WO2014166038A1

WO2014166038A1 - Organic semiconductor apparatus

Info

Publication number: WO2014166038A1
Application number: PCT/CN2013/073835
Authority: WO
Inventors: 刘大佼; 杨之光
Original assignee: Liu Tajo; Yang Chihkuang
Priority date: 2013-04-07
Filing date: 2013-04-07
Publication date: 2014-10-16

Abstract

An organic semiconductor apparatus, comprising one first packaging layer, one second packaging layer, one base plate, one organic semiconductor element and one gel. The second packaging layer is disposed in correspondence with the first packaging layer, defining an internal space therebetween. The base plate is disposed within the internal space. The organic semiconductor element is disposed on the base plate and within the internal space. The gel fills the internal space, and is used for engaging the first packaging layer and the second packaging layer to seal the organic semiconductor element, in order to effectively block moisture or gas in the external environment.

Description

Organic semiconductor device

The present invention relates to a semiconductor device; and more particularly to an organic semiconductor device.

Background technique

In recent years, due to the booming of organic semiconductor products, organic light-emitting components have been made

(organic light emitting diodes, OLED), polymer light emitting diodes (PLEDs), organic solar cells, batteries (organic photovoltaics, OPVs), thin solar cells (thin fi lm photovoltaic), flexible liquid crystals Flexible LCD, electric paper, etc., have already played a pivotal role in the current and future markets.

Most of the current 0LEDs use active metals with low work functions to make metal cathodes, so the lifetime of 0LEDs is closely related to the water and oxygen content of the display components. As the use time increases, moisture and oxygen in the environment easily penetrate into the display assembly, and interact with the active metal cathode, which easily causes peeling between the metal cathode and the organic light-emitting layer, material cracking, electrode oxidation, Defects such as darkspots, which greatly reduce the luminous quality of the display components such as luminous intensity and uniformity of illumination.

However, in the case of a display made of OLED, in order to meet the requirements of modern technology for electronic products, replacing the conventional glass substrate with a plastic substrate as a display substrate has become a trend of technology development. The plastic substrate not only provides thinner and lighter characteristics, but also has better flexibility, which further improves the lack of impact and fragility of the conventional glass substrate. However, the biggest disadvantage of plastic substrates over glass substrates is their poor resistance to moisture and oxygen in the external environment. At this time, the components in these organic electronic products are only Contact with moisture and oxygen in the air can cause component damage.

In order to solve the above drawbacks, the use of a gas barrier film (ga s barr i er film) is a recent and widely adopted improvement method for protecting components in organic electronic products from water oxygen and oxygen in the air. Interference, thereby maintaining their functionality and extending their useful life. However, in the current production process of the gas barrier film, often due to the choice of the gas barrier film material or the type of the process, the two phases cannot be balanced in the process, or the surface quality of the substrate is uneven, resulting in a film. Poor surface roughness and defects in various sizes. Furthermore, since some commonly used gas barrier film materials are less flexible, such as: inorganic materials, in the process of flexing, if further applied to the flexible flexible electronic products currently prevailing in the foregoing, It is also prone to problems such as rupture of the membrane surface. It is not difficult to imagine that the above defects will reduce the gas barrier capacity of the gas barrier film, allowing molecular-scale moisture and oxygen to enter the organic electronic product through these defects. Traditionally, the component is damaged by moisture and oxygen. eradicate.

Summary of the invention

In view of the above, it is a primary object of the present invention to provide an organic semiconductor device which seals an organic semiconductor element through a gel and an encapsulating layer, and effectively blocks the erosion of the organic semiconductor element by moisture or gas in an external environment.

To achieve the above objective, the present invention provides an organic semiconductor device comprising: a first encapsulation layer; a second encapsulation layer corresponding to the first encapsulation layer and defined between the first encapsulation layer An internal space; a substrate disposed in the internal space; an organic semiconductor component disposed on the substrate and located in the internal space; and a solid body filled in the internal space for mating The first encapsulation layer and the second encapsulation layer seal the organic semiconductor element. Further, the The first and second encapsulating layers of the gel are used to block moisture or gas from the external environment.

In a preferred embodiment of the invention, the first encapsulation layer and the second encapsulation layer are a substance having a plurality of static pores. Further, the gel is used to fill a portion of the plurality of static pores, wherein the gel is a substance having no static pores.

In this preferred embodiment, the gel is a liquid substance or a colloidal substance. Preferably, the liquid substance is a polar or non-polar liquid. a hydrogen bond molecule, a functional group molecule or a charged ion is added to the polar liquid, and the functional group molecule added to the gel includes -0H, -0-, =C0, _F, -Li 2, or -N =N functional group (most of the above functional groups are polar molecules).

In a preferred embodiment of the invention, the liquid substance is a non-polar liquid. In addition, the liquid substance may also be a non-volatile liquid, and the non-volatile liquid may be selected from the group consisting of a lubricating oil, a silicone oil, a glycerin, an ionic liquid, a non-edible soybean oil and a non-volatile organic alcohol. Group.

In a preferred embodiment of the invention, the gel is added with an anti-corrosion additive. In a preferred embodiment of the invention, the first encapsulation layer and/or the second encapsulation layer are made of a polymer material. More specifically, the substrate is made of the same material as the first encapsulation layer and the second encapsulation layer.

In a preferred embodiment of the invention, the organic semiconductor component is one selected from the group consisting of an organic light emitting diode, a polymer light emitting diode, an organic solar cell, and an organic thin film transistor.

The organic semiconductor device of this embodiment further includes at least one lead connecting the organic semiconductor element and an external component. In addition to this, The condensate is added with an anti-corrosion additive. Furthermore, the at least one pin comprises a protective coating. In this preferred embodiment, the first encapsulation layer and the second encapsulation layer are thermocompression bonded around the inner space. More specifically, a portion of the at least one pin is clamped to the thermal compression of the first encapsulation layer and the second encapsulation layer.

In another preferred embodiment of the present invention, the organic semiconductor device further includes an adhesive for bonding between the first encapsulation layer and the second encapsulation layer, and defining the Internal space. Additionally, the at least one pin is connected to the outer component through the sealant. In this preferred embodiment, the sealant comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.

The invention utilizes a liquid or gel-like gel to encapsulate the organic semiconductor component in the first and second encapsulation layers, so that the gel fills the first and second packages on the interface with the encapsulation layer The plurality of static pores of the layer portion, thereby blocking moisture of the organic semiconductor element by moisture or gas blocking the external environment. Accordingly, the present invention achieves the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element by moisture or gas in the external environment.

DRAWINGS

1 is a cross-sectional view showing an organic semiconductor device according to a preferred embodiment of the present invention;

2 is a schematic plan view of the organic semiconductor device of FIG. 1;

3 is a cross section of an organic semiconductor device according to another preferred embodiment of the present invention. detailed description

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the organic semiconductor device of the present invention will be described in detail with reference to the accompanying drawings. Referring to Figure 1, Figure 1 is a cross-sectional view of an organic semiconductor device in accordance with a preferred embodiment of the present invention. The organic semiconductor device 10 of the present invention includes a first encapsulation layer 120, a second encapsulation layer 140, a substrate 150, an organic semiconductor device 160, and a conden s ed mater 180.

As shown in FIG. 1, the second encapsulation layer 140 is disposed corresponding to the first encapsulation layer 120, and defines an internal space 130 between the first encapsulation layer 120 and the first encapsulation layer 120. In the preferred embodiment, the first encapsulation layer 120 and/or the second encapsulation layer 140 are made of a polymer material. Preferably, the first encapsulation layer 120 and the second encapsulation layer 140 are made of the same material. However, the present invention is not limited thereto, and the first encapsulation layer 120 and the second encapsulation layer 140 may also be two different materials.

Specifically, the first encapsulation layer 120 and the second encapsulation layer 140 are made of a flexible material, which may be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene. (PP), polyvinyl chloride (PVC), etc. Among them, PET and PE materials are often used, and because PET materials are cheaper and have certain cost advantages, they are more commonly used for soft electronic products. In addition, it is further explained that when the first encapsulating layer 120 and the second encapsulating layer 140 provided by the present invention are to be applied to an optoelectronic electronic product, the material has a transmittance of more than 85%.

The substrate 150 is disposed in the internal space 130 formed by the first encapsulation layer 120 and the second encapsulation layer 140. Preferably, the substrate 150 is made of the same material as the first encapsulation layer 120 and the second encapsulation layer 140, for example, a flexible polymer material. Next, the organic semiconductor device 160 is disposed on the substrate 150 and located inside the substrate Between 130. Further, the organic semiconductor device 160 is selected from the group consisting of an organic light emitting diode (OLED), a polymer light emitting diode (PLED), an organic solar cell (PVC), and an organic thin film transistor (OFFF). One of the groups.

In this embodiment, the organic semiconductor device 160 is an organic light emitting diode having a multilayer structure such as an anode, a cathode, a hole transport layer, a light emitting layer and an electron transport layer, which are well known to those skilled in the art (not shown). , I will not repeat them here. It is worth mentioning that the substrate 150 is of the same material as the first encapsulation layer 120 and the second encapsulation layer 140, for example, a flexible polymer material.

As shown in FIG. 1, the body 180 is filled in the internal space 130 for sealing the organic semiconductor element 160 with the first encapsulation layer 120 and the second encapsulation layer 140. Accordingly, the condensed body 180 cooperates with the first encapsulation layer 120 and the second encapsulation layer 140 to block the external environment from moisture or gas from eroding the organic semiconductor device 160.

In the present embodiment, the uppermost and lowermost layers of the organic semiconductor device 160 are electrodes. Usually, the uppermost layer is aluminum and the lowermost layer is an IT0 transparent electrode, and the uppermost layer electrode contacts the gel 180. The lowermost layer electrode also contacts the gel due to the lead wire being closed. 180.

Specifically, since the organic semiconductor element 160 is in contact with the condensed body 180, the condensed body 180 may be added with an anti-corrosion additive to further prevent corrosion or aging of the surface electrode of the organic semiconductor element 160, such as: an antioxidant, or for a specific metal (eg, : Corrosion inhibitor of aluminum electrode) makes the surface electrode of organic semiconductor element 160 extremely resistant to oxidation or metal ion elution, and electrochemical cell reaction does not occur. Specifically, some cationic surfactant (anion) is added to the gel 180. Surfactant), such as: Hexadecyl sulphate sodium salt, Dodecy 1 benzene sulfonate sodium salt, or Additional hexavalent ion (eg, heavy acid salt) to form Chromate conversion coatings on aluminum metal surfaces , can protect the surface of the semiconductor element 160 aluminum electrode.

On the other hand, a protective coating may be formed on the surface electrode of the organic semiconductor element 160 in advance for protection. Since IT0 itself is more resistant to aluminum metal corrosion, no special anti-corrosion scheme is required, but as the composition of the gel 180 is different, a corrosion inhibitor for ICO corrosion can be added as needed.

The principle of the barrier 180 blocking moisture or gas will be described in detail below. The first encapsulation layer and the second encapsulation layer are a substance having a plurality of static pores, and the static pores may be a free volume between molecules or a defect in its structure. The solid body 180 forms a junction with the first encapsulation layer 120 and the second encapsulation layer 140 around the inner space 130, and the gel 180 is used to fill the plurality of static apertures adjacent to the junction portion. , in order to form a junction of high barrier performance.

Further, according to the present invention, the foregoing condensed body 180 is formed of a substance which is not solid or has a continuous phase, such as a liquid substance or a colloidal substance. Therefore, the solid body 180 can fill a portion of the static pores of the first and second encapsulation layers 120, 140 close to the junction. Thereby, when the moisture or gas of the external environment (especially oxygen) passes through the path of the static pores in the first and second encapsulating layers 120, 140, a high concentration gradient is formed near the barrier interface, It is not conducive to the diffusion phenomenon required for moisture or gas to enter the condensed body 180, and thus the moisture or gas of the external environment is more difficult to enter the condensed body 180.

Specifically, the gel 180 is a substance having no static pores. For example, the condensed body 180 is a liquid substance or a colloidal substance, wherein the liquid substance is a pole A non-polar liquid, preferably a non-polar liquid. As described above, the solid body 180 of the present invention mainly utilizes the continuity of the liquid to achieve the effect of blocking water and gas. The liquid selected for the gel 180 can be a volatile liquid, a non-volatile liquid or a flowable colloid. In a preferred embodiment, the thickness of the gel 180 is between 10 and 100 μπι. In addition, the condenser 180 is preferably a non-volatile liquid, and the non-volatile liquid may be selected from the group consisting of a lubricating oil, a silicone oil, a glycerin, an ionic liquid, a non-edible soybean oil, and a non-volatile organic alcohol. However, as mentioned above, the gel 180 of the present invention may also be a volatile liquid or a flowable colloid, and substantially the material used for the gel 180 may be the same as the first encapsulation layer 120 and the second package. Layer 140

The material has good compatibility, and the invention is not limited to the above materials.

However, the invention is not limited to practice with only non-polar liquids. After the addition of the anti-corrosion additive to the gel 180, the liquid selectivity will increase. For example, the gel 180 may further comprise or add polar molecules. Polar molecules may include hydrogen bonding molecules, compliant functional group molecules or charged ions. Thereby, the effect of the barrier can be further improved, and there is a strong force between the gas molecules and the liquid molecules, so that moisture or gas (especially oxygen is adsorbed to the first and second encapsulating layers 120, 140 and the gel) 180 barrier surfaces are formed, and due to the aforementioned strong force, the gas or gas (especially oxygen) is not easily separated from the interface, which is not conducive to the diffusion of moisture or gas (especially oxygen) and its absorption by the gel 180. That is, the diffusion phenomenon is thus greatly reduced. Therefore, according to the polar molecules in the foregoing embodiments of the present invention, the effect of the moisture or gas of the external environment on the erosion of the organic semiconductor element 160 can be further reduced.

In an embodiment of the invention, the selected colloid 180 may further comprise or add at least one chemical molecule, the chemical molecule comprising a specific functional group for use in moisture Water molecules produce hydrogen bonds or produce polar molecules. Furthermore, the chemical molecule may also include a specific functional group for oxygen molecules in oxygen, and the following figure is an example of a coordination compound with oxygen molecules (for example, Heme Heme):

[(THF)(F ₈ )Fe'"(0 ₂ )] [(P ^PY )Fe ⁿⁱ (0 ₂ -)] [(P ^lm )Fe ^m (0 ₂ -)] Coordination of another oxygen molecule Compound example:

Or a carbon dioxide molecule in the external environment to produce a coordination compound (c oor d i nat i on comp l ex). Examples of coordination compounds with carbon dioxide:

Also, the selected body 180 may further include or add a plurality of polar molecules. The polar molecule includes a hydrogen bond molecule, a specific functional group molecule or a charged ion, and a strong force between the gas molecule and the liquid molecule, for example, -0H, -0-, =C0, - F, -Li, -N=N, etc. The moisture or gas (especially oxygen) is adsorbed to the selected colloid 180, and due to the aforementioned strong force, the diffusion coefficient thereof is lowered, and the transmittance of the control gas molecules is lowered. As can be appreciated from the above formulation techniques, the present invention can control the formulation to control the penetration of different gas molecules, and thus in embodiments of the invention, the package structure has different transmittance characteristics for at least two gas molecules.

The package structure provided by the present invention can be manufactured by a wet coating process, but the invention realizes the use of the junction between the first and second encapsulation layers 120, 140 and the gel to form a barrier. The barrier of moisture or gas in the external environment. Therefore, the process is not limited to all using a full wet coating process, or a full wet coating process is used in conjunction with the bonding process. That is, the present invention mainly wet coats the first and second encapsulating layers 120, 140. Subsequent other processes or similar processes are performed. Furthermore, the wet coating process may be a wire bar coating process, a blade coating process, a roller coating process, a dip coating process, a rotary coating process, or a precision slit coating process. Any coating method such as a curtain coating process or a slant-plate coating is produced in the form of a sheet-to-sheet (pi ec e by pie ce ) or a roll-to-roll (ro llto ro ll ).

In summary, in the present invention, a gel is applied to the first and second encapsulating layers 120 and 140 by a wet coating process, which is suitable for mass production because of low cost. According to the present invention, the object of the present invention can be achieved by forming at least one joint surface to effectively block moisture or gas from the external environment. At the same time, compared with the conventional technology, it is no longer necessary to carry out technical development with specificity and limitation for individual products and articles, and the manufacturing cost is also greatly reduced. Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic plan view of the organic semiconductor device of FIG. 1. The first encapsulation layer 120 and the second encapsulation layer 140 are thermocompression bonded around the inner space 130, thereby forming a rectangular inner space 130 as shown in FIG. In addition, the organic semiconductor device 10 of the present embodiment further includes at least one pin 190 that connects the organic semiconductor device 160 and an external component (not shown). In this embodiment, the pins 190 are respectively connected to the anode and the cathode of the organic semiconductor element 160 implemented by the OLED, thereby providing power required for light emission.

It should be noted that the pin 190 is preferably a very thin copper foil, such that a portion of the at least one pin 190 is hot pressed by the first encapsulation layer 120 and the second encapsulation layer 140. Cohesive without affecting the tightness of hot pressing.

Specifically, since the metal pin 190 is in contact with the gel 180, the gel 180 may be added with an anti-corrosion additive to further prevent the metal pin 190 from being rusted or aged, taking into account the reliability of the overall assembly, such as: An oxidant, or a corrosion inhibitor for a specific metal (eg, copper in copper), causes the metal pin 190 to be less susceptible to oxidation or metal ions to form an electrochemical cell reaction and rust. Specifically for inorganic copper pins, inorganic additives such as: chromate Cr04 ² — , molybdate Mo04 ² — and tetraborate B407 ² — may be used. Or the following types of organically added U, (1) Azoles such as: 2_amino_5_ethyl_l, 3, 4_thiadiazole and 5-phenyl-tetrazole; (2) Amines such as:

N-phenyl-1, 4-pheny lenediamine; (3) Ami no acids, such as: tryptophan; (4) Tr i pheny lmethane derivatives; (5) Th io 1 e group compounds, such as: l_phenyl - 2, 5_dithio hydrazodicarbonamide; (6) Phosphates (tr iethy 1 phosphate) such as: triethyl phosphate;

(7) Others: dithiouracil, 3-mercapto-propyltrimethoxy-silane (PropS-SH). Alternatively, the at least one pin 190 can further comprise a protective coating that can be protected in advance by a protective coating on the metal pin 190.

Hereinafter, an organic semiconductor device according to another embodiment of the present invention will be described. Referring to FIG. 3 and FIG. 4, FIG. 3 is a cross-sectional view showing an organic semiconductor device according to another preferred embodiment of the present invention, and FIG. 4 is a third view. A schematic top view of the organic semiconductor device of the Figure. The organic semiconductor device 20 of another preferred embodiment of the present invention includes a first encapsulation layer 120; a second encapsulation layer 140 corresponding to the first encapsulation layer 120 and between the first encapsulation layer 120 An internal space 130 is defined; a substrate 150 is disposed in the internal space 130; an organic semiconductor element 160 is disposed on the substrate 150 and located in the internal space 130; and a solid body 180 is filled in the In the internal space 130, the organic semiconductor device 160 is sealed by the first encapsulation layer 120 and the second encapsulation layer 140. In the present embodiment, the same components as those in the above embodiment are described in the foregoing, and will not be described herein.

Different from the foregoing embodiments, the organic semiconductor device 20 of the further preferred embodiment further includes a sealant 210 for bonding the first encapsulation layer 120 and the second encapsulation layer 140. The internal space 130 is defined and defined. Specifically, the sealant 210 comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.

Similarly, the organic semiconductor device 20 of this other preferred embodiment includes at least one pin 190 that connects the organic semiconductor device 160 and an external component (not shown). In this embodiment, as shown in FIG. 4, the at least one reference The foot 190 is connected to the outer component through the sealant 190. However, the present invention does not limit the specific location of the pins 190 in the encapsulant 190 through the encapsulant 190.

In summary, the present invention utilizes a liquid or gel-like gel 180 to encapsulate the organic semiconductor component 160 in the first and second encapsulation layers 120, 140 such that the gel 180 is bonded to the encapsulation layer. And filling the plurality of static pores of the first and second encapsulation layers 120, 140, thereby eroding the organic semiconductor element 160 by moisture or gas blocking the external environment. Accordingly, the present invention can achieve the object of the present invention by merely forming a solid-liquid interface to effectively block the erosion of the organic semiconductor element 160 by moisture or gas in the external environment.

While the invention has been described above by way of a preferred embodiment, the preferred embodiments are not intended to limit the invention, and various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope defined by the claims.

Claims

Claim

An organic semiconductor device comprising:

a first encapsulation layer;

a second encapsulation layer corresponding to the first encapsulation layer and defining an internal space between the first encapsulation layer and the first encapsulation layer;

a substrate disposed in the internal space;

An organic semiconductor component disposed on the substrate and located in the internal space;

A solid body filled in the inner space for sealing the organic semiconductor element in cooperation with the first encapsulation layer and the second encapsulation layer.

2. The organic semiconductor device according to claim 1, wherein the first body layer and the second package layer are used to block moisture or gas from an external environment.

3. The organic semiconductor device according to claim 1, wherein the first encapsulation layer and the second encapsulation layer are a substance having a plurality of static pores.

4. The organic semiconductor device according to claim 3, wherein the solid is used to fill a portion of the plurality of static pores.

5. The organic semiconductor device according to claim 1, wherein the gel is a substance having no static pores.

6. The organic semiconductor device according to claim 5, wherein the gel is a liquid substance or a colloidal substance.

The organic semiconductor device according to claim 1, wherein a hydrogen bond molecule, a functional group molecule or a charged ion is added to the gel.

The organic semiconductor device according to claim 7, wherein the functional group molecule added to the gel includes -OH, -0-, =C0, _F, -Li 2, or -N=N functional groups .

9. The organic semiconductor device according to claim 6, wherein the liquid substance is a non-polar liquid.

10. The organic semiconductor device according to claim 6, wherein the liquid substance is a non-volatile liquid, and the non-volatile liquid may be selected from a lubricating oil, a silicone oil, a glycerin, an ionic liquid, a non-edible soybean oil, and a non-volatile liquid. A group of organic alcohols.

The organic semiconductor device according to claim 1, wherein the condensate is added with an anti-corrosive additive.

The organic semiconductor device according to claim 1, wherein the first encapsulation layer and/or the second encapsulation layer are made of a polymer material.

13. The organic semiconductor device according to claim 1, wherein the substrate is made of the same material as the first encapsulation layer and the second encapsulation layer.

14. The organic semiconductor device according to claim 1, wherein the organic semiconductor element is one selected from the group consisting of an organic light emitting diode, a polymer light emitting diode, an organic solar cell, and an organic thin film transistor.

15. The organic semiconductor device according to claim 1, further comprising at least one lead, the at least one pin connecting the organic semiconductor element and an external component.

16. The organic semiconductor device according to claim 15, wherein the condensate is added with an anti-corrosive additive.

17. The organic semiconductor device according to claim 15, wherein the at least one pin comprises a protective coating.

18. The organic semiconductor device according to claim 15, wherein the first encapsulation layer and the second encapsulation layer are thermocompression bonded around the inner space.

19. The organic semiconductor device according to claim 18, wherein a part of said at least one pin is clipped Holding the thermal compression of the first encapsulation layer and the second encapsulation layer.

20. The organic semiconductor device according to claim 15, further comprising an adhesive for bonding between the first encapsulation layer and the second encapsulation layer and defining the internal space.

21. The organic semiconductor device according to claim 20, wherein the at least one pin is connected to the external component through the sealant.

The organic semiconductor device according to claim 20, wherein the sealant comprises an ultraviolet curable resin or a solid material, and the solid material may be a metal material, an organic material or an inorganic material.