WO2011157171A3 - Insulating ring for packaging, insulating ring assembly, and package - Google Patents

Insulating ring for packaging, insulating ring assembly, and package Download PDF

Info

Publication number
WO2011157171A3
WO2011157171A3 PCT/CN2011/075288 CN2011075288W WO2011157171A3 WO 2011157171 A3 WO2011157171 A3 WO 2011157171A3 CN 2011075288 W CN2011075288 W CN 2011075288W WO 2011157171 A3 WO2011157171 A3 WO 2011157171A3
Authority
WO
WIPO (PCT)
Prior art keywords
insulating ring
top surface
package
packaging
sidewall
Prior art date
Application number
PCT/CN2011/075288
Other languages
French (fr)
Chinese (zh)
Other versions
WO2011157171A2 (en
Inventor
蔚翔
谢伦琛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP11795137A priority Critical patent/EP2571047A2/en
Priority to PCT/CN2011/075288 priority patent/WO2011157171A2/en
Priority to CN2011800008099A priority patent/CN102217059A/en
Publication of WO2011157171A2 publication Critical patent/WO2011157171A2/en
Publication of WO2011157171A3 publication Critical patent/WO2011157171A3/en
Priority to US13/721,439 priority patent/US20130107469A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00Insulators or insulating bodies characterised by their form
    • H01B17/20Pin insulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/061Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322Composite web or sheet

Abstract

An insulating ring for packaging, insulating ring assembly and package are provided in the embodiments of the present invention. The through hole of the insulating ring passes through the top surface and the bottom surface of the insulating ring, wherein the through hole is used for accommodating chips; The outer wall of the insulating ring has an outwardly extending protrusion, and the sidewall of the protrusion which faces to the top surface is lower than the top surface; The lead is disposed on the sidewall, and the adhesive material layer and the surface metallization layer of the lead are lower than the top surface. Therefore, the silver ions of the adhesive material can not pass round the outer wall and the top surface over the sidewall and can not enter into the package, which ensuring the reliability of the power amplifier(PA) device.
PCT/CN2011/075288 2011-06-03 2011-06-03 Insulating ring for packaging, insulating ring assembly and package WO2011157171A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11795137A EP2571047A2 (en) 2011-06-03 2011-06-03 Insulating ring for packaging, insulating ring assembly and package
PCT/CN2011/075288 WO2011157171A2 (en) 2011-06-03 2011-06-03 Insulating ring for packaging, insulating ring assembly and package
CN2011800008099A CN102217059A (en) 2011-06-03 2011-06-03 Insulating ring, insulating assembly and package for packaging
US13/721,439 US20130107469A1 (en) 2011-06-03 2012-12-20 Insulating Ring for Packaging, Insulating Ring Assembly and Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/075288 WO2011157171A2 (en) 2011-06-03 2011-06-03 Insulating ring for packaging, insulating ring assembly and package

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/721,439 Continuation US20130107469A1 (en) 2011-06-03 2012-12-20 Insulating Ring for Packaging, Insulating Ring Assembly and Package

Publications (2)

Publication Number Publication Date
WO2011157171A2 WO2011157171A2 (en) 2011-12-22
WO2011157171A3 true WO2011157171A3 (en) 2012-05-03

Family

ID=44746736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/075288 WO2011157171A2 (en) 2011-06-03 2011-06-03 Insulating ring for packaging, insulating ring assembly and package

Country Status (4)

Country Link
US (1) US20130107469A1 (en)
EP (1) EP2571047A2 (en)
CN (1) CN102217059A (en)
WO (1) WO2011157171A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109901350A (en) * 2017-12-08 2019-06-18 深圳光峰科技股份有限公司 Laser aid and projection device
CN109037161A (en) * 2018-06-15 2018-12-18 华为技术有限公司 A kind of flange and semiconductor power device
EP3879566A4 (en) * 2018-11-26 2021-12-01 Huawei Technologies Co., Ltd. Packaging structure and communication device
US11844178B2 (en) 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component
CN114582826A (en) * 2020-11-30 2022-06-03 上海华为技术有限公司 Packaging structure and packaging method
USD1000958S1 (en) * 2021-10-08 2023-10-10 Oura Health Oy Ring packaging insert
US20230317575A1 (en) * 2022-03-30 2023-10-05 Analog Devices, Inc. Electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204560A (en) * 1986-03-04 1987-09-09 Kyocera Corp Electronic part with lead
US5309014A (en) * 1992-04-02 1994-05-03 Motorola Inc. Transistor package
JPH09283651A (en) * 1996-04-12 1997-10-31 Kyocera Corp Electronic component with lead
US6072238A (en) * 1999-04-07 2000-06-06 Motorola, Inc. Semiconductor component
US6462413B1 (en) * 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
CN1802740A (en) * 2003-05-21 2006-07-12 基奥塞拉美国股份有限公司 Semiconductor package having filler metal of gold/silver/copper alloy

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0320618A1 (en) * 1987-12-14 1989-06-21 BBC Brown Boveri AG Housing for a GTO power thyristor
US5185653A (en) * 1990-11-08 1993-02-09 National Semiconductor Corporation O-ring package
JP2833266B2 (en) * 1991-06-25 1998-12-09 富士電機株式会社 Power semiconductor device and method of manufacturing the same
JP2792638B2 (en) * 1992-10-06 1998-09-03 京セラ株式会社 Package for storing semiconductor elements
JP4687769B2 (en) * 2008-10-20 2011-05-25 Tdk株式会社 Electronic component unit
CN102024770A (en) * 2009-09-18 2011-04-20 中芯国际集成电路制造(上海)有限公司 Semiconductor chip package structure and package method
CN101777523A (en) * 2010-01-19 2010-07-14 无锡小天鹅陶瓷有限责任公司 Case of extra-high voltage high-power thyristor component
CN201812808U (en) * 2010-10-08 2011-04-27 潮州三环(集团)股份有限公司 Ceramic packaging base with boss

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204560A (en) * 1986-03-04 1987-09-09 Kyocera Corp Electronic part with lead
US5309014A (en) * 1992-04-02 1994-05-03 Motorola Inc. Transistor package
JPH09283651A (en) * 1996-04-12 1997-10-31 Kyocera Corp Electronic component with lead
US6072238A (en) * 1999-04-07 2000-06-06 Motorola, Inc. Semiconductor component
US6462413B1 (en) * 1999-07-22 2002-10-08 Polese Company, Inc. LDMOS transistor heatsink package assembly and manufacturing method
CN1802740A (en) * 2003-05-21 2006-07-12 基奥塞拉美国股份有限公司 Semiconductor package having filler metal of gold/silver/copper alloy

Also Published As

Publication number Publication date
US20130107469A1 (en) 2013-05-02
CN102217059A (en) 2011-10-12
EP2571047A2 (en) 2013-03-20
WO2011157171A2 (en) 2011-12-22

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