WO2013040063A3 - Determining design coordinates for wafer defects - Google Patents

Determining design coordinates for wafer defects Download PDF

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Publication number
WO2013040063A3
WO2013040063A3 PCT/US2012/054904 US2012054904W WO2013040063A3 WO 2013040063 A3 WO2013040063 A3 WO 2013040063A3 US 2012054904 W US2012054904 W US 2012054904W WO 2013040063 A3 WO2013040063 A3 WO 2013040063A3
Authority
WO
WIPO (PCT)
Prior art keywords
defects
design coordinates
determining
wafer
detected
Prior art date
Application number
PCT/US2012/054904
Other languages
French (fr)
Other versions
WO2013040063A2 (en
Inventor
Ellis Chang
Michael VAN RIET
Allen Park
Khurram Zafar
Santosh Bhattacharyya
Original Assignee
Kla-Tencor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla-Tencor Corporation filed Critical Kla-Tencor Corporation
Priority to KR1020147009402A priority Critical patent/KR101834608B1/en
Publication of WO2013040063A2 publication Critical patent/WO2013040063A2/en
Publication of WO2013040063A3 publication Critical patent/WO2013040063A3/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects.
PCT/US2012/054904 2011-09-13 2012-09-12 Determining design coordinates for wafer defects WO2013040063A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020147009402A KR101834608B1 (en) 2011-09-13 2012-09-12 Determining design coordinates for wafer defects

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161534104P 2011-09-13 2011-09-13
US61/534,104 2011-09-13
US13/601891 2012-08-31
US13/601,891 US9087367B2 (en) 2011-09-13 2012-08-31 Determining design coordinates for wafer defects

Publications (2)

Publication Number Publication Date
WO2013040063A2 WO2013040063A2 (en) 2013-03-21
WO2013040063A3 true WO2013040063A3 (en) 2013-06-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/054904 WO2013040063A2 (en) 2011-09-13 2012-09-12 Determining design coordinates for wafer defects

Country Status (5)

Country Link
US (1) US9087367B2 (en)
JP (1) JP2014530495A (en)
KR (1) KR101834608B1 (en)
TW (1) TWI547818B (en)
WO (1) WO2013040063A2 (en)

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