WO2011035771A1 - Method for welding a plastic housing - Google Patents

Method for welding a plastic housing Download PDF

Info

Publication number
WO2011035771A1
WO2011035771A1 PCT/DE2010/001122 DE2010001122W WO2011035771A1 WO 2011035771 A1 WO2011035771 A1 WO 2011035771A1 DE 2010001122 W DE2010001122 W DE 2010001122W WO 2011035771 A1 WO2011035771 A1 WO 2011035771A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
housing
force
welding
shaped section
Prior art date
Application number
PCT/DE2010/001122
Other languages
German (de)
French (fr)
Inventor
Henryk Frenzel
Volker Müller
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2011035771A1 publication Critical patent/WO2011035771A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7829—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/324—Avoiding burr formation
    • B29C66/3242—Avoiding burr formation on the inside of a tubular or hollow article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/841—Machines or tools adaptable for making articles of different dimensions or shapes or for making joints of different dimensions
    • B29C66/8416—Machines or tools adaptable for making articles of different dimensions or shapes or for making joints of different dimensions of different thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
    • B29C66/92651—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops
    • B29C66/92655—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops by using several stops
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
    • B29C66/9292—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges in explicit relation to another variable, e.g. pressure diagrams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0068—Permeability to liquids; Adsorption
    • B29K2995/0069—Permeability to liquids; Adsorption non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Definitions

  • the invention relates to a method for welding a plastic housing according to the preamble of claim 1.
  • a circuit carrier such as a circuit board is arranged inside the housing, which in turn must be attached to a housing half, especially if acceleration sensitive sensors are arranged on this circuit substrate, which a correspondingly rigid attachment for receiving the sensed Need accelerations.
  • an oil filter in eime plastic housing is also known, in which the elsesiche filter medium is bent by a clamping rib in a formation, a part of the filter medium, the clamping rib engages behind and is secured substantially form-fitting manner, wherein the plastic housing
  • the object of the present invention is to provide a method for welding a plastic housing, in which particularly inexpensive and yet secure the circuit board can be attached.
  • the circuit board is inserted.
  • An essential idea of the invention is that on the other housing part a molding is provided towards the circuit board and the housing part is pressed with the molding during welding in the direction of the circuit board, preferably until a predetermined counterforce is achieved, and also during cooling a predetermined force is exerted on the housing part with the shaping, so that a frictional attachment of the circuit board in the housing is achieved.
  • the pressing ensures a fixation of the printed circuit board in the predetermined position and prevents floating of the circuit board and the spread of melt in critical regions of the circuit board.
  • the pressing causes a spring-like tension of the housing part with the shape.
  • the preferred laser welding is always discussed below in the embodiments, however, the invention is also suitable for other forms of local welding, such as friction welding, ultrasonic welding, etc.
  • the invention is a new concept for closing a plastic housing with a lid, with simultaneous attachment of a circuit board, during a welding operation, for example via a laser.
  • the goal is the PCB so too
  • the circuit board is fixed by stops on the lid frictionally in the housing.
  • the joining path is, by the stops, depending on the board thickness. He is for example at 0.4-0.8mm.
  • the fixation of the PCB is always done with different thickness tolerances of the PCB with the same force and over the life of a secure fixed fixation is generated, for example suitable for vibration-free mounting of the PCB without additional components (eg screws, gluing) and transmission of crash pulses.
  • a watertight housing closure takes place.
  • the advantage of this concept is that it is necessary to attach the circuit board and closing the housing only one operation. Furthermore, the mounting surface of the circuit board is much larger than the conventional hot gas riveting. However, the space requirement on the circuit board is lower because the contact surfaces affect only the edge zone of the circuit board.
  • This edge zone in turn is defined as a barrier zone due to the separation of the individual circuit board from the benefit. Due to the larger contact surface preload losses caused by creep of the plastic are not disturbing in appearance.
  • this method is very reliable, since the sweat path is controlled by means of a force evaluation. Therefore, the welding process can be stopped when the biasing force increases (after the stops on the printed circuit board have come to rest) without overstressing the printed circuit board.
  • the welding of a lid is much more material-saving than the casting of the circuit board.
  • a welding process also saves considerable time because the welded joint cools faster and does not have to dry.
  • the electrical contacting of the circuit board can be done both in a conventional manner, with Pressfitein expertsn, as well as with single pins or direct connections.
  • FIG. 1 embodiment with the housing cover, housing base and circuit board at the beginning of the welding process.
  • Fig. 2 embodiment with the housing cover, housing base and circuit board after
  • FIG. 1 shows a first exemplary embodiment with the housing cover 1, the housing lower part 2 and the printed circuit board 3 at the beginning of the welding process.
  • a molding 1.1 is provided to the circuit board.
  • the lower housing part 2 has a molding 2.1 with an oversize, wherein this excess results in relation to the outer nose 1.3 and / or with respect to the molding 1.1 on the cover and determines a defined volume of material melt, which is melted during welding.
  • a laser beam penetrates the cover 1 at the location and direction shown and heats the molding 2.1 of the opposite housing lower part 2.
  • the lid 1 is designed by appropriate choice of material at least in the area irradiated by the laser so that it lets pass a large portion of the laser light to the surface 2.1.1 of the opposite formation 2.1, while there by appropriate choice of material, for example. Introduction of soot particles, etc. a particularly high absorption and thus conversion of the laser light into heat and thus production of plastic melt is effected.
  • the cover 1 has a shape 1.1 to the circuit board 3 out.
  • a compression of the housing parts 1, 2 to each other and the welding is only terminated when a predetermined counterforce is reached or a predetermined Verpressweg the housing parts 1, 2 was covered to each other.
  • a corresponding increase in the counterforce is achieved when the molding 1.1 touches the circuit board 3 and a bias in the lid 1 is formed.
  • the molding 1.1 may be partially or preferably completely encircling and thus form a further seal and natural barrier for the melt produced during welding.
  • this molding 1.1 can be the printed circuit board 3 during cooling PCB 3 prevents. Since the plastic material also shrinks during cooling, the tension and fixation of the printed circuit board 3 in the housing is only improved.
  • An outer nose 2.6 here formed on the housing base, additionally protects the weld against objects acting directly on it.
  • FIG. 3 shows a typical force curve over the adjustment path s of the cover relative to the printed circuit board with a clear increase in the counterforce when the printed circuit board is reached in T1, which thus activates the shutdown in T2.
  • a counterforce Fmax be given for shutdown, which is dimensioned so that it ensures just a tension between the circuit board and the lid.
  • the change in the increase ie the relative change in the force over the adjustment path AF / AS or over the time AF / AT can be taken into account.

Abstract

The printed circuit board (3) is inserted into a housing piece (2). A shaped section (1.1) facing the circuit board (3) is provided on the other housing piece (1), and the housing piece (1) comprising the shaped section (1.1) is pressed in the direction of the circuit board (3) during the welding process, preferably until a predefined counterforce has been reached. In addition, a predefined force is also applied to the housing piece (1) comprising the shaped section (1.1) during the cooling phase such that the circuit board (3) is fixed in a force-locked manner within the housing. During the welding process, the pressing action fixes the circuit board (3) in the predefined position and prevents the circuit board (3) from floating and melt from spreading into critical regions on the circuit board. Furthermore, the pressing action causes the housing piece (1) comprising the shaped section (1.1) to be braced like a spring. Since a predefined force is maintained during the cooling phase, the circuit board (3) remains fixed within the housing by means of the shaped section (1.1), and the bracing force does not decrease but actually even increases because the material shrinks during the curing process, thus ensuring that the shaped section (1.1) presses onto the circuit board (3) at a predefined force also following the curing process and therefore fixes the circuit board (3) in a very securely force-locked manner within the housing.

Description

Verfahren zum Verschweißen eines Kunststoffgehäuses  Method for welding a plastic housing
Die Erfindung betrifft ein Verfahren zum Verschweißen eines Kunststoffgehäuses gemäß dem Oberbegriff von Anspruch 1. The invention relates to a method for welding a plastic housing according to the preamble of claim 1.
Zum Verschließen von Kunststoffgehäusen insbesondere elektronischer Baugruppen, wie Kraftfahrzeugsteuergeräten wird mittlerweile häufig ein Verschweißen der Kunststoffteile eingesetzt, wobei die Einbringung der Wärmeenergie durch den Laser besonders bevorzugt ist, weil dabei die Wärmeenergie besonders genau an die innere Verbindungsstelle zwischen den Gehäuseteilen eingebracht werden kann und ein besonders gleichmäßiger und allseits dichter Schweißvorgang erreicht werden kann. For sealing plastic housings, in particular electronic assemblies, such as motor vehicle control devices, a welding of the plastic parts is now often used, wherein the introduction of heat energy by the laser is particularly preferred, because the heat energy can be particularly accurately introduced to the inner joint between the housing parts and a particularly uniform and on all sides tight welding process can be achieved.
Bei elektronischer Baugruppen, wie beispielsweise Kraftfahrzeugsteuergeräten ist im Inneren des Gehäuses ein Schaltungsträger, wie beispielweise eine Leiterplatte angeordnet, die ihrerseits an einer Gehäusehälfte befestigt werden muss, insbesondere wenn auf diesem Schaltungsträger beschleunigungsempfindliche Sensoren angeordnet sind, welche eine entsprechend starre Befestigung zur Aufnahme der zu sensierenden Beschleunigungen benötigen. In electronic assemblies, such as motor vehicle control devices, a circuit carrier, such as a circuit board is arranged inside the housing, which in turn must be attached to a housing half, especially if acceleration sensitive sensors are arranged on this circuit substrate, which a correspondingly rigid attachment for receiving the sensed Need accelerations.
Aus der DE 102005000160 A1 ist dabei ein Verfahren und eine Vorrichtung zum formschlüssigen Verbinden zweier Bauteile durch plastische Deformation eines Bauteils während eines Laserschweißvorgangs bekannt, wobei an einer Gehäuseseite ein Bolzen durch ein Öffnung in der Leiterplatte geführt und dieser Bolzen durch Laserstrahlung erwärmt und durch Druck so umgeformt wird, dass sich ein Nietkopf bildet. Dieses Verfahren setzt das Einbringen von Laserstrahlung an zwei unterschiedlichen Positionen des Gehäuses sowie Öffnungen für die Bolzen auf der Leiterplatte voraus, so dass die nutzbare Leiterplattenfläche reduziert wird.  From DE 102005000160 A1, a method and a device for the positive connection of two components by plastic deformation of a component during a laser welding process is known, wherein on one side of a housing bolt passed through an opening in the circuit board and this bolt heated by laser radiation and pressure is transformed, that forms a rivet head. This method requires the introduction of laser radiation at two different positions of the housing and openings for the bolts on the circuit board, so that the usable board area is reduced.
Aus der DE19860357 A1 ist darüber hinaus ein Ölfilter in eime Kunststoffgehäuse bekannt, bei dem das elastsiche Filtermedium durch in einer Klemmrippe um eine Ausformung gebogen wird, ein Teil des Filtermediums die Klemmrippe hintergreift und so im wesentlichen formschlüssig befestigt wird, wobei das Kunststoffgehäuse durch Die Aufgabe der vorliegenden Erfindung ist es, ein Verfahren zum Verschweißen eines Kunststoffgehäuses anzugeben, bei dem besonders preiswert und dennoch sicher die Leiterplatte befestigt werden kann. From DE19860357 A1 an oil filter in eime plastic housing is also known, in which the elsesiche filter medium is bent by a clamping rib in a formation, a part of the filter medium, the clamping rib engages behind and is secured substantially form-fitting manner, wherein the plastic housing The object of the present invention is to provide a method for welding a plastic housing, in which particularly inexpensive and yet secure the circuit board can be attached.
Diese Aufgabe wird durch die Merkmale der unabhängigen Ansprüche gelöst. Vorteilhafte Weiterbildungen der Erfindung ergeben sind aus den Unteransprüchen, wobei auch Kombinationen und Weiterbildungen einzelner Merkmale miteinander denkbar sind.  This object is solved by the features of the independent claims. Advantageous developments of the invention will become apparent from the dependent claims, wherein combinations and developments of individual features are conceivable with each other.
In ein Gehäuseteil wird die Leiterplatte eingelegt. Ein wesentlicher Gedanke der Erfindung besteht darin, dass am anderen Gehäuseteil eine Ausformung zur Leiterplatte hin vorgesehen ist und das Gehäuseteil mit der Ausformung während dem Verschweißen in Richtung der Leiterplatte gepresst wird, vorzugsweise so lange bis eine vorgegebene Gegenkraft erreicht wird, und zudem auch beim Auskühlen eine vorgegebene Kraft auf das Gehäuseteil mit der Ausformung ausgeübt wird, so dass eine kraftschlüssige Befestigung der Leiterplatte im Gehäuse erreicht wird.  In a housing part, the circuit board is inserted. An essential idea of the invention is that on the other housing part a molding is provided towards the circuit board and the housing part is pressed with the molding during welding in the direction of the circuit board, preferably until a predetermined counterforce is achieved, and also during cooling a predetermined force is exerted on the housing part with the shaping, so that a frictional attachment of the circuit board in the housing is achieved.
Während des Verschweißens sorgt das Anpressen für eine Fixierung der Leiterplatte in der vorgegebenen Position und verhindert ein Aufschwimmen der Leiterplatte und die Ausbreitung von Schmelze in kritische Regionen der Leiterplatte. Zudem bewirkt das Anpressen eine federartige Verspannung des Gehäuseteils mit der Ausformung. Durch das Halten einer vorgegebenen Kraft während dem Auskühlen bleibt die Leiterplatte durch die Ausformung im Gehäuse fixiert und kann sich die Verspannung nicht abbauen, sondern wird durch das Schrumpfen des Materials beim Aushärten eher noch verstärkt. Dadurch wird sichergestellt, dass auch nach dem Aushärten die Ausformung mit einer vorgegebenen Kraft auf die Leiterplatte drückt und diese somit äußerst sicher kraftschlüssig im Gehäuse fixiert.  During welding, the pressing ensures a fixation of the printed circuit board in the predetermined position and prevents floating of the circuit board and the spread of melt in critical regions of the circuit board. In addition, the pressing causes a spring-like tension of the housing part with the shape. By holding a predetermined force during cooling, the printed circuit board remains fixed by the molding in the housing and can not break the tension, but is rather reinforced by the shrinkage of the material during curing. This ensures that even after curing, the molding presses with a predetermined force on the circuit board and thus fixed extremely secure in the housing.
Es ist dabei hervorzuheben, dass es für die Erfindung völlig unerheblich ist, welches der Gehäuseteile Deckel bzw. Unterteil sind und ob die nachfolgend diskutierten Ausformungen am Deckel bzw. Unterteil vorhanden sind. Einzig deren relative Lage zur Leiterplatte ist für die Funktionsweise relevant.  It should be emphasized that it is completely irrelevant for the invention which of the housing parts are the cover or lower part and whether the embodiments discussed below are present on the cover or lower part. Only their relative position to the circuit board is relevant to the operation.
Auch wird im folgenden in den Ausführungsbeispielen immer das bevorzugte Laserschweißen diskutiert, ist jedoch die Erfindung auch für andere Formen der lokalen Verschweißung, wie Reibschweißen, Ultraschallschweißen usw. geeignet.  Also, the preferred laser welding is always discussed below in the embodiments, however, the invention is also suitable for other forms of local welding, such as friction welding, ultrasonic welding, etc.
Bei der Erfindung handelt es sich also um ein neues Konzept zum Verschließen eines Kunststoffgehäuses mit einem Deckel, bei gleichzeitiger Befestigung einer Leiterplatte, während eines Schweißvorganges, z.B. via Laser. Das Ziel ist es die Leiterplatte so zu So wird die Leiterplatte durch Anschläge am Deckel kraftschlüssig im Gehäuse befestigt. Der Fügeweg ist, durch die Anschläge, abhängig von der Leiterplattendicke. Er liegt beispielsweise bei 0,4-0,8mm. Durch dieses Verfahren bzw. Design erfolgt die Fixierung der PCB selbst bei unterschiedlichen Dickentoleranzen der PCB immer mit der gleichen Kraft und wird über die Lebensdauer eine sichere feste Fixierung erzeugt, die z.B. geeignet für vibrationsfreie Montage der PCB ohne zusätzliche Bauteile (z.B. Schrauben, Kleben) und Übertragung von Crashimpulsen. Parallel erfolgt auch ein wasserdichter Gehäuseverschluß. Thus, the invention is a new concept for closing a plastic housing with a lid, with simultaneous attachment of a circuit board, during a welding operation, for example via a laser. The goal is the PCB so too Thus, the circuit board is fixed by stops on the lid frictionally in the housing. The joining path is, by the stops, depending on the board thickness. He is for example at 0.4-0.8mm. By this method or design, the fixation of the PCB is always done with different thickness tolerances of the PCB with the same force and over the life of a secure fixed fixation is generated, for example suitable for vibration-free mounting of the PCB without additional components (eg screws, gluing) and transmission of crash pulses. At the same time, a watertight housing closure takes place.
Der Vorteil dieses Konzeptes besteht darin das zum Befestigen der Leiterplatte und Verschließen des Gehäuses nur noch ein Arbeitsgang notwendig ist. Weiterhin ist die Befestigungsfläche der Leiterplatte weit größer als beim herkömmlichen Heißgasnieten. Wobei der Platzbedarf auf der Leiterplatte aber geringer ist, da die Auflageflächen nur die Randzone der Leiterplatte beeinträchtigen.  The advantage of this concept is that it is necessary to attach the circuit board and closing the housing only one operation. Furthermore, the mounting surface of the circuit board is much larger than the conventional hot gas riveting. However, the space requirement on the circuit board is lower because the contact surfaces affect only the edge zone of the circuit board.
Diese Randzone wiederum ist aufgrund der Trennung der einzelnen Leiterplatte aus dem Nutzen als Sperrzone definiert. Durch die größere Kontaktfläche treten Vorspannverluste durch Kriechen des Kunststoffes nicht störend in Erscheinung.  This edge zone in turn is defined as a barrier zone due to the separation of the individual circuit board from the benefit. Due to the larger contact surface preload losses caused by creep of the plastic are not disturbing in appearance.
Neben den genannten Vorteilen ist dieses Verfahren sehr prozesssicher, da der Schweißweg mithilfe einer Kraftauswertung gesteuert wird. Daher kann der Schweißprozess beim Anstieg der Vorspannkraft (nach Aufliegen der Anschläge auf die Leiterplatte) gestoppt werden, ohne dass die Leiterplatte zu stark beansprucht wird. Außerdem ist das Verschweißen eines Deckels erheblich materialsparender als das Vergießen der Leiterplatte. Neben der Materialersparnis gegenüber dem Verguss spart ein Schweißvorgang auch erheblich Zeit da die Schweißverbindung schneller auskühlt und nicht trocknen muss. Die elektrische Kontaktierung der Leiterplatte kann sowohl auf herkömmliche Art, mit Pressfiteinsätzen, als auch mit Einfach-Pins oder direkten Verbindungen erfolgen.  In addition to the advantages mentioned, this method is very reliable, since the sweat path is controlled by means of a force evaluation. Therefore, the welding process can be stopped when the biasing force increases (after the stops on the printed circuit board have come to rest) without overstressing the printed circuit board. In addition, the welding of a lid is much more material-saving than the casting of the circuit board. In addition to the material savings compared to the casting, a welding process also saves considerable time because the welded joint cools faster and does not have to dry. The electrical contacting of the circuit board can be done both in a conventional manner, with Pressfiteinsätzen, as well as with single pins or direct connections.
Der entscheidende Punkt ist das während eines Schweißvorganges sowohl die Leiterplatte fixiert als auch das Gehäuse verschlossen wird. Bei bisherigen Anwendungen sind diese beiden Arbeitsschritte immer voneinander getrennt.  The key point is that during a welding process both the circuit board fixed and the housing is closed. In previous applications, these two steps are always separated.
Die Erfindung wird nun nachfolgend anhand eines Ausführungsbeispieles unter Zuhilfenahme der Figuren 1 bis 2 näher erläutert. Im Folgenden können für funktional gleiche und/oder gleiche Elemente mit den gleichen Bezugsziffern bezeichnet sein. Es zeigen Fig. 1: Ausführungsbeispiel mit Gehäusedeckel, Gehäuseunterteil und Leiterplatte zu Beginn des Schweißvorgangs. The invention will now be explained in more detail below with reference to an embodiment with the aid of Figures 1 to 2. Hereinafter, for functionally identical and / or identical elements may be denoted by the same reference numerals. Show it Fig. 1: embodiment with the housing cover, housing base and circuit board at the beginning of the welding process.
Fig. 2: Ausführungsbeispiel mit Gehäusedeckel, Gehäuseunterteil und Leiterplatte nach  Fig. 2: embodiment with the housing cover, housing base and circuit board after
Beendigung des Schweißvorgangs.  Termination of the welding process.
Fig. 3 Skizze des Kraftverlaufs  Fig. 3 sketch of the force curve
Figur 1 zeigt ein erstes Ausführungsbeispiel mit Gehäusedeckel 1, Gehäuseunterteil 2 und Leiterplatte 3 zu Beginn des Schweißvorgangs. Am Deckel 1 ist eine Ausformung 1.1 zur Leiterplatte hin vorgesehen.  FIG. 1 shows a first exemplary embodiment with the housing cover 1, the housing lower part 2 and the printed circuit board 3 at the beginning of the welding process. On the cover 1, a molding 1.1 is provided to the circuit board.
Das Gehäuseunterteil 2 weist eine Ausformung 2.1 mit einem Übermaß auf, wobei dieses Übermaß sich gegenüber der äußeren Nase 1.3 und/oder gegenüber der Ausformung 1.1 am Deckel ergibt und ein definiertes Materialvolumen an Schmelze bestimmt, welches während des Schweißens aufgeschmolzen wird.  The lower housing part 2 has a molding 2.1 with an oversize, wherein this excess results in relation to the outer nose 1.3 and / or with respect to the molding 1.1 on the cover and determines a defined volume of material melt, which is melted during welding.
So durchdringt ein Laserstrahl an der gezeigten Stelle und Richtung den Deckel 1 und erwärmt die Ausformung 2.1 des gegenüberliegenden Gehäuseunterteils 2.  Thus, a laser beam penetrates the cover 1 at the location and direction shown and heats the molding 2.1 of the opposite housing lower part 2.
Der Deckel 1 ist durch entsprechende Materialwahl zumindest in dem vom Laser durchstrahlten Bereich so gestaltet, dass er einen großen Anteil des Laserlichts zur Oberfläche 2.1.1 der gegenüberliegenden Ausformung 2.1 hindurchläßt, während dort durch entsprechende Materialwahl, bspw. Einbringung von Russpartikeln usw. eine besonders hohe Absorption und damit Umwandlung des Laserlichts in Wärme und damit Erzeugung von Kunststoffschmelze bewirkt wird.  The lid 1 is designed by appropriate choice of material at least in the area irradiated by the laser so that it lets pass a large portion of the laser light to the surface 2.1.1 of the opposite formation 2.1, while there by appropriate choice of material, for example. Introduction of soot particles, etc. a particularly high absorption and thus conversion of the laser light into heat and thus production of plastic melt is effected.
Der Deckel 1 weist eine Ausformung 1.1 zur Leiterplatte 3 hin auf. Während dem Verschweißen erfolgt ein Zusammenpressen der Gehäuseteile 1 ,2 zueinander und wird das Verschweißen erst dann beendet, wenn eine vorgegebene Gegenkraft erreicht oder ein vorgegebener Verpressweg der Gehäuseteile 1 ,2 zueinander zurückgelegt wurde. Ein entsprechender Anstieg der Gegenkraft wird dann erreicht, wenn die Ausformung 1.1 auf die Leiterplatte 3 aufsetzt und eine Vorspannung im Deckel 1 entsteht.  The cover 1 has a shape 1.1 to the circuit board 3 out. During welding, a compression of the housing parts 1, 2 to each other and the welding is only terminated when a predetermined counterforce is reached or a predetermined Verpressweg the housing parts 1, 2 was covered to each other. A corresponding increase in the counterforce is achieved when the molding 1.1 touches the circuit board 3 and a bias in the lid 1 is formed.
Die Ausformung 1.1 kann dabei partiell oder vorzugsweise komplett umlaufend ausgebildet sein und so eine weitere Abdichtung und natürliche Barriere für die beim Schweißen entstehende Schmelze bilden.  The molding 1.1 may be partially or preferably completely encircling and thus form a further seal and natural barrier for the melt produced during welding.
Wird die Leiterplatte 3 in das Gehäuseunterteil 2 an der Auflagefläche 2.2 eingelegt und erreicht die Ausformung 1.1 zumindest zum Endzeitpunkt des Verschweißens die Leiterplatte 3, so kann diese Ausformung 1.1 die Leiterplatte 3 während des Auskühlens Leiterplatte 3 verhindert. Da das Kunststoffmaterial beim Abkühlen zudem schrumpft, wird die Verspannung und Fixierung der Leiterplatte 3 im Gehäuse nur noch verbessert. If the printed circuit board 3 is inserted into the lower housing part 2 on the contact surface 2.2 and the molding 1.1 reaches the printed circuit board 3 at least at the end time of the welding, then this molding 1.1 can be the printed circuit board 3 during cooling PCB 3 prevents. Since the plastic material also shrinks during cooling, the tension and fixation of the printed circuit board 3 in the housing is only improved.
Eine äußere Nase 2.6, hier ausgeformt am Gehäuseunterteil, schützt zusätzlich die Schweißnaht gegen direkt darauf einwirkende Objekte.  An outer nose 2.6, here formed on the housing base, additionally protects the weld against objects acting directly on it.
Die Figur 3 zeigt einen typischen Kraftverlauf über den Verstellweg s des Deckels relativ zur Leiterplatte mit einem deutlichen Anstieg der Gegenkraft bei Erreichen der Leiterplatte in T1, was damit die Abschaltung in T2 aktiviert. So kann eine Gegenkraft Fmax zur Abschaltung vorgegeben sein, die so dimensioniert ist, dass diese eben eine Verspannung zwischen Leiterplatte und Deckel sicherstellt. Alternativ kann auch die Veränderung des Anstiegs, also die relative Änderung der Kraft über den Verstellweg AF/AS oder über die Zeit AF/AT berücksichtigt werden. FIG. 3 shows a typical force curve over the adjustment path s of the cover relative to the printed circuit board with a clear increase in the counterforce when the printed circuit board is reached in T1, which thus activates the shutdown in T2. Thus, a counterforce Fmax be given for shutdown, which is dimensioned so that it ensures just a tension between the circuit board and the lid. Alternatively, the change in the increase, ie the relative change in the force over the adjustment path AF / AS or over the time AF / AT can be taken into account.
Bezugszeichenliste LIST OF REFERENCE NUMBERS
1 Deckel 1 lid
1.1 Ausformung am Deckel zur Leiterplatte hin  1.1 molding on the lid to the circuit board
1.2 Aufnahmeraum für Schmelze zwischen der Ausformung am Deckel und einer Ausformung am Gehäuseunterteil zum Deckel hin  1.2 receiving space for melt between the molding on the lid and a molding on the housing bottom to the lid
1.3 Äußere Nase am Deckel  1.3 Outer nose on the lid
2 Gehäuseunterteil  2 lower housing part
2.1 Ausformung am Gehäuseunterteil zum Deckel hin  2.1 molding on the lower housing part to the lid
2.1.1 Oberseite an der Ausformung 2.1  2.1.1 Top on the forming 2.1
2.1.2 Abflussphase an der Ausformung 2.1  2.1.2 Discharge phase at the formation 2.1
2.2 Auflagefläche für Leiterplatte  2.2 contact surface for printed circuit board
2.3 Aufnahmeraum zur Gehäuseaußenseite für überschüssige Schmelze 2.3 receiving space to the outside of the housing for excess melt
2.4 Zur Leiterplatte hin abgeflossene und erhärtete Schmelze 2.4 Molten melt hardened towards the printed circuit board
2.5 Zur Gehäuseaußenseite abgeflossene Schmelze  2.5 Melt drained to the outside of the housing
2.6 Äußere Nase am Gehäuseunterteil  2.6 Outer nose on the housing base
3 Leiterplatte  3 circuit board
F Kraft F force
S Verstellweg  S adjustment path

Claims

Patentansprüche claims
1) Verfahren zum Verschweißen eines Kunststoffgehäuses bestehend aus zwei Gehäuseteilen, wobei im Gehäuse eine elektronische Leiterplatte angeordnet ist, dadurch gekennzeichnet, daß 1) A method for welding a plastic housing consisting of two housing parts, wherein in the housing an electronic circuit board is arranged, characterized in that
- in ein Gehäuseteil die Leiterplatte eingelegt wird,  in a housing part, the circuit board is inserted,
- am anderen Gehäuseteil eine Ausformung zur Leiterplatte hin vorgesehen ist,  on the other housing part is provided a shaping towards the printed circuit board,
- das Gehäuseteil mit der Ausformung während dem Verschweißen in Richtung der Leiterplatte gepresst wird und  - The housing part is pressed with the molding during welding in the direction of the circuit board and
- beim Auskühlen eine vorgegebene Kraft auf das Gehäuseteil mit der Ausformung ausgeübt wird  - When cooling a predetermined force is exerted on the housing part with the formation
- und nach dem Auskühlen die Leiterplatte durch die Ausformung kraftschlüssig im Gehäuse fixiert ist.  - And after cooling, the circuit board is fixed by the formation frictionally in the housing.
2) Verfahren nach Anspruch 1 , dadurch gekennzeichnet, daß während des Schweißens die auf das Gehäuseteil mit der Ausformung einwirkende Kraft erfasst und daraus der Zeitpunkt der Beendigung des Schweißens abgeleitet wird. 2) Method according to claim 1, characterized in that detected during welding, the force acting on the housing part with the shaping force and from the time of termination of the welding is derived.
3) Verfahren nach Anspruch 1 , dadurch gekennzeichnet, daß während des Schweißens der Verstellweg des Gehäuseteils mit der Ausformung relativ zum anderen Gehäuseteil und/oder der Leiterplatte erfasst und daraus der Zeitpunkt der Beendigung des Schweißens abgeleitet wird. 3) Method according to claim 1, characterized in that detected during welding, the adjustment of the housing part with the molding relative to the other housing part and / or the circuit board and from the time of termination of the welding is derived.
4) Elektronische Baugruppe bestehend aus einem Kunststoffgehäuse mit zwei Gehäuseteilen, wobei im Gehäuse eine elektronische Leiterplatte angeordnet ist, hergestellt nach dem Verfahren nach einem der vorangehenden Ansprüche. 4) Electronic assembly consisting of a plastic housing with two housing parts, wherein in the housing an electronic circuit board is arranged, prepared by the method according to one of the preceding claims.
PCT/DE2010/001122 2009-09-26 2010-09-24 Method for welding a plastic housing WO2011035771A1 (en)

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