WO2015008870A3 - Semiconductor device using a self-assembly method for its manufacturing - Google Patents

Semiconductor device using a self-assembly method for its manufacturing Download PDF

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Publication number
WO2015008870A3
WO2015008870A3 PCT/JP2014/069265 JP2014069265W WO2015008870A3 WO 2015008870 A3 WO2015008870 A3 WO 2015008870A3 JP 2014069265 W JP2014069265 W JP 2014069265W WO 2015008870 A3 WO2015008870 A3 WO 2015008870A3
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WO
WIPO (PCT)
Prior art keywords
tray
self
engage
manufacturing
recess
Prior art date
Application number
PCT/JP2014/069265
Other languages
French (fr)
Other versions
WO2015008870A4 (en
WO2015008870A2 (en
Inventor
Yoshiaki Sugizaki
Akihiro Kojima
Original Assignee
Kabushiki Kaisha Toshiba
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Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Publication of WO2015008870A2 publication Critical patent/WO2015008870A2/en
Publication of WO2015008870A3 publication Critical patent/WO2015008870A3/en
Publication of WO2015008870A4 publication Critical patent/WO2015008870A4/en

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    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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Abstract

A method for manufacturing a semiconductor device according to an embodiment includes making intermediate structural bodies. The shape of an upper and a lower portion of the body are different from each other. The rotational symmetry of the electrode corresponds to that of the semiconductor body. The method includes arranging the intermediate structural bodies to be separated from each other on a tray and vibrating the tray. By causing one of these portions to engage with a recess in an upper surface of a tray the bodies are self-assembled on the tray. The one portion is specially shaped to engage with the recess, while the opposite side does not to engage with the recess. The method includes forming an external electrode connected to an electrode of the intermediate structural body with extends laterally from the body.
PCT/JP2014/069265 2013-07-16 2014-07-15 Semiconductor device and method for manufacturing same WO2015008870A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-147867 2013-07-16
JP2013147867 2013-07-16
JP2014052787A JP2015038957A (en) 2013-07-16 2014-03-14 Semiconductor device and manufacturing method of the same
JP2014-052787 2014-03-14

Publications (3)

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WO2015008870A2 WO2015008870A2 (en) 2015-01-22
WO2015008870A3 true WO2015008870A3 (en) 2015-03-19
WO2015008870A4 WO2015008870A4 (en) 2015-07-02

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JP (1) JP2015038957A (en)
TW (1) TW201515190A (en)
WO (1) WO2015008870A2 (en)

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US9892944B2 (en) * 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
DE102016115644B4 (en) 2016-08-23 2020-12-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Process for the production of optoelectronic semiconductor components and optoelectronic semiconductor component
JP2018064077A (en) * 2016-10-14 2018-04-19 株式会社ディスコ Device chip, housing tray, and housing method of device chip
KR102385571B1 (en) 2017-03-31 2022-04-12 삼성전자주식회사 Semiconductor light emitting device
WO2019132050A1 (en) * 2017-12-26 2019-07-04 박일우 Led display device and method for manufacturing same
JP7429094B2 (en) * 2018-09-10 2024-02-07 東レエンジニアリング株式会社 Mounting board manufacturing method and mounting board
CN110289279B (en) * 2019-06-04 2021-09-24 上海天马微电子有限公司 Transfer method, array substrate, manufacturing method of array substrate and display device
US20220310883A1 (en) * 2019-10-31 2022-09-29 Uldtec Co., Ltd. Semiconductor chip integrated device manufacturing method, semiconductor chip integrated device, semiconductor chip integrated device assembly, semiconductor chip ink, and semiconductor chip ink ejection device
JP6842783B1 (en) * 2019-10-31 2021-03-17 アルディーテック株式会社 Manufacturing method of micro LED display and micro LED display
KR20200021968A (en) * 2020-02-11 2020-03-02 엘지전자 주식회사 Chip tray for self assembly and method for supplying light emitting diode
CN113314446B (en) * 2020-02-27 2023-06-02 上海微电子装备（集团）股份有限公司 Chip transfer device and chip transfer method
JP7300785B2 (en) * 2021-05-28 2023-06-30 東北マイクロテック株式会社 Alignment tray, alignment device, and alignment method
TWI773587B (en) * 2021-11-17 2022-08-01 友達光電股份有限公司 Light board

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