WO2011041438A3 - Chemical mechanical planarization pad with surface characteristics - Google Patents

Chemical mechanical planarization pad with surface characteristics Download PDF

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Publication number
WO2011041438A3
WO2011041438A3 PCT/US2010/050753 US2010050753W WO2011041438A3 WO 2011041438 A3 WO2011041438 A3 WO 2011041438A3 US 2010050753 W US2010050753 W US 2010050753W WO 2011041438 A3 WO2011041438 A3 WO 2011041438A3
Authority
WO
WIPO (PCT)
Prior art keywords
chemical mechanical
surface characteristics
mechanical planarization
projections
planarization pad
Prior art date
Application number
PCT/US2010/050753
Other languages
French (fr)
Other versions
WO2011041438A2 (en
Inventor
Yongqi Hu
Kadthala Ramaya Narendrnath
Ashish Bhatnagar
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2011041438A2 publication Critical patent/WO2011041438A2/en
Publication of WO2011041438A3 publication Critical patent/WO2011041438A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation

Abstract

A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane ("POSS") molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.
PCT/US2010/050753 2009-09-30 2010-09-29 Chemical mechanical planarization pad with surface characteristics WO2011041438A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24741109P 2009-09-30 2009-09-30
US61/247,411 2009-09-30

Publications (2)

Publication Number Publication Date
WO2011041438A2 WO2011041438A2 (en) 2011-04-07
WO2011041438A3 true WO2011041438A3 (en) 2011-07-28

Family

ID=43826868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/050753 WO2011041438A2 (en) 2009-09-30 2010-09-29 Chemical mechanical planarization pad with surface characteristics

Country Status (3)

Country Link
US (1) US20110105000A1 (en)
TW (1) TW201118160A (en)
WO (1) WO2011041438A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130081599A (en) 2012-01-09 2013-07-17 에스케이하이닉스 주식회사 Polishing composition and method of chemical mechanical planarization using the same
KR101417274B1 (en) * 2012-05-23 2014-07-09 삼성전자주식회사 Polishing pad and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US20060046622A1 (en) * 2004-09-01 2006-03-02 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US20060046622A1 (en) * 2004-09-01 2006-03-02 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Also Published As

Publication number Publication date
US20110105000A1 (en) 2011-05-05
WO2011041438A2 (en) 2011-04-07
TW201118160A (en) 2011-06-01

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