
JP5335339B2 (en) | 2013-11-06 |
EP2324074A4 (en) | 2012-06-13 |
KR20110085978A (en) | 2011-07-27 |
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