WO2015163763A1 - Illumination device and method of making same - Google Patents
Illumination device and method of making same Download PDFInfo
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- WO2015163763A1 WO2015163763A1 PCT/NL2015/050273 NL2015050273W WO2015163763A1 WO 2015163763 A1 WO2015163763 A1 WO 2015163763A1 NL 2015050273 W NL2015050273 W NL 2015050273W WO 2015163763 A1 WO2015163763 A1 WO 2015163763A1
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- circuit board
- illumination device
- intermediate bonding
- plate
- apertures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10293—Edge features, e.g. inserts or holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
An illumination device (1) for coupling to an electrical energy source includes a circuit board (5) that defines opposite first and second outer surfaces (13, 26) of a predetermined area size within an outer perimeter (11) of the circuit board (5). A plurality of electroluminescent semiconductors (15) each with a light emitting side and an electrical connection side are electrically connected to the circuit board (5) and distributed over the first outer surface (13) in a first pattern with their light emitting sides exposed. A first plate (7) is positioned to overlie the first outer surface (13) of the circuit board (5), and a first intermediate bonding layer (23; 25) of thermoplastic material is interposed between the circuit board (5) and the first plate (7). A second plate (9) is positioned to overlie the second outer surface (26) of the circuit board (5), and a second intermediate bonding layer (27) of thermoplastic material is interposed between the circuit board (5) and the second plate (9). The first and second plates (7, 9) and the first and second intermediate bonding layers (23; 25, 27) each have a surface area larger than the predetermined area size to extend beyond the outer perimeter (11) of the circuit board. At least the first plate (7) and the first intermediate bonding layer (23; 25) are each translucent or transparent. The circuit board (5) has a plurality of apertures (21) distributed in a second pattern commensurate with the first pattern, so as to avoid interference and allow uniting of the first and second intermediate bonding layers (23; 25, 27) through the plurality of apertures (21).
Description
Title: Illumination device and method of making same
The invention relates to an illumination device arranged to be coupled to an electrical energy source and useful for general illumination of human occupied spaces, such as working spaces. More in particular the invention relates to an illumination device for hazardous environments where contact of exposed electric appliances and/or open electrical conductors with an explosive or humid atmosphere should be avoided. The invention also relates to a method of making such an illumination device.
Across the world differing regulations and requirements exist, which dictate performance standards and certification of devices for use in hazardous locations. Such hazardous locations may include premises, buildings or parts thereof where fire or explosion risk may exist due to a presence of easily ignitable gases, vapors or dust particles.
To achieve explosion safe illumination equipment it has been a common practice to seal electrical equipment from the potentially hazardous environment. Test and standards to meet for certification often require such seals to retain their effectiveness over a wide range of temperatures and extended periods of time. Such conditions have often been difficult to meet because of heat produced by the illumination equipment itself. This has in particular been problematic with electroluminescent semiconductors, such as light emitting diodes (LEDs), which produce about 70% heat, including Infra Red radiation, and 30% light from the electric energy. In contrast to LEDs used in display devices, high-luminance LEDs as used in illumination applications produce a significant amount of heat that is not easy to dissipate and can cause distortions, as well as loss of efficiency or service life.
Accordingly it is an object of the present invention to propose an improved illumination device and method of making same that meets at least one of these requirements, while using energy efficient semiconductor
light emitting devices. In a more general sense it is thus an object of the invention to overcome or reduce at least one of the disadvantages of the prior art. It is also an object of the present invention to provide alternative solutions which are less cumbersome in assembly and operation and which moreover can be made relatively inexpensively. It is an object of the invention to at least provide a useful alternative.
To this end the invention provides an illumination device and method of making it as defined in one or more of the appended claims. In particular an illumination device arranged to be coupled to an electrical energy source can include one or more of the following elements and features: a circuit board defining opposite first and second outer surfaces of a predetermined area size within an outer perimeter of the circuit board; a plurality of electroluminescent semiconductors each having a light emitting side and an electrical connection side, the plurality of electroluminescent semiconductors are electrically connected to the circuit board and
distributed over at least the first outer surface in a first pattern with the hght emitting sides exposed; a first plate positioned to overhe the first outer surface of the circuit board; a first intermediate bonding layer of
thermoplastic material interposed between the circuit board and the first plate; a second plate positioned to overlie the second outer surface of the circuit board; and a second intermediate bonding layer of thermoplastic material interposed between the circuit board and the second plate, wherein the first and second plates and the first and second intermediate bonding layers each have a surface area larger than the predetermined area size and extending beyond the outer perimeter of the circuit board, wherein at least the first plate and the first intermediate bonding layer are each one of translucent and transparent, and wherein the circuit board has a plurality of apertures distributed over the circuit board in a second pattern
commensurate with the first pattern, so as to avoid interference therewith and allow uniting of the first and second intermediate bonding layers
through the plurality of apertures. An illumination device with these elements and features has been found to have advantages over the prior art. By uniting the bonding layers to one another around the circuit board and also intimately through the plurahty of apertures, any difference in thermal expansion gradients of the circuit board material and the outer plates is compensated and accommodated by the elastic nature of the bonding material. The heat generated by electronic components on the circuit board can thereby be effectively dissipated to the exterior by the material of the bonded layers through the outer plates. In particular the translucent or transparent first plate can be either of Plexiglas, Lexan, polycarbonate, glass or like materials. The second plate, when not translucent or
transparent can also be of metal. However it may be preferable to arrange for a close match between the thermal expansion coefficients of the first and second plates to ensure form stability of the illumination device during use. Hence in an advantageous embodiment the first and second plates are glass plates. When both the first and second plates are of a translucent or transparent material it is also possible to arrange a plurahty of
electroluminescent semiconductors on both the first and second outer surfaces of the circuit board. In addition to being translucent or transparent, the first and second plates may optionally also be provided with optical elements, such as lenses, or have an otherwise optically structured surface.
In an embodiment of the invention the plurality of
electroluminescent semiconductors can be embedded in the first
intermediate bonding layer.
In an embodiment the circuit board can also be an assembly of interconnected individual circuit board elements.
An embodiment can have the circuit board provided with electrical terminals that extend beyond the outer perimeter of the circuit board and between the first and second intermediate bonding layers to a location outside of the first and second plates for coupling to an electrical
energy source. Such electrical terminals can conveniently include elongate electrical conductors, suitable for being embedded in the thermoplastic material of at least one of the first and second bonding layers.
The second pattern can advantageously differ from the first pattern. It is also advantageous for the plurality of apertures in the circuit board to outnumber the plurality of electroluminescent semiconductors. Preferably, but not necessarily the number of apertures can exceed the number of electroluminescent semiconductors by at least 25%. Also the plurality of apertures may occupy at least 5% of the predetermined area size of the circuit board, and preferably occupy at least 7.5% of that
predetermined area size.
In an advantageous embodiment the first and second
intermediate bonding layers are each formed from at least one sheet of ethylene vinyl acetate (EVA) that has been thermally treated to establish a bond between the first and second plates and the circuit board, and to unite with one another through the plurality of apertures and around the outer perimeter of the circuit board. Conveniently the first intermediate bonding layer can also be formed by two individual sheets of ethylene vinyl acetate (EVA) of equal thickness.
In one advantageous arrangement the illumination device is formed as a rectangular panel and outer edges of the first and second plates, as well as outer edges of the first and second intermediate bonding layers can then be aligned to form an outer perimeter of the illumination device.
Spacing between the first and second plates and/or between the each of the first and second plates and the circuit board may be ensured by additional spacer elements embedded in the bonding layers. The outer perimeter of the first and second plates may also be bordered by a perimeter frame, and optionally the spacer elements can be integrated into such a perimeter frame.
Optionally the translucent or transparent first plate is a plate of glass. Conveniently the second plate can also be a plate of glass.
The electroluminescent semiconductors are preferably high- luminance light emitting diodes (LEDs). The circuit board can be a printed circuit board, and may also be composed of epoxy impregnated glass fiber and a conducting layer incorporated therein.
A method of making the illumination device with one or more of the above elements and features is also part of the invention.
Further advantageous aspects of the invention will become clear from the appended description and in reference to the accompanying drawings, in which:
Figure 1 is a partial plan view of an illumination device according to the invention; and
Figure 2 is a schematic exploded elevation of the illumination device of Figure 1.
Figure 1 shows an illumination device 1 configured as a rectangular panel defining an outer edge 3. The rectangular panel delimited by the outer edge 3 in this example is a glass laminate enclosing a circuit board 5 between first and second plates of glass 7, 9. The circuit board 5 has an outer perimeter 11, which is fully accommodated inside of the outer edge 3 of the illuminating device 1. A first outer surface 13 of the circuit board 5 is equipped with a plurality of electroluminescent semiconductors 15, such a high-luminance light emitting diodes (LEDs). Each light emitting diode 15 has a light emitting side directed away from the first outer surface 13 and en electrical connection side with which it is connected to an electrically conductive layer of the circuit board 5 (not shown, but conventional). The circuit board 5 may conveniently be a printed circuit board (PCB) of epoxy impregnated glass fiber with a conductive layer integrated therein. The circuit board 5 may also be equipped with additional electronic components, such as resistors 17, current limiters, sensors, solar cells, or other electrical
components. Elongate electrical terminals 19 for coupling to an electrical energy source are also arranged on the circuit board 5. The elongate electrical terminals 19 are in the form of flat conductive strips, or small diameter wire conductors, that extend outside of the outer edge 3 of the glass laminate and are electrically connected to the conductive layer of the circuit board 5. A suitable small diameter can be in a region of about 0.8 mm, but other suitable diameters are not excluded. Alternatively the elongate electrical terminals can also be formed as integral extensions of the circuit board. A plurality of apertures 21 is extending through the material thickness of the circuit board 5 for a purpose that will be described herein below.
A schematic side elevation of the individual components of the illumination device 1 is shown in Figure 1 in a not yet assembled, so called exploded arrangement. The first plate of glass 7 forms a functional outer element of the illumination device 1 and is either translucent or transparent to permit the electroluminescent semiconductors or LEDs 15 to transmit light to an outside of the illumination device 1. A first thermoplastic intermediate bonding layer 23 is provided for bonding the first plate of glass 7 to the circuit board 5. Because the electroluminescent semiconductors extend above the first outer surface 13 of the circuit board 5, the first intermediate bonding layer 23 needs to have a thickness that is sufficient to embed therein the electroluminescent semiconductors 15, or other electronic components, such as the resistors 17. In the example illustrated in Figure 2 the first intermediate bonding layer 23 is composed of two sheets 25 of thermoplastic material to provide for this thickness, but clearly a
sufficiently thick single layer or more than two layers could also be used. The thermoplastic material of the first intermediate bonding layer 23 may conveniently be ethylene vinyl acetate (EVA). The second plate of glass 9 forms a basis of the illumination device 1 and receives a second outer surface 26 of the circuit board 5 by means of an interposed second
thermoplastic intermediate bonding layer 27. The second thermoplastic bonding layer 27 may also be provided in the form of a sheet of ethylene vinyl acetate (EVA). While the second plate of glass 9, when LED devices are only provided on the first outer surface 13, does not need to be
translucent or transparent and could be a different material other than glass, it is conveniently the same glass material as the first plate of glass to ensure identical thermal expansion in use. As is well known high-luminance LEDs produce a lot of heat. This is in significant contrast to LEDs used in lumination devices such as displays, where heat production is not normally seen as a problem. In illumination applications to which the present invention relates heat production is a concern. In particular this is the case in the present invention where the circuit board 5 and LED devices 15 are embedded between first and second plates of glass 7, 9. The heat generated by the electronic components (LEDs 15 and resistors 17) on the circuit board 5 is dissipated to the exterior by the material of the bonding layers and the glass plates and inevitably raises the temperature of these materials.
Thereby the thermal expansion gradients of the circuit board material and the outer glass plates is likely to be different, as will be the expansion gradient of the bonding material.
The illumination device 1 is obtained by laminating together the various layers shown in Figure 2 and described above using heat and pressure. Conveniently the first and second plates of glass 7, 9 and the sheets 25, 27 forming the intermediate bonding layers 23, 27 have the same size and are aligned according to the outer edge 13. During this lamination the first and second bonding layers 23, 25, 27 and the circuit board 5 are both bonded to the first and second plates of glass 7, 9. Furthermore the bonding layers 23, 25, 27 are united to one another around the outer perimeter 11 of the circuit board 5 and also through the plurality of apertures 21 (shown in Figure 1). Apart from considerations of heat transfer, which is important for LED efficiency and lifetime, the laminated
materials also pose a risk of delamination. As has been found by the inventors of the present invention delamination within a temperature range of -55 degrees C and well above 120 degrees C can be avoided by providing the plurality of openings 21 (Figure 1) in a pattern that is commensurate with a pattern in which the electroluminescent semiconductors 15 are distributed over the circuit board 5. The patterns are commensurate with one another in that the apertures 21 do not interfere with the
electroluminescent semiconductors 15, as well as with the resistors 17. It has also been found that the elastic nature of the bonded and united bonding material, such as EVA, and the intimate interconnection through the plurality of apertures 21 allows and compensates for differences in thermal expansion between the circuit board 5 and the outer first and second plates of glass 7, 9. In this examplethe number of apertures 21 exceeds the number of electroluminescent semiconductors 15 by at least 25%. Also the plurality of apertures 21 occupy an area of at least 5% of the total area size of the circuit board 5, more in particular when the occupied area size exceeds 7.5% of the circuit board area. It however is conceivable that in future improvements in LEDs may enable a reduction in the number of LED elements for the same output, and this may also lead to a size reduction of the circuit board. Hence the indicated ranges may be subject to change.
Accordingly an illumination device 1 is described for coupling to an electrical energy source that includes a circuit board 5, which defines opposite first and second outer surfaces 13, 26 of a predetermined area size within an outer perimeter 11 of the circuit board 5. A plurality of
electroluminescent semiconductors 15 each with a hght emitting side and an electrical connection side are electrically connected to the circuit board 5 and distributed over the first outer surface 13 in a first pattern with their hght emitting sides exposed. A first plate 7 is positioned to overlie the first outer surface 13 of the circuit board 5, and a first intermediate bonding
layer 23; 25 of thermoplastic material is interposed between the circuit board 5 and the first plate 7. A second plate 9 is positioned to overlie the second outer surface 26 of the circuit board 5, and a second intermediate bonding layer 27 of thermoplastic material is interposed between the circuit board 5 and the second plate 9. The first and second plates 7, 9 and the first and second intermediate bonding layers 23; 25, 27 each have a surface area larger than the predetermined area size to extend beyond the outer perimeter 11 of the circuit board. At least the first plate 7 and the first intermediate bonding layer 23; 25 are each translucent or transparent. The circuit board 5 has a plurality of apertures 21 distributed in a second pattern commensurate with the first pattern, so as to avoid interference and allow uniting of the first and second intermediate bonding layers 23; 25, 27 through the plurality of apertures 21. While in the example described above the first and second plates are of glass, it is to be understood that other suitable translucent, transparent, or opaque materials can be selected, including Plexiglas, Lexan, polycarbonate, and metal. Similarly LEDs can be provided on each of the opposite first and second outer surfaces of the circuit board, in which case the second plate and the second intermediate bonding layer each also are required to be translucent or transparent.
Spacing between the first and second plates and/or between the each of the first and second plates and the circuit board may be ensured by additional spacer elements embedded in the EVA bonding layers. The outer perimeter of the first and second plates may also be bordered by a perimeter frame, and optionally the spacer elements can be integrated into such a perimeter frame. Such a perimeter frame can assist in accurately
positioning of the circuit board in respect of the first and second plates, as well as in locating the electrical terminals at one of the longer or shorter sides.
It is thus believed that the operation and construction of the present invention will be apparent from the foregoing description and
drawings appended thereto. It will be clear to the skilled person that the invention is not limited to any embodiment herein described and that modifications are possible which should be considered within the scope of the appended claims. Also kinematic inversions are considered inherently disclosed and to be within the scope of the invention. In the claims, any reference signs shall not be construed as limiting the claim. The term
'comprising' and 'including' when used in this description or the appended claims should not be construed in an exclusive or exhaustive sense but rather in an inclusive sense. Thus the expression 'comprising' as used herein does not exclude the presence of other elements or steps in addition to those listed in any claim. Furthermore, the words 'a' and 'an' shall not be construed as limited to 'only one', but instead are used to mean 'at least one', and do not exclude a plurality. Features that are not specifically or explicitly described or claimed may be additionally included in the structure of the invention within its scope. Expressions such as: "means for ..." should be read as: "component configured for ..." or "member constructed to ..." and should be construed to include equivalents for the structures disclosed. The use of expressions like: "critical", "preferred", "especially preferred" etc. is not intended to limit the invention. Additions, deletions, and modifications within the purview of the skilled person may generally be made without departing from the spirit and scope of the invention, as is determined by the claims.
Claims
1. Illumination device arranged to be coupled to an electrical energy source and including:
a circuit board defining opposite first and second outer surfaces of a predetermined area size within an outer perimeter of the circuit board;
a plurality of electroluminescent semiconductors each having a light emitting side and an electrical connection side, the plurality of electroluminescent semiconductors are electrically connected to the circuit board and distributed over at least the first outer surface in a first pattern with the light emitting sides exposed;
a first plate positioned to overlie the first outer surface of the circuit board;
a first intermediate bonding layer of thermoplastic material interposed between the circuit board and the first plate;
a second plate positioned to overlie the second outer surface of the circuit board; and
a second intermediate bonding layer of thermoplastic material interposed between the circuit board and the second plate,
wherein the first and second plates and the first and second intermediate bonding layers each have a surface area larger than the predetermined area size and extending beyond the outer perimeter of the circuit board,
wherein at least the first plate and the first intermediate bonding layer are each one of translucent and transparent, and
wherein the circuit board has a plurality of apertures distributed over the circuit board in a second pattern commensurate with the first pattern, so as to avoid interference therewith and allow uniting of the first and second intermediate bonding layers through the plurality of apertures.
2. Illumination device according to claim 1, wherein the plurality of electroluminescent semiconductors are embedded in the first intermediate bonding layer.
3. Illumination device according to claim 1 or 2, wherein the circuit board is an assembly of interconnected individual circuit board elements.
4. Illumination device according to claim 1, 2 or 3, wherein the circuit board is provided with electrical terminals that extend beyond the outer perimeter of the circuit board and between the first and second intermediate bonding layers to a location outside of the first and second plates for coupling to an electrical energy source.
5. Illumination device according to claim 4, wherein the electrical terminals include elongate electrical conductors, suitable for being embedded in the thermoplastic material of at least one of the first and second bonding layers.
6. Illumination device according to one of claims 1-5, wherein the second pattern differs from the first pattern.
7. Illumination device according to one of claims 1-6, wherein the plurality of apertures in the circuit board outnumbers the plurality of electroluminescent semiconductors .
8. Illumination device according to claim 7, wherein the number of apertures exceeds the number of electroluminescent semiconductors by at least 25%.
9. Illumination device according to claim 7 or 8, wherein the plurality of apertures occupies at least 5% of the predetermined area size of the circuit board.
10. Illumination device according to claim 8 or 9, wherein the plurality of apertures occupies at least 7.5% of the predetermined area size of the circuit board.
11. Illumination device according to one of claims 1-10, wherein the first and second intermediate bonding layers are each formed from at least one sheet of ethylene vinyl acetate (EVA) that has been thermally treated to establish a bond between the first and second plates and the circuit board, and to unite with one another through the plurality of apertures and around the outer perimeter of the circuit board.
12. Illumination device according to claim 11, wherein the first intermediate bonding layer is formed by two individual sheets of ethylene vinyl acetate (EVA) of equal thickness.
13. Illumination device according to one of claims 1-12, wherein the illumination device is formed as a rectangular panel and wherein outer edges of the first and second plates, as well as outer edges of the first and second intermediate bonding layers are aligned to form an outer perimeter of the illumination device.
14. Illumination device according to one of claims 1-13, wherein the translucent or transparent first plate is a plate of glass.
15. Illumination device according to one of claims 1-14, wherein the second plate is a plate of glass.
16. Illumination device according to one of claims 1-15, wherein the electroluminescent semiconductors are high-luminance light emitting diodes (LEDs).
17. Illumination device according to one of claims 1 - 16, wherein the circuit board is a printed circuit board.
18. Illumination device according to one of claims 1-17, wherein the circuit board is composed of epoxy impregnated glass fiber and a conducting layer incorporated therein.
19. Method of making an illumination device arranged to be coupled to an electrical energy source, the method including:
providing a circuit board of a predefined area size having opposite first and second outer surfaces and an outer perimeter;
providing a plurality of electroluminescent semiconductors each having a light emitting side and an electrical connection side;
electrically connecting the electrical connection side of each electroluminescent semiconductor to the first outer surface of the circuit board, while distributing the electroluminescent semiconductors in a first pattern;
providing a plurality of apertures in the circuit board, distributed in a second pattern with the first pattern, so as to avoid interference therewith;
applying a first intermediate bonding layer of thermoplastic material having a surface area larger than the predetermined area size onto the first outer surface of the circuit board after connection of
the electroluminescent semiconductors;
positioning a first plate having a surface area larger than
the predetermined area size in overlying relationship with the first intermediate layer at a side remote from the circuit board;
applying a second intermediate layer of thermoplastic material having a surface area larger than the predetermined area size onto the second outer surface of the circuit board;
positioning a second plate having a surface area larger than the predetermined area size in overlying relationship with the second intermediate layer at a side remote from the circuit board;
aligning edges the first and second plates, and the first and second intermediate bonding layers to extend beyond the outer perimeter of the circuit board;
subjecting a thus formed assembly to heat and pressure; and allowing the first and second intermediate bonding layers to bond the first and second plates to the circuit board, as well as uniting
the first and second intermediate bonding layers through the apertures and around the outer perimeter of the circuit board.
20. Method according to claim 19, wherein the steps of applying the first and second intermediate bonding layers includes positioning at least one each of a sheet of ethylene vinyl acetate (EVA).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2012690A NL2012690B1 (en) | 2014-04-24 | 2014-04-24 | Illumination device and method of making same. |
| NL2012690 | 2014-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015163763A1 true WO2015163763A1 (en) | 2015-10-29 |
Family
ID=51656001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/NL2015/050273 WO2015163763A1 (en) | 2014-04-24 | 2015-04-23 | Illumination device and method of making same |
Country Status (2)
| Country | Link |
|---|---|
| NL (1) | NL2012690B1 (en) |
| WO (1) | WO2015163763A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018170339A (en) * | 2017-03-29 | 2018-11-01 | 京セラディスプレイ株式会社 | Display device |
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|---|---|---|---|---|
| EP0525690A2 (en) * | 1991-07-30 | 1993-02-03 | BGT Bischoff Glastechnik GmbH & Co. KG | Element for a glass construction |
| WO2004009349A1 (en) * | 2002-07-19 | 2004-01-29 | Pilkington Plc. | Laminated glazing panel |
| WO2007085599A1 (en) * | 2006-01-25 | 2007-08-02 | Agc Flat Glass Europe Sa | Automotive glazing |
| WO2008083915A1 (en) * | 2007-01-11 | 2008-07-17 | Pilkington Automotive Deutschland Gmbh | Laminated vehicle glazing |
| US20090046355A1 (en) * | 2006-01-06 | 2009-02-19 | Pilkington Automotive Deutschland Gmbh | Vehicle glazing |
| US7745838B2 (en) * | 2003-01-10 | 2010-06-29 | Agc Glass Europe | Glazing comprising electronics elements |
| US20100163892A1 (en) * | 2008-12-29 | 2010-07-01 | Yu-Huan Liu | Led device and method of packaging the same |
| WO2013189794A1 (en) * | 2012-06-19 | 2013-12-27 | Agc Glass Europe | Sunroof comprising lighting means |
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2014
- 2014-04-24 NL NL2012690A patent/NL2012690B1/en not_active IP Right Cessation
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2015
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0525690A2 (en) * | 1991-07-30 | 1993-02-03 | BGT Bischoff Glastechnik GmbH & Co. KG | Element for a glass construction |
| WO2004009349A1 (en) * | 2002-07-19 | 2004-01-29 | Pilkington Plc. | Laminated glazing panel |
| US7745838B2 (en) * | 2003-01-10 | 2010-06-29 | Agc Glass Europe | Glazing comprising electronics elements |
| US20090046355A1 (en) * | 2006-01-06 | 2009-02-19 | Pilkington Automotive Deutschland Gmbh | Vehicle glazing |
| WO2007085599A1 (en) * | 2006-01-25 | 2007-08-02 | Agc Flat Glass Europe Sa | Automotive glazing |
| WO2008083915A1 (en) * | 2007-01-11 | 2008-07-17 | Pilkington Automotive Deutschland Gmbh | Laminated vehicle glazing |
| US20100163892A1 (en) * | 2008-12-29 | 2010-07-01 | Yu-Huan Liu | Led device and method of packaging the same |
| WO2013189794A1 (en) * | 2012-06-19 | 2013-12-27 | Agc Glass Europe | Sunroof comprising lighting means |
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| JP2018170339A (en) * | 2017-03-29 | 2018-11-01 | 京セラディスプレイ株式会社 | Display device |
Also Published As
| Publication number | Publication date |
|---|---|
| NL2012690B1 (en) | 2016-07-08 |
| NL2012690A (en) | 2016-02-04 |
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