WO2011157171A3 - Insulating ring for packaging, insulating ring assembly, and package - Google Patents
Insulating ring for packaging, insulating ring assembly, and package Download PDFInfo
- Publication number
- WO2011157171A3 WO2011157171A3 PCT/CN2011/075288 CN2011075288W WO2011157171A3 WO 2011157171 A3 WO2011157171 A3 WO 2011157171A3 CN 2011075288 W CN2011075288 W CN 2011075288W WO 2011157171 A3 WO2011157171 A3 WO 2011157171A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulating ring
- top surface
- package
- packaging
- sidewall
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/20—Pin insulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Abstract
An insulating ring for packaging, insulating ring assembly and package are provided in the embodiments of the present invention. The through hole of the insulating ring passes through the top surface and the bottom surface of the insulating ring, wherein the through hole is used for accommodating chips; The outer wall of the insulating ring has an outwardly extending protrusion, and the sidewall of the protrusion which faces to the top surface is lower than the top surface; The lead is disposed on the sidewall, and the adhesive material layer and the surface metallization layer of the lead are lower than the top surface. Therefore, the silver ions of the adhesive material can not pass round the outer wall and the top surface over the sidewall and can not enter into the package, which ensuring the reliability of the power amplifier(PA) device.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11795137A EP2571047A2 (en) | 2011-06-03 | 2011-06-03 | Insulating ring for packaging, insulating ring assembly and package |
PCT/CN2011/075288 WO2011157171A2 (en) | 2011-06-03 | 2011-06-03 | Insulating ring for packaging, insulating ring assembly and package |
CN2011800008099A CN102217059A (en) | 2011-06-03 | 2011-06-03 | Insulating ring, insulating assembly and package for packaging |
US13/721,439 US20130107469A1 (en) | 2011-06-03 | 2012-12-20 | Insulating Ring for Packaging, Insulating Ring Assembly and Package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/075288 WO2011157171A2 (en) | 2011-06-03 | 2011-06-03 | Insulating ring for packaging, insulating ring assembly and package |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/721,439 Continuation US20130107469A1 (en) | 2011-06-03 | 2012-12-20 | Insulating Ring for Packaging, Insulating Ring Assembly and Package |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011157171A2 WO2011157171A2 (en) | 2011-12-22 |
WO2011157171A3 true WO2011157171A3 (en) | 2012-05-03 |
Family
ID=44746736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2011/075288 WO2011157171A2 (en) | 2011-06-03 | 2011-06-03 | Insulating ring for packaging, insulating ring assembly and package |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130107469A1 (en) |
EP (1) | EP2571047A2 (en) |
CN (1) | CN102217059A (en) |
WO (1) | WO2011157171A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109901350A (en) * | 2017-12-08 | 2019-06-18 | 深圳光峰科技股份有限公司 | Laser aid and projection device |
CN109037161A (en) * | 2018-06-15 | 2018-12-18 | 华为技术有限公司 | A kind of flange and semiconductor power device |
EP3879566A4 (en) * | 2018-11-26 | 2021-12-01 | Huawei Technologies Co., Ltd. | Packaging structure and communication device |
US11844178B2 (en) | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
CN114582826A (en) * | 2020-11-30 | 2022-06-03 | 上海华为技术有限公司 | Packaging structure and packaging method |
USD1000958S1 (en) * | 2021-10-08 | 2023-10-10 | Oura Health Oy | Ring packaging insert |
US20230317575A1 (en) * | 2022-03-30 | 2023-10-05 | Analog Devices, Inc. | Electronic device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62204560A (en) * | 1986-03-04 | 1987-09-09 | Kyocera Corp | Electronic part with lead |
US5309014A (en) * | 1992-04-02 | 1994-05-03 | Motorola Inc. | Transistor package |
JPH09283651A (en) * | 1996-04-12 | 1997-10-31 | Kyocera Corp | Electronic component with lead |
US6072238A (en) * | 1999-04-07 | 2000-06-06 | Motorola, Inc. | Semiconductor component |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
CN1802740A (en) * | 2003-05-21 | 2006-07-12 | 基奥塞拉美国股份有限公司 | Semiconductor package having filler metal of gold/silver/copper alloy |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0320618A1 (en) * | 1987-12-14 | 1989-06-21 | BBC Brown Boveri AG | Housing for a GTO power thyristor |
US5185653A (en) * | 1990-11-08 | 1993-02-09 | National Semiconductor Corporation | O-ring package |
JP2833266B2 (en) * | 1991-06-25 | 1998-12-09 | 富士電機株式会社 | Power semiconductor device and method of manufacturing the same |
JP2792638B2 (en) * | 1992-10-06 | 1998-09-03 | 京セラ株式会社 | Package for storing semiconductor elements |
JP4687769B2 (en) * | 2008-10-20 | 2011-05-25 | Tdk株式会社 | Electronic component unit |
CN102024770A (en) * | 2009-09-18 | 2011-04-20 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor chip package structure and package method |
CN101777523A (en) * | 2010-01-19 | 2010-07-14 | 无锡小天鹅陶瓷有限责任公司 | Case of extra-high voltage high-power thyristor component |
CN201812808U (en) * | 2010-10-08 | 2011-04-27 | 潮州三环(集团)股份有限公司 | Ceramic packaging base with boss |
-
2011
- 2011-06-03 WO PCT/CN2011/075288 patent/WO2011157171A2/en active Application Filing
- 2011-06-03 EP EP11795137A patent/EP2571047A2/en not_active Withdrawn
- 2011-06-03 CN CN2011800008099A patent/CN102217059A/en active Pending
-
2012
- 2012-12-20 US US13/721,439 patent/US20130107469A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62204560A (en) * | 1986-03-04 | 1987-09-09 | Kyocera Corp | Electronic part with lead |
US5309014A (en) * | 1992-04-02 | 1994-05-03 | Motorola Inc. | Transistor package |
JPH09283651A (en) * | 1996-04-12 | 1997-10-31 | Kyocera Corp | Electronic component with lead |
US6072238A (en) * | 1999-04-07 | 2000-06-06 | Motorola, Inc. | Semiconductor component |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
CN1802740A (en) * | 2003-05-21 | 2006-07-12 | 基奥塞拉美国股份有限公司 | Semiconductor package having filler metal of gold/silver/copper alloy |
Also Published As
Publication number | Publication date |
---|---|
US20130107469A1 (en) | 2013-05-02 |
CN102217059A (en) | 2011-10-12 |
EP2571047A2 (en) | 2013-03-20 |
WO2011157171A2 (en) | 2011-12-22 |
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