WO2012000114A8 - Electronic devices with yielding substrates - Google Patents

Electronic devices with yielding substrates Download PDF

Info

Publication number
WO2012000114A8
WO2012000114A8 PCT/CA2011/050399 CA2011050399W WO2012000114A8 WO 2012000114 A8 WO2012000114 A8 WO 2012000114A8 CA 2011050399 W CA2011050399 W CA 2011050399W WO 2012000114 A8 WO2012000114 A8 WO 2012000114A8
Authority
WO
WIPO (PCT)
Prior art keywords
electronic devices
semiconductor die
yielding substrates
yielding
substrates
Prior art date
Application number
PCT/CA2011/050399
Other languages
French (fr)
Other versions
WO2012000114A1 (en
Inventor
Michael Tischler
Philippe Schick
Ian Ashdown
Calvin Wade Sheen
Paul Jungwirth
Original Assignee
Cooledge Lighting Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooledge Lighting Inc. filed Critical Cooledge Lighting Inc.
Priority to KR1020137002293A priority Critical patent/KR101372084B1/en
Priority to EP11800038.9A priority patent/EP2589082B1/en
Priority to CN201180032811.4A priority patent/CN102959708B/en
Priority to JP2013516931A priority patent/JP5512888B2/en
Publication of WO2012000114A1 publication Critical patent/WO2012000114A1/en
Publication of WO2012000114A8 publication Critical patent/WO2012000114A8/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/275Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/278Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/65Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66Details of globes or covers forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02Combinations of only two kinds of elements
    • F21V13/08Combinations of only two kinds of elements the elements being filters or photoluminescent elements and reflectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12Combinations of only three kinds of elements
    • F21V13/14Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/10Refractors for light sources comprising photoluminescent material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/22Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F21V7/30Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985Flexible insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387Flexible insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0445PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H01L31/0468PV modules composed of a plurality of thin film solar cells deposited on the same substrate comprising specific means for obtaining partial light transmission through the module, e.g. partially transparent thin film solar modules for windows
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/002Devices characterised by their operation having heterojunctions or graded gap
    • H01L33/0025Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00Structural details of PV modules other than those related to light conversion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • H05B45/12Controlling the intensity of the light using optical feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • H05B45/22Controlling the colour of the light using optical feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/105Controlling the light source in response to determined parameters
    • H05B47/11Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/105Controlling the light source in response to determined parameters
    • H05B47/115Controlling the light source in response to determined parameters by determining the presence or movement of objects or living beings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061Disposition
    • H01L2224/06102Disposition the bonding areas being at different heights
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/29198Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199Material of the matrix
    • H01L2224/2929Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83862Heat curing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047Details of electrical connections between containers
    • H01L2225/107Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0102Calcium [Ca]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01024Chromium [Cr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0103Zinc [Zn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01049Indium [In]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01063Europium [Eu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01073Tantalum [Ta]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10321Aluminium antimonide [AlSb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10322Aluminium arsenide [AlAs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10323Aluminium nitride [AlN]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10324Aluminium phosphide [AlP]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10328Gallium antimonide [GaSb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10329Gallium arsenide [GaAs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/1033Gallium nitride [GaN]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10331Gallium phosphide [GaP]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10332Indium antimonide [InSb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10333Indium arsenide [InAs]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10334Indium nitride [InN]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/1026Compound semiconductors
    • H01L2924/1032III-V
    • H01L2924/10335Indium phosphide [InP]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/38Effects and problems related to the device integration
    • H01L2924/381Pitch distance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/28Materials of the light emitting region containing only elements of group II and group VI of the periodic system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40Control techniques providing energy savings, e.g. smart controller or presence detection
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
PCT/CA2011/050399 2010-06-29 2011-06-29 Electronic devices with yielding substrates WO2012000114A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020137002293A KR101372084B1 (en) 2010-06-29 2011-06-29 Electronic devices with yielding substrates
EP11800038.9A EP2589082B1 (en) 2010-06-29 2011-06-29 Electronic devices with yielding substrates
CN201180032811.4A CN102959708B (en) 2010-06-29 2011-06-29 There is the electronic installation of flexible substrate
JP2013516931A JP5512888B2 (en) 2010-06-29 2011-06-29 Electronic device with flexible substrate

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
US35946710P 2010-06-29 2010-06-29
US61/359,467 2010-06-29
US36317910P 2010-07-09 2010-07-09
US61/363,179 2010-07-09
US37670710P 2010-08-25 2010-08-25
US61/376,707 2010-08-25
US39012810P 2010-10-05 2010-10-05
US61/390,128 2010-10-05
US39302710P 2010-10-14 2010-10-14
US61/393,027 2010-10-14
US201161433249P 2011-01-16 2011-01-16
US61/433,249 2011-01-16
US201161445416P 2011-02-22 2011-02-22
US61/445,416 2011-02-22
US201161447680P 2011-02-28 2011-02-28
US61/447,680 2011-02-28

Publications (2)

Publication Number Publication Date
WO2012000114A1 WO2012000114A1 (en) 2012-01-05
WO2012000114A8 true WO2012000114A8 (en) 2012-12-20

Family

ID=45351669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2011/050399 WO2012000114A1 (en) 2010-06-29 2011-06-29 Electronic devices with yielding substrates

Country Status (6)

Country Link
US (9) US8384121B2 (en)
EP (1) EP2589082B1 (en)
JP (2) JP5512888B2 (en)
KR (1) KR101372084B1 (en)
CN (1) CN102959708B (en)
WO (1) WO2012000114A1 (en)

Families Citing this family (134)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US10037947B1 (en) * 2010-06-29 2018-07-31 Cooledge Lighting Inc. Electronic devices with yielding substrates
WO2012000114A1 (en) 2010-06-29 2012-01-05 Cooledge Lightning Inc. Electronic devices with yielding substrates
DE102010026562A1 (en) * 2010-07-08 2012-01-12 Hella Kgaa Hueck & Co. Sensor arrangement for detecting environmental conditions
US9064712B2 (en) 2010-08-12 2015-06-23 Freescale Semiconductor Inc. Monolithic microwave integrated circuit
JP5695881B2 (en) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 Electronic component connection method and connection structure
US9674938B2 (en) 2010-11-03 2017-06-06 3M Innovative Properties Company Flexible LED device for thermal management
KR20130143061A (en) 2010-11-03 2013-12-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Flexible led device with wire bond free die
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
US9716061B2 (en) * 2011-02-18 2017-07-25 3M Innovative Properties Company Flexible light emitting semiconductor device
US8641525B2 (en) 2011-06-17 2014-02-04 Ironburg Inventions Ltd. Controller for video game console
WO2013025402A2 (en) 2011-08-17 2013-02-21 3M Innovative Properties Company Two part flexible light emitting semiconductor device
US8759153B2 (en) 2011-09-06 2014-06-24 Infineon Technologies Ag Method for making a sensor device using a graphene layer
WO2013036561A2 (en) * 2011-09-07 2013-03-14 Cooledge Lighting, Inc. Broad-area lighting systems
US20120175667A1 (en) 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
US8952529B2 (en) * 2011-11-22 2015-02-10 Stats Chippac, Ltd. Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids
JP5806608B2 (en) * 2011-12-12 2015-11-10 株式会社東芝 Semiconductor light emitting device
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
WO2013112435A1 (en) 2012-01-24 2013-08-01 Cooledge Lighting Inc. Light - emitting devices having discrete phosphor chips and fabrication methods
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
JP5985322B2 (en) * 2012-03-23 2016-09-06 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
TW201340422A (en) * 2012-03-30 2013-10-01 Hon Hai Prec Ind Co Ltd Method for soldering light emitting diode
FR2989825B1 (en) * 2012-04-18 2014-06-06 Centre Nat Rech Scient ELECTRICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
DE102012207061A1 (en) * 2012-04-27 2013-10-31 Siemens Aktiengesellschaft Electronic circuit arrangement for use in e.g. lamp module, of motor car, has electrically interconnected component coupled to contact element on carrier by connector, where connector and/or contact element is formed from graphene
TWI508334B (en) * 2012-05-23 2015-11-11 Delta Electronics Inc Light emitting semiconductor element and mathod of manufacturing the same
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
US8940587B1 (en) * 2012-07-11 2015-01-27 Amkor Technology, Inc. Die seal design and method and apparatus for integrated circuit production
JP5962285B2 (en) * 2012-07-19 2016-08-03 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP2014179569A (en) * 2013-03-15 2014-09-25 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing the same
JP6089507B2 (en) * 2012-08-31 2017-03-08 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
US9337405B2 (en) * 2012-08-31 2016-05-10 Nichia Corporation Light emitting device and method for manufacturing the same
KR101401242B1 (en) * 2012-09-21 2014-05-29 서울대학교산학협력단 Forming Method of Flexible Conduction Trace, Flexible Conduction Trace and Flexible Electronic Device Using Thereof
CN103000779B (en) * 2012-09-24 2015-01-07 安徽三安光电有限公司 Vertical light emitting diode with current blocking function and method for manufacturing vertical light emitting diode
US9299687B2 (en) * 2012-10-05 2016-03-29 Bridgelux, Inc. Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
US8907482B2 (en) 2012-11-08 2014-12-09 Honeywell International Inc. Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
CN104798141B (en) * 2012-11-26 2017-09-05 东丽株式会社 Scintillator panel and preparation method thereof
US9217838B2 (en) * 2012-12-11 2015-12-22 Finisar Corporation Heat sink retention in an optical component
JP6197294B2 (en) * 2013-01-16 2017-09-20 富士電機株式会社 Semiconductor element
TWI483434B (en) * 2013-02-18 2015-05-01 Lextar Electronics Corp Led sub-mount and method for manufacturing light-emitting device using the sub-mount
US20150021632A1 (en) * 2013-03-14 2015-01-22 Heilux, Llc Led with multiple bonding methods on flexible transparent substrate
US8928014B2 (en) * 2013-03-15 2015-01-06 Cooledge Lighting Inc. Stress relief for array-based electronic devices
US9105829B2 (en) 2013-03-15 2015-08-11 Cooledge Lighting Inc. Thermal management in electronic devices with yielding substrates
US20140264423A1 (en) * 2013-03-15 2014-09-18 Grote Industries, Llc Flexible lighting device including a protective conformal coating
US9952372B2 (en) * 2013-03-15 2018-04-24 Cree, Inc. Luminaire utilizing waveguide
WO2014185693A1 (en) * 2013-05-13 2014-11-20 서울반도체 주식회사 Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same
EP3000138B8 (en) * 2013-05-20 2018-08-22 Lumileds Holding B.V. Chip scale light emitting device package with dome
TW201445082A (en) * 2013-05-29 2014-12-01 Genesis Photonics Inc Light emitting device
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
DE102013211640A1 (en) * 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Optoelectronic arrangement
US9214614B2 (en) * 2013-07-23 2015-12-15 Grote Industries, Llc Flexible lighting device having unobtrusive conductive layers
US9299899B2 (en) * 2013-07-23 2016-03-29 Grote Industries, Llc Flexible lighting device having unobtrusive conductive layers
US9719636B2 (en) * 2013-08-07 2017-08-01 Florida Intellectual Properties Llc LED lighting device
KR101919163B1 (en) * 2013-08-30 2018-11-15 동우 화인켐 주식회사 Optical Film
DE102013110114A1 (en) * 2013-09-13 2015-04-02 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
KR101611660B1 (en) 2013-09-30 2016-04-11 주식회사 엘지화학 Laminate structure for manufacturing substrate and device comprising substrate manufactured by using same
KR101476687B1 (en) * 2013-10-24 2014-12-26 엘지전자 주식회사 Display device using semiconductor light emitting device
EP3066896A1 (en) 2013-11-05 2016-09-14 Philips Lighting Holding B.V. Assembly and method of manufacturing an assembly
WO2015083366A1 (en) 2013-12-02 2015-06-11 東芝ホクト電子株式会社 Light-emission unit, light-emission device, and light-emission-unit production method
EP3079177B1 (en) * 2013-12-02 2020-03-25 Toshiba Hokuto Electronics Corporation Light-emission device, and production method therefor
JP6312412B2 (en) * 2013-12-04 2018-04-18 シャープ株式会社 Nitride semiconductor light emitting device
US9651740B2 (en) * 2014-01-09 2017-05-16 Cree, Inc. Extraction film for optical waveguide and method of producing same
JP6265055B2 (en) 2014-01-14 2018-01-24 ソニー株式会社 LIGHT EMITTING DEVICE, DISPLAY DEVICE, AND LIGHTING DEVICE
WO2015119858A1 (en) 2014-02-05 2015-08-13 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
EP3143323B1 (en) 2014-04-29 2019-10-09 Cooledge Lighting, Inc. Modular led lighting systems
US9287467B2 (en) * 2014-05-08 2016-03-15 Osram Sylvania Inc. Techniques for adhering surface mount devices to a flexible substrate
JP6464877B2 (en) * 2014-05-21 2019-02-06 日亜化学工業株式会社 Method for manufacturing light emitting device
KR102199991B1 (en) 2014-05-28 2021-01-11 엘지이노텍 주식회사 Light emitting device and light unit having the same
US9520537B2 (en) * 2014-06-18 2016-12-13 X-Celeprint Limited Micro assembled LED displays and lighting elements
JP2016009690A (en) * 2014-06-20 2016-01-18 大日本印刷株式会社 Mounting substrate and method for manufacturing mounting substrate
JP2016009689A (en) * 2014-06-20 2016-01-18 大日本印刷株式会社 Method for manufacturing mounting substrate and mounting substrate
US20160025311A1 (en) * 2014-07-28 2016-01-28 Michael A. Tischler Led lighting system incorporating folded light sheets
KR101629268B1 (en) * 2014-10-29 2016-06-10 엘지전자 주식회사 Display device using semiconductor light emitting device and method of fabricating the same
JP6518936B2 (en) * 2014-11-14 2019-05-29 パナソニックIpマネジメント株式会社 Component mounting device
GB201420452D0 (en) 2014-11-18 2014-12-31 Mled Ltd Integrated colour led micro-display
WO2016085182A1 (en) * 2014-11-27 2016-06-02 Samsung Electronics Co., Ltd. Flexible display device
KR102088674B1 (en) * 2014-11-27 2020-03-13 삼성전자주식회사 flexible display device
EP3032105B1 (en) 2014-12-12 2021-05-19 Pierburg Pump Technology GmbH Mechanical motor vehicle vacuum pump
US9647189B2 (en) * 2015-01-26 2017-05-09 Cooledge Lighting Inc. Methods for adhesive bonding of electronic devices
US9331043B1 (en) 2015-01-30 2016-05-03 Invensas Corporation Localized sealing of interconnect structures in small gaps
CN107208874B (en) * 2015-02-05 2020-02-18 飞利浦灯具控股公司 LED module and sealing method
JP6414485B2 (en) * 2015-02-27 2018-10-31 日亜化学工業株式会社 Light emitting device
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US10206288B2 (en) * 2015-08-13 2019-02-12 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate
CN106469772B (en) * 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 A kind of process of the thermoplastic resin light conversion body fitting encapsulation LED based on rolling-type
DE102015114645B4 (en) 2015-09-02 2023-03-23 Infineon Technologies Ag SMART CARD, DEVICE AND METHOD
US9658489B1 (en) * 2015-12-31 2017-05-23 Nanosys, Inc. Backlight units for display devices
CA2919293A1 (en) * 2016-01-29 2017-07-29 Alain Carel Flexible conductive circuit
US10344954B1 (en) 2016-03-02 2019-07-09 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
US11274823B1 (en) 2016-03-02 2022-03-15 Cooledge Lighting, Inc. Lighting systems incorporating connections for signal and power transmission
US10746358B1 (en) 2016-03-02 2020-08-18 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
US10132476B2 (en) * 2016-03-08 2018-11-20 Lilibrand Llc Lighting system with lens assembly
US10193031B2 (en) * 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
JP6914246B2 (en) 2016-03-24 2021-08-04 ソニーグループ株式会社 Light emitting device, display device and lighting device
KR102483956B1 (en) * 2016-03-31 2023-01-03 삼성디스플레이 주식회사 Display device
US10883045B2 (en) * 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
CA2976195C (en) * 2016-08-11 2021-04-13 Abl Ip Holding Llc Luminaires with transition zones for glare control
KR102405120B1 (en) * 2016-09-29 2022-06-08 삼성디스플레이 주식회사 Display apparatus and method for manufacturing the same
CH712996A1 (en) * 2016-09-30 2018-04-13 Hoffmann Neopac Ag Tube and tube body with an electronic device.
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
CN108076584B (en) * 2016-11-15 2020-04-14 鹏鼎控股(深圳)股份有限公司 Flexible circuit board, circuit board element and manufacturing method of flexible circuit board
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
KR102555383B1 (en) * 2016-12-07 2023-07-12 엘지디스플레이 주식회사 Lighting apparatus using organic light emitting diode and method of fabricating the same
JP7224285B2 (en) * 2016-12-09 2023-02-17 ルミレッズ ホールディング ベーフェー Method for manufacturing LED carrier assembly
EP3561870A4 (en) 2016-12-23 2020-11-25 Lumens Co., Ltd. Micro led module and manufacturing method therefor
JP7108171B2 (en) * 2016-12-27 2022-07-28 日亜化学工業株式会社 light emitting device
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
TWI664683B (en) * 2017-03-16 2019-07-01 佳邦科技股份有限公司 Method of manufacturing semiconductor package
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
KR101959057B1 (en) * 2017-07-21 2019-03-18 한국광기술원 Transfering method and apparatus of micro LED chip
KR102473378B1 (en) * 2017-08-31 2022-12-01 엘지디스플레이 주식회사 Organic light emitting display device
KR102377175B1 (en) * 2017-09-28 2022-03-21 엘지디스플레이 주식회사 Backlight unit and liquid crystal display device including the same
US10020212B1 (en) * 2017-10-09 2018-07-10 Oculus Vr, Llc Micro-LED pick and place using metallic gallium
DE102018126783A1 (en) * 2017-10-26 2019-05-02 Epistar Corporation Light-emitting device
CN109755266B (en) * 2017-11-02 2021-01-12 錼创显示科技股份有限公司 Micro light-emitting diode display panel
JP7020109B2 (en) * 2017-12-25 2022-02-16 東芝ライテック株式会社 Luminescent device
CN110056786A (en) * 2018-01-18 2019-07-26 展晶科技(深圳)有限公司 Bendable ultra-thin light-emitting body structure and preparation method thereof
US10692996B1 (en) 2018-02-05 2020-06-23 United States Of America As Represented By The Secretary Of The Air Force Systems, methods and apparatus for radio frequency devices
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
JP7311255B2 (en) * 2018-09-25 2023-07-19 不二サッシ株式会社 Lighting device with LED module unit
US11314012B2 (en) 2018-09-28 2022-04-26 Lumileds Llc Rayleigh spacing limited and low z-height LED arrays
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN209327741U (en) * 2018-10-26 2019-08-30 苹果公司 Electronic equipment
TWI683175B (en) * 2018-10-29 2020-01-21 志聖工業股份有限公司 Detecting method of circuit board
CN111477732B (en) * 2019-01-24 2021-10-08 隆达电子股份有限公司 Light emitting device
US11101417B2 (en) * 2019-08-06 2021-08-24 X Display Company Technology Limited Structures and methods for electrically connecting printed components
US11499707B2 (en) * 2020-04-13 2022-11-15 Calyxpure, Inc. Light fixture having a fan and ultraviolet sterilization functionality
CN114068503A (en) * 2020-08-10 2022-02-18 深超光电(深圳)有限公司 Miniature LED display panel and preparation method thereof
CN112241088B (en) * 2020-10-15 2021-09-03 Tcl华星光电技术有限公司 Miniature light-emitting diode lamp panel, backlight module and preparation method thereof
CN114859596A (en) 2021-02-03 2022-08-05 群创光电股份有限公司 Display device
KR20240029101A (en) * 2021-07-21 2024-03-05 루미레즈 엘엘씨 Later configurable LED modules and vehicle headlights
US11460185B1 (en) * 2022-03-25 2022-10-04 Tactotek Oy Integrated multilayer structure containing optically functional module and related method of manufacture

Family Cites Families (207)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1011498A (en) 1910-11-01 1911-12-12 Arthem I Saphiloff Skin-cleanser.
US1000214A (en) 1911-05-26 1911-08-08 H K Mulford Company Process of preparing extractive compounds of the suprarenal gland.
US1016368A (en) 1911-08-17 1912-02-06 Eugene Schneider Percussion-fuse for explosive projectiles.
US1909480A (en) 1931-06-18 1933-05-16 Everlasting Valve Co Method of producing wear rings
JPS558061A (en) 1978-07-03 1980-01-21 Seiko Epson Corp Semiconductor integrated circuit
US4675575A (en) 1984-07-13 1987-06-23 E & G Enterprises Light-emitting diode assemblies and systems therefore
EP0265077A3 (en) * 1986-09-25 1989-03-08 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
US4851862A (en) 1988-08-05 1989-07-25 Eastman Kodak Company Led array printhead with tab bonded wiring
US5081520A (en) 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
EP0641019A3 (en) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc A flexible printed polymer lead-frame.
US5820716A (en) 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
JPH09148374A (en) * 1995-11-24 1997-06-06 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPH1084014A (en) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd Manufacture of semiconductor device
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP3284262B2 (en) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 Liquid crystal display device and electronic device using the same
EP0993039B1 (en) 1997-06-26 2006-08-30 Hitachi Chemical Company, Ltd. Substrate for mounting semiconductor chips
JPH1154658A (en) 1997-07-30 1999-02-26 Hitachi Ltd Semiconductor device, manufacture thereof and frame structure
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
US6326696B1 (en) 1998-02-04 2001-12-04 International Business Machines Corporation Electronic package with interconnected chips
JPH11251645A (en) * 1998-02-27 1999-09-17 Matsushita Electron Corp Semiconductor light emitting device
US6893896B1 (en) 1998-03-27 2005-05-17 The Trustees Of Princeton University Method for making multilayer thin-film electronics
AU4186699A (en) 1998-05-20 1999-12-06 Intermec Ip Corp. Method and apparatus for making electrical traces, circuits and devices
US6965361B1 (en) 1998-06-16 2005-11-15 Agilent Technologies, Inc. Method of manufacture of active matrix addressed polymer LED display
WO2000045431A1 (en) 1999-01-27 2000-08-03 Citizen Watch Co., Ltd. Method of packaging semiconductor device using anisotropic conductive adhesive
JP3509642B2 (en) * 1999-06-24 2004-03-22 松下電器産業株式会社 Semiconductor device mounting method and mounting structure
TW423166B (en) 1999-09-09 2001-02-21 Epistar Corp Photodiode with the emitting surface and ohmic electrode located on different plane and its manufacturing method
AU7617800A (en) 1999-09-27 2001-04-30 Lumileds Lighting U.S., Llc A light emitting diode device that produces white light by performing complete phosphor conversion
US6357889B1 (en) 1999-12-01 2002-03-19 General Electric Company Color tunable light source
US6513949B1 (en) 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
JP3491595B2 (en) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 Anisotropic conductive adhesive film
US6357893B1 (en) 2000-03-15 2002-03-19 Richard S. Belliveau Lighting devices using a plurality of light sources
JP2001298042A (en) * 2000-04-18 2001-10-26 Casio Comput Co Ltd Electrical connection method of electronic component
US6603258B1 (en) 2000-04-24 2003-08-05 Lumileds Lighting, U.S. Llc Light emitting diode device that emits white light
JP4785229B2 (en) 2000-05-09 2011-10-05 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US6621211B1 (en) 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
US6518097B1 (en) 2000-08-29 2003-02-11 Korea Advanced Institute Of Science And Technology Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive
JP3822040B2 (en) 2000-08-31 2006-09-13 株式会社ルネサステクノロジ Electronic device and manufacturing method thereof
US6614103B1 (en) 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US6650044B1 (en) 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
JP3851767B2 (en) * 2000-10-16 2006-11-29 ソニーケミカル&インフォメーションデバイス株式会社 Adhesive film and method for producing adhesive film
US6685852B2 (en) 2001-04-27 2004-02-03 General Electric Company Phosphor blends for generating white light from near-UV/blue light-emitting devices
KR100419611B1 (en) 2001-05-24 2004-02-25 삼성전기주식회사 A Light Emitting Diode, a Lighting Emitting Device Using the Same and a Fabrication Process therefor
US6689999B2 (en) 2001-06-01 2004-02-10 Schott-Fostec, Llc Illumination apparatus utilizing light emitting diodes
US6576488B2 (en) 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6642652B2 (en) 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
US20030019735A1 (en) 2001-07-30 2003-01-30 Howie David Malcolm Bonding electrical components to substrates
JP2005235779A (en) * 2001-08-09 2005-09-02 Matsushita Electric Ind Co Ltd Led lighting fixture and card type led lighting light source
US7153015B2 (en) 2001-12-31 2006-12-26 Innovations In Optics, Inc. Led white light optical system
TW558622B (en) 2002-01-24 2003-10-21 Yuan Lin Lamp on sheet and manufacturing method thereof
EP1490453B1 (en) 2002-03-25 2012-08-15 Philips Intellectual Property & Standards GmbH Tri-color white light led lamp
JP3993475B2 (en) 2002-06-20 2007-10-17 ローム株式会社 LED chip mounting structure and image reading apparatus having the same
US6665170B1 (en) 2002-06-21 2003-12-16 Bryan T. Warner Light emitting diode illumination system
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
AU2003297588A1 (en) 2002-12-02 2004-06-23 3M Innovative Properties Company Illumination system using a plurality of light sources
US6998777B2 (en) 2002-12-24 2006-02-14 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
JP5030360B2 (en) 2002-12-25 2012-09-19 オリンパス株式会社 Method for manufacturing solid-state imaging device
JP4397394B2 (en) 2003-01-24 2010-01-13 ディジタル・オプティクス・インターナショナル・コーポレイション High density lighting system
US6936857B2 (en) 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
EP2596948B1 (en) 2003-03-10 2020-02-26 Toyoda Gosei Co., Ltd. Method of making a semiconductor device
DE10319514A1 (en) 2003-04-30 2004-11-18 Tridonicatco Gmbh & Co. Kg Interface for digital and mains voltage signals
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7633093B2 (en) 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7244326B2 (en) 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
CN100511732C (en) 2003-06-18 2009-07-08 丰田合成株式会社 Light emitting device
JP4687460B2 (en) 2003-07-28 2011-05-25 日亜化学工業株式会社 LIGHT EMITTING DEVICE, LED LIGHTING, LED LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE CONTROL METHOD
JP4083638B2 (en) * 2003-07-30 2008-04-30 東北パイオニア株式会社 Flexible wiring board, semiconductor chip mounting flexible wiring board, display device, semiconductor chip mounting method
CA2536837C (en) 2003-08-27 2016-02-23 Osram Sylvania Inc. Driver circuit for led vehicle lamp
US6942360B2 (en) 2003-10-01 2005-09-13 Enertron, Inc. Methods and apparatus for an LED light engine
EP1523043B1 (en) 2003-10-06 2011-12-28 Semiconductor Energy Laboratory Co., Ltd. Optical sensor and method for manufacturing the same
US20050110161A1 (en) 2003-10-07 2005-05-26 Hiroyuki Naito Method for mounting semiconductor chip and semiconductor chip-mounted board
JP4246134B2 (en) * 2003-10-07 2009-04-02 パナソニック株式会社 Semiconductor element mounting method and semiconductor element mounting substrate
JP4402425B2 (en) * 2003-10-24 2010-01-20 スタンレー電気株式会社 Vehicle headlamp
US7488432B2 (en) 2003-10-28 2009-02-10 Nichia Corporation Fluorescent material and light-emitting device
US20050116235A1 (en) 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7066623B2 (en) 2003-12-19 2006-06-27 Soo Ghee Lee Method and apparatus for producing untainted white light using off-white light emitting diodes
US7303400B2 (en) 2004-01-27 2007-12-04 United Microelectronics Corp. Package of a semiconductor device with a flexible wiring substrate and method for the same
US7128438B2 (en) 2004-02-05 2006-10-31 Agilight, Inc. Light display structures
JP4572312B2 (en) 2004-02-23 2010-11-04 スタンレー電気株式会社 LED and manufacturing method thereof
US20050183884A1 (en) 2004-02-25 2005-08-25 Arima Display Corporation Flexible printed circuit board
TWI257184B (en) * 2004-03-24 2006-06-21 Toshiba Lighting & Technology Lighting apparatus
US7294961B2 (en) 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US7217956B2 (en) 2004-03-29 2007-05-15 Articulated Technologies, Llc. Light active sheet material
US7427782B2 (en) 2004-03-29 2008-09-23 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7052924B2 (en) 2004-03-29 2006-05-30 Articulated Technologies, Llc Light active sheet and methods for making the same
US7259030B2 (en) 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US7997771B2 (en) 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
WO2005120135A1 (en) 2004-06-04 2005-12-15 Philips Intellectual Property & Standards Gmbh Electroluminescent structure and led with an el structure
WO2006015476A1 (en) 2004-08-12 2006-02-16 Tir Systems Ltd. Method and apparatus for scaling the average current supply to light-emitting elements
TWI254997B (en) 2004-09-10 2006-05-11 Aiptek Int Inc Process of manufacturing flip-chips and the apparatus thereof
US7144131B2 (en) 2004-09-29 2006-12-05 Advanced Optical Technologies, Llc Optical system using LED coupled with phosphor-doped reflective materials
WO2006043379A1 (en) 2004-10-21 2006-04-27 Matsushita Electric Industrial Co., Ltd. Illumination device
US7256483B2 (en) 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
US7858408B2 (en) 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7575959B2 (en) 2004-11-26 2009-08-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2006156643A (en) * 2004-11-29 2006-06-15 Citizen Electronics Co Ltd Surface-mounted light-emitting diode
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
JP4064403B2 (en) 2005-01-18 2008-03-19 シャープ株式会社 Semiconductor device, display module, semiconductor chip mounting film substrate manufacturing method, and semiconductor device manufacturing method
US20060171152A1 (en) 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
US20060170096A1 (en) 2005-02-02 2006-08-03 Yang Jun Y Chip scale package and method for manufacturing the same
US7316488B2 (en) 2005-02-07 2008-01-08 Philips Lumileds Lighting Company, Llc Beam shutter in LED package
JP2006278751A (en) * 2005-03-29 2006-10-12 Mitsubishi Cable Ind Ltd Garium nitride-based semiconductor light emitting element
KR20080009198A (en) 2005-03-31 2008-01-25 도와 일렉트로닉스 가부시키가이샤 Phosphor phosphor sheet, and manufacturing method therefore, and light emission device using the phosphor
US20060228973A1 (en) 2005-04-11 2006-10-12 Jlj, Inc. LED Light Strings
TW200704283A (en) 2005-05-27 2007-01-16 Lamina Ceramics Inc Solid state LED bridge rectifier light engine
US7319246B2 (en) 2005-06-23 2008-01-15 Lumination Llc Luminescent sheet covering for LEDs
JP5426160B2 (en) 2005-06-28 2014-02-26 ソウル バイオシス カンパニー リミテッド Light-emitting element for alternating current
US7294861B2 (en) 2005-06-30 2007-11-13 3M Innovative Properties Company Phosphor tape article
US7847302B2 (en) 2005-08-26 2010-12-07 Koninklijke Philips Electronics, N.V. Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
WO2007034680A1 (en) 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. Led illumination device
US8168989B2 (en) 2005-09-20 2012-05-01 Renesas Electronics Corporation LED light source and method of manufacturing the same
JP2007116131A (en) 2005-09-21 2007-05-10 Sanyo Electric Co Ltd Led light emitting device
EP3614442A3 (en) * 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP4951937B2 (en) * 2005-10-28 2012-06-13 日亜化学工業株式会社 Light emitting device
TWI306652B (en) 2005-10-28 2009-02-21 Chipmos Technologies Inc Light emitting diode package structure
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
JP2007142173A (en) * 2005-11-18 2007-06-07 Koha Co Ltd Illuminator
US7564070B2 (en) 2005-11-23 2009-07-21 Visteon Global Technologies, Inc. Light emitting diode device having a shield and/or filter
EP1969647A4 (en) 2005-12-08 2012-08-01 Univ California High efficiency light emitting diode (led)
CN1988188A (en) 2005-12-23 2007-06-27 香港应用科技研究院有限公司 Light emitting diode crystal particle with fluorescence layer structure and its producing method
KR100764148B1 (en) 2006-01-17 2007-10-05 루시미아 주식회사 Sheet type phosphors, preparation method thereof, and light emitting devices using these phosphors
WO2007087710A1 (en) 2006-02-01 2007-08-09 Tir Technology Lp Lighting system for creating an illuminated surface
CN101385402B (en) * 2006-02-13 2012-03-21 松下电器产业株式会社 Circuit board and process for producing the same
KR100746749B1 (en) 2006-03-15 2007-08-09 (주)케이디티 Photoluminescent diffusion sheet
US7682850B2 (en) 2006-03-17 2010-03-23 Philips Lumileds Lighting Company, Llc White LED for backlight with phosphor plates
KR100738933B1 (en) 2006-03-17 2007-07-12 (주)대신엘이디 Led module for illumination
US20090160364A1 (en) 2006-04-12 2009-06-25 Koninklijke Philips Electronics N V Operating solid-state lighting elements
EP2016629B1 (en) 2006-05-02 2015-03-25 Koninklijke Philips N.V. Vehicle headlight
US7583244B2 (en) 2006-05-11 2009-09-01 Ansaldo Sts Usa, Inc. Signal apparatus, light emitting diode (LED) drive circuit, LED display circuit, and display system including the same
US8080828B2 (en) 2006-06-09 2011-12-20 Philips Lumileds Lighting Company, Llc Low profile side emitting LED with window layer and phosphor layer
TW200802928A (en) * 2006-06-13 2008-01-01 Bright View Electronics Co Ltd A flexible ribbon illumination device and manufacture method thereof
WO2007144809A1 (en) 2006-06-14 2007-12-21 Philips Intellectual Property & Standards Gmbh Lighting device
US20070297020A1 (en) 2006-06-21 2007-12-27 Chi-Ting Shen Image-sensing module using white LEDs as a light source thereof
US20080007885A1 (en) 2006-07-05 2008-01-10 Texas Instruments Incorporated System for improving LED illumination reliability in projection display systems
US7766512B2 (en) 2006-08-11 2010-08-03 Enertron, Inc. LED light in sealed fixture with heat transfer agent
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
US7703942B2 (en) 2006-08-31 2010-04-27 Rensselaer Polytechnic Institute High-efficient light engines using light emitting diodes
JP5227503B2 (en) 2006-09-29 2013-07-03 Dowaエレクトロニクス株式会社 Phosphor, phosphor sheet, phosphor production method, and light emitting device using the phosphor
US20080151143A1 (en) 2006-10-19 2008-06-26 Intematix Corporation Light emitting diode based backlighting for color liquid crystal displays
US7902560B2 (en) 2006-12-15 2011-03-08 Koninklijke Philips Electronics N.V. Tunable white point light source using a wavelength converting element
TWI325644B (en) 2007-01-03 2010-06-01 Chipmos Technologies Inc Chip package and manufacturing thereof
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
TW200837943A (en) 2007-01-22 2008-09-16 Led Lighting Fixtures Inc Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters
US7948468B2 (en) 2007-02-23 2011-05-24 The Regents Of The University Of Colorado Systems and methods for driving multiple solid-state light sources
JP4927019B2 (en) 2007-04-10 2012-05-09 信越化学工業株式会社 Phosphor-containing adhesive silicone composition, composition sheet comprising the composition, and method for producing a light-emitting device using the sheet
JP5222490B2 (en) 2007-04-25 2013-06-26 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
US7972031B2 (en) 2007-05-31 2011-07-05 Nthdegree Technologies Worldwide Inc Addressable or static light emitting or electronic apparatus
EP2017890B1 (en) 2007-06-07 2015-10-07 Cfg S.A. White-light LED-based device
WO2008153130A1 (en) * 2007-06-15 2008-12-18 Rohm Co., Ltd. Nitride semiconductor light emitting element and method for manufacturing nitride semiconductor
JP2010533976A (en) 2007-07-18 2010-10-28 キユーデイー・ビジヨン・インコーポレーテツド Quantum dot-based light sheet useful for solid-state lighting
KR100966374B1 (en) 2007-08-27 2010-07-01 삼성엘이디 주식회사 Plane light source using white LED and LCD backlight unit comprising the same
US7791093B2 (en) 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
JP4381439B2 (en) 2007-09-18 2009-12-09 株式会社沖データ LED backlight device and liquid crystal display device
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
JP2009105291A (en) 2007-10-25 2009-05-14 Panasonic Corp Junction structure and its manufacturing method
WO2009055821A1 (en) 2007-10-26 2009-04-30 Lighting Science Group Corporation High efficiency light source with integrated ballast
US8018139B2 (en) 2007-11-05 2011-09-13 Enertron, Inc. Light source and method of controlling light spectrum of an LED light engine
JP5437626B2 (en) 2007-12-28 2014-03-12 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method of semiconductor device
US7906786B2 (en) * 2008-01-11 2011-03-15 Industrial Technology Research Institute Light emitting device
KR101535064B1 (en) 2008-01-17 2015-07-09 삼성디스플레이 주식회사 Light source module for display device and display device having the same
US8531126B2 (en) 2008-02-13 2013-09-10 Canon Components, Inc. White light emitting apparatus and line illuminator using the same in image reading apparatus
US7766536B2 (en) 2008-02-15 2010-08-03 Lunera Lighting, Inc. LED light fixture
JP2009255497A (en) 2008-03-18 2009-11-05 Fujifilm Corp Micro phase separation structure on flexible substrate and its method for manufacturing
KR101562772B1 (en) 2008-03-31 2015-10-26 서울반도체 주식회사 Light emitting divece for white light of incandescent color
US7859000B2 (en) 2008-04-10 2010-12-28 Cree, Inc. LEDs using single crystalline phosphor and methods of fabricating same
US7618157B1 (en) 2008-06-25 2009-11-17 Osram Sylvania Inc. Tubular blue LED lamp with remote phosphor
JP5499448B2 (en) 2008-07-16 2014-05-21 デクセリアルズ株式会社 Anisotropic conductive adhesive
US7973327B2 (en) 2008-09-02 2011-07-05 Bridgelux, Inc. Phosphor-converted LED
US8361840B2 (en) 2008-09-24 2013-01-29 Eastman Kodak Company Thermal barrier layer for integrated circuit manufacture
JP2010092705A (en) 2008-10-08 2010-04-22 Sony Corp Illuminating device and display device using this
JP2010103522A (en) 2008-10-21 2010-05-06 Seoul Opto Devices Co Ltd Ac drive type light-emitting element with delay phosphor and light-emitting element module
KR101577300B1 (en) 2008-10-28 2015-12-15 삼성디스플레이 주식회사 Light Emitting Diode Using Quantum Dot And Backlight Assembly Having The Same
JP2010135513A (en) 2008-12-03 2010-06-17 Sumitomo Electric Ind Ltd Package
JP5146356B2 (en) 2009-02-24 2013-02-20 豊田合成株式会社 Light emitting device and manufacturing method thereof
JP5402109B2 (en) 2009-02-27 2014-01-29 デクセリアルズ株式会社 Anisotropic conductive film and light emitting device
JP5327042B2 (en) 2009-03-26 2013-10-30 豊田合成株式会社 LED lamp manufacturing method
US7997784B2 (en) 2009-05-12 2011-08-16 Global Lighting Technologies (Taiwan) Inc. Light guide apparatus of backlight module
US8323998B2 (en) 2009-05-15 2012-12-04 Achrolux Inc. Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
US8597963B2 (en) 2009-05-19 2013-12-03 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8227269B2 (en) 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8440500B2 (en) 2009-05-20 2013-05-14 Interlight Optotech Corporation Light emitting device
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
JP5255527B2 (en) 2009-07-03 2013-08-07 デクセリアルズ株式会社 Color conversion member and display device
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
JP5659519B2 (en) * 2009-11-19 2015-01-28 豊田合成株式会社 Light emitting device, method for manufacturing light emitting device, method for mounting light emitting device, and light source device
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US8493000B2 (en) 2010-01-04 2013-07-23 Cooledge Lighting Inc. Method and system for driving light emitting elements
US7811843B1 (en) 2010-01-13 2010-10-12 Hon Hai Precision Industry Co., Ltd. Method of manufacturing light-emitting diode
US8501536B2 (en) 2010-03-31 2013-08-06 Seagate Technology Llc Integrating and aligning laser chips on sliders for HAMR applications
JP2011251645A (en) 2010-06-03 2011-12-15 Toyota Motor Corp Mounting structure and mounting method of power control device
US20110303936A1 (en) 2010-06-10 2011-12-15 Shang-Yi Wu Light emitting device package structure and fabricating method thereof
WO2012000114A1 (en) * 2010-06-29 2012-01-05 Cooledge Lightning Inc. Electronic devices with yielding substrates
WO2012024792A1 (en) 2010-08-25 2012-03-01 Cooledge Lighting Inc. Failure mitigation in arrays of light-emitting devices
US8461602B2 (en) 2010-08-27 2013-06-11 Quarkstar Llc Solid state light sheet using thin LEDs for general illumination
US8210716B2 (en) 2010-08-27 2012-07-03 Quarkstar Llc Solid state bidirectional light sheet for general illumination
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8338199B2 (en) 2010-08-27 2012-12-25 Quarkstar Llc Solid state light sheet for general illumination
US8192051B2 (en) 2010-11-01 2012-06-05 Quarkstar Llc Bidirectional LED light sheet
US8119427B1 (en) 2011-01-06 2012-02-21 Chi Mei Lighting Technology Corporation Light emitting diode die-bonding with magnetic field
US8410726B2 (en) 2011-02-22 2013-04-02 Quarkstar Llc Solid state lamp using modular light emitting elements
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
US9018730B2 (en) 2011-04-05 2015-04-28 Stmicroelectronics S.R.L. Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device
US20130301274A1 (en) 2012-05-09 2013-11-14 Deloren E. Anderson Led fixture with interchangeable components
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
US8947001B2 (en) 2012-09-06 2015-02-03 Cooledge Lighting Inc. Wiring boards for array-based electronic devices
US8704448B2 (en) 2012-09-06 2014-04-22 Cooledge Lighting Inc. Wiring boards for array-based electronic devices

Also Published As

Publication number Publication date
US20140034960A1 (en) 2014-02-06
US8466488B2 (en) 2013-06-18
US20160327220A1 (en) 2016-11-10
JP2013531378A (en) 2013-08-01
JP5512888B2 (en) 2014-06-04
CN102959708A (en) 2013-03-06
US9252373B2 (en) 2016-02-02
JP2014160835A (en) 2014-09-04
US9426860B2 (en) 2016-08-23
CN102959708B (en) 2016-05-04
US8552463B2 (en) 2013-10-08
US9054290B2 (en) 2015-06-09
EP2589082B1 (en) 2018-08-08
EP2589082A1 (en) 2013-05-08
JP6245753B2 (en) 2017-12-13
WO2012000114A1 (en) 2012-01-05
US20140191257A1 (en) 2014-07-10
US8680567B2 (en) 2014-03-25
EP2589082A4 (en) 2015-02-25
US20160113087A1 (en) 2016-04-21
US20120217496A1 (en) 2012-08-30
KR101372084B1 (en) 2014-03-07
US8384121B2 (en) 2013-02-26
KR20130087518A (en) 2013-08-06
US20130181238A1 (en) 2013-07-18
US20150001465A1 (en) 2015-01-01
US20150236214A1 (en) 2015-08-20
US20110315956A1 (en) 2011-12-29
US8907370B2 (en) 2014-12-09

Similar Documents

Publication Publication Date Title
WO2012000114A8 (en) Electronic devices with yielding substrates
WO2012015284A3 (en) Touch panel
WO2012021196A3 (en) Method for manufacturing electronic devices and electronic devices thereof
WO2012125651A3 (en) Wafer level packaging of mems devices
EP2513242A4 (en) Pressure sensitive adhesives for low surface energy substrates
WO2012118588A3 (en) Stretchable devices and methods of manufacture and use thereof
WO2011063089A3 (en) Surface-modified adhesives
WO2007024837A3 (en) Fluoropolymer-glass fabric for circuit substrates
WO2012154815A3 (en) Silicone coated light-emitting diode
WO2013003428A3 (en) Structure integrated by vacuum pressure forming or vacuum forming, and manufacturing method thereof
WO2012094436A3 (en) Electronic components on paper-based substrates
IN2014CN03520A (en)
WO2012127245A3 (en) Structures and methods relating to graphene
EP2601047B8 (en) Methods of coating a low surface energy substrate
WO2012070796A3 (en) Adhesive composition for touch panel, adhesive film, and touch panel
WO2011062380A3 (en) Solar photovoltaic device
EP2369453A3 (en) Touch panel and method for fabricating the same
BR112015001829A2 (en) adhesion method using thin adhesive layers
WO2013036480A3 (en) Backplate with recess and electronic component
WO2011103383A3 (en) Attachment of photovoltaic devices to substrates using slotted extrusion members
WO2012169866A3 (en) Printed circuit board and method for manufacturing the same
GB2526464A (en) Methods of forming buried microelectricomechanical structures coupled with device substrates and structures formed thereby
WO2012037242A3 (en) Glass-coated flexible substrates for photovoltaic cells
EP3014673A4 (en) Preparation and coating of three-dimensional objects with organic optoelectronic devices including electricity-generating organic photovoltaic films using thin flexible substrates with pressure-sensitive adhesives
ZA201104870B (en) Substrate for the front surface of a photovoltaic panel,photocoltaic panel,and use of a substrate for the front surface of a photovoltaic panel

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180032811.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11800038

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013516931

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2011800038

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20137002293

Country of ref document: KR

Kind code of ref document: A