WO2012099466A3 - Method for manufacturing an electronic device by electrodeposition from an ionic liquid - Google Patents
Method for manufacturing an electronic device by electrodeposition from an ionic liquid Download PDFInfo
- Publication number
- WO2012099466A3 WO2012099466A3 PCT/NL2012/050026 NL2012050026W WO2012099466A3 WO 2012099466 A3 WO2012099466 A3 WO 2012099466A3 NL 2012050026 W NL2012050026 W NL 2012050026W WO 2012099466 A3 WO2012099466 A3 WO 2012099466A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrodeposition
- conducting layer
- takes place
- electronic conducting
- electronic
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title abstract 11
- 238000000034 method Methods 0.000 title abstract 3
- 239000002608 ionic liquid Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000013067 intermediate product Substances 0.000 abstract 3
- 229910052752 metalloid Inorganic materials 0.000 abstract 3
- 150000002738 metalloids Chemical class 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- -1 metalloid ions Chemical class 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
Abstract
Method for manufacturing an electronic device, the method comprising - providing an electronic intermediate product, said intermediate product having a an electronic conducting layer and - forming an metallic or metalloid layer on an outer surface the electronic conducting layer by electrodeposition using a plating liquid comprising an ionic liquid and metal ions or metalloid ions, wherein during electrodeposition the electronic conducting layer of the intermediate product on which electrodeposition takes place is connected to an electrical power source and the electronic conducting layer on which electrodeposition takes place provides a cathode for the electrodeposition, and wherein the metallic or metalloid layer is formed gradually in the plane parallel to the surface of the electronic conducting layer on which electrodeposition takes place, which gradual forming comprises starting the electrodeposition on a part of the surface of the electronic conducting layer on which electrodeposition takes place relatively close to the connection to the power source before starting the electrodeposition on a part of the surface of the electronic conducting layer on which electrodeposition takes place relatively remote from the connection to the power source.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11151257A EP2476784A1 (en) | 2011-01-18 | 2011-01-18 | Method for manufacturing an electronic device by electrodeposition from an ionic liquid |
EP11151257.0 | 2011-01-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012099466A2 WO2012099466A2 (en) | 2012-07-26 |
WO2012099466A3 true WO2012099466A3 (en) | 2013-01-03 |
Family
ID=44245687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL2012/050026 WO2012099466A2 (en) | 2011-01-18 | 2012-01-17 | Method for manufacturing an electronic device by electrodeposition from an ionic liquid |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2476784A1 (en) |
WO (1) | WO2012099466A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2606530B1 (en) | 2010-08-20 | 2017-04-26 | Rhodia Operations | Polymer compositions, polymer films, polymer gels, polymer foams, and electronic devices containing such films, gels, and foams |
DE102015103895A1 (en) | 2015-03-17 | 2016-09-22 | Osram Oled Gmbh | Method for producing an organic component |
FR3047604B1 (en) * | 2016-02-04 | 2018-02-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | HUMIDITY PROTECTED HYBRID ELECTRONIC DEVICE AND HUMIDITY PROTECTION METHOD OF HYBRID ELECTRONIC DEVICE |
CN105714364B (en) * | 2016-03-30 | 2018-07-03 | 河南平高电气股份有限公司 | A kind of plating cathode conducting seat, plating cathode electric installation and electroplating device |
CN106801248B (en) * | 2017-02-03 | 2020-04-10 | 中山大学 | Device and method for manufacturing three-dimensional micro-nano structure device |
KR102482452B1 (en) * | 2017-09-28 | 2022-12-29 | 삼성디스플레이 주식회사 | Organic material purification composition and method of purifying organic materials using the same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5372699A (en) * | 1991-09-13 | 1994-12-13 | Meco Equipment Engineers B.V. | Method and apparatus for selective electroplating of metals on products |
US5395508A (en) * | 1992-10-05 | 1995-03-07 | Commissariat A L'energie Atomique | Apparatus for the electrolytic deposition of a metal on a weakly conductive flexible substrate electrolytic deposition process and product obtained by this process |
WO1999026275A2 (en) * | 1997-11-13 | 1999-05-27 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6159354A (en) * | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
US6217736B1 (en) * | 1997-04-25 | 2001-04-17 | Atotech Deutschland Gmbh | Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment |
US6402923B1 (en) * | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
US20020079230A1 (en) * | 2000-12-21 | 2002-06-27 | Basol Bulent M. | Method and apparatus for controlling thickness uniformity of electroplated layer |
EP1983078A1 (en) * | 2007-04-17 | 2008-10-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Electrodeposition |
WO2008127110A1 (en) * | 2007-04-17 | 2008-10-23 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Barrier layer and method for making the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4764440A (en) | 1987-05-05 | 1988-08-16 | Eveready Battery Company | Low temperature molten compositions |
US5731101A (en) | 1996-07-22 | 1998-03-24 | Akzo Nobel Nv | Low temperature ionic liquids |
FR2757850B1 (en) | 1996-12-27 | 1999-04-16 | Inst Francais Du Petrole | IMPROVED PROCESS FOR DIENIC CONDENSATION CALLED DIELS-ALDER REACTION |
GB0023708D0 (en) | 2000-09-27 | 2000-11-08 | Scionix Ltd | Hydrated salt mixtures |
US6576351B2 (en) | 2001-02-16 | 2003-06-10 | Universal Display Corporation | Barrier region for optoelectronic devices |
AU2002237478A1 (en) | 2001-03-29 | 2002-10-15 | Koninklijke Philips Electronics N.V. | Method and device for measuring a permeation rate |
GB2374202A (en) | 2001-04-03 | 2002-10-09 | Seiko Epson Corp | Patterning method |
GB2379414A (en) | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate |
US6569706B2 (en) | 2001-09-19 | 2003-05-27 | Osram Opto Semiconductors Gmbh | Fabrication of organic light emitting diode using selective printing of conducting polymer layers |
NL1023679C2 (en) | 2003-06-17 | 2004-12-20 | Tno | Light-emitting diode. |
NL1023680C2 (en) | 2003-06-17 | 2004-12-20 | Tno | Sensor with polymer components. |
WO2010093237A1 (en) | 2009-02-11 | 2010-08-19 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno | Optoelectronic device and method for fabricating such device |
-
2011
- 2011-01-18 EP EP11151257A patent/EP2476784A1/en not_active Withdrawn
-
2012
- 2012-01-17 WO PCT/NL2012/050026 patent/WO2012099466A2/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5372699A (en) * | 1991-09-13 | 1994-12-13 | Meco Equipment Engineers B.V. | Method and apparatus for selective electroplating of metals on products |
US5395508A (en) * | 1992-10-05 | 1995-03-07 | Commissariat A L'energie Atomique | Apparatus for the electrolytic deposition of a metal on a weakly conductive flexible substrate electrolytic deposition process and product obtained by this process |
US6217736B1 (en) * | 1997-04-25 | 2001-04-17 | Atotech Deutschland Gmbh | Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment |
WO1999026275A2 (en) * | 1997-11-13 | 1999-05-27 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6159354A (en) * | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
US6402923B1 (en) * | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
US20020079230A1 (en) * | 2000-12-21 | 2002-06-27 | Basol Bulent M. | Method and apparatus for controlling thickness uniformity of electroplated layer |
EP1983078A1 (en) * | 2007-04-17 | 2008-10-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Electrodeposition |
WO2008127110A1 (en) * | 2007-04-17 | 2008-10-23 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Barrier layer and method for making the same |
Also Published As
Publication number | Publication date |
---|---|
EP2476784A1 (en) | 2012-07-18 |
WO2012099466A2 (en) | 2012-07-26 |
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