WO2011049764A3 - Leadframe packages having enhanced ground-bond reliability - Google Patents

Leadframe packages having enhanced ground-bond reliability Download PDF

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Publication number
WO2011049764A3
WO2011049764A3 PCT/US2010/052061 US2010052061W WO2011049764A3 WO 2011049764 A3 WO2011049764 A3 WO 2011049764A3 US 2010052061 W US2010052061 W US 2010052061W WO 2011049764 A3 WO2011049764 A3 WO 2011049764A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
attach pad
tie bar
die attach
bonding
Prior art date
Application number
PCT/US2010/052061
Other languages
French (fr)
Other versions
WO2011049764A2 (en
Inventor
Shaw Wei Lee
Ein Sun Ng
Chue Siak Liu
Yee Kim Lee
Lee Han Meng @ Eugene Lee
Original Assignee
National Semiconductor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corporation filed Critical National Semiconductor Corporation
Priority to JP2012535229A priority Critical patent/JP2013508974A/en
Priority to CN2010800427454A priority patent/CN102576698A/en
Publication of WO2011049764A2 publication Critical patent/WO2011049764A2/en
Publication of WO2011049764A3 publication Critical patent/WO2011049764A3/en

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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.
PCT/US2010/052061 2009-10-19 2010-10-08 Leadframe packages having enhanced ground-bond reliability WO2011049764A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012535229A JP2013508974A (en) 2009-10-19 2010-10-08 Leadframe package with improved ground bond reliability
CN2010800427454A CN102576698A (en) 2009-10-19 2010-10-08 Leadframe packages having enhanced ground-bond reliability

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/581,609 2009-10-19
US12/581,609 US8093707B2 (en) 2009-10-19 2009-10-19 Leadframe packages having enhanced ground-bond reliability

Publications (2)

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WO2011049764A2 WO2011049764A2 (en) 2011-04-28
WO2011049764A3 true WO2011049764A3 (en) 2011-11-17

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Country Status (5)

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US (1) US8093707B2 (en)
JP (1) JP2013508974A (en)
CN (1) CN102576698A (en)
TW (1) TWI515855B (en)
WO (1) WO2011049764A2 (en)

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Also Published As

Publication number Publication date
TW201125092A (en) 2011-07-16
US8093707B2 (en) 2012-01-10
WO2011049764A2 (en) 2011-04-28
TWI515855B (en) 2016-01-01
US20110089556A1 (en) 2011-04-21
CN102576698A (en) 2012-07-11
JP2013508974A (en) 2013-03-07

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