WO2013130257A1 - Methods of modulating microlasers at ultralow power levels, and systems thereof - Google Patents

Methods of modulating microlasers at ultralow power levels, and systems thereof Download PDF

Info

Publication number
WO2013130257A1
WO2013130257A1 PCT/US2013/025632 US2013025632W WO2013130257A1 WO 2013130257 A1 WO2013130257 A1 WO 2013130257A1 US 2013025632 W US2013025632 W US 2013025632W WO 2013130257 A1 WO2013130257 A1 WO 2013130257A1
Authority
WO
WIPO (PCT)
Prior art keywords
microlaser
photovoltaic power
power source
assembly
triggering event
Prior art date
Application number
PCT/US2013/025632
Other languages
French (fr)
Inventor
Seheon Kim
Axel Scherer
Aditya Rajagopal
Chieh-Feng Chang
Original Assignee
California Institute Of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by California Institute Of Technology filed Critical California Institute Of Technology
Publication of WO2013130257A1 publication Critical patent/WO2013130257A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/0627Construction or shape of active medium the resonator being monolithic, e.g. microlaser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/025Constructional details of solid state lasers, e.g. housings or mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/1028Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123Q-switching
    • H01S3/115Q-switching using intracavity electro-optic devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
    • H01S5/0612Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/3013AIIIBV compounds
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/145Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1455Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/1459Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters invasive, e.g. introduced into the body by a catheter
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1042Optical microcavities, e.g. cavity dimensions comparable to the wavelength

Definitions

  • the present teachings relate to microlasers. More specifically, the present disclosure relates to microlasers that can be incorporated into a variety of monitoring applications wherein low power consumption is desirable.
  • FIG. 1 shows a prior art microlaser system that includes a photovoltaic power source 105 for providing power via switch 115 to semiconductor microlaser 110 that is arranged in a forward-biased configuration.
  • switch 115 When switch 115 is in an open condition, photovoltaic power source 105 is disconnected from microlaser 110, thereby placing microlaser 110 in an off state. However, when switch 115 is closed (as a result of a switch activation signal provided via line 116), photovoltaic power source 105 provides a voltage in the range of 1.5-2V to drive microlaser 110 into an on state and generate output laser beam 111.
  • the driving voltage (1.5-2V) required to turn on microlaser 110 is roughly ten times higher than what a single photo-voltaic cell can generate in an open circuit condition.
  • FIG. 1 necessitates a more complex and expensive photovoltaic power source 105 incorporating multiple photovoltaic cells in a tandem arrangement. Furthermore, the manner in which semiconductor microlaser 110 is operated proves inefficient in terms of power consumption.
  • a microlaser system includes an optical source, a microlaser, an actuator switch, and a photovoltaic power source.
  • the microlaser which includes a control element, is optically pumped by at least a portion of light emitted by the optical source.
  • the actuator switch is configured to be activated by a triggering event.
  • the photovoltaic power source is coupled in a series connection with the actuator switch and the control element, the series connection configured to connect the photovoltaic power source to the control element of the microlaser when the actuator switch is activated by the triggering event.
  • a method of operation includes directing light upon a microlaser for optically pumping the microlaser; and detecting the occurrence of a triggering event based on a change in an optical output of the microlaser, the change in optical output occurring in response to connecting a photovoltaic power source to the microlaser only upon occurrence of the triggering event.
  • a method of operation includes directing light upon a microlaser for optically pumping the microlaser; and connecting a photovoltaic power source to modify an operational condition of the microlaser only upon occurrence of a triggering event, the modified operational condition indicative of the occurrence of the triggering event.
  • FIG. 1 shows a prior art microlaser system that includes a semiconductor microlaser arranged in a forward-biased configuration.
  • FIG. 2 shows a first embodiment of a microlaser system incorporating a
  • FIG. 3 shows a second embodiment of a microlaser system incorporating a piezoelectric -based control element in accordance with the present disclosure.
  • FIG. 4 shows a third embodiment of a microlaser system incorporating a capacitor- based control element in accordance with the present disclosure.
  • FIG. 5 shows a fourth embodiment of a microlaser system incorporating a reverse biased diode-based control element in accordance with the present disclosure.
  • FIGs. 6 A and 6B show graphs depicting a time profile of intensity and wavelength of a pump light (an emitted beam) in accordance with the present disclosure.
  • FIGs. 7 A and 7B show graphs depicting a time profile of intensity and wavelength of a pump light (an emitted beam) in accordance with the present disclosure.
  • FIG. 8 shows some structural details of a microlaser incorporating a first embodiment of the capacitor-based control element in accordance with the present disclosure.
  • FIG. 9 shows some structural details of a microlaser incorporating a second embodiment of the capacitor-based control element in accordance with the present disclosure.
  • FIG. 10 shows some structural details of a microlaser incorporating the
  • piezoelectric -based control element in accordance with the present disclosure.
  • FIG. 11 shows some structural details of a microlaser incorporating the
  • the various embodiments described herein are generally directed at a microlaser system that may be used in various monitoring applications, including applications involving detection of one or more occurrences of an event.
  • the microlaser system incorporates a microlaser which is optically pumped into operation based on
  • the microlaser emits a laser beam when pumped into operation by the light source.
  • the microlaser system further incorporates an event sensor circuit that provides a trigger signal to a switch.
  • a triggering event occurs, the switch is activated by the trigger signal, and a photovoltaic power source is coupled to a control element of the microlaser.
  • the control element When energized by the photovoltaic power source, the control element (which can be implemented in a variety of ways, some of which are described below) operates to cause a change in characteristic (wavelength, intensity etc.) of the emitted laser beam. This change in characteristic (which may be alternatively understood as modulation of an emitted laser beam) may be used to optically communicate the occurrence of the event.
  • the photovoltaic power source is used to provide power for driving the control element instead.
  • the power consumption of the control element is low enough to permit a relatively small photovoltaic power source to be used, thereby providing cost and efficiency benefits over prior art systems that use complex, higher capacity, and expensive photovoltaic power sources.
  • control elements Four types of control elements and the corresponding changes in characteristics of the emitted laser beam are described below in accordance with the invention.
  • the four types of control elements enable modulation of the emitted laser beam on the basis of temperature variation, piezoelectric deformation, capacitance variation, and electronic forward/reverse biasing of the microlaser.
  • FIG. 2 shows a first embodiment of a microlaser system 200 based on varying the temperature of a microlaser whereby a wavelength shift and/or an intensity change is impressed upon an emitted beam of light.
  • Microlaser system 200 which can be used for detecting various types of event occurrences (triggering events) in a wide variety of applications, includes microlaser 210 that is optically pumped into operation based on photoluminescence by a light source 225.
  • photovoltaic power source 205 can be a low power source that generates low Open circuit voltage' and current. More particularly, the open circuit voltage which is used to drive a control element (rather than the microlaser itself), is around 0.5 V, which is about 4 times smaller than what is required in prior art systems.
  • control element is a heater element, more particularly a micro-heater 230.
  • Micro-heater 230 is in contact with a surface of microlaser 210, for example, a bottom surface of microlaser 210, such that heat provided by micro-heater 230 affects the active layer (not shown) of microlaser 210 and
  • a photovoltaic power source 205 which is configured to receive light from light source 220, convert the received light into electrical power, and provide the electrical power to micro-heater 230 when actuator switch 215 is in a closed (on) position.
  • Actuator switch 215 is turned on/off (closed/open) on the basis of a trigger signal provided on line 216.
  • the trigger signal is derived from an event sensor circuit (not shown) that is selected on the basis of various applications.
  • event detection system 200 is partially or entirely embedded inside an animate object (such as a human being for example), and used to detect the occurrence of various biomedical events, such as for example, when an undesirable substance carried in the bloodstream of the animate object exceeds a threshold level.
  • light sources 220 and 225 may be combined into a single light source, a laser for example.
  • a laser may be also embedded into the animate object for providing light to photovoltaic power source 205 and microlaser 210.
  • the emitted beam 211 from microlaser 210 may be observed through suitable viewing ports provided in the animate object, or by using optical fiber to optically transport emitted beam 211 out of the animate object.
  • Micro-heater 230 may be implemented in a variety of ways. In one example implementation based on platinum/titanium (Pt/Ti) [3], micro-heater 230 can be selected to provide a localized temperature of around 150°C when provided with 2.25 mW of driving power (0.75V x 3mA) from photovoltaic power system 205. At a driving power of 1 mW (0.5V x 2 mA), the localized temperature can reach 75°C.
  • Pt/Ti platinum/titanium
  • FIG. 3 shows a second embodiment of an event detection system 300 based on piezoelectric deformation of a portion of microlaser 310.
  • the piezoelectric deformation results in a wavelength shift and/or an intensity change in an emitted beam of light.
  • the control element is a piezoelectric layer 330 that may be fabricated as an integral layer inside microlaser 310.
  • Piezoelectric layer 330 is a p-i-n doped layer that can be actuated by application of a low voltage under a reverse biased condition.
  • piezoelectric layer 330 is significantly deformed when photovoltaic power system 205 provides a few hundred millivolts. This mechanical deformation causes emitted beam 211 to undergo a change in wavelength - either an increase or a decrease in wavelength depending on the way microlaser 310 is fabricated.
  • the electrical power provided by photovoltaic power system 205 for enabling this wavelength change is as low as a few nW because there is essentially no current flow through microlaser 310 that is configured to operate in a reverse biased state (by suitable polarity-based connections between microlaser 310 and photovoltaic power system 205).
  • FIG. 4 shows a third embodiment of an event detection system 400 based on varying a capacitive element 430 that is a part of microlaser 410.
  • capacitive element 430 is a metallic membrane located above an active layer (described below in more detail using FIG. 8) of microlaser 410.
  • the metallic membrane is deflected closer to a lasing disk upon application of a voltage provided by photovoltaic power system 205. The deflection results in an increase in light scattering by the metallic membrane and/or absorption of light in the metallic membrane and switches off microlaser 410.
  • a thin insulating layer separates two microdisks (described below in more detail using FIG. 9) that operate as a lasing cavity.
  • the separation distance between the two micro-disks can be changed by electrostatic deflection of one or both of these two micro-disks upon application of a voltage provided by photovoltaic power system 205.
  • the change in separation distance in microlaser 410 is intended as a means to alter a quality factor of the microlaser (in other word, Q-switching) and/or a resonant wavelength of the microlaser.
  • wavelength/intensity of emitted beam 211 can be modulated in response to the triggering signal 212.
  • the power provided by photovoltaic power system 205 for enabling this action is quite low because there is essentially no current flow through microlaser 410 that is configured to operate in a reverse biased state by suitable polarity-based connections between microlaser 410 and
  • photovoltaic power system 205 photovoltaic power system 205.
  • FIG. 5 shows a fourth embodiment of an event detection system 500 based on electronic reverse biasing of microlaser 510, which may be interpreted as integrally incorporating a reverse-biased diode assembly.
  • the electronic reverse biasing which is carried out by suitable polarity-based connections between microlaser 510 and photovoltaic power system 205, is operative to changing the carrier concentration within microlaser 510.
  • light source 225 provides enough light to optically pump enough carriers within microlaser 510 so as to exceed a lasing threshold.
  • An electrostatic field can be used to move carriers inside microlaser 510.
  • microlaser 510 the carrier depletion close to the active lasing material inside microlaser 510 results in turning off microlaser 510.
  • the resulting on-off binary nature of the emitted beam 211 can be used to carry digital information optically.
  • the electrical power provided by photovoltaic power system 205 is quite low because there is essentially no current flow through microlaser 510 that is configured to operate in the reverse biased state.
  • a forward bias can be used to supply more carriers inside microlaser 510 so as to increase a laser gain.
  • light source 225 provides a stationary laser gain within microlaser 510 at a level close to/above a lasing threshold of the microlaser 510, which results in stationary laser emission 211 whose intensity does not change in time.
  • Intensity of the emitted beam 211 can be modulated (increased) in response to the forward biased current by the photovoltaic power system 205.
  • the electrical power provided by photovoltaic power system 205 for enabling this action is relatively low in comparison to prior art implementations.
  • FIG. 6A shows a train of optical pulses provided by pump light source 225 to wirelessly power any of the microlaser embodiments described above.
  • the train of optical pulses can be characterized by using a variety of parameters such as, a pulse period, a pulse width, a duty cycle, and/or a repetition rate.
  • a pulse period such as, a pulse period
  • a pulse width such as, a pulse width
  • a duty cycle such as a pulse width
  • a repetition rate such as, a pulse width, a duty cycle, and/or a repetition rate.
  • pulse widths in the range of tens of nanoseconds.
  • this low pulse width may not be suitable and consequently, a larger pulse width may be selected.
  • microlasers can be operated at duty cycles of 1% to 10% when a pulse period is in the range of 0.1 ⁇ 8 to a few ⁇ 8. Some advanced microlasers having ultra- low thresholds may be operated continuously (100% duty cycle) without encountering thermal problems. Peak power to operate a microlaser is typically about lkW/cm . About 10-20% of the pump light power 225 incident on some microlasers may be absorbed by the microlasers and used to create population inversion in the active layer.
  • FIG. 6A further shows a graph of light intensity versus wavelength (in other words, 'spectrum'), wherein wavelength ⁇ ⁇ represents the wavelength of the light provided by light source 225 to wirelessly power any of the microlaser embodiments described above. In certain embodiments, this wavelength may not only be used by light source 225 but by light source 220. As indicated above, these two light sources may be implemented as a merged, single light source.
  • FIG. 6B shows a train of emitted beam pulses 211 from the microlaser
  • the train of microlaser output pulses is synchronized with that of the pump laser 225.
  • the microlaser 211 is operated at a wavelength of ⁇ ⁇ , which is longer than that of the pump light wavelength ⁇ ⁇ .
  • the peak output intensity and the emission wavelength ⁇ 6 do not change in time.
  • FIG. 7A shows a train of optical pulses that is provided by light source 225 at a wavelength of ⁇ ⁇ to wirelessly power any of the microlaser embodiments described above.
  • FIG. 7A further shows a graph of wavelength versus time. As can be understood, the wavelength of ⁇ ⁇ remains unchanged over time regardless of the presence of an event (which would close actuator switch 215 but could not affect the pump light source 225).
  • FIG. 7B illustrates a change in the time profile 705 of the event as a result of the occurrence of the event.
  • the change in time profile 705 is characterized by a change in the intensity of emitted beam 211 in accordance with certain embodiments of the invention.
  • a change in the wavelength ( ⁇ ⁇ >0 or ⁇ 0) of emitted beam 211 may take place along with the intensity change as indicated in the graph of wavelength versus time.
  • FIG. 8 shows some structural details of a microlaser 410 incorporating a first embodiment of the capacitor-based control element in accordance with the present disclosure.
  • capacitive element 430 (shown in FIG. 4) is a metallic membrane 830 separated by a gap 835 from lasing structure 825, which includes an active layer 815.
  • Metallic membrane 830 is deflected closer to active layer 815 upon application of a voltage that is provided by photovoltaic power system 205 (shown in FIG. 4). The deflection results in an increase in light scattering by the metallic membrane and/or absorption of light in the metallic membrane and switches off microlaser 410.
  • Layers 805 and 820 are configured as electrodes located on opposing sides of lasing structure 825 for application of the voltage by photovoltaic power system 205.
  • FIG. 9 shows some structural details of a microlaser 410 incorporating a second embodiment of the capacitor-based control element in accordance with the present disclosure.
  • capacitive element 430 is formed of an insulating layer 30 separating two micro-disks 35 and 40 (having active layers 15 and 20 respectively).
  • the separation distance between the two micro-disks can be changed by electrostatic deflection of one or both of these two micro-disks upon application of a voltage (provided by photovoltaic power system 205).
  • the change in separation distance causes microlaser 410 to be detuned out of the gain region, thereby resulting in a change in wavelength/intensity of emitted beam 211.
  • FIG. 10 shows some structural details of a microlaser 310 incorporating the piezoelectric -based control element in accordance with the present disclosure.
  • Microlaser 310 includes a pair of electrodes 50 and 55 that are located on opposite surfaces of layered structure 60, which includes multiple p-i-n layers.
  • An intrinsic layer 57 serves as both an active layer and a piezoelectric layer.
  • the voltage applied via electrodes 50 and 55 induces mechanical stress in intrinsic layer 57 based on the piezoelectric nature of this layer.
  • the mechanical stress causes the brim of layered structure 60 to deform, which in turn changes the emission wavelength ( ⁇ ⁇ ) of the emitted beam 211 (shown in FIG. 3).
  • the change in wavelength is typically of the order of a few nanometers.
  • FIG. 11 shows some structural details of a microlaser 210 incorporating the temperature-based control element in accordance with the present disclosure.
  • Microlaser 210 includes a metal pedestal 85 that is in contact with a microlaser layer 80.
  • metal pedestal 85 is made of one or more metals such as gold and platinum. Such metals operate as very good thermal as well as electrical conductors. Heat generated by heater 230 (shown in FIG. 2), which may be located inside metal pedestal 85 or external to metal pedestal 85, is efficiently delivered to microlaser layer 80 via metal pedestal 85.
  • microlaser layer 80 may incorporate an indium gallium arsenide phosphate (InGaAsP) compound.
  • the diameter of microlaser layer 80 can be in a range of 3 to 5 ⁇ , which results in single mode lasing operation.
  • n refractive index
  • InP indium phosphate
  • T temperature
  • dn/dT 2 x 10 "4 .
  • the modified operational conditions of a microlaser can be used to detect an occurrence of an event.
  • Emitted beam 211 may be transported via a wide variety of transmission media, such as for example, free space optics and optical fiber media, and may be used for providing various types of information depending on the type of application in which the various embodiments described herein are used.
  • the information may be a digital bit stream that indicates occurrence or non-occurrence of an event, or carries digital communication data.
  • the information pertains to voltage levels and/or current levels present in various elements of a system (for example, on line 216, or on the lines that couple photovoltaic power source 205 to the microlaser).
  • microlaser systems described herein can be used in a side variety of environments, such as in an in-vivo environment described above.
  • the system may be integrated into certain structures, such as for example, a wing of an airplane made of a composite material.
  • a suitable transparent epoxy window may be used in such an implementation for propagating emitted beam 211.

Abstract

A microlaser system includes an optical source, a microlaser, an actuator switch, and a photovoltaic power source. The microlaser, which includes a control element, is optically pumped by at least a portion of light emitted by the optical source. The actuator switch is configured to be activated by a triggering event. Furthermore, the photovoltaic power source is coupled in a series connection with the actuator switch and the control element, the series connection configured to connect the photovoltaic power source to the control element of the microlaser when the actuator switch is activated by the triggering event.

Description

METHODS OF MODULATING MICROLASERS AT ULTRALOW POWER LEVELS, AND SYSTEMS THEREOF
CROSS REFERENCE TO RELATED APPLICATIONS
[001] The present application claims priority to US Provisional Application 61/605,462 filed on March 1, 2012, entitled "Methods of Modulating Microlasers at Ultralow Power Levels and Related Devices, " which is incorporated herein in its entirety by reference.
FIELD
[002] The present teachings relate to microlasers. More specifically, the present disclosure relates to microlasers that can be incorporated into a variety of monitoring applications wherein low power consumption is desirable.
BACKGROUND
[003] FIG. 1 shows a prior art microlaser system that includes a photovoltaic power source 105 for providing power via switch 115 to semiconductor microlaser 110 that is arranged in a forward-biased configuration.
[004] When switch 115 is in an open condition, photovoltaic power source 105 is disconnected from microlaser 110, thereby placing microlaser 110 in an off state. However, when switch 115 is closed (as a result of a switch activation signal provided via line 116), photovoltaic power source 105 provides a voltage in the range of 1.5-2V to drive microlaser 110 into an on state and generate output laser beam 111.
[005] The driving voltage (1.5-2V) required to turn on microlaser 110 is roughly ten times higher than what a single photo-voltaic cell can generate in an open circuit condition.
Consequently, the prior art arrangement shown in FIG. 1 necessitates a more complex and expensive photovoltaic power source 105 incorporating multiple photovoltaic cells in a tandem arrangement. Furthermore, the manner in which semiconductor microlaser 110 is operated proves inefficient in terms of power consumption. SUMMARY
[006] According to a first aspect of the present disclosure, a microlaser system includes an optical source, a microlaser, an actuator switch, and a photovoltaic power source. The microlaser, which includes a control element, is optically pumped by at least a portion of light emitted by the optical source. The actuator switch is configured to be activated by a triggering event. The photovoltaic power source is coupled in a series connection with the actuator switch and the control element, the series connection configured to connect the photovoltaic power source to the control element of the microlaser when the actuator switch is activated by the triggering event.
[007] According to a second aspect of the present disclosure, a method of operation includes directing light upon a microlaser for optically pumping the microlaser; and detecting the occurrence of a triggering event based on a change in an optical output of the microlaser, the change in optical output occurring in response to connecting a photovoltaic power source to the microlaser only upon occurrence of the triggering event.
[008] According to a third aspect of the present disclosure, a method of operation includes directing light upon a microlaser for optically pumping the microlaser; and connecting a photovoltaic power source to modify an operational condition of the microlaser only upon occurrence of a triggering event, the modified operational condition indicative of the occurrence of the triggering event.
[009] Further aspects of the disclosure are shown in the specification, drawings and claims of the present application.
BRIEF DESCRIPTION OF THE DRAWINGS
[010] The accompanying drawings, which are incorporated into and constitute a part of this specification, illustrate one or more embodiments of the present disclosure and, together with the description of a few example embodiments, serve to explain the principles and implementations of the disclosure. The components in the drawings are not necessarily drawn to scale. Instead, emphasis is placed upon clearly illustrating various principles. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. [Oil] FIG. 1 shows a prior art microlaser system that includes a semiconductor microlaser arranged in a forward-biased configuration.
[012] FIG. 2 shows a first embodiment of a microlaser system incorporating a
temperature-based control element in accordance with the present disclosure.
[013] FIG. 3 shows a second embodiment of a microlaser system incorporating a piezoelectric -based control element in accordance with the present disclosure.
[014] FIG. 4 shows a third embodiment of a microlaser system incorporating a capacitor- based control element in accordance with the present disclosure.
[015] FIG. 5 shows a fourth embodiment of a microlaser system incorporating a reverse biased diode-based control element in accordance with the present disclosure.
[016] FIGs. 6 A and 6B show graphs depicting a time profile of intensity and wavelength of a pump light (an emitted beam) in accordance with the present disclosure.
[017] FIGs. 7 A and 7B show graphs depicting a time profile of intensity and wavelength of a pump light (an emitted beam) in accordance with the present disclosure.
[018] FIG. 8 shows some structural details of a microlaser incorporating a first embodiment of the capacitor-based control element in accordance with the present disclosure.
[019] FIG. 9 shows some structural details of a microlaser incorporating a second embodiment of the capacitor-based control element in accordance with the present disclosure.
[020] FIG. 10 shows some structural details of a microlaser incorporating the
piezoelectric -based control element in accordance with the present disclosure.
[021] FIG. 11 shows some structural details of a microlaser incorporating the
temperature-based control element in accordance with the present disclosure. DETAILED DESCRIPTION
[022] Throughout this description, embodiments and variations are described for the purpose of illustrating uses and implementations of the inventive concept. The illustrative description should be understood as presenting examples of the inventive concept, rather than as limiting the scope of the concept as disclosed herein.
[023] The various embodiments described herein are generally directed at a microlaser system that may be used in various monitoring applications, including applications involving detection of one or more occurrences of an event. The microlaser system incorporates a microlaser which is optically pumped into operation based on
photoluminescence by a light source (thereby avoiding a power penalty associated with using a separate power source, such as a photovoltaic cell). The microlaser emits a laser beam when pumped into operation by the light source.
[024] The microlaser system further incorporates an event sensor circuit that provides a trigger signal to a switch. When a triggering event occurs, the switch is activated by the trigger signal, and a photovoltaic power source is coupled to a control element of the microlaser. When energized by the photovoltaic power source, the control element (which can be implemented in a variety of ways, some of which are described below) operates to cause a change in characteristic (wavelength, intensity etc.) of the emitted laser beam. This change in characteristic (which may be alternatively understood as modulation of an emitted laser beam) may be used to optically communicate the occurrence of the event.
[025] Significantly, rather than using the photovoltaic power source to provide an electrical voltage/current (power) to drive the microlaser in the manner indicated in prior art FIG. 1, the photovoltaic power source is used to provide power for driving the control element instead. The power consumption of the control element is low enough to permit a relatively small photovoltaic power source to be used, thereby providing cost and efficiency benefits over prior art systems that use complex, higher capacity, and expensive photovoltaic power sources.
[026] Four types of control elements and the corresponding changes in characteristics of the emitted laser beam are described below in accordance with the invention. In broad terms, the four types of control elements enable modulation of the emitted laser beam on the basis of temperature variation, piezoelectric deformation, capacitance variation, and electronic forward/reverse biasing of the microlaser.
[027] To elaborate upon these aspects in more detail, attention is first drawn to FIG. 2, which shows a first embodiment of a microlaser system 200 based on varying the temperature of a microlaser whereby a wavelength shift and/or an intensity change is impressed upon an emitted beam of light. Microlaser system 200, which can be used for detecting various types of event occurrences (triggering events) in a wide variety of applications, includes microlaser 210 that is optically pumped into operation based on photoluminescence by a light source 225.
[028] As can be understood, unlike prior art systems wherein a photovoltaic power source containing a significant number of photovoltaic cells is needed to drive a microlaser, in the embodiment shown in FIG. 1, photovoltaic power source 205 can be a low power source that generates low Open circuit voltage' and current. More particularly, the open circuit voltage which is used to drive a control element (rather than the microlaser itself), is around 0.5 V, which is about 4 times smaller than what is required in prior art systems.
[029] In the example embodiment shown in FIG. 2, the control element is a heater element, more particularly a micro-heater 230. Other types of control elements will be described below using other embodiments. Micro-heater 230 is in contact with a surface of microlaser 210, for example, a bottom surface of microlaser 210, such that heat provided by micro-heater 230 affects the active layer (not shown) of microlaser 210 and
consequently changes a wavelength and/or an intensity of emitted beam 211.
[030] A photovoltaic power source 205, which is configured to receive light from light source 220, convert the received light into electrical power, and provide the electrical power to micro-heater 230 when actuator switch 215 is in a closed (on) position. Actuator switch 215 is turned on/off (closed/open) on the basis of a trigger signal provided on line 216. The trigger signal is derived from an event sensor circuit (not shown) that is selected on the basis of various applications. In one example implementation, event detection system 200 is partially or entirely embedded inside an animate object (such as a human being for example), and used to detect the occurrence of various biomedical events, such as for example, when an undesirable substance carried in the bloodstream of the animate object exceeds a threshold level.
[031] Furthermore, in this example embodiment as well as other embodiments described herein, light sources 220 and 225 may be combined into a single light source, a laser for example. In the example biomedical implementation described above, such a laser may be also embedded into the animate object for providing light to photovoltaic power source 205 and microlaser 210. The emitted beam 211 from microlaser 210 may be observed through suitable viewing ports provided in the animate object, or by using optical fiber to optically transport emitted beam 211 out of the animate object.
[032] Micro-heater 230 may be implemented in a variety of ways. In one example implementation based on platinum/titanium (Pt/Ti) [3], micro-heater 230 can be selected to provide a localized temperature of around 150°C when provided with 2.25 mW of driving power (0.75V x 3mA) from photovoltaic power system 205. At a driving power of 1 mW (0.5V x 2 mA), the localized temperature can reach 75°C.
[033] Attention is next drawn to FIG. 3, which shows a second embodiment of an event detection system 300 based on piezoelectric deformation of a portion of microlaser 310. The piezoelectric deformation results in a wavelength shift and/or an intensity change in an emitted beam of light. More particularly, in contrast to micro-heater 230 which is the control element in the first example embodiment, in this example embodiment, the control element is a piezoelectric layer 330 that may be fabricated as an integral layer inside microlaser 310. Piezoelectric layer 330 is a p-i-n doped layer that can be actuated by application of a low voltage under a reverse biased condition.
[034] In one example implementation, piezoelectric layer 330 is significantly deformed when photovoltaic power system 205 provides a few hundred millivolts. This mechanical deformation causes emitted beam 211 to undergo a change in wavelength - either an increase or a decrease in wavelength depending on the way microlaser 310 is fabricated. The electrical power provided by photovoltaic power system 205 for enabling this wavelength change is as low as a few nW because there is essentially no current flow through microlaser 310 that is configured to operate in a reverse biased state (by suitable polarity-based connections between microlaser 310 and photovoltaic power system 205).
[035] FIG. 4 shows a third embodiment of an event detection system 400 based on varying a capacitive element 430 that is a part of microlaser 410. In one example implementation, capacitive element 430 is a metallic membrane located above an active layer (described below in more detail using FIG. 8) of microlaser 410. The metallic membrane is deflected closer to a lasing disk upon application of a voltage provided by photovoltaic power system 205. The deflection results in an increase in light scattering by the metallic membrane and/or absorption of light in the metallic membrane and switches off microlaser 410.
[036] In another example implementation, a thin insulating layer separates two microdisks (described below in more detail using FIG. 9) that operate as a lasing cavity. The separation distance between the two micro-disks can be changed by electrostatic deflection of one or both of these two micro-disks upon application of a voltage provided by photovoltaic power system 205. The change in separation distance in microlaser 410 is intended as a means to alter a quality factor of the microlaser (in other word, Q-switching) and/or a resonant wavelength of the microlaser. As a result, wavelength/intensity of emitted beam 211 can be modulated in response to the triggering signal 212. The power provided by photovoltaic power system 205 for enabling this action is quite low because there is essentially no current flow through microlaser 410 that is configured to operate in a reverse biased state by suitable polarity-based connections between microlaser 410 and
photovoltaic power system 205.
[037] FIG. 5 shows a fourth embodiment of an event detection system 500 based on electronic reverse biasing of microlaser 510, which may be interpreted as integrally incorporating a reverse-biased diode assembly. The electronic reverse biasing, which is carried out by suitable polarity-based connections between microlaser 510 and photovoltaic power system 205, is operative to changing the carrier concentration within microlaser 510. In this embodiment, light source 225 provides enough light to optically pump enough carriers within microlaser 510 so as to exceed a lasing threshold. An electrostatic field can be used to move carriers inside microlaser 510. In this approach, the carrier depletion close to the active lasing material inside microlaser 510 results in turning off microlaser 510. The resulting on-off binary nature of the emitted beam 211 can be used to carry digital information optically. The electrical power provided by photovoltaic power system 205 is quite low because there is essentially no current flow through microlaser 510 that is configured to operate in the reverse biased state.
[038] In an alternative approach, in lieu of the reverse bias, a forward bias can be used to supply more carriers inside microlaser 510 so as to increase a laser gain. In this approach, light source 225 provides a stationary laser gain within microlaser 510 at a level close to/above a lasing threshold of the microlaser 510, which results in stationary laser emission 211 whose intensity does not change in time. Intensity of the emitted beam 211 can be modulated (increased) in response to the forward biased current by the photovoltaic power system 205. The electrical power provided by photovoltaic power system 205 for enabling this action is relatively low in comparison to prior art implementations.
[039] Attention is next drawn to FIG. 6A which shows a train of optical pulses provided by pump light source 225 to wirelessly power any of the microlaser embodiments described above. The train of optical pulses can be characterized by using a variety of parameters such as, a pulse period, a pulse width, a duty cycle, and/or a repetition rate. One or more of these parameters may be varied in accordance with one or more respective applications. For example, in a biological application where it is undesirable to overheat biological samples, it may be preferable to use pulse widths in the range of tens of nanoseconds. However, in certain other applications this low pulse width may not be suitable and consequently, a larger pulse width may be selected.
[040] As for duty cycles, microlasers can be operated at duty cycles of 1% to 10% when a pulse period is in the range of 0.1 μ8 to a few μ8. Some advanced microlasers having ultra- low thresholds may be operated continuously (100% duty cycle) without encountering thermal problems. Peak power to operate a microlaser is typically about lkW/cm . About 10-20% of the pump light power 225 incident on some microlasers may be absorbed by the microlasers and used to create population inversion in the active layer.
[041] FIG. 6A further shows a graph of light intensity versus wavelength (in other words, 'spectrum'), wherein wavelength λρ represents the wavelength of the light provided by light source 225 to wirelessly power any of the microlaser embodiments described above. In certain embodiments, this wavelength may not only be used by light source 225 but by light source 220. As indicated above, these two light sources may be implemented as a merged, single light source.
[042] FIG. 6B shows a train of emitted beam pulses 211 from the microlaser
embodiments described above. The train of microlaser output pulses is synchronized with that of the pump laser 225. The microlaser 211 is operated at a wavelength of λε, which is longer than that of the pump light wavelength λρ. In the absence of a triggering 'event' 212, the peak output intensity and the emission wavelength λ6 do not change in time.
[043] FIG. 7A shows a train of optical pulses that is provided by light source 225 at a wavelength of λρ to wirelessly power any of the microlaser embodiments described above. FIG. 7A further shows a graph of wavelength versus time. As can be understood, the wavelength of λρ remains unchanged over time regardless of the presence of an event (which would close actuator switch 215 but could not affect the pump light source 225).
[044] On the other hand, FIG. 7B illustrates a change in the time profile 705 of the event as a result of the occurrence of the event. The change in time profile 705 is characterized by a change in the intensity of emitted beam 211 in accordance with certain embodiments of the invention. In these and/or embodiments, a change in the wavelength (Δλε>0 or <0) of emitted beam 211 may take place along with the intensity change as indicated in the graph of wavelength versus time.
[045] FIG. 8 shows some structural details of a microlaser 410 incorporating a first embodiment of the capacitor-based control element in accordance with the present disclosure. In this embodiment, capacitive element 430 (shown in FIG. 4) is a metallic membrane 830 separated by a gap 835 from lasing structure 825, which includes an active layer 815. Metallic membrane 830 is deflected closer to active layer 815 upon application of a voltage that is provided by photovoltaic power system 205 (shown in FIG. 4). The deflection results in an increase in light scattering by the metallic membrane and/or absorption of light in the metallic membrane and switches off microlaser 410. Layers 805 and 820 are configured as electrodes located on opposing sides of lasing structure 825 for application of the voltage by photovoltaic power system 205.
[046] FIG. 9 shows some structural details of a microlaser 410 incorporating a second embodiment of the capacitor-based control element in accordance with the present disclosure. In this embodiment, capacitive element 430 is formed of an insulating layer 30 separating two micro-disks 35 and 40 (having active layers 15 and 20 respectively). The separation distance between the two micro-disks can be changed by electrostatic deflection of one or both of these two micro-disks upon application of a voltage (provided by photovoltaic power system 205). The change in separation distance causes microlaser 410 to be detuned out of the gain region, thereby resulting in a change in wavelength/intensity of emitted beam 211.
[047] FIG. 10 shows some structural details of a microlaser 310 incorporating the piezoelectric -based control element in accordance with the present disclosure. Microlaser 310 includes a pair of electrodes 50 and 55 that are located on opposite surfaces of layered structure 60, which includes multiple p-i-n layers. An intrinsic layer 57 serves as both an active layer and a piezoelectric layer. Under a reverse bias condition, the voltage applied via electrodes 50 and 55 induces mechanical stress in intrinsic layer 57 based on the piezoelectric nature of this layer. The mechanical stress causes the brim of layered structure 60 to deform, which in turn changes the emission wavelength (λε) of the emitted beam 211 (shown in FIG. 3). The change in wavelength is typically of the order of a few nanometers.
[048] FIG. 11 shows some structural details of a microlaser 210 incorporating the temperature-based control element in accordance with the present disclosure. Microlaser 210 includes a metal pedestal 85 that is in contact with a microlaser layer 80. In some example implementations, metal pedestal 85 is made of one or more metals such as gold and platinum. Such metals operate as very good thermal as well as electrical conductors. Heat generated by heater 230 (shown in FIG. 2), which may be located inside metal pedestal 85 or external to metal pedestal 85, is efficiently delivered to microlaser layer 80 via metal pedestal 85. In one embodiment, where emitted beam 211 operates at a wavelength of 1.3 μιη, microlaser layer 80 may incorporate an indium gallium arsenide phosphate (InGaAsP) compound. The diameter of microlaser layer 80 can be in a range of 3 to 5 μιη, which results in single mode lasing operation.
[049] It is generally known that a refractive index (n) of indium phosphate (InP), which is widely used as a backbone material for building a microlaser emitting at near infrared wavelengths, is a function of temperature (T) with dn/dT = 2 x 10"4. [4]. For prior art microlaser designs emitting at near infrared wavelengths, this thermal coefficient can be translated into dλe/dT - 0.1 nm/K, where λε is the emission wavelength of the laser[5], which implies that, if ΔΤ (temperature change)= 50 K, one should observe about Δλ6=5 nm red-shift in the wavelength of emitted beam 211. Therefore, as shown in FIG. 6B, one would observe a wavelength increase of a few nanometers.
[050] Most microlasers undergo noticeable degradation in output power upon an increase in the temperature of operation because the gain of a microlaser tends to decrease as temperature increases. In accordance with the disclosure, the modified operational conditions of a microlaser, more particularly the changes in the emission wavelength and/or the changes in the intensity of emitted beam 211, can be used to detect an occurrence of an event.
[051] Emitted beam 211 may be transported via a wide variety of transmission media, such as for example, free space optics and optical fiber media, and may be used for providing various types of information depending on the type of application in which the various embodiments described herein are used. For example, in a first application, the information may be a digital bit stream that indicates occurrence or non-occurrence of an event, or carries digital communication data. In a second application, the information pertains to voltage levels and/or current levels present in various elements of a system (for example, on line 216, or on the lines that couple photovoltaic power source 205 to the microlaser).
[052] Furthermore, the microlaser systems described herein can be used in a side variety of environments, such as in an in-vivo environment described above. In another implementation, the system may be integrated into certain structures, such as for example, a wing of an airplane made of a composite material. A suitable transparent epoxy window may be used in such an implementation for propagating emitted beam 211.
[053] All patents and publications mentioned in the specification may be indicative of the levels of skill of those skilled in the art to which the disclosure pertains. All references cited in this disclosure are incorporated by reference to the same extent as if each reference had been incorporated by reference in its entirety individually.
[054] It is to be understood that the disclosure is not limited to particular methods or systems, which can, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting. As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. The term "plurality" includes two or more referents unless the content clearly dictates otherwise. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the disclosure pertains.
[055] The examples set forth above are provided to give those of ordinary skill in the art a complete disclosure and description of how to make and use the embodiments described herein, and are not intended to limit the scope of what the inventors regard as their disclosure. Modifications of the above-described modes for carrying out the disclosure may be used by persons of skill in the relevant arts, and are intended to be within the scope of the following claims.
[056] A number of embodiments of the disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the present disclosure. Accordingly, other embodiments are within the scope of the following claims. LIST OF REFERENCES
[1] A. Scherer, et al. "Systems and methods for optically powering transducers and related transducers," US patent Pub. No. US2011/0044694 Al.
[2] M. Fujita, et al. "Continuous wave lasing in GalnAsP microdisk injection laser with threshold current of 40 μΑ," Electron. Lett., Vol. 36, pp. 790-791 (2000).
[3] Y. Mo, et al. "Micro-machined gas sensor array based on metal film micro-heater,"
Sensors and Actuators B, Vol. 79, pp. 175-181 (2001).
[4] R. Ushigome, et al. "GalnAsP microdisk injection laser with benzocyclobutene polymer cladding and its athermal effect," Jpn. J. Appl. Phys., Vol. 41, pp. 6364-
6369 (2002).
[5] K. lnoshita and T. Baba, "Fabrication of GalnAsP/InP photonic crystal lasers by ICP etching and control of resonant mode in point and line composite defects," IEEE J. Sel. Top. Quantum Electron., Vol. 9, pp. 1347-1354 (2003).
[6] A. S. Sadek, et al., "Wiring nanoscale biosensors with piezoelectric nanomechanical resonators," Nano Lett., Vol. 10, pp. 1769-1773 (2010).

Claims

CLAIMS What is claimed is:
1. A microlaser system comprising:
an optical source;
a microlaser that is optically pumped by at least a portion of light emitted by the optical source, the microlaser comprising a control element;
an actuator switch configured to be activated by a triggering event; and a photovoltaic power source coupled in a series connection with the actuator switch and the control element, the series connection configured to connect the photovoltaic power source to the control element of the microlaser when the actuator switch is activated by the triggering event.
2. The system of claim 1, wherein the at least a portion of light comprises a train of pulses that wirelessly power the microlaser.
3. The system of claim 2, wherein at least one of a pulse width or a duty cycle of the train of pulses is selected on the basis of a thermal threshold of operation of the microlaser.
4. The system of any one of claims 1-3, wherein the microlaser is configured to
receive a first portion of light emitted by the optical source and the photovoltaic power source is configured to receive a second portion of light emitted by the optical source.
5. The system of claim 4, wherein the photovoltaic power source is operative to
converting the second portion of light into electrical power, and wherein the microlaser is operative to use the first portion of light to enter a lasing state without using the electrical power of the photovoltaic power source.
6. The system of any one of claims 1-5, wherein the control element comprises a heater element configured to heat at least a portion of the microlaser for modifying an optical output of the microlaser upon an occurrence of the triggering event.
7. The system of any one of claims 1-5, wherein the control element comprises a
piezoelectric assembly configured for modifying the optical output of the microlaser on the basis of a mechanical deflection of at least one element of the piezoelectric assembly when the photovoltaic power source is connected to the piezoelectric assembly upon an occurrence of the triggering event.
8. The system of any one of claims 1-5, wherein the control element comprises a diode assembly configured for modifying the optical output of the microlaser on the basis of a change in reverse bias applied to the diode assembly when the photovoltaic power source is connected to the diode assembly upon an occurrence of the triggering event.
9. The system of any one of claims 1-5, wherein the control element comprises a
capacitive assembly configured for modifying the optical output of the microlaser on the basis of an electrostatic displacement of at least one element of the capacitive assembly when the photovoltaic power source is connected to the capacitive assembly upon an occurrence of the triggering event.
10. The system of claim 9, wherein the at least one element of the capacitive assembly is a metallic membrane configured to undergo electrostatic displacement that modifies a lasing current of the microlaser.
11. The system of claim 9, wherein the at least one element of the capacitive assembly is a multilayer assembly and at least one layer of the multilayer assembly is configured to undergo electrostatic displacement that detunes the microlaser.
12. The system of claim 11, wherein detuning the microlaser comprises at least one of a) changing a wavelength of the optical output of the microlaser, or b) changing an intensity of the optical output of the microlaser.
13. A method of operation comprising:
directing light upon a microlaser for optically pumping the microlaser; and detecting the occurrence of a triggering event based on a change in an optical output of the microlaser, the change in optical output occurring in response to connecting a photovoltaic power source to the microlaser only upon occurrence of the triggering event.
14. The method of claim 13, further comprising:
reducing power consumption by disconnecting the photovoltaic power source from the microlaser during an absence of the triggering event.
15. The method of claim 14, wherein directing light upon the microlaser comprises using a light source to direct a first portion of light upon the microlaser and a second portion of light upon the photovoltaic power source.
16. The method of claim 15, wherein connecting the photovoltaic power source to the microlaser comprises connecting the photovoltaic power source to one of: a) a heater element located in the microlaser, b) a diode assembly located in the microlaser, c) a piezoelectric assembly located in the microlaser, or d) a capacitive assembly located in the microlaser.
17. A method of operation comprising:
directing light upon a microlaser for optically pumping the microlaser; and connecting a photovoltaic power source to modify an operational condition of the microlaser only upon occurrence of a triggering event, the modified operational condition indicative of the occurrence of the triggering event.
18. The method of claim 17, wherein modifying the operational condition of the
microlaser comprises heating at least a portion of the microlaser for modifying at least one of a wavelength or an intensity of the optical output of the microlaser. The method of claim 17, wherein modifying the operational condition of the microlaser comprises mechanical deflecting at least one element of a piezoelectric assembly that is a part of the microlaser.
The method of claim 17, wherein modifying the operational condition of the microlaser comprises an electrostatic displacement of at least one element of capacitive assembly that is a part of the microlaser.
The method of claim 17, wherein modifying the operational condition of the microlaser comprises changing a reverse bias applied to a diode assembly that part of the microlaser.
PCT/US2013/025632 2012-03-01 2013-02-11 Methods of modulating microlasers at ultralow power levels, and systems thereof WO2013130257A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261605462P 2012-03-01 2012-03-01
US61/605,462 2012-03-01

Publications (1)

Publication Number Publication Date
WO2013130257A1 true WO2013130257A1 (en) 2013-09-06

Family

ID=49042815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/025632 WO2013130257A1 (en) 2012-03-01 2013-02-11 Methods of modulating microlasers at ultralow power levels, and systems thereof

Country Status (2)

Country Link
US (2) US9031102B2 (en)
WO (1) WO2013130257A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011022690A2 (en) 2009-08-21 2011-02-24 California Institute Of Technology Systems and methods for optically powering transducers and related transducers
WO2013130257A1 (en) 2012-03-01 2013-09-06 California Institute Of Technology Methods of modulating microlasers at ultralow power levels, and systems thereof
JP2015530564A (en) 2012-07-25 2015-10-15 カリフォルニア インスティチュート オブ テクノロジー Nanopillar field effect and junction transistors with functional gate and base electrodes
US8883645B2 (en) 2012-11-09 2014-11-11 California Institute Of Technology Nanopillar field-effect and junction transistors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825081A (en) * 1987-12-01 1989-04-25 General Electric Company Light-activated series-connected pin diode switch
US6437554B1 (en) * 1999-11-19 2002-08-20 The United States Of America As Represented By The Secretary Of The Interior High current measurement system incorporating an air-core transducer
US20070116082A1 (en) * 2005-09-20 2007-05-24 Jds Uniphase Corporation Modular Solid-State Laser Platform Based On Coaxial Package And Corresponding Assembly Process
US20080089367A1 (en) * 2006-10-03 2008-04-17 Kartik Srinivasan Fiber-Coupled Solid State Microcavity Light Emitters
US20100084729A1 (en) * 2008-08-29 2010-04-08 Gary Steinbrueck Integrated photodiode for semiconductor substrates

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346478A (en) 1980-12-01 1982-08-24 Siemens Corporation Fiber optical sensor system, preferably for measuring physical parameters
FR2598574B1 (en) 1986-05-06 1992-02-28 Matra OPTICAL FREQUENCY MULTIPLEXED DATA TRANSMISSION METHOD AND DEVICE
US4963729A (en) 1989-03-03 1990-10-16 Simmonds Precision Products, Inc. Optically powered sensor system with improved signal conditioning
US5090254A (en) 1990-04-11 1992-02-25 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers
JP3144928B2 (en) 1991-12-19 2001-03-12 株式会社東芝 Optical sensor
JPH05243588A (en) 1992-02-26 1993-09-21 Asahi Glass Co Ltd Optical element module and sensor using the same
US5291502A (en) * 1992-09-04 1994-03-01 The Board Of Trustees Of The Leland Stanford, Jr. University Electrostatically tunable optical device and optical interconnect for processors
US5369657A (en) * 1992-09-15 1994-11-29 Texas Instruments Incorporated Silicon-based microlaser by doped thin films
CN1146029C (en) 1995-06-30 2004-04-14 株式会社东芝 Electronic component and method of production thereof
US5629951A (en) * 1995-10-13 1997-05-13 Chang-Hasnain; Constance J. Electrostatically-controlled cantilever apparatus for continuous tuning of the resonance wavelength of a fabry-perot cavity
EP1024348B1 (en) 1999-01-28 2011-07-27 Denso Corporation Low-frequency noise removing method and a related CMOS sensing circuit
JP2001250967A (en) 2000-03-03 2001-09-14 Canon Inc Photovoltaic element and manufacturing method therefor
US6757467B1 (en) 2000-07-25 2004-06-29 Optical Air Data Systems, Lp Optical fiber system
US20030099273A1 (en) 2001-01-09 2003-05-29 Murry Stefan J. Method and apparatus for coupling a surface-emitting laser to an external device
US6970619B2 (en) * 2001-05-21 2005-11-29 Lucent Technologies Inc. Mechanically tunable optical devices such as interferometers
US20030090161A1 (en) * 2001-10-19 2003-05-15 Marlow C. Allen Light communication channel-based electronics power distribution system
US6549687B1 (en) * 2001-10-26 2003-04-15 Lake Shore Cryotronics, Inc. System and method for measuring physical, chemical and biological stimuli using vertical cavity surface emitting lasers with integrated tuner
KR100425477B1 (en) * 2001-12-07 2004-03-30 삼성전자주식회사 Circuit for protecting lighting element
SE524828C2 (en) 2002-06-06 2004-10-12 Alfa Exx Ab Resonator
US6836578B2 (en) * 2003-04-14 2004-12-28 Lake Shore Cryotronics, Inc. System and method for measuring physical stimuli using vertical cavity surface emitting lasers with integrated tuning means
US6963119B2 (en) 2003-05-30 2005-11-08 International Business Machines Corporation Integrated optical transducer assembly
US7387892B2 (en) * 2004-09-01 2008-06-17 Palo Alto Research Center Incorporated Biosensor using microdisk laser
WO2006073908A2 (en) 2004-12-30 2006-07-13 E.I. Dupont De Nemours And Company Electronic device having a mirror stack
JP4419886B2 (en) 2005-03-23 2010-02-24 富士ゼロックス株式会社 Photosensor, detected object detection device, and image forming apparatus incorporating this photosensor
JP2006267477A (en) 2005-03-23 2006-10-05 Fuji Xerox Co Ltd Display medium and display medium controller
KR100906270B1 (en) 2006-01-20 2009-07-06 올림푸스 메디칼 시스템즈 가부시키가이샤 An apparatus of analyzing information of an object to be diagnosed, an endoscope apparatus and a method of analyzing information of an object to be diagnosed
WO2008022021A2 (en) 2006-08-10 2008-02-21 Medtronic, Inc. Devices with photocatalytic surfaces and uses thereof
KR100781545B1 (en) 2006-08-11 2007-12-03 삼성전자주식회사 Image sensor with improved sensitivity and method for fabricating the same
US7928471B2 (en) * 2006-12-04 2011-04-19 The United States Of America As Represented By The Secretary Of The Navy Group III-nitride growth on silicon or silicon germanium substrates and method and devices therefor
RU2485626C2 (en) 2007-12-21 2013-06-20 Квалкомм Мемс Текнолоджис, Инк. Multijunction photovoltaic cells
US7965948B1 (en) 2008-01-04 2011-06-21 Simmonds Precision Products, Inc. Power and data transmitted over a single optical fiber
US8682159B2 (en) 2008-07-09 2014-03-25 Tyco Electronics Subsea Communications Llc Optical communication system supporting detection and communication networks
WO2010123592A2 (en) * 2009-01-14 2010-10-28 Research Foundation Of The City University Of New York Flexible microcavities through spin coating
WO2011022690A2 (en) * 2009-08-21 2011-02-24 California Institute Of Technology Systems and methods for optically powering transducers and related transducers
WO2013130257A1 (en) 2012-03-01 2013-09-06 California Institute Of Technology Methods of modulating microlasers at ultralow power levels, and systems thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825081A (en) * 1987-12-01 1989-04-25 General Electric Company Light-activated series-connected pin diode switch
US6437554B1 (en) * 1999-11-19 2002-08-20 The United States Of America As Represented By The Secretary Of The Interior High current measurement system incorporating an air-core transducer
US20070116082A1 (en) * 2005-09-20 2007-05-24 Jds Uniphase Corporation Modular Solid-State Laser Platform Based On Coaxial Package And Corresponding Assembly Process
US20080089367A1 (en) * 2006-10-03 2008-04-17 Kartik Srinivasan Fiber-Coupled Solid State Microcavity Light Emitters
US20100084729A1 (en) * 2008-08-29 2010-04-08 Gary Steinbrueck Integrated photodiode for semiconductor substrates

Also Published As

Publication number Publication date
US20150222073A1 (en) 2015-08-06
US20130230063A1 (en) 2013-09-05
US9407055B2 (en) 2016-08-02
US9031102B2 (en) 2015-05-12

Similar Documents

Publication Publication Date Title
US9407055B2 (en) Methods of modulating microlasers at ultralow power levels, and systems thereof
US10263394B2 (en) Widely tunable swept source
JP6730783B2 (en) Tunable laser device and optical coherence tomography
Ansbæk et al. Resonant mems tunable VCSEL
JP2012044161A (en) Surface emission laser, light source, and optical module
FR2948777A1 (en) OPTICAL FREQUENCY CONTROL DEVICE, METHOD FOR MANUFACTURING SUCH A DEVICE
US20190222000A1 (en) Optoelectronic device based on a surface-trapped optical mode
Slipchenko et al. Fundamental aspects of closed optical mode formation in Fabry–Perot semiconductor lasers based on AlGaAs/GaAs (905 nm) asymmetric heterostructures
JP2014053346A (en) Short optical pulse generator, terahertz wave generator, camera, imaging device, and measuring device
JP2018041771A (en) Light-emitting device and light transmission device
JP2007019313A (en) Optical element and optical module
Chang et al. Electrically tunable organic vertical-cavity surface-emitting laser
JP2808562B2 (en) Semiconductor optical amplifier
Kim et al. Electrothermally actuated Fabry-Pe/spl acute/rot tunable filter with a high tuning efficiency
Chaqmaqchee Gain analysis of vertical-cavity surface-emitting laser for long optical fiber communication
Shimura et al. Non-mechanical beam scanner integrated VCSEL for solid state LIDAR
TWI822147B (en) Surface emitting laser, laser device, detection device, mobile object, and surface emitting laser driving method
US8937978B2 (en) Semiconductor laser
Nakahama et al. Electro-thermal tuning of MEMS VCSEL with giant wavelength-temperature dependence
Amano et al. A thermally tunable GaAlAs-GaAs micromachined optical filter with submillisecond tuning speed
Nakahama et al. Monolithic beam steering device employing slow-light waveguide and tunable MEMS VCSEL
KR20240011783A (en) Surface-emitting laser, laser device, detection device, moving object, and surface-emitting laser driving method
Koyama et al. Micromachined tunable filters using stress control of multilayer semiconductor mirrors
Gierl et al. Widely tunable MEMS-VCSELs operating at> 70 degrees° C
Matsuo et al. Optical flip-flop operation using a DBR laser

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13754217

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13754217

Country of ref document: EP

Kind code of ref document: A1