WO2011034737A2 - Structures, design structures and methods of fabricating global shutter pixel sensor cells - Google Patents
Structures, design structures and methods of fabricating global shutter pixel sensor cells Download PDFInfo
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- WO2011034737A2 WO2011034737A2 PCT/US2010/047599 US2010047599W WO2011034737A2 WO 2011034737 A2 WO2011034737 A2 WO 2011034737A2 US 2010047599 W US2010047599 W US 2010047599W WO 2011034737 A2 WO2011034737 A2 WO 2011034737A2
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- 238000013461 design Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims description 23
- 238000002955 isolation Methods 0.000 claims abstract description 119
- 239000004065 semiconductor Substances 0.000 claims abstract description 116
- 238000009792 diffusion process Methods 0.000 claims abstract description 110
- 238000007667 floating Methods 0.000 claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 claims abstract description 30
- 238000002161 passivation Methods 0.000 claims description 55
- 238000003860 storage Methods 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 9
- 239000002019 doping agent Substances 0.000 claims 16
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 238000012938 design process Methods 0.000 description 13
- 238000004088 simulation Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012804 iterative process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
Definitions
- the present invention relates to the field of solid-state image sensing devices; more specifically, it relates to CMOS based pixel sensor cell devices, methods of fabricating CMOS based pixel sensor cell devices and design structures for CMOS based pixel sensor cell devices.
- CMOS complementary metal oxide semiconductor
- a first aspect of the present invention is a pixel sensor cell, comprising: a
- photodiode body in a first region of a semiconductor layer; a floating diffusion node in a second region of the semiconductor layer, a third region of the semiconductor layer between and abutting the first and second regions; and dielectric isolation in the semiconductor layer, the dielectric isolation surrounding the first, second and third regions, the dielectric isolation abutting the first, second and third regions and the photodiode body, the dielectric isolation not abutting the floating diffusion node, portions of the second region intervening between the dielectric isolation and the floating diffusion node.
- a second aspect of the present invention is a method of fabricating a pixel sensor cell, comprising: forming a photodiode body in a first region of a semiconductor layer; forming a floating diffusion node in a second region of the semiconductor layer, a third region of the semiconductor layer between and abutting the first and second regions; and forming dielectric isolation in the semiconductor layer, the dielectric isolation
- the dielectric isolation abutting the first, second and third regions and the photodiode body, the dielectric isolation not abutting the floating diffusion node, portions of the second region intervening between the dielectric isolation and the floating diffusion node.
- a third aspect of the present invention is a design structure comprising design data tangibly embodied in a machine-readable medium, the design data being used for designing, manufacturing, or testing an integrated circuit, the design data comprising information describing a pixel sensor cell the pixel sensor cell comprising: a photodiode body in a first region of a semiconductor layer; a floating diffusion node in a second region of the semiconductor layer, a third region of the semiconductor layer between and abutting the first and second regions; and dielectric isolation in the semiconductor layer, the dielectric isolation surrounding the first, second and third regions, the dielectric isolation abutting the first, second and third regions and the photodiode body, the dielectric isolation not abutting the floating diffusion node, portions of the second region intervening between the dielectric isolation and the floating diffusion node.
- FIG. 1A is a top view and FIGs. IB, 1C, ID and IE are cross- sections through respective lines IB- IB, 1C-1C, ID- ID and IE- IE of FIG. 1A illustrating fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 2A is a top view and FIGs. 2B, 2C, 2D and 2E are cross- sections through respective lines 2B-2B, 2C-2C, 2D-2D and 2E-2E of FIG. 2A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 3A is a top view and FIGs. 3B, 3C, 3D and 3E are cross- sections through respective lines 3B-3B, 3C-3C, 3D-3D and 3E-3E of FIG. 3A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 4A is a top view and FIGs. 4B, 4C, 4D and 4E are cross- sections through respective lines 4B-4B, 4C-4C, 4D-4D and 4E-4E of FIG. 4A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 5A is a top view and FIGs. 5B, 5C, 5D and 5E are cross- sections through respective lines 5B-5B, 5C-5C, 5D-5D and 5E-5E of FIG. 5A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 5F is a cross-section illustrating gate structures through line 5B-5B of FIG.
- FIG. 6A is a top view and FIGs. 6B, 6C, 6D and 6E are cross- sections through respective lines 6B-6B, 6C-6C, 6D-6D and 6E-6E of FIG. 6A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 7A is a top view and FIGs. 7B, 7C, 7D and 7E are cross- sections through respective lines 7B-7B, 7C-7C, 7D-7D and 7E-7E of FIG. 7A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 8A is a top view and FIGs. 8B, 8C, 8D and 8E are cross- sections through respective lines 8B-8B, 8C-8C, 8D-8D and 8E-8E of FIG. 8A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIG. 9A is a top view and FIGs. 9B, 9C, 9D and 9E are cross- sections through respective lines 9B-9B, 9C-9C, 9D-9D and 9E-9E of FIG. 9A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention
- FIGs. 10A, 10B, IOC and 10D illustrate alternative structures for the storage node of a pixel sensor cell according to embodiments of the present invention
- FIG. 11 is a top view of illustrating interconnections of the structural elements in a pixel sensor cell circuit
- FIG. 12 is a circuit diagram of a pixel sensor cell circuit according to embodiments of the present invention.
- FIG. 13 is a diagram illustrating an array of global shutter pixel sensor cells
- FIG. 14 shows a block diagram of an exemplary design flow 400 used for
- Solid state imaging devices contain CMOS based pixel sensor cells arranged in an array of rows and columns and a shutter mechanism to expose the pixel sensor cell array.
- the image is captured on a row-by-row basis. For a given row the image is captured by photodiodes, transferred to floating diffusion nodes, and then the nodes are read out to column sample circuits before moving on to the next row. This repeats until the all the pixel sensor cell rows are captured and read out. In the resulting image each row represents the subject at a different time.
- the rolling shutter methodology can create image artifacts.
- the image is captured for the whole frame in the photodiodes at the same time for all the rows and columns of the pixel sensor cell array. Then the image signal is transferred to the floating diffusion nodes where it is stored until it is read out on a row-by-row basis.
- the global shutter method solves the problem with image capture of high speed subjects, but introduces the problem of charge level change on the charge storage node of the pixel sensor cell.
- the image signal is held in the charge storage nodes for a significantly shorter time than the actual time of exposure of the photodiode, and this hold time is the same for all pixel sensor cells in the array, making correction for charge level change in storage node simple with standard CDS techniques.
- the image signal is held in the storage node for varying amounts of time. The time in the first row being the shortest time (the time to read out a single row) with the time in the last row being the longest time (the time to read all rows). Thus any charge generation or leakage occurring on storage node can have a significant impact to the signal being read out of the row.
- the present invention reduce the amount of change to the charge being held on the floating diffusion node of the pixel sensor cell.
- the embodiments of the present invention use unique well and floating diffusion node ion implantation design levels/masks to create floating diffusion nodes that have minimal dark current generation and leakage caused by stray carriers that may be generated in adjacent semiconductor regions.
- the drain ion implant design level/mask leaves a space between the floating diffusion node and the dielectric isolation sidewalls.
- the well ion implantation design level/mask is designed such that the well extends under the floating diffusion node and the dielectric isolation.
- an electron shield ion implantation design level/mask is provided.
- a dielectric trench sidewall passivation ion implantation design level/mask is provided, which reduces carrier generation that can occur along the dielectric isolation sidewall surfaces.
- a surface pinning ion implantation design level/mask is provided which passivates the surface of the photodiode and the floating diffusion node.
- FIG. 1A is a top view and FIGs. IB, 1C, ID and IE are cross- sections through respective lines IB- IB, 1C-1C, ID- ID and IE- IE of FIG. 1A illustrating fabrication of a pixel sensor cell according to embodiments of the present invention.
- semiconductor layer 100 is dielectric trench isolation 105.
- semiconductor layer 100 is a single crystal silicon substrate or an epitaxial single crystal silicon layer on a single crystal silicon or semiconductor substrate.
- semiconductor layer is an upper semiconductor layer (which may be a single crystal silicon layer) of a semiconductor-on-insulator substrate comprising the upper semiconductor layer separated from a lower semiconductor layer (which may be a single crystal silicon layer) by a buried oxide (BOX) layer.
- Dielectric isolation 105 is formed, for example, by photo lithographically defining and etching a trench in substrate 100, then filling the trench with a dielectric material (e.g., Si02) and performing a chemical- mechanical-polish to coplanarize a top surface 106 of dielectric isolation with a top surface 107 of substrate 100.
- semiconductor layer 100 is doped P-type.
- a photolithographic process is one in which a photoresist layer is applied to a surface of a substrate, the photoresist layer exposed to actinic radiation through a patterned photomask (fabricated based on a design level) and the exposed photoresist layer developed to form a patterned photoresist layer.
- the photoresist layer comprises positive photoresist
- the developer dissolves the regions of the photoresist exposed to the actinic radiation and does not dissolve the regions where the patterned photomask blocked (or greatly attenuated the intensity of the radiation) from impinging on the photoresist layer.
- the developer does not dissolve the regions of the photoresist exposed to the actinic radiation and does dissolve the regions where the patterned photomask blocked (or greatly attenuated the intensity of the radiation) from impinging on the photoresist layer.
- the patterned photoresist is removed. Processing results in a physical change to the substrate.
- FIG. 2A is a top view and FIGs. 2B, 2C, 2D and 2E are cross- sections through respective lines 2B-2B, 2C-2C, 2D-2D and 2E-2E of FIG. 2A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- an optional dielectric passivation layer 110 is formed in semiconductor layer 100 along selected surfaces of dielectric isolation.
- Dielectric passivation layer 110 is formed, in one example, by photo lithographically defining and then ion implanting a selected region of substrate 100.
- dielectric passivation layer 100 is doped P-type.
- FIG. 2C and 2D dielectric passivation layer 110 extends along the sidewalls and bottom surfaces of dielectric isolation 105.
- FIG. 2C illustrates a region of semiconductor layer 100 where a photodiode will be subsequently formed and
- FIG. 2D illustrates a region of the semiconductor layer 100 where a floating diffusion node will be subsequently formed.
- FIG. 3A is a top view and FIGs. 3B, 3C, 3D and 3E are cross- sections through respective lines 3B-3B, 3C-3C, 3D-3D and 3E-3E of FIG. 3A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- first and second wells 115A and 115B are formed in semiconductor layer 100.
- First and second P-wells 115A and 115B are simultaneously formed, in one example, by photolithographically defining and then ion implanting selected regions of substrate 100.
- first and second wells 115A and 115B are doped P-type.
- first and second wells 115A and 115B extends along the bottom surfaces of dielectric isolation 105. Wells are not formed in FIG. 3C (where the photodiode will be subsequently formed) and FIG. 3D (where the floating diffusion node will be subsequently formed).
- FIG. 4A is a top view and FIGs. 4B, 4C, 4D and 4E are cross- sections through respective lines 4B-4B, 4C-4C, 4D-4D and 4E-4E of FIG. 4A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- an optional electron shield 120 formed in semiconductor layer 100. Electron shield 120 is formed, in one example, by photolithographically defining and then ion implanting selected regions of substrate 100. In one example, electron shield 120 is doped P-type.
- electron shield 120 is a buried layer and does not extend to top surface 107 of semiconductor layer 100, a region of semiconductor layer 100 above electron shield 120 intervening. Electron shield 120 extends along the bottom surfaces of dielectric isolation 105. In FIG 4D, (where the floating diffusion node will be subsequently formed) electron shield 120 abuts (i.e., abuts) dielectric passivation layer 110 and extend under dielectric passivation 105. If dielectric passivation layer 110 is not present, electron shield 120 abuts dielectric isolation 105.
- FIG. 5A is a top view and FIGs. 5B, 5C, 5D and 5E are cross- sections through respective lines 5B-5B, 5C-5C, 5D-5D and 5E-5E of FIG. 5A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- gate electrodes 125, 130, 135, 140 and 145 are formed in FIGs. 5A and 5B.
- Bold lines illustrate perimeters of gate electrodes 125, 130, 135, 140 and 145.
- gate electrodes 125, 130, 135, 140 and 145 may be simultaneously formed by depositing a gate dielectric layer, then a polysilicon layer on the gate dielectric later followed by photo lithographically defining and then etching away unprotected (by the patterned photoresist layer) regions of the polysilicon layer.
- FIG. 5F is a cross-section illustrating gate structures through line 5B-5B of FIG.
- gate dielectric layers 126, 131, 136, 141 and 146 intervene between respective gate electrodes 125, 130, 135, 140 and 145 and semiconductor layer 100.
- There are five gate electrodes as the completed pixel sensor cell will be a five-transistor pixel sensor cell.
- FIG. 6A is a top view and FIGs. 6B, 6C, 6D and 6E are cross- sections through respective lines 6B-6B, 6C-6C, 6D-6D and 6E-6E of FIG. 6A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- a photodiode body 150 is formed in semiconductor layer 100. Photodiode body 150 is formed, in one example, by photolithographically defining and then ion implanting selected regions of substrate 100. In one example, photodiode body 150 is doped N-type.
- photodiode body 150 When photodiode body is N-type and semiconductor layer 100 is P-type, photodiode body 150 forms the cathode and semiconductor layer 100 forms the anode of the photodiode. In FIGs. 6B and 6C, photodiode body 150 does not extend as deep into semiconductor layer 100 as dielectric isolation and abuts dielectric passivation layer 110. In FIGs. 6B and 6C, photodiode body 150 is a buried structure and does not extend to top surface 107 of semiconductor layer 100, a region of semiconductor layer 100 above photodiode body 150 intervening. In FIG 6C, photodiode body 150 abuts dielectric isolation passivation layer 110. If dielectric isolation passivation layer 110 is not present, then photodiode body 150 abuts dielectric isolation 105 directly.
- FIG. 7A is a top view and FIGs. 7B, 7C, 7D and 7E are cross- sections through respective lines 7B-7B, 7C-7C, 7D-7D and 7E-7E of FIG. 7A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- an optional pinning layer 155 is formed in semiconductor layer 100.
- Pinning layer 155 is formed, in one example, by photolithographically defining and then ion implanting selected regions of substrate 100.
- pinning layer 155 is doped P-type.
- pinning layer 155 extends from top surface 107 of semiconductor layer 100 to photodiode body 150.
- pinning layer 155 extends from top surface 107 of semiconductor layer 100, toward but does not abut electron shield 120 if electron shield 120 is present. If electron shield 120 is present, a region of semiconductor layer intervenes 100 between pinning layer 155 and electron shield 120. In FIG. 7D, pinning layer 155 abuts dielectric isolation 105 and overlaps opposite side of electron shield 120. A region of top surface 107 of semiconductor layer 100 is exposed between regions of pinning layer 155. In FIG 7D, if dielectric passivation layer 110 is present, pinning layer 155 abuts dielectric passivation layer 105.
- FIG. 8A is a top view and FIGs. 8B, 8C, 8D and 8E are cross- sections through respective lines 8B-8B, 8C-8C, 8D-8D and 8E-8E of FIG. 8A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- source/drains 160A, 160B, 160C and 160D are formed in semiconductor layer 100.
- Source/drains 160A, 160B, 160C and 160D are simultaneously formed, in one example, by photo lithographically defining and then ion implanting selected regions of substrate 100.
- source/drains 160 A, 160B, 160C and 160D are doped N-type.
- Source/drains 160A, 160B, 160C and 160D extend from top surface 107 of semiconductor layer 100 a distance that lees than the distance dielectric isolation extend into semiconductor layer 100.
- FIG. 9A is a top view and FIGs. 9B, 9C, 9D and 9E are cross- sections through respective lines 9B-9B, 9C-9C, 9D-9D and 9E-9E of FIG. 9A illustrating continuing fabrication of a pixel sensor cell according to embodiments of the present invention.
- a floating diffusion node 165 is formed in semiconductor layer 100.
- Floating diffusion node 165 is formed, in one example, by photolithographically defining and then ion implanting selected regions of substrate 100.
- floating diffusion node 165 is doped N-type.
- floating diffusion node 165 extends from top surface 107 of semiconductor layer 100 into but not through electron shield 120 (if electron shield 120 is present).
- FIG. 9D illustrates the floating diffusion node (FD node) with all optional elements. It is a feature of the embodiments of the present invention that floating diffusion node 165 does not abut dielectric isolation 105. It is a feature of the embodiments of the present invention that floating diffusion node 165 does not abut pinning layer 155 (if pinning layer 155 is present). It is a feature of the embodiments of the present invention that floating diffusion node 165 does not extend to dielectric isolation passivation layer 110 (if dielectric isolation passivation layer 110 is present). In FIG. 9D, a region of semiconductor layer 100 intervenes between floating diffusion node and dielectric isolation 105 and/or dielectric isolation passivation layer 110 and/or pinning layer 155.
- FIGs. 10A, 10B, IOC and 10D illustrate alternative structures for the storage node of a pixel sensor cell according to embodiments of the present invention.
- FIGS. 10A, 10B, IOC and 10D illustrate four possible combinations of the structural elements defining charge storage nodes according to the embodiments of the present invention.
- a first charge storage node 170 includes floating diffusion node 165 and semiconductor layer 100.
- Floating diffusion node 165 does not abut dielectric isolation 105, semiconductor layer 100 intervening between floating diffusion node 165 and dielectric isolation 105. This is the minimum number of elements for a floating diffusion node according to embodiments of the present invention.
- a second charge storage node 175 includes floating diffusion node
- Electron shield 120 abuts dielectric isolation 105. Electron shield 120 does not abut top surface 107 of
- Floating diffusion node 165 extends into semiconductor layer 100 but not to electron shield 120, a region of semiconductor layer 100 intervening between floating diffusion node 165 and electron shield 120. Alternatively, floating diffusion node 165 extends to electron shield 120 or extends part way into electron shield 120.
- a third charge storage node 180 includes floating diffusion node 165, semiconductor layer 100, electron shield 120, and dielectric isolation passivation layer 110.
- Dielectric isolation passivation layer 110 abuts sidewalls and bottom surface of dielectric isolation 105.
- Floating diffusion node 165 does not abut dielectric isolation passivation layer 110, a region of semiconductor layer 100 intervening between floating diffusion node 165 and dielectric isolation passivation layer 110.
- Electron shield 120 abuts dielectric isolation passivation layer 110.
- Electron shield 120 does not abut top surface 107 of semiconductor layer 100, regions of semiconductor layer 100 intervening between electron shield 120 and top surface 107 of semiconductor layer 100.
- Floating diffusion node 165 extends into semiconductor layer 100 but not to electron shield 120, a region of semiconductor layer 100 intervening between floating diffusion node 165 and electron shield 120. Alternatively, floating diffusion node 165 extends to electron shield 120 or extends part way into electron shield 120.
- a fourth charge storage node 185 includes floating diffusion node
- Dielectric isolation passivation layer 110 abuts sidewalls and a bottom surface of dielectric isolation 105.
- Floating diffusion node 165 does not abut dielectric isolation passivation layer 110, semiconductor layer 100 intervening between floating diffusion node 165 and dielectric isolation passivation layer 110.
- Electron shield 120 abuts dielectric isolation passivation layer 110. Electron shield 120 does not abut top surface 107 of semiconductor layer 100, regions of semiconductor layer 100 intervening between electron shield 120 and top surface 107 of semiconductor layer 100.
- Floating diffusion node 165 extends into semiconductor layer 100 from top surface 107 but not to electron shield 120, a region of semiconductor layer 100 intervening between floating diffusion node 165 and electron shield 120.
- floating diffusion node 165 extends to electron shield 120 or extends part way into electron shield 120.
- Pinning layer 155 extends from top surface 107 into semiconductor layer 100 and along top surface 107 toward floating diffusion node 165 but does not abut floating diffusion node 165, a region of semiconductor layer 100 intervening.
- pinning layer 155 extends to abut floating diffusion node 165.
- Pinning layer 155 abuts dielectric isolation 105, dielectric passivation layer 110 and regions of semiconductor layer 100 but not electron shield 120. A region of semiconductor layer 100 intervenes between pinning layer 155 and electron shield 120.
- FIG. 11 is a top view of illustrating interconnections of the structural elements in a pixel sensor cell circuit.
- FIG. 11 is similar to FIG. 9.
- source/drain 160A is connected to Vdd
- gate 125 is connected to a global shutter signal (GS)
- gate 130 is connected to a transfer gate signal (TG)
- floating diffusion node 165 is connected to gate 140
- gate 135 is connected to a reset gate signal (RG)
- source/drain 160B is connected to Vdd
- gate 145 is connected to a row select signal (RS)
- source/drain 160D is connected to Data Out.
- FIG. 12 is a circuit diagram of a pixel sensor cell circuit according to
- circuit 200 describes device of FIG. 11.
- Circuit 200 includes NFETs Tl (reset transistor), T2 (source follower), T3 (row select transistor), T4 (global shutter transistor) and T5 (transfer gate), and photodiode Dl (photon detector).
- the gate of NFET Tl is connected to RG
- the gate of NFET T2 is connected to the floating diffusion node (FD Node)
- the gate of NFET T3 is connected to RS
- the gate of NFET T4 is connected to GS
- the gate of NFET T5 is connected to TG.
- the drains of NFETS Tl, T2 and T4 are connected to Vdd.
- the source of NFET Tl is connected to the FD Node, the drain of NFET T2 to the source of NFET T3 and the source of NFET T3 to Data Out.
- the source of NFET T4 is connected to the source of NFET T5 and the drain of NFET T5 is connected to FD Node.
- the cathode of diode Dl is connected to the sources of NFETS T4 and T5 and the anode of diode Dl is connected to GND.
- Diode Dl is the pinned photo diode of FIG. 11.
- Circuit 200 utilizes NFETs.
- NFETs Tl, T2, T3, T4 and T5 can be
- FIG. 13 is a diagram illustrating an array of global shutter pixel sensor cells
- an image sensor 300 includes an array 305 of pixel sensor cells P (rows are horizontal and columns vertical), pixel sensor cell drivers 3190 and a column sampler 315.
- Each pixel sensor cell P is a circuit 200 of Fig. 11.
- the GS, TG, RG, and RS signals of FIG. 12 are connected to pixel sensor cells P from pixel sensor cell row drivers 310.
- the Data Out signals of FIG 12 from pixel sensor cells P are connected to column sampler 315.
- Readout is performed by (1) turning on RS to read all columns in a selected row and (2) pulsing RG on/off after reading the selected row. Readout steps (1) and (2) are repeated for each row sequentially, starting with the first row and ending with the last row.
- FIG. 14 shows a block diagram of an exemplary design flow 400 used for
- Design flow 400 includes processes and mechanisms for processing design structures or devices to generate logically or otherwise functionally equivalent representations of the design structures and/or devices described above and shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- the design structures processed and/or generated by design flow 400 may be encoded on machine-readable transmission or storage media to include data and/or instructions that when performed or otherwise processed on a data processing system generate a logically, structurally, mechanically, or otherwise functionally equivalent representation of hardware components, circuits, devices, or systems.
- Design flow 400 may vary depending on the type of representation being designed. For example, a design flow 400 for building an application specific IC (ASIC) may differ from a design flow 400 for designing a standard component or from a design flow 400 for instantiating the design into a programmable array, for example a
- ASIC application specific IC
- PGA programmable gate array
- FPGA field programmable gate array
- FIG. 14 illustrates multiple such design structures including an input design structure 420 that is preferably processed by a design process 410.
- the design structure 420 comprises input design data used in a design process and comprising information describing an embodiment of the invention with respect to a CMOS imaging cell as shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- the design data in the form of schematics or HDL, a hardware description language (e.g., Verilog, VHDL, C, etc.) may be embodied on one or more machine-readable media.
- design structure 420 may be a text file, numerical data or a graphical representation of an embodiment of the invention as shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- Design structure 420 may be a logical simulation design structure generated and processed by design process 410 to produce a logically equivalent functional representation of a hardware device.
- Design structure 420 may also or alternatively comprise data and/or program instructions that when processed by design process 410, generate a functional representation of the physical structure of a hardware device. Whether representing functional and/or structural design features, design structure 420 may be generated using electronic computer-aided design (ECAD) such as implemented by a core developer/designer.
- ECAD electronic computer-aided design
- design structure 420 When encoded on a machine-readable data transmission, gate array, or storage medium, design structure 420 may be accessed and processed by one or more hardware and/or software modules within design process 410 to simulate or otherwise functionally represent an electronic component, circuit, electronic or logic module, apparatus, device, or system such as those shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- design structure 420 may comprise files or other data structures including human and/or machine-readable source code, compiled structures, and computer-executable code structures that when processed by a design or simulation data processing system, functionally simulate or otherwise represent circuits or other levels of hardware logic design.
- Such data structures may include hardware description language (HDL) design entities or other data structures conforming to and/or compatible with lower- level HDL design languages such as Verilog and VHDL, and/or higher- level design languages such as C or C++.
- HDL hardware description language
- Design process 410 preferably employs and incorporates hardware and/or software modules for synthesizing, translating, or otherwise processing a design/simulation functional equivalent of the components, circuits, devices, or logic structures shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13 to generate a netlist 480 which may contain design structures such as design structure 420.
- Netlist 480 may comprise, for example, compiled or otherwise processed data structures representing a list of wires, discrete components, logic gates, control circuits, I/O devices, models, etc. that describes the connections to other elements and circuits in an integrated circuit design.
- Netlist 480 may be synthesized using an iterative process in which netlist 480 is re- synthesized one or more times depending on design specifications and parameters for the device. As with other design structure types described herein, netlist 480 may be recorded on a machine-readable data storage medium or programmed into a
- the medium may be a non- volatile storage medium such as a magnetic or optical disk drive, a programmable gate array, a compact flash, or other flash memory. Additionally, or in the alternative, the medium may be a system or cache memory, buffer space, or electrically or optically conductive devices and materials on which data packets may be transmitted and intermediately stored via the Internet, or other networking suitable means.
- Design process 410 may include hardware and software modules for processing a variety of input data structure types including netlist 480.
- data structure types may reside, for example, within library elements 430 and include a set of commonly used elements, circuits, and devices, including models, layouts, and symbolic representations, for a given manufacturing technology (e.g., different technology nodes, 32 nm, 45 nm, 90 nm, etc.).
- the data structure types may further include design specifications 440, characterization data 450, verification data 460, design rules 470, and test data files 485 which may include input test patterns, output test results, and other testing information.
- Design process 410 may further include, for example, standard mechanical design processes such as stress analysis, thermal analysis, mechanical event simulation, process simulation for operations such as casting, molding, and die press forming, etc.
- standard mechanical design processes such as stress analysis, thermal analysis, mechanical event simulation, process simulation for operations such as casting, molding, and die press forming, etc.
- One of ordinary skill in the art of mechanical design can appreciate the extent of possible mechanical design tools and applications used in design process 410 without deviating from the scope and spirit of the invention.
- Design process 410 may also include modules for performing standard circuit design processes such as timing analysis, verification, design rule checking, place and route operations, etc.
- Design process 410 employs and incorporates logic and physical design tools such as HDL compilers and simulation model build tools to process design structure 420 together with some or all of the depicted supporting data structures along with any additional mechanical design or data (if applicable), to generate a output design structure 490 comprising output design data embodied on a storage medium in a data format used for the exchange of layout data of integrated circuits and/or symbolic data format (e.g.
- the second design data resides on a storage medium or programmable gate array in a data format used for the exchange of data of mechanical devices and structures (e.g. information stored in an IGES, DXF, Parasolid XT, JT, DRG, or any other suitable format for storing or rendering such mechanical design structures).
- design structure 490 preferably comprises one or more files, data structures, or other computer-encoded data or instructions that reside on transmission or data storage media and that when processed by an ECAD system generate a logically or otherwise functionally equivalent form of one or more of the embodiments of the invention shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- design structure 490 may comprise a compiled, executable HDL simulation model that functionally simulates the devices shown in FIGs. 9A, 9B, 9C, 9D, 9E, 10A, 10B, IOC, 10D, 11, 12 and 13.
- Design structure 490 may also employ a data format used for the exchange of layout data of integrated circuits and/or symbolic data format (e.g. information stored in a GDSII (GDS2), GLl, OASIS, map files, or any other suitable format for storing such design data structures).
- Design structure 490 may comprise information such as, for example, symbolic data, map files, test data files, design content files, manufacturing data, layout parameters, wires, levels of metal, vias, shapes, data for routing through the
- Design structure 490 may then proceed to a stage 495 where, for example, design structure 490 proceeds to tape-out, is released to manufacturing, is released to a mask house, is sent to another design house, is sent back to the customer, etc.
Abstract
Description
Claims
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CN201080041345.1A CN102498568B (en) | 2009-09-17 | 2010-09-02 | Structures and methods of fabricating global shutter pixel sensor cells |
DE112010003704.3T DE112010003704B4 (en) | 2009-09-17 | 2010-09-02 | Structures, design structures, and methods for making global-aperture pixel sensor cells |
JP2012529794A JP5731513B2 (en) | 2009-09-17 | 2010-09-02 | Structure, design structure and manufacturing method of global shutter pixel sensor cell |
GB1204572.0A GB2486607B (en) | 2009-09-17 | 2010-09-02 | Structures, design structures and methods of fabricating global shutter pixel sensor cells |
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US12/561,581 | 2009-09-17 | ||
US12/561,581 US8138531B2 (en) | 2009-09-17 | 2009-09-17 | Structures, design structures and methods of fabricating global shutter pixel sensor cells |
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JP (1) | JP5731513B2 (en) |
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DE (1) | DE112010003704B4 (en) |
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CN102498568B (en) | 2014-08-20 |
JP5731513B2 (en) | 2015-06-10 |
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GB2486607A (en) | 2012-06-20 |
TW201138079A (en) | 2011-11-01 |
US20110062542A1 (en) | 2011-03-17 |
JP2013505580A (en) | 2013-02-14 |
US8138531B2 (en) | 2012-03-20 |
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DE112010003704B4 (en) | 2015-10-22 |
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WO2011034737A3 (en) | 2011-06-30 |
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