WO2011088308A1

WO2011088308A1 - Contact pin holder

Info

Publication number: WO2011088308A1
Application number: PCT/US2011/021284
Authority: WO
Inventors: Yuichi Tsubaki; Masahiko Kobayashi
Original assignee: 3M Innovative Properties Company
Priority date: 2010-01-18
Filing date: 2011-01-14
Publication date: 2011-07-21
Also published as: JP2011146334A; TW201145728A

Abstract

To provide a contact pin holder connecting terminals of an electronic device having a terminal pitch different from the terminal pitch of a circuit board to corresponding terminals of the circuit board and able to transmit high frequency signals. A contact pin holder 1 includes a substrate 2 having a plurality of first holes 3 formed on a first surface 2a of the substrate 2 and a plurality of second holes 5 formed on a second surface 2b of the substrate 2; a plurality of first contact pins 4 respectively inserted into the plurality of first holes 3; a plurality of second contact pins 6 respectively inserted into the plurality of second holes 5; and a connection member 7 disposed in the substrate 2, electrically connecting at least one of the first contact pins 4 to at least one of the second contact pins 5, and having an impedance matching the impedances of two electrically connected contact pins.

Description

CONTACT PIN HOLDER

Technical Field

The present invention relates to a contact pin holder holding contact pins used to electrically connect terminals of an electronic device such as a processor, memory, or other semiconductor integrated circuit to a circuit board.

Background

In recent years, various electronic devices have been utilized. An electronic device generally comprises a plurality of signal terminals for receiving various types of circuits from a circuit board that operates the electronic device or sends signals output from the electronic device to the circuit board; a power supply terminal supplying power to the electronic device; and a ground terminal. The pitch between terminals differs depending on the electronic device. Thus, in order for one circuit board for operating an electronic device, for example, an electronic device inspection board, to be used to operate a plurality of types of electronic devices of differing pitches between terminals, an electronic device contact pin holder having a plurality of contact pins arranged matching the pitch between terminals in order to electrically connect the terminal of an electronic device and corresponding terminals of the circuit board is utilized.

For example, Patent Literature 1 discloses a terminal pitch conversion board.

Further, Patent Literature 1 describes that "the terminal pitch conversion board is provided at a center of a board body 1 with a plurality of socket terminal insertion holes 3 to be connected with individual terminal pins 2a so as to match the positions of terminal pins 2a of a burn-in socket 2 in which a BGA package has been plugged and is provided at a periphery of the board body 1 with a plurality of connecting pins 5 to be connected with terminal connecting holes 4a so as to match the positions of the terminal connecting holes 4a provided in the printed circuit board 4 and thereby realizes terminal connection between the burn-in socket 2 and the printed circuit board 4 having mutually different terminal pitches." Further, Patent Literature 2 describes, with respect to the socket, "the pitch of arrangement of the back electrodes 23 may also be enlarged from the pitch of arrangement of the front electrodes 22."

Further, the IC socket disclosed in Patent Literature 3 has "a lower bracket 11, an upper bracket 20, an adjusting bracket 30, a cover 40, a lower anisotropic conductive sheet 50, a pad pitch conversion board 60, and an upper anisotropic conductive sheet 70." Further, Patent Literature 3 describes "the pad pitch conversion board 60 includes has semiconductor device side pads 81 and the like arranged in a lattice pattern on its upper surface and motherboard device side pads arranged in a lattice pattern converted to a pitch about two times the pitch between semiconductor device side pads on its bottom surface. The pads of the motherboard are arranged at the pitch of the motherboard side pads of the pitch pad conversion board 60."

Patent Literature

[PTL 1] Japanese Patent Publication (A) No. 11-67396

[PTL 2] Japanese Patent Publication (A) No. 2000-82553

[PTL 3] Japanese Patent Publication (A) No. 2007-80592

Summary

In recent years, along with the faster processing speed of electronic devices, the signals used by electronic device are becoming higher in frequency. Depending on the device, signals with a frequency higher than 1 GHz are being used. Therefore, in response to the higher frequency of signals, the ability to transmit high frequency signals has also been sought from contact pin holders.

Therefore, the present invention provides a contact pin holder that connects terminals of an electronic device having a terminal pitch different from the terminal pitch of the circuit board to the corresponding terminals of the circuit board and is able to transmit high frequency signals.

According to one aspect of the present invention, there is provided a contact pin holder. This contact pin holder includes a substrate having a plurality of first holes formed on a first surface of the substrate and a plurality of second holes formed on a second surface of the substrate, a plurality of first contact pins, each of the first contact pins inserted in any one of the first holes, a plurality of second contact pins, each of the second contact pins inserted in anyone of the second holes, and a connection member disposed in the substrate and electrically connecting at least one of the first contact pins to at least one of the second contact pins, and having an impedance matching the impedances of two electrically connected contact pins.

According to the present invention, it becomes possible to provide a contact pin holder that connects terminals of an electronic device having a terminal pitch different from the pitch between terminals of the circuit board with corresponding terminals of the circuit board and is able to transmit high frequency signals.

Brief Description of the Drawings

FIG. 1 is a perspective view of a contact pin holder according to a first embodiment of the present invention.

FIG. 2 is a view showing a lateral cross-section of a contact pin holder along a line I-I of FIG. 1.

FIG. 3 is a plan view of a substrate of a contact pin holder according to the first embodiment.

FIG. 4 is a bottom view of a substrate of the contact pin holder according to the first embodiment.

FIG. 5 is a view showing a plan see-through view of a substrate showing the structure of a connection member.

FIG. 6 is a view showing a lateral cross-section of a substrate along II-II of FIG. 5.

FIG. 7 is a view showing a lateral cross-section of a substrate along III-III of FIG. 5.

FIG. 8 is a plan see-through view of a substrate according to a modification of the first embodiment.

FIG. 9 is a view showing a lateral cross-section of a substrate along IV-IV of FIG. 8. FIG. 10 is a plan view of a substrate of a contact pin holder according to a second embodiment.

FIG. 1 1 is a bottom view of a substrate of the contact pin holder according to the second embodiment.

FIG. 12 is a plan see-through view of a substrate showing the structure of a connection member 7.

FIG. 13 is a view showing a lateral cross-section of a substrate along a line V-V of FIG. 12.

FIG. 14 is a view showing a lateral cross-section of a substrate of a contact pin holder according to a third embodiment. FIG. 15 A view showing a lateral cross-section of a contact pin able to be used in the contact pin holder according to the embodiments.

FIG. 16 A view showing a lateral cross-section of another example of a contact pin able to be used in the contact pin holder according to the embodiments.

Detailed Description

Below, a contact pin holder according to the embodiments of the present invention will be explained with reference to the drawings. This contact pin holder includes a substrate, a first group of a plurality of contact pins provided on the surface of the side of the substrate where the electronic device is to be attached and a second group of a plurality of contact pins provided on the surface of the side of the substrate of the circuit board operating the electronic device. Further, even if the pitch of terminals and arrangement of terminals of the electronic device is different from the pitch of terminals and arrangement of terminals of the circuit board, the pitch and arrangement of the first group of contact pins differ from the pitch and arrangement of the second group of contact pins so that the terminals of the electronic device can be electrically connected to the corresponding terminals of the circuit board. The contact pins included in the first group are electrically connected to the corresponding contact pins included in the second group by a connection member disposed in the substrate. Further, this connection member has, for example, a strip line structure by which the impedances of the signal pins sending signals among the first group of contact pins are matched with the impedances of the corresponding contact pins among the second group of contact pins. Due to this, this contact pin holder reduces the transmission loss of high frequency signals between the electronic device attached to the contact pin holder and the circuit board.

FIG. 1 is a perspective view showing a guided contact pin holder 100 according to a first embodiment of the present invention. FIG. 2 is a view showing a cross-section of the guided contact pin holder 100 along I-I of FIG. 1. The guided contact pin holder 100 has a contact pin holder 1 and a guide body 8 provided at the periphery of the contact pin holder 1 and supporting the contact pin holder 1. The contact pin holder 1 has a substrate 2, a plurality of contact pins 4 respectively inserted in a plurality of holes formed on a top surface 2a of the substrate 2, a plurality of contact pins 6 respectively inserted in a plurality of holes formed on a bottom surface 2b of the substrate 2, and a connection member 7 for electrically connecting contact pins 4 with corresponding contact pins 6. The guide body 8 has a guide part or guide wall 81 for arranging an electronic device (not shown) at a predetermined position on the substrate 2 and has a positioning part (in the present embodiment, positioning pins 82 shown in FIG. 2) for positioning the contact pin holder 1 at a predetermined position of the circuit board of a system operating the electronic device, for example, an inspection system (not shown) for inspecting electronic devices. Note that, the guide body 8 is mounted to the contact pin holder 1 depending on necessity. Further, the substrate 2 may have a hole or notch used in conjunction with the positioning part to carry out positioning.

Further, in order to mount the electronic device to an accurate position with respect to the contact pin holder 1, a positioning device provided separate from the contact pin holder 1 may be used. In this case, the guide body 8 is omitted.

FIG. 3 shows a plan view of the substrate 2, while FIG. 4 shows a bottom view of the substrate 2. Further, FIG. 5 is a plan see-through view of the substrate 2 showing the structure of the connection member 7. FIG. 6 is a view showing a lateral cross-section of the substrate 2 along II-II of FIG. 5. Further, FIG. 7 is a view showing a lateral cross-section of the substrate 2 along III-III of FIG. 5.

As shown in FIG. 3, the upper surface 2a of the substrate 2 has a plurality of contact pins

4 arranged in two rows of eight pins each at equal intervals along the longitudinal direction so as to be respectively electrically connected to terminals of an electronic device attached to the contact pin holder 1. On the other hand, as shown in FIG. 4, the bottom surface 2b of the substrate 2 has a plurality of contact pins 6 arranged in an array of four pins each in the longitudinal directions and four pins each in the lateral directions so as to be respectively electrically connected to terminals of the circuit board to which the contact pin holder 1 is attached.

Further, the pitch between contact pins 6 adjacent in the lateral direction is narrower than the pitch between contact pins 4 adjacent in the lateral direction. Note that the pitch between contact pins 4 adjacent in the longitudinal direction may also be different from the pitch of contact pins 6 adjacent in the longitudinal direction.

In such a way, the pitch and arrangement of the contact pins 4 are the pitch and arrangement of the contact pins 6 differ. Further, as shown in FIG. 5, the contact pins 4 are electrically connected by the connection member 7 to the corresponding contact pins among the contact pins 6. Therefore, the contact pin holder 1 can electrically connect terminals of an electronic device having a pitch and arrangement of terminals different from the pitch and arrangement of terminals of the circuit board to the corresponding terminals of the circuit board.

As shown in FIG. 6 and FIG. 7, the substrate 2 has at least one (two in the illustrated example) lamellar dielectric 22, 23 disposed (preferably embedded) on a base material 21 comprised of a glass epoxy resin or other dielectric material, each lamellar dielectric having a copper or other conductive layer formed on its two sides. That is, in the substrate 2, the base material 21 has one conductive layer, a lamellar dielectric, and another conductive layer disposed on it in that order. Due to this, each lamellar dielectric and the conductive layers on the two sides of the same work in conjunction to form a capacitor. Further, to raise the capacity of the capacitor, the higher the permittivity of each lamellar dielectric 22, 23, the more preferable. Each lamellar dielectric is preferably a high dielectric material having a permittivity higher than the permittivity of the base material 21. For example, as a lamellar dielectric, an embedded capacitor material (ECM) made by 3M may be used. The ECM is comprised of a high dielectric material of C-Ply (for example, relative permittivity of 16) provided by 3M formed into a flexible sheet. The layers of the substrate 2 can be fabricated by for example using etching or other fabrication technology.

The materials forming the substrate 2 may include paper in place of glass fiber and may include a phenol resin or a polyamide resin in place of an epoxy resin. Further, as the material forming the conductive layer, other than copper, silver, gold, nickel, or their alloys may be used. The lamellar dielectric may include a polymer. Preferably, the lamellar dielectric includes a polymer and a plurality of particles, specifically, is fabricated from a mix of resin and particles. As preferable resins, an epoxy, polyimide, polyvinylidene fluoride, cyanoethyl pullulan, benzocyclobutene, polynorbornene, polytetrafluoroethylene, acrylate, and their mixtures may be mentioned. The particles include dielectric (or insulating) particles. As typical examples of these, barium titanate, barium strontium titanate, titanium oxide, lead zirconate titanate, and their mixtures may be mentioned.

The thickness of each lamellar dielectric 22, 23 can be for example be made for example 0.5 micrometer or more and can be made 20 micrometers or less. The thickness is preferably thinner as that allows higher electrostatic capacitance of the capacitor. For example, it can be made to be 15 micrometers or less or 10 micrometers or less. However, thicker thicknesses of the layers of dielectric materials 22, 23 are preferable from the viewpoint of bonding strength and for example can be made 1 micrometer or more.

Further, the higher the relative permittivity of the lamellar dielectric materials 22, 23, the more preferable. For example, it can be made to be 10 or more or 12 or more. The upper limit of the relative permittivity is not particularly set, however, it can be made 45 or less, 30 or less, 20 or less, or 16 less. As shown in FIG. 5 and FIG. 7, among the conductive layers formed at the two sides of the lamellar dielectrics 22, 23, the conductive layers 24, 26 closer to the surface of the substrate 2 are respectively electrically connected to the power supply pins 42a, 62a connected to the power supply terminals of the electronic device and the circuit board among the contact pins 4, 6. On the other hand, the conductive layers 25, 27 positioned at the inner side of the substrate 2 from the lamellar dielectrics 22, 23 are respectively electrically connected to the ground pins 43 a, 63 a connected to the ground terminals of the electronic device and circuit board among the contact pins 4, 6. In more detail, the conductive layer 24 which adjoins the top surface of the first lamellar dielectric 22 close to the surface of the not shown electronic device side of the substrate 2 (top surface 2a in FIG. 2) is formed as a first power supply layer, while the conductive layer 25 which adjoins the bottom surface of the lamellar dielectric 22 is formed as a first ground layer. Similarly, the conductive layer 26 which adjoins the surface of the side close to the bottom surface of the substrate 2 of the second lamellar dielectric 23 close to the surface of the not shown circuit board side of the substrate 2 (bottom surface 2b in FIG. 2) is formed as a second power supply layer, while the conductive layer 27 is formed on the surface of the opposite side of the lamellar dielectric 23 as a second ground layer. Here, the potentials of the first power supply layer 24 and the second power supply layer 26 are substantially the same. Similarly, the potentials of the first ground layer 25 and the second ground layer 27 are substantially the same.

Note that the lamellar dielectrics and the conductive layers on their two sides are arranged over the entire substrate 2. Therefore, it is possible to form capacitors having areas substantially equal to the area of the substrate 2.

In this way, the contact pin holder 1 has capacitors connected between power supply pins and ground pins and thereby can reduce the impedance generated at each contact pin.

Further, as shown in FIG. 6 and FIG. 7, it is preferable that the substrate 2 have a capacitor formed by a power supply layer and ground layer sandwiching a lamellar dielectric at a position as close to each of the top surface 2a and bottom surface 2b of the substrate 2 (that is, the surface layer side) as possible. The reason is that a smaller distance between the surface of the substrate 2 and the conductive layer gives good signal transmission

characteristics. More specifically speaking, the shorter the distance between the top surface 2a of the substrate 2 and the lamellar dielectric 22, the more the input sensitivity of the electronic device attached to the contact pin holder 1 rises, while the shorter the distance between the bottom surface 2b of the substrate 2 and the lamellar dielectric 23, the more the output sensitivity of the electronic device rises. In the present embodiment, the substrate is configured as a substantially a single piece including the dielectric layers sandwiched between the power supply layers and the ground layers, so a configuration in which the capacitors are arranged near the surfaces of the substrate 2 can be easily realized. Therefore, the contact pin holder 1 can give better signal transmission characteristics.

Further, by arranging the power supply layer closer to the surface layer of the substrate 2 compared with the ground layer, the contact pin holder 1 can give better signal transmission characteristics.

Note that depending on the electronic device attached to the contact pin holder 1, the substrate 2 need only have either the capacitor on the upper surface 2a side of the substrate 2 or the capacitor on the bottom surface 2b side. Alternatively, the substrate 2 may have no capacitors.

As shown in FIG. 5, the contact pins 4 include the signal pins 41a to 411 connected to the signal terminals of the electronic device, the power supply pins 42a, 42b connected to the power supply terminals of the electronic device, and the ground pins 43 a, 43b connected to the ground terminals of the electronic device. Similarly, the contact pins 6 include the signal pins 61a to 611 connected to the signal terminals of the circuit board, the power supply pins 62a, 62b connected to the power supply terminals of the circuit board, and the ground pins 63a, 63b connected to the ground terminals of the circuit board.

Each contact pin 4, 6 is formed from a member having conductivity and has a predetermined characteristic impedance. Note that, the characteristic impedance of each contact pin 4 is preferably approximately equivalent to the characteristic impedance of each terminal of the electronic device for the frequency of the signal that is sent to the electronic device attached to the contact pin holder 1. Further, the characteristic impedance of each contact pin 6 is preferably approximately equivalent to the characteristic impedance of each terminal of the circuit board attached to the contact pin holder for the frequency of the signal that is sent to the electronic device. Due to this, the contact pin holder 1 matches the impedance between the terminals of the electronic device or circuit board and the contact pins 4, 6, so it can reduce the transmission loss that occurs when a high frequency signal is transmitted between a terminal and contact pin.

As shown in FIG. 6 and FIG. 7, on the interior surface of each hole 3 formed at the top surface 2a side of the substrate 2 and which a contact pin 4 is inserted into, for example plating etc. is used to provide a conductor 31. Similarly, on the interior surface of each hole 5 formed at the bottom surface 2b side of the substrate 2 and which a contact pin 6 is inserted into, a conductor 51 is provided. The conductors 31, 51 are formed by for example a metal such as copper, gold, silver, nickel, or their alloys or other materials having conductivity. These conductors 31, 51 are respectively electrically connected to the connection member 7.

Each contact pin 4 is press fit into a corresponding hole among the holes 3, whereby the contact pin 4 contacts the conductor 31. Similarly, each contact pin 6 is press fit into a corresponding hole among the holes 5, whereby the contact pin 6 contacts the conductor 51.

By press fitting the contact pins 4, 6 to make them contact the conductors 31, 51 provided on the inner walls of the holes 3, 5 formed in the substrate 2, the contact pins 4, 6 and conductors 31, 51 are electrically connected without using solder. Due to this, a material having a different impedance than the impedance of the contact pins will no longer have to be interposed between the contact pins 4, 6 and conductors 31, 51.

Therefore, the contact pin holder 1 can reduce the transmission loss of high frequency signals between the contact pins 4, 6 and the conductors 31, 51.

The dimensions of the holes 3, 5 are determined so that the contact pins 4, 6 held in the holes do not fallout due to the reaction forces of the built-in springs of the contact pins 4, 6 generated when the contact pin holder 1 is placed on the circuit board of the inspection system. For example, the press-fitting holding force of the contact pins 4, 6 is preferably not less than 0.1N. Further, the dimensions of the holes 3, 5 are determined so that the contact pins 4, 6 can be taken out from the holes with relative ease for maintenance, replacement, etc. of the contact pins 4, 6. Further, they are determined so that the conductors 31, 51 on the interior surfaces of the holes 3, 5 do not peel off when the contact pins 4, 6 are pulled out from the substrate 2. For example, the press-fitting holding forces of the contact pins 4, 6 is preferably not more than 2. ON.

As shown in FIG. 5 to FIG. 7, the connection member 7 electrically connects any contact pin among the plurality of contact pins 4 to at corresponding contact pins among the plurality of contact pins 6. To do this, the connection member 7 has at least one conductive layer 71 in the substrate 2 and conductive layers 72 and 73 provided adjacent to the top side and bottom side of the conductive layer 71 so as to sandwich the conductive layer 71. The conductive layers 71 to 73 are respectively formed from for example a metal such as copper, gold, silver, nickel, or their alloys or another material having conductivity. The conductive layers 71 to 73 are formed in the substrate 2 using, for example, etching, photolithography, or other fabrication technology.

The conductive layer 71 is formed with a plurality of conductive paths 71 la to 7111 electrically connecting the signal pins 41a to 411 of the contact pins 4 to any of the signal pins 61a to 611 of the contact pins 6. Further, the conductive layer 71 is formed with conductive paths 712a, 712b respectively electrically connecting the power supply pins 42a, 42b of the contact pins 4 to the power supply pins 62a, 62b of the contact pins 6.

The conductive layers 72, 73 are respectively electrically connected to ground pins 43 a, 43b of the contact pins 4 and ground pins 63a, 63b of the contact pins 6. Further, the conductive layers 72, 73 preferably have areas sufficient for sandwiching the conductive paths 711a to 7111 between them. In the present embodiment, the conductive layers 72, 73 are arranged so that they respectively cover the entire horizontal surface of the substrate 2. However, the conductive layers 72, 73 are arranged so that they are insulated from the contact pins other than the ground pins.

In this way, the connection member 7 has conductive paths 711a to 7111 transmitting the signals and conductive layers 72 and 73 that are grounded to the two sides, so functions as a stripline. Further, by suitably setting the widths of the conductive paths and the distance between the adjoining conductive layers according to the conductance rate of the conductive path and the relative permittivity of the substrate 2, reflection of a signal between each signal pin and the connection member 7 electrically connecting the signal pins is kept to a minimum with respect to the frequency of the signal sent to the electronic device. Due to this, the connection member 7 can reduce the transmission loss that occurs when a high frequency signal is transmitted through the conductive paths 711a to 7111 between the signal pins.

Note that, it is sufficient if the impedance of the connection member 7 is made to match the impedance of the signal pins to the extent that one of an electronic device and circuit board can receive a high frequency signal the other. The contact pin holder according to the present invention is not limited to one completely matching the impedance of the connection member 7 to the impedance of the electronic device and circuit board. Note that the signal pins are preferably connected at first ends to the conductive paths 711a to 7111 of the connection member 7. Therefore, in the present embodiment, the conductive paths 711a to 7111 are electrically connected, at the bottom surface of the holes 3, 5 that the signal pins are inserted in, to the conductors 31, 51 that are formed at the interior surfaces of the holes 3, 5. By connecting first ends of the signal pins to the conductive paths 711a to 7111, the parts of the signal pins inserted in the holes of the substrate 2 are prevented from functioning as stubs connected in parallel to the conductive paths 711a to 7111.

Therefore, the contact pin holder 1 can prevent the occurrence of mismatch of the impedances of the paths formed by the signal pins and connection member 7 and the characteristic impedance of the electronic device or circuit boards caused by self inductance or capacitance at parts of the signal pins.

Alternatively, when the characteristic impedance of a signal pins and the characteristic impedance of the connection member 7 differ, the conductive path of the connection member 7 may also be connected to the conductor formed on the side wall of the hole which the signal pin is inserted into at a position separated from the bottom surface of the hole by exactly a predetermined distance so that one end of the signal pin functions as a stub. Due to this, the characteristic impedance of the path formed by the signal pin and connection member 7 can be adjusted so that the impedance of the path can match well with the characteristic impedance of the electronic device or circuit board.

As explained above, the contact pin holder according to the first embodiment can electrically connect terminals of an electronic device having a pitch and arrangement of terminals different from the pitch and arrangement of terminals of the circuit board with the corresponding terminals of the circuit board. Further, this contact pin holder connects them through the connection member configured such as to match the impedances of the contact pins connected to the signal terminals of the electronic device and the impedances of the contact pins connected to the signal terminals of the circuit board for the frequency of the signal sent to the electronic device. Therefore, this contact pin holder can reduce the transmission loss of a signal that is sent between the electronic device and circuit board.

FIG. 8 is a plan see-through view of the substrate 2 showing another example of the connection member 7. Further, FIG. 9 is a view showing a lateral cross-section of the substrate 2 along IV-IV of FIG. 8. In this example, conductive paths 741a to 74 If are formed in the first conductive layer 74, and conductive paths 751a to 75 If are formed in the second conductive layer 75. Further, the conductive layer 76 electrically connected to the ground pins 43a, 43b, 63a, and 63b, is formed between the first conductive layer 74 and second conductive layer 75. Further, the upper side of the first conductive layer 74 and the lower side of the second conductive layer 75 are also formed with conductive layers 77, 78 which are connected to the ground pins. However, the conductive layers 76 to 78 are arranged so that they are insulated from contact pins other than the ground pins. The conductive layers 74 to 78 are respectively formed from for example a metal such as copper, gold, silver, or nickel or their alloys or other materials having conductivity.

Even in this case, the conductive paths 741a to 74 If transmitting the signals and the conductive layers 76 and 77 grounded at the two sides function as a stripline. Similarly, the conductive paths 751a to 75 If transmitting the signals and the conductive layers 76 and 78 grounded at the two sides also function as a stripline. Further, by appropriately designing the widths of the conductive paths and the distances between the conductive paths and conductive layers, the reflection of signals between the strip line and signal pins can be kept to a minimum.

Further, the conductive paths 741 a to 741 f and 751 a to 751 f are formed so that the lengths of the conductive paths become equal to each other. Therefore, the lengths of the paths formed by the signal pins and the conductive paths connecting the signal terminals of the electronic device and corresponding terminals of the circuit board become the same.

Therefore, the delay times of signals transmitted over the paths are also equal. Due to this, the contact pin holder can prevent deviation in the timings of signals input to the signal terminals of the electronic device or the circuit board.

Next, a contact pin holder according to a second

embodiment will be explained. The contact pin holder according to the second embodiment electrically connects terminals of an electronic device which has a terminal arrangement different from the arrangement of terminals of a circuit board operating the electronic device to the corresponding terminals of the circuit board. Therefore, this contact pin holder electrically connects them so that the arrangement of the contact pins connected to the terminal of the circuit board, which are respectively connected to contact pins connected to terminals of the electronic device, is different from the arrangement of contact pins connected to terminals of the electronic device.

The contact pin holder according to the second embodiment, in comparison to the contact pin holder according to the first embodiment, has a different arrangement of contact pins. Thus, below, the arrangement of contact pins and related matters will be explained. For other matters, refer to the explanation relating to the first embodiment.

FIG. 10 is a plan view of the substrate 2 of the contact pin holder according to the second embodiment. Further, FIG. 11 is a bottom view of the substrate 2 of the contact pin holder according to the second embodiment. Note that, in FIGS. 10, 11, the elements of the contact pin holder according to the second embodiment are assigned the same reference numerals as the corresponding elements of the contact pin holder according to the first embodiment shown in FIG. 1 to FIG. 7.

As shown in FIG. 10, the top surface 2a of the substrate 2 is formed with two rows of eight holes each at equal intervals along the longitudinal direction. Further, the plurality of contact pins 4 are respectively inserted into holes so that they are electrically connected to terminals of the electronic board attached to the contact pin holder 1.

Similarly, as shown in FIG. 11, the bottom surface 2b of the substrate 2 is formed with two rows of eight holes each at equal intervals along the longitudinal direction. Further, the plurality of contact pins 6 are respectively inserted into holes so that they are electrically connected to terminals of the circuit board attached to the contact pin holder 1. Further, the pitch between adjoining contact pins 4 is equal to the pitch between adjoining contact pins 6.

Further, instead of separately forming holes in the top surface 2a and the bottom surface 2b of the substrate 2, a number of through holes equal to the number of contact pins 4 may be formed in the substrate 2. In this case, each through hole is press fit with one of the contact pins 4 and one of the contact pins 6 from the two sides of the substrate 2. Further, in order that the two contact pins inserted in one through hole be insulated from each other, for example, no conductor is provided in a region in the interior surface of the through hole which neither contact pin contacts.

FIG. 12 is a plan see-through view of the substrate 2 showing the structure of the connection member 7. Further, FIG. 13 is a view showing a lateral cross-section of the substrate along the V-V line of FIG. 12.

As shown in FIG. 12 and FIG. 13, the connection member 7 electrically connects any of the contact pins among the plurality of contact pins 4 to corresponding contact pins among the plurality of contact pins 6.

Therefore, the connection member 7 has, within the substrate 2, a plurality of conductive paths 71 la to 7111 and conductive paths 712a, 712b. The conductive path 71 1a electrically connects a signal pin 41a among the contact pins 4 to a signal pin 61b among the contact pins 6. The conductive path 71 lb electrically connects a signal pin 41b to a signal pin 61a. The conductive path 71 1c electrically connects a signal pin 41c to a signal pin 6 Id. The conductive path 71 Id electrically connects a signal pin 41d to a signal pin 61c. The conductive path 71 le electrically connects a signal pin 41e to a signal pin 6 If. The conductive path 71 If electrically connects a signal pin 41f to a signal pin 61e. The conductive path 71 lg electrically connects a signal pin 41g to a signal pin 61h. The conductive path 71 lh electrically connects a signal pin 41h to a signal pin 61g. The conductive path 71 li electrically connects a signal pin 4 li to a signal pin 61j. The conductive path 71 lj electrically connects a signal pin 4 lj to a signal pin 6 li. The conductive path 71 lk electrically connects a signal pin 41k to a signal pin 61 1. Further, the conductive path 71 1 1 electrically connects a signal pin 41 1 to a signal pin 61k.

Further, the conductive path 712a conductively connects the power supply pin 42a and the power supply pin 62a, while the conductive path 712b conductively connects the power supply pin 42b and the power supply pin 62b.

In this way, the sequence of the signal pins 41a to 41 1 in the arrangement of contact pins 4 and the sequence of signal pins 61 a to 61 1 electrically connected to the signal pins 41a to 41 1 are different. Therefore, the contact pin holder according to the second embodiment can connect terminals of an electronic device having an arrangement of terminals different from the arrangement of terminals of the circuit board to the corresponding terminals of the circuit board.

Note that the connection between contact pins is not limited to the above examples. It is sufficient that the connection be determined according to the terminal arrangement of the electronic device attached to the contact pin holder and the terminal arrangement of the circuit board.

Further, the contact pins 4, 6 may for example be arranged in a grid array so as be able to handle electronic devices and circuit boards with ball grid arrays, land grid arrays, pin grid arrays, or other terminal arrangements.

The connection member 7 further has conductive layers 72, 73, 76, and 77 electrically connected to the ground pins 43 a, 43b of the contact pins 4 and the ground pins 63 a, 63b of the contact pins 6. The conductive layers 72, 73, 76, 77 are formed so that they sandwich the conductive paths 711a to 7111. Therefore, the conductive layers 72, 73, 76, 77 and conductive paths 711a to 7111 can form striplines. Further, the widths of the conductive paths and the distances between the conductive paths and the conductive layers are set such so that reflection of signals between the signal pins and connection member 7 becomes a minimum. Due to this, the connection member 7 can reduce the transmission loss that occurs from a high frequency signal being sent through conductive paths 711a to 7111 between signal pins.

Note that the conductive paths and conductive layers are respectively formed from for example a metal such as copper, gold, silver, or nickel or their alloys or other materials having conductivity. Further, the conductive paths and conductive layers are formed in the substrate 2 using, for example, etching, photolithography, or other fabrication technology.

As explained above, the contact pin holder according to the second embodiment can connect terminals of an electronic device which has an arrangement of terminals different from the arrangement of terminals a circuit board to the corresponding terminals of the circuit board.

Next, a contact pin holder according to a third embodiment will be explained. The contact pin holder according to the third embodiment has the signal pins held by the contact pin holder form coaxial transmission line to thereby make characteristic impedances of the signal pins match the impedance of the electronic device and the circuit board operating the electronic device.

The contact pin holder according to the third embodiment, in comparison to the contact pin holder according to the first embodiment, is different in the point that the signal pins constitute a coaxial transmission line. Therefore, below, the signal pins and matters relating to the holes the signal pins are inserted in will be explained. For other matters, refer to the explanations relating to the first embodiment.

FIG. 14 is a view showing a lateral cross-section of the substrate of the contact pin holder according to the third embodiment.

The length of the hole 30 which the signal pin 41a of the contact pins 4 is inserted into is shorter than the longitudinal direction length of the signal pin 41a. Therefore, the signal pin 41a is held so that one end of the signal pin 41a contacts the bottom surface 30d of the hole 30 and the other end sticks out from the hole 30 above the substrate 2. Further, the inside diameter of the center 30a of the hole 30 is larger than the outside diameter of the lower portion 412 of the signal pin 41a. Further, the inside diameter of the upper end 30b and the inside diameter of the lower end 30c of the hole 30 are smaller than the inside diameter of the center 30a. Further, the inside diameter of the lower end 30b is approximately equivalent to the outside diameter of the upper portion 411 of the signal pin 41a and is smaller than the outside diameter of the lower portion 412 of the signal pin 41a. Further, the inside diameter of the lower end 30e of the hole 30 is approximately equivalent to the outside diameter of the lower portion 412 of the signal pin 41a. Therefore, the signal pin 41a is held by the upper end 30b and lower end 30e of the hole 30.

Further, a conductor 32 is formed at the interior surface of the center 311a of the hole 30. This conductor 32 is conductively connected through the conductive layer 72 of the connection member 7 to the ground pin 43a and ground pin 63a. Therefore, the conductor 32 is grounded. Further, the signal pin 41a is insulated from the conductor 32 by being arranged away from the conductor 32. Due to this, the signal pin 41a and the conductor 32 constitute a coaxial transmission line. Note that the space between the conductor 32 and signal pin 41a may be filled with a resin or other dielectric.

By appropriately setting the diameter of the signal pin 41a and the distance between the signal pin 41a and conductor 32, the coaxial transmission line formed by the signal pin

41a and conductor 32 can be given a characteristic impedance approximately equivalent to the characteristic impedance for the frequency of signals sent to the electronic device connected to the signal pin 41a. Therefore, this contact pin holder can make the characteristic impedance of the signal terminal of the electronic device match the characteristic impedance of the coaxial transmission line constituted by the signal pin 41a and conductor 32, so the transmission loss of signals transmitted through the signal pin 41a can be reduced.

Similarly, the inside diameter of the center 50a of the hole 50 which the signal pin 61a of the contact pins 6 is inserted into is larger than the outside diameter of the upper portion 611 of the signal pin 61a. Further, the interior surface of the center 50a of the hole 50 is formed with a conductor 52. This conductor 52 is conductively connected through the conductive layer 73 of the connection member 7 to the ground pin 43 a and ground pin 63 a. Therefore, the conductor 52 is grounded. Further, the signal pin 61a is insulated from the conductor 52 by being arranged away from the conductor 52. Due to this, the signal pin 61a and conductor 52 constitute a coaxial transmission line.

A conductor 33 is formed on the bottom surface 30d of the hole 30. The conductor 33 is insulated from the conductor 32. On the other hand, the signal pin 41a has a tip contacting the conductor 33 whereby the signal pin 41a and conductor 33 are electrically connected.

Similarly, the top surface 50d of the hole 50 is formed with a conductor 53. The conductor 53 is insulated from the conductor 52. On the other hand, the signal pin 61a has a tip contacting the conductor 53 whereby the signal pin 61a and conductor 53 are electrically connected.

Further, the conductive path 71 of the connection member 7 electrically connects the conductor 33 and the conductor 53. Further, the conductive path 71 is arranged between the grounded conductive layers 72 and 73. Therefore, the connection member 7 can form a strip line.

Note that the contact pin holder according to this embodiment also may have, near the surface layer of the substrate 2, a capacitor configured by conductive layers connected to the power supply pins, that is, the power supply layers 24, 26, conductive layers connected to the ground pins, that is, the ground layers 25, 27, and dielectric layers 22, 23 sandwiched between the power supply layers 24, 26 and ground layers 25, 27.

As explained above, the contact pin holder according to the third embodiment can form a coaxial transmission line by a signal pin connected to a signal terminal of the electronic device or circuit board and a conductor formed on the interior surface of a hole which the signal pin is inserted into and grounded. Therefore, this contact pin holder can make the impedance between each signal terminal and signal pin for the frequency of the signals sent to the electronic device match, so the transmission loss of the signals transmitted through the signal pin can be reduced. Further, this contact pin holder can also make the connection member which connects a signal pin connected to a signal terminal of an electronic device to a signal pin connected to a signal terminal of the circuit board into a stripline structure and can therefore suppress signal reflection between the signal pin and connection member. In this way, this contact pin holder can make the impedance of the overall path between a signal terminal of the electronic device and the signal terminal of the circuit board match the impedance of each signal terminal. Therefore, the transmission loss of signals transmitted in this contact pin holder is reduced well.

Note that, the present invention is not limited to the above embodiments.

For example, in the above embodiments, it is also possible to omit one of the two of the grounded conductive layers of the connection members 7 adjoining the conductive path connected to the signal pin. In this case, the conductive path of the connection member and one grounded conductive layer can form a micro stripline. Therefore, by adjusting the width of the conductive path of the connection member 7 and the distance between the conductive path and the grounded conductive layer according to the conductance rates of the conductive paths and the relative permittivity of the base material 21, reflection of a signal between the connection member 7 and signal pins can be kept to a minimum. Further, the connection member 7 may have a different configuration enabling a characteristic impedance approximately the same as the characteristic impedance of the signal pins for a specific frequency.

Further, the contact pins able to be used in the above embodiments may have a so- called "pogo pin" configuration.

FIG. 15 is a view showing a lateral cross-section of a contact pin 400 usable in the contact pin holder according to the above embodiments. The contact pin 400 has an approximately cylindrical pin body 401 inserted in the substrate, a first contact member 402 sticking out from one end of the pin body 401 (the lower end in the illustrated example) and able to abut against the bottom surface of a hole (for example, hole 3 of FIG. 6) formed on the substrate or a terminal of a not shown circuit board, and a second contact member 403 sticking out from one end of the pin body 401 (the upper end in the illustrated example) and able to abut against the top surface of a hole (for example, hole 5 of FIG. 6) formed on the substrate or a terminal of a not shown electronic device. The pin body 401 and contact members 402, 403 are formed from materials having conductivity. Further, the inside diameters of the openings on the upper end and lower end of the pin body 401 are narrower than the inside diameter at the center of the pin body 401. Further, the sides of the contact members 402, 403 are formed with flanges that abut against the lower end or upper end of the pin body 401 from the inner side and prevent the contact members 402, 403 from falling off the pin body 401.

Further, the inside of the pin body 401 is provided with an elastic member having conductivity such as a metal spring 404. Further, the spring 404 biases both contact members 402, 403 to the lower end or upper end of the pin body 401 respectively so that the contact members 402, 403 can displace in the axial direction of the pin body 401. Therefore, if one end of the contact pin 400 is pressed along the axial direction of the pin body 401 by a terminal of an electronic device etc., a force opposite to the pressing direction acts on the contact member 402, 403, so contact between the contact members 402, 403 and the terminals is made more reliable. Therefore, the contact pin 400 is reliably conductive ly connected to the terminal contacting the contact member 402 or 403 etc.

FIG. 16 is a view showing a lateral cross-section of a contact pin 410 according to another example able to be used in a contact pin holder according to the above embodiments.

The contact pin 410 has an approximately cylindrical pin body 411 formed from a conductive metal and inserted in the substrate, a slender pin-shaped plunger 412, and a coil spring 413. The plunger 412 and coil spring 413 are both formed from conductive metals and contained inside the pin body 411.

The pin body 411 has a first part 41 la that opens at the lower side, a second part 411c arranged coaxially with the first part, and a slanting part 411b having an inside diameter that gradually changes in the extending direction of the pin body 411 and connects the first part 411a and second part 411c together. The inside diameter of the first part 41 la which is near the lower surface opening of the pin body 411 (for example, the opening facing the bottom surface of the hole or the circuit board) is smaller than the inside diameter of the second part 411c which is the center part of the pin body 411. Further, the pin body 411 has a third part 411 d connecting to the second part 411 c above the second part 411c and having an inside diameter narrower than the second part 411c. The third part 41 Id is formed with a top surface opening.

The coil spring 413 contained in the pin body 411 is provided with an upper part 413a contained in the second part 41 lc of the pin body 411 and a lower part 413b connected with the upper part 413a. The upper part 413a has elasticity enabling

compression in the axial direction, that is, the extending direction of the pin body 411. Further, the upper part 413a has an outside diameter that is approximately the same or smaller than the inside diameter of the second part 41 lc of the pin body 411. The lower part 413b is formed connected with the upper part 413a. In the lower part 413b, the spring is more thickly coiled than at the upper part 413a. Further, the outside diameter of the lower part 413b is smaller than the upper part 413a and is approximately the same or less than the inside diameter of the first part 41 la of the pin body 411. Therefore, the diameter of the upper part 413a of the coil spring 413 (that is, the part positioned inside the second part 41 lc of the pin body 411) is larger than the inside diameter of the first part 41 la of the pin body 411. Therefore, the pin body 411 can prevent the coil spring 413 from falling off the pin body 411. Further, the length of the upper part 413a of the coil spring 413 has approximately the same length as the length of the second part 41 lc of the pin body 411. On the other hand, the length of the lower part 413b of the coil spring 413 is longer than the first part 41 la of the pin body 411. Therefore, the coil spring 413 inserted in the pin body 411 is set so that its lower part 413b sticks out from the opening of the lower part of the pin body 411 and the lower end of the coil spring 413 contacts the terminal of a circuit board or bottom surface of a hole and is electrically connected. Further, a plunger 412 to be explained later is in a state constantly biased in the upward direction by the coil spring 413.

Further, the lower part 413b of the coil spring 413 is configured so that when the coil spring 413 is in a free state (state not receiving compression force), the adjoining turns of the spring contact. Therefore, at the lower part 413b of the coil spring 413, the cross-sectional area of the conductive path formed by the coil spring 413 and pin body 411 becomes broader, and the conduction resistance of the conductive path can be made smaller. Further, the conductive path can be formed not in a coiled state, but in a straight line that is approximately parallel to the extending direction of the coil spring 413. Therefore, even if a high frequency signal is applied to the contact pin, the generation of inductance at this part can be suppressed. In the present embodiment, by changing the outside diameter and coil pitch of one spring, the upper part 413a and lower part 413b are configured. Therefore, elastic members can be fabricated at low cost with a low number of parts.

Further, the lower part of the coil spring may also be configured so that when the spring is in a free state, the adjoining turns of the spring do not contact and when the electronic device or circuit board is attached to the contact pin holder and the coil spring is compressed, adjoining turns of the lower part of the coil spring contact. When the coil spring is configured so that the adjoining turns of the lower part of the coil spring contact, a conductive path is formed approximately parallel to the extending direction of the coil spring irrespective of the degree of compression of the coil spring, so it is possible to more reliably shorten the conductive path.

On the other hand, at the second part 41 lc of the pin body 411, the coil spring 413 is sparsely coiled, so the coil spring 413 has elasticity along the longitudinal direction of the pin body 411.

In the present embodiment, one coil spring is use to form the elastic member, however, the elastic member can also be configured in other forms. For example, two coil springs with differing outside diameters or spring constants may be inserted in series in the pin body 411. Further, these coil springs may be combined into one.

Alternatively, the lower part of the coil spring may be made by a metal sleeve or metal rod. Further, the metal sleeve or metal rod may be connected with the upper part of the coil spring by a known method near the upper end. As a method of connection, there may be used, for example, a method of mechanically engaging these or a method of joining them by a conductive adhesive. Further, it is sufficient if the upper part of the coil spring is an elastic member having conductivity. The upper part can be configured from, for example, an elastomer having conductivity, a pneumatic spring configured from a conductive material, a plate spring compressible in the extending direction of the pin body 411, etc.

Further, a plunger 412 contained in the pin body 411 electrically connects the terminal of the electronic device or a conductor provided at the top surface of a hole formed in a substrate with the coil spring 413 and pin body 411.

The upper end of the plunger 412 sticks out from the opening of the upper part of the pin body 411 so that it reliably contacts the terminal of the electronic device or the conductor provided on the top surface of the hole formed in the substrate. On the other hand, the lower end of the plunger 412 is inserted into the coil spring 413. Further, the approximately center part in the longitudinal direction of the plunger 412 is formed with a flange 412a with a diameter larger than the other portions of the plunger 412. The bottom end of the plunger 412a strikes the top end of the coil spring 413. Therefore, if the plunger 412 is pressed by a terminal of the electronic device or the like, the plunger 412 moves downward, and the plunger 412 compresses the coil spring 413 along the longitudinal direction of the pin body 411. Due to this, the plunger 412 and the coil spring 413 reliably contact and poor contact between the plunger 412 and coil spring 413 can be prevented. Further, the contact area of the plunger 412 and coil spring 413 with the pin body 411 increases, so the resistance of the conductive path from the plunger 412 and coil spring 413 through the pin body 411 can be made smaller.

Note that, the length of the plunger 412 is preferably designed so that even when positioned at the lower end of the range of movement of the plunger 412, the lower end of the plunger 412 is contained in the portion of the pin body 411 with a large inside diameter (that is, the second part 411c). By setting the length of the plunger 412 in this way, it is possible to prevent the lower end of the plunger 412 from being caught in the part of the coil spring 413 with a narrow diameter and preventing removal when removing the electronic device or circuit board from the contact pin holder.

Further, when the coil spring 413 is in a compressed state, the lower end part of the plunger 412 preferably contacts the part of the coil spring 413 which is sparsely wound. If the plunger 412 contacts the inner circumference of the coil spring 413, the coil spring 413 bends and the plunger 412 is pushed back by the coil spring 413 by this elastic reaction force. If this elastic reaction force is large, the friction between the coil spring 413 and plunger 412 becomes large and the up and down movement of the plunger 412 is liable to be hindered. The rigidity of the part of the coil spring 413 which is sparsely wound becomes lower than the rigidity of the part which is densely wound. Therefore, when the lower end part of the plunger 412 contacts the coil spring 413, if the part of the coil spring 413 contacted is sparsely wound, the elastic reaction force acting on the plunger 412 can be reduced, whereby the up and down movement of the plunger 412 can be smoothed.

Further, the shorter the densely wound part of the coil spring 413, the better.

Preferably, the upper part 413a of the coil spring 413 comprises only the substantially sparsely wound part.

The shorter the densely wound part of the coil spring 413, the longer the dimension of the part exhibiting elasticity in the longitudinal direction, that is, the sparsely wound part of the coil spring 413, can be made. Therefore, the shorter the densely wound part of the coil spring 413, the greater the amount of movement of the plunger 412. Further, if the amount of movement of the plunger 412 can be made larger, it is possible to make the spring coefficient of the sparsely wound part smaller. Therefore, for example, even when there is a difference in the positions in the height direction (the longitudinal direction of the contact pins 410) of terminals of the electronic device contacting the upper ends of the plurality of contact pins 410 held in the contact pin holder, the fluctuation in the contact pressures of the plungers 412 to the terminals of the electronic device terminal between the different contact pins becomes smaller, and a stable contact state can be obtained.

Further, the pin body 411 has an inside diameter that becomes smaller near the opening at the upper part. This thin portion locks the upper end of the flange 412a of a plunger 412 and limits the upper end of the range of movement of the plunger 412.

Note that, according to another embodiment, the inside shape of each hole formed in the substrate of the contact pin holder may be formed similarly to the inside shape of the pin body 411 of the contact pin 410 shown in FIG. 16. Further, it is also possible to form a conductor in each hole and arrange the plunger 412 and coil spring 413 of the contact pin 410 shown in FIG. 16 as shown in FIG. 16. In this case, the plunger 412 and coil spring 413 make up the contact pin.

As explained above, a person skilled in the art can make various changes within the range of the present invention in accordance with the mode of use. Reference Signs List

100 guided contact pin holder

1 contact pin holder

2 substrate

21 base material

22, 23 dielectric layer

24, 25, 26, 27 conductive layer

3, 5, 30, 50 hole

4, 6, 400, 410 contact pin

41a to 411, 61a to 61 1 signal pin

42a, 42b, 62a, 62b power supply pin

43a, 43b, 63a, 63b ground pin

7 connection member

71 la to 7111, 741a to 741f, 751a to 751 f conductive path 71 to 78 conductive layer

8 guide body

Claims

What is claimed is:

1. A contact pin holder comprising:

a substrate having a plurality of first holes formed on a first surface of the substrate and a plurality of second holes formed on a second surface of the substrate;

a plurality of first contact pins, each of the first contact pins inserted in anyone of the first holes;

a plurality of second contact pins, each of the second contact pins inserted in anyone of the second holes; and

a connection member disposed in the substrate and electrically connecting at least one of the first contact pins to at least one of the second contact pins, and having an impedance matching the impedances of two electrically connected contact pins.

2. The contact pin holder according to claim 1, wherein

the plurality of the first contact pins comprise a first signal pin arranged to be electrically connected to a signal terminal of an electronic device and a ground pin arranged to be electrically connected to a ground terminal of the electronic device;

the plurality of the second contact pins comprise a second signal pin arranged to be electrically connected to a signal terminal of a circuit for operating the electronic device; and the connection member comprises

a conductive path formed in the substrate and electrically connecting the first signal pin to the second signal pin; and

two conductive layers electrically connected to the ground pin and disposed in the substrate so that the conductive path is disposed between the two conductive layers.

3. The contact pin holder according to claim 2, wherein

the conductive path and the two conductive layers make up a strip line.

4. The contact pin holder according to claim 1, wherein

a conductive path formed in the substrate and electrically connecting the first signal pin to the second signal pin and

a conductive layer electrically connected to the ground pin and disposed near the conductive path.

5. The contact pin holder according to claim 4, wherein

the conductive path and the conductive layer make up a micro strip line.

6. The contact pin holder according to anyone of claims 2 to 5, wherein the first signal pin is disposed such that one end of the first signal pin is electrically contacted to the

conductive path.

7. The contact pin holder according to anyone of claims 2 to 6, wherein

the plurality of the first contact pins further comprise a third signal pin arranged to be electrically connected to another signal terminal of the electronic device;

the plurality of the second contact pins further comprise a fourth signal pin arranged to be electrically connected to another signal terminal of the circuit; and

the connection member further comprises a second conductive path electrically connecting the third signal pin to the fourth signal pin;

wherein the length of the conductive path is equal to the length of the second conductive path.

8. The contact pin holder according to anyone of claims 2 to 7, wherein

the first pin comprising:

a hollow shell having a conductivity;

an elastic member comprised of a coil spring, provided with an upper part wound in a coil shape and having elasticity along a longitudinal direction of the hollow shell and a lower part wound in a coil shape more densely than the upper part and able to form a conductive path substantially parallel to an extension direction of the hollow shell, and inserted into the hollow shell, and

a plunger having conductivity inserted into the hollow shell and biased from the elastic member toward a top end of the hollow shell facing to the electronic device, wherein the hollow shell is configured to electrically connect near a part of the elastic member where the upper part of the elastic member and the plunger contact each other, to the lower part of the elastic member when the elastic member is compressed so that the electronic device is electrically connected to the first signal pin.

9. The contact pin holder according to anyone of claims 2 to 8, wherein

the second pin comprising:

a hollow shell having a conductivity;

a plunger having conductivity inserted into the hollow shell and biased from the elastic member toward a top end of the hollow shell facing to a top surface of a hole among the plurality of the second holes which the second pin is inserted into,

wherein the hollow shell is configured to electrically connect near a part of the elastic member where the upper part of the elastic member and the plunger contact each other, to the lower part of the elastic member when the elastic member is compressed so that the circuit is electrically connected to the second signal pin.

10. The contact pin holder according to anyone of claims 2 to 9, wherein

the plurality of the first contact pins further comprise a power supply pin arranged to be electrically connected to a power supply terminal of the electronic device; and

the substrate comprises

a base material;

a first conductive layer disposed on the base material being electrically connected to the ground pin;

a dielectric layer disposed on the first conductive layer; and

a second conductive layer disposed on the dielectric layer and being disposed nearer than the dielectric layer to the surface of the substrate and being electrically connected to the power supply pin.

11. The contact pin holder according to claim 10, wherein

a permittivity of the dielectric layer is higher than a permittivity of the base material.

12. The contact pin holder according to anyone of claims 1 to 11, further comprising

a conductor disposed on an interior surface of the plurality of first and second holes of the substrate, the conductor electrically connected to the connection member; wherein

each contact pin of the plurality of first contact pins and the plurality of second contact pins is press fit into a corresponding hole among the plurality of first and second holes and electrically connected to the conductor.

13. The contact pin holder according to anyone of claims 2 to 12, further comprising

a conductive material disposed on an interior surface of the first hole which the first signal pin is inserted into, the conductive material being electrically connected to the ground pin; wherein

the first signal pin is insulated from the conductive material, and the first signal pin and the conductive material define a coaxial transmission line having a predetermined characteristic impedance.

14. The contact pin holder according to anyone of claims 2 to 13, further comprising

a conductive material disposed on an interior surface of the second hole which the second signal pin is inserted into, the conductive material being electrically connected to the ground pin; wherein

the second signal pin is insulated from the conductive material, and the second signal pin and the conductive material define a coaxial transmission line having a predetermined characteristic impedance.

15. The contact pin holder according to anyone of claims 1 to 14, wherein

the connection member connects each of the first contact pins to any of the second contact pins such that the arrangement of the first contact pins differs from the arrangement of the second contact pins which are connected to the first contact pins.