WO2011049357A3 - Polyamic acid solution, polyimide resin, and flexible copper clad laminate using same - Google Patents

Polyamic acid solution, polyimide resin, and flexible copper clad laminate using same Download PDF

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Publication number
WO2011049357A3
WO2011049357A3 PCT/KR2010/007173 KR2010007173W WO2011049357A3 WO 2011049357 A3 WO2011049357 A3 WO 2011049357A3 KR 2010007173 W KR2010007173 W KR 2010007173W WO 2011049357 A3 WO2011049357 A3 WO 2011049357A3
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide resin
acid solution
polyamic acid
clad laminate
copper clad
Prior art date
Application number
PCT/KR2010/007173
Other languages
French (fr)
Korean (ko)
Other versions
WO2011049357A2 (en
Inventor
김원겸
김형완
양동보
Original Assignee
주식회사 두산
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 두산 filed Critical 주식회사 두산
Publication of WO2011049357A2 publication Critical patent/WO2011049357A2/en
Publication of WO2011049357A3 publication Critical patent/WO2011049357A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

The present invention relates to a polyamic acid solution comprising: (a) an aromatic tetracarboxylic acid dianhydride comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA) and pyromellitic dianhydride (PMDA); (b) an aromatic diamine; and (c) a solvent, and a polyimide resin prepared by imidization of the polyamic acid solution. A flexible copper clad laminate with excellent flexibility can be prepared by using the polyimide resin.
PCT/KR2010/007173 2009-10-20 2010-10-20 Polyamic acid solution, polyimide resin, and flexible copper clad laminate using same WO2011049357A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090099680A KR20110042831A (en) 2009-10-20 2009-10-20 Polyamic acid solution, polyimide resin and flexible copper clad laminate using the same
KR10-2009-0099680 2009-10-20

Publications (2)

Publication Number Publication Date
WO2011049357A2 WO2011049357A2 (en) 2011-04-28
WO2011049357A3 true WO2011049357A3 (en) 2011-10-27

Family

ID=43900815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007173 WO2011049357A2 (en) 2009-10-20 2010-10-20 Polyamic acid solution, polyimide resin, and flexible copper clad laminate using same

Country Status (2)

Country Link
KR (1) KR20110042831A (en)
WO (1) WO2011049357A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170335062A1 (en) * 2015-02-11 2017-11-23 Kolon Industries, Inc. Polyamic acid, polyimide resin and polyimide film
WO2016129926A1 (en) * 2015-02-11 2016-08-18 코오롱인더스트리 주식회사 Polyamic acid, polyimide resin and polyimide film
KR102171061B1 (en) * 2018-09-12 2020-10-28 피아이첨단소재 주식회사 Polyimide Film with Improved Surface Property and Method for Preparing the Same
KR102162628B1 (en) * 2019-07-17 2020-10-07 피아이첨단소재 주식회사 Flexible Metal Foil Clad Laminate
CN112689454A (en) * 2020-12-23 2021-04-20 宁波今山新材料有限公司 Method for manufacturing shielding material
CN113637449B (en) * 2021-08-25 2023-05-26 余鹏飞 High-frequency adhesive and protective film for high-frequency copper-clad plate prepared from same
CN115286756A (en) * 2022-09-05 2022-11-04 瑞声科技（南京）有限公司 Benzoxazine resin, preparation method and adhesive

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5298331A (en) * 1990-08-27 1994-03-29 E. I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5470693A (en) * 1992-02-18 1995-11-28 International Business Machines Corporation Method of forming patterned polyimide films
KR20080013355A (en) * 2006-08-08 2008-02-13 주식회사 엘지화학 Metallic laminate and method for preparing thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5298331A (en) * 1990-08-27 1994-03-29 E. I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5470693A (en) * 1992-02-18 1995-11-28 International Business Machines Corporation Method of forming patterned polyimide films
KR20080013355A (en) * 2006-08-08 2008-02-13 주식회사 엘지화학 Metallic laminate and method for preparing thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HSIAO ET AL.: "Structure-property study of polymides derived from PMDA and BPDA dianhydrides with structurally different diamines", EUROPEAN POLYMER JOURNAL, vol. 38, 2002, pages 815 - 828, XP004340251, DOI: doi:10.1016/S0014-3057(01)00229-4 *

Also Published As

Publication number Publication date
WO2011049357A2 (en) 2011-04-28
KR20110042831A (en) 2011-04-27

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