WO2011159536A3 - A splicing technique for fixed abrasives used in chemical mechanical planarization - Google Patents

A splicing technique for fixed abrasives used in chemical mechanical planarization Download PDF

Info

Publication number
WO2011159536A3
WO2011159536A3 PCT/US2011/039618 US2011039618W WO2011159536A3 WO 2011159536 A3 WO2011159536 A3 WO 2011159536A3 US 2011039618 W US2011039618 W US 2011039618W WO 2011159536 A3 WO2011159536 A3 WO 2011159536A3
Authority
WO
WIPO (PCT)
Prior art keywords
edge
chemical mechanical
mechanical planarization
abrasives used
fixed abrasives
Prior art date
Application number
PCT/US2011/039618
Other languages
French (fr)
Other versions
WO2011159536A2 (en
Inventor
John J. Gagliardi
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Priority to CN201180029876.3A priority Critical patent/CN102939644B/en
Priority to SG2012089686A priority patent/SG186203A1/en
Priority to JP2013515384A priority patent/JP2013533125A/en
Priority to KR1020137000932A priority patent/KR20130079480A/en
Publication of WO2011159536A2 publication Critical patent/WO2011159536A2/en
Publication of WO2011159536A3 publication Critical patent/WO2011159536A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Abstract

An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.
PCT/US2011/039618 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization WO2011159536A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201180029876.3A CN102939644B (en) 2010-06-15 2011-06-08 For the joining technique of concretion abrasive used in chemical-mechanical planarization
SG2012089686A SG186203A1 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization
JP2013515384A JP2013533125A (en) 2010-06-15 2011-06-08 Bonding technique for fixed abrasives used for chemical mechanical planarization
KR1020137000932A KR20130079480A (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
US12/815,764 2010-06-15

Publications (2)

Publication Number Publication Date
WO2011159536A2 WO2011159536A2 (en) 2011-12-22
WO2011159536A3 true WO2011159536A3 (en) 2012-04-05

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Country Status (7)

Country Link
US (1) US8360823B2 (en)
JP (1) JP2013533125A (en)
KR (1) KR20130079480A (en)
CN (1) CN102939644B (en)
SG (1) SG186203A1 (en)
TW (1) TWI535526B (en)
WO (1) WO2011159536A2 (en)

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TWI613285B (en) 2010-09-03 2018-02-01 聖高拜磨料有限公司 Bonded abrasive article and method of forming
US9266219B2 (en) 2012-12-31 2016-02-23 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
WO2014106156A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (en) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 Fixed abrasive and grinding technique for sapphire
WO2019224040A1 (en) * 2018-05-22 2019-11-28 Asml Holding N.V. Apparatus for and method of in situ clamp surface roughening
CN113165141A (en) * 2018-11-29 2021-07-23 株式会社大辉 Polishing pad and method for manufacturing the same
JP2023504283A (en) * 2020-01-06 2023-02-02 サンーゴバン アブレイシブズ，インコーポレイティド Abrasive article and method of use thereof

Citations (4)

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US20040137831A1 (en) * 2003-01-10 2004-07-15 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
US20060003675A1 (en) * 1999-06-24 2006-01-05 Micron Technology, Inc. Fixed-abrasive chemical-mechanical planarization of titanium nitride
US20070026770A1 (en) * 2005-07-28 2007-02-01 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same

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US20060003675A1 (en) * 1999-06-24 2006-01-05 Micron Technology, Inc. Fixed-abrasive chemical-mechanical planarization of titanium nitride
US20040137831A1 (en) * 2003-01-10 2004-07-15 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
US20070026770A1 (en) * 2005-07-28 2007-02-01 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same

Also Published As

Publication number Publication date
SG186203A1 (en) 2013-01-30
US8360823B2 (en) 2013-01-29
US20110306276A1 (en) 2011-12-15
CN102939644B (en) 2015-12-16
KR20130079480A (en) 2013-07-10
TW201208810A (en) 2012-03-01
JP2013533125A (en) 2013-08-22
CN102939644A (en) 2013-02-20
WO2011159536A2 (en) 2011-12-22
TWI535526B (en) 2016-06-01

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