WO2016034538A1

WO2016034538A1 - Organic component

Info

Publication number: WO2016034538A1
Application number: PCT/EP2015/069853
Authority: WO
Inventors: Richard Baisl; Simon SCHICKTANZ
Original assignee: Osram Oled Gmbh
Priority date: 2014-09-03
Filing date: 2015-08-31
Publication date: 2016-03-10
Also published as: DE102014112696B4; DE102014112696A1

Abstract

The invention relates to an organic component, comprising: - a substrate (21) with a main surface (21a), - an organic element (1) which is applied onto the main surface (21a) in a stacking direction (H) and which comprises an organic light-emitting functional layer stack (10) and outer surfaces (1a, 1b) that are not covered by the substrate (21), - a protective layer (4) which is applied onto the outer surfaces (1a, 1b) of the organic element (1) and which comprises a covering surface (4a) facing away from the organic element (1), - a covering element (22) which is applied onto the organic element (1) face facing away from the substrate (21), and - a connecting frame (23) which is arranged between the substrate (21) and the covering element (22), wherein - the covering element (22) together with the connecting frame (23) and the substrate (21) form a cavity (2) in which the organic element (1) and the protective layer (4) are arranged, - the covering surface (4a) and the covering element (22) have a minimum spacing (d) at least in some areas in the stacking direction (H) of maximally 1/10 of the height of the protective layer (4) in the stacking direction (H), and - the protective layer (4) is designed to mechanically support a part of the covering element (22) and to protect the organic component (1) from being destroyed.

Description

description

Organic component US Pat. Nos. 7,629,018 B2 and 6,952,078 B1 each describe an organic component.

One problem to be solved is an organic one

Component with the largest possible continuous

To provide light exit surface.

An organic component is specified. In which

organic component may be an organic optoelectronic element for emission and / or

Detection of electromagnetic radiation is provided, such as an organic light emitting diode act.

According to at least one embodiment of the organic

This component comprises a substrate with a

Main area. The substrate may be formed with a glass, a ceramic, a metal and / or a plastic. The substrate may be, for example, a glass plate or a metallized film. Preferably, the substrate is formed with a radiation-transmissive material. A material is here and below as

"radiation-transmissive" when at least 90%, preferably at least 95%, of the radiation emitted and / or detected by the organic device is transmitted through said material. Preferably, then, the substrate is formed transparent to radiation.

The substrate has a main plane of extension in which it extends in lateral directions. Perpendicular to Main extension plane, in a stacking direction, the substrate has a thickness. The thickness of the substrate is small compared to the maximum extent of the substrate in one

lateral direction. A major plane of the substrate forms the major surface of the substrate. The substrate is thus formed, for example, as a plate, which in the context of

Manufacturing tolerance has a uniform thickness.

According to at least one embodiment of the organic

Component comprises this an organic component with a light-emitting organic functional layer stack. The organic component is deposited on the major surface of the substrate. The organic component further comprises uncovered outer surfaces of the substrate. The outer surfaces which are uncovered by the substrate can be, for example, a component cover surface facing away from the substrate and / or component side surfaces running along the stacking direction within the scope of the manufacturing tolerances. A

Component bottom surface is in this case facing the substrate and is preferably in direct contact with the substrate.

In accordance with at least one embodiment, the organic component comprises a protective layer applied to the outer surfaces of the organic component. The protective layer can

in particular in direct physical contact with the outer surfaces of the organic component and completely cover the organic component. The protective layer comprises a cover surface facing away from the organic component. The protective layer may be formed of a mechanically protective material. The material of the protective layer may be radiation-permeable or radiation-reflecting. Preferably, the protective layer is formed of a material that in the

Essentially non-contact on the organic component can be applied. "Essentially non-contact" here and below means that the material of the protective layer can be designed such that the pressure acting on the organic component when the protective layer is applied is so low that the organic component is not destroyed by this pressure can. Here and below is a material "mechanically protective"

formed, if it can prevent damage to the active layers of the organic component by external mechanical forces, for example, the distribution of external forces over a larger area. Further, a material is "radiation reflective" when that of the organic

Component emitted, and in particular the incident on the material, radiation to at least 90%, preferably

at least 95%, of said material is reflected.

According to at least one embodiment of the organic

Component further comprises a mounted on the side facing away from the substrate of the organic component

Cover body. The cover body preferably follows directly in the stacking direction on the protective layer. In other words, between the cover body and the protective layer, preferably no further layer is arranged in the stacking direction. In which

Cover body is for example a

Vitreous. Preferably, the cover body has a similar lateral extent as the substrate. For example, the lateral extent of the cover body is at least 80% and at most 110% of the lateral extent of the substrate. The cover body can be translucent or

be formed radiation reflective.

According to at least one embodiment of the organic

Component includes this one between the substrate and the cover body arranged connection frame. The connection frame may be, for example, a glass frit

and / or include or be formed from a glass solder.

Alternatively or additionally, it is possible for the connection frame to be a part of the cover body running along the stacking direction and / or the

Connecting frame is formed with a plastic material.

The connection frame preferably encloses the organic component laterally completely. The connection frame can mechanically connect the cover body and the substrate. A

"Mechanical connection" here and hereinafter means a non-destructively releasable connection between two objects, wherein between the two objects, a third object may be arranged, which is in direct contact with the first and the second object and / or soldered to these, welded or glued. For example, it is possible that between the connection frame and the substrate

Contact points are arranged, wherein the contact points are in direct contact with the main surface of the substrate and the connection frame in direct contact with the

Contact points stands. In this case, a mechanical connection between the connection frame and the substrate is made via the contact points.

A mechanical connection between the connection frame and the substrate, the cover body and / or the contact points can be produced by fusing the connection frame to the substrate, the cover body and / or the contact points. This is the connection frame

melted for example with a laser beam and, for example, using an external pressure with the Substrate and / or the cover body during solidification of the material of the connection frame connected.

According to at least one embodiment of the organic

Component forms the cover body together with the

Connecting frame and the substrate, a cavity in which the organic component and the protective layer are arranged. The cavity preferably forms a hermetically sealed cavity. In other words, the organic component is protected by the cavity from environmental influences, such as an atmospheric gas. In particular, that can

organic component must be completely enclosed by hermetically sealing materials.

In a plan view from the stacking direction on the organic component, the connecting frame can surround the organic component like a frame. In other words, the organic component is then formed in lateral directions by the multi-connected in a plan view

Enclosed connection frame. The cover body and the

Substrate, the organic component at the

Component cover surface and component bottom surface is preferred

completely cover. It is also possible that the

organic component at least in places laterally of

Contact points is enclosed.

According to at least one embodiment of the organic

Component, the protective layer is adapted to mechanically support a part of the cover body and to protect the organic component from destruction. For example, the protective layer for this purpose is formed of a particularly hard material, which is substantially non-contact on the

organic component can be applied. In particular, can the material of the protective layer and / or the protective layer may be formed harder than the organic component. In other words, the protective layer may have a higher Shore D hardness than all layers of the organic component. Furthermore, it is possible that the distance of the

Protective layer and the cover body is chosen so low that a bending of the cover body is already prevented by the small distance. According to at least one embodiment of the organic

This component comprises a substrate with a

Main surface, an applied in a stacking direction on the main surface organic component with a

light-emitting organic functional layer stack and outer surfaces uncovered by the substrate, one applied to the outer surfaces of the organic component

Protective layer with a cover surface facing away from the organic component, and a cover body attached to a side of the organic component facing away from the substrate and one arranged between the substrate and the cover body

Connecting frame. The cover body, together with the connection frame and the substrate, forms a cavity in which the organic component and the protective layer are arranged. The protective layer is adapted to be part of the

Mechanically supporting the cover body and protecting the organic component against destruction.

In a large-area organic device occurs in

Generally, the problem is that the encapsulant serving as the cover body by mechanical stress, such as a depression, and / or sagging due to

Gravity can be pressed on the organic component, and the active layers of the organic functional Layer stacks can thus be damaged. One way of protecting the organic component is by means of points of contact between the organic

Prevent component and the cover body to introduce into the organic component. However, this results in the problem that the organic component does not emit light in the region of the support points and thus no organic components with a large continuous light exit surface

can be realized. Alternatively, damage to the organic component can be prevented by the use of mechanically stable encapsulating glass. In contrast to a conventional cover body, by means of a

Connection frame is connected to the substrate, however, such a capsule glass in production is extremely expensive.

In the present case, accordingly, the idea is pursued that

Pressing the cover body to prevent the organic component with an applied to the organic component protective layer, which in the extreme case over the entire

Cover surface of the organic component extends. Through the protective layer, first, a distance between the

Cover body and the organic component are increased, whereby the likelihood of destruction of the

organic component is reduced by the cover body.

In particular, this makes it possible to prevent direct contact between the organic component and the covering body.

Furthermore, in the case of pushing through and / or bending of the cover body in the direction of the organic component

acting mechanical forces are distributed over the protective layer and thus damage to the organic component, in particular the active layers of the organic functional layer stack, be prevented. In other words, in a pressing and / or placing the cover body on the protective layer is the through

Pressing and / or laying on the protective layer in the vertical direction acting force due to their hardness is not passed to the organic component, but laterally distributed over the protective layer. The protective layer is therefore not bent due to their hardness and / or

pushed through, why the organic component of the

external mechanical force is mechanically protected. The force then acts effectively only on the top surface of the

Protective layer and is laterally, but not vertically distributed. Alternatively or additionally, the mechanical forces can be dissipated via the substrate by the

Protective layer at least in places with the substrate

mechanically connected.

According to at least one embodiment of the organic

Component have the top surface and the cover body in

Stacking direction at least in places a lowest

Distance of at most 1/10, preferably at most 1/20 and particularly preferably at most 1/50, the height of the protective surface in the stacking direction. In this case, it is possible that areas of the protective layer have elevations, wherein the top surface of the protective layer in the areas of the elevations

Have smaller distance to the cover body, and outside the surveys a greater distance. For example, the height of the protective layer is at least 8 ym and at most 22 ym, and the smallest distance between the top surface and the covering body is at most 2 ym. Furthermore, the height of the

Protective layer at least 1 mm and not more than 2 mm. The smallest distance between the top surface and the

Cover body can then be at most 40 ym. The smallest distance is preferably different from 0 ym. In other words, there is always a small distance between the protective layer and the covering body, which can be reduced to 0 ym only when the covering body is deflected and / or pushed through. The protective layer and the

Cover body can therefore only touch when a force acts on the cover body. By a low minimum distance between the

Cover body and the top surface of the protective layer can

in particular a bending and / or pushing of the

Cover body can be prevented. It is possible that the smallest distance between the cover body and the

Top surface of the protective layer only by the

Contraction and / or expansion of the protective layer and / or the cover body and / or the connection frame when

Cool down after the connection is determined by fusing. For example, the cover body during the

At least in places directly to the manufacturing process

Adjacent top surface of the protective layer. In the case of different coefficients of expansion of the materials during cooling, a small distance between the top surface and the cover body may arise in this case.

According to at least one embodiment of the organic

Component is the protective layer at least in places mechanically connected to the substrate. Here it is

possible that the protective layer is directly adjacent to the substrate. Alternatively or additionally, the protective layer may adjoin the contact pads which are mounted on the main surface of the substrate. According to at least one embodiment of the organic

Component have the top surface and the cover body in

Stacking direction at least in places a distance of at most 2 ym, preferably of at most 1 ym and more preferably of at most 0.5 ym, on. Accordingly, there is only a thin gap between the top surface and the cover body. The gap may, for example, be filled with a gas, preferably with an inert gas. It is also possible that the organic component is an encapsulation layer, the

for example, with Atomic Layer Deposition (ALD). In this case, the gap may be filled with air and / or a gas.

According to at least one embodiment of the organic

Component, the protective layer comprises a hard coating. The hard coating comprises a material whose Shore D hardness is at least 60, preferably at least 65, and more preferably at least 70. For example, the hard coating is formed with a material whose Shore D hardness is on the order of magnitude of the Shore D hardness of Plexiglas. The hard coating is preferably formed as a continuous layer. In other words, the hard coating covers the outer surfaces of the organic component

Completely .

For example, the hard coating is formed with an epoxy resin, acrylic, a lacquer, an adhesive and / or a polyurethane. Preferably, the hard coating comprises a

Material that is essentially pressure-free

or non-contact method can be applied. Here, in particular, the idea is pursued that mechanical stress on the organic component should be avoided by applying the hard coating. According to at least one embodiment of the organic

Element is the smallest distance between the

Top surface of the protective layer and the cover body at most 1/10, preferably at most 1/20 and more preferably at most 1/50, the height of the hard coating in

Stacking direction. The smallest distance is here

in particular by the coefficient of expansion of

Hard coating given in comparison to the expansion coefficient of the connection frame.

According to at least one embodiment of the organic

Component, the protective layer further comprises a plurality of spacer balls. The spacer balls each have the shape of a ball within the manufacturing tolerances. In other words, the spacer balls preferably have no corners and / or edges. The spacer balls may further have a polygonal shape which may be substantially approximated with a sphere. The diameter of each spacer ball deviates by at most ± 5%, preferably in order

not more than ± 2,5%, of a mean diameter of

Spacer balls off. In other words, the spacer balls have a similar size. For example, the lateral distance between the outer surfaces of two

adjacent spacer balls at least half of

average diameter and at most twice the

average diameter. The spacer balls thus have a small distance from each other. Preferably border the

Spacer balls not directly to the organic component.

For example, a part of the hard coating is arranged between the spacer balls and the organic component. Here, in particular, the idea is pursued, the organic component in addition by spacer balls in front of a to protect mechanical load. Due to the similar size of the spacer balls, a mechanical force can be better distributed over the entire protective layer. In particular, this is an increased pressure on a range of

reduced organic component.

According to at least one embodiment of the organic

Component, the plurality of spacer balls between the hard coating and the cover body is arranged. The

Spacer balls can be applied directly to the hard coating. Furthermore, the hard coating can be applied directly to the organic component.

According to at least one embodiment of the organic

Component is the variety of spacer balls in the

Hard coating arranged. It is possible that the spacer balls are completely covered by the hard coating. Alternatively, it is possible that the spacer balls project beyond the hard coating at least in places.

For example, then at least 80% of the outer surfaces of the spacer balls are covered by the hard coating. The plurality of spacer balls can be incorporated into the material of the hard coating and applied to the organic component simultaneously with the hard coating.

According to at least one embodiment of the organic

Component, the average diameter of the plurality of spacer balls is at least 1 mm. By choosing such large spacer balls is particularly ensured that the smallest distance between the cover body and the

Protective layer is as small as possible, whereby sagging and / or pushing the cover body, even in large Cavities can be avoided. Furthermore, increases in larger spacer balls, the bearing surface of the spacer balls, whereby a pressure on the spacer balls can be better distributed by the cover body.

The cover body closest to the outer surfaces of the spacer balls have in particular the smallest distance to the cover body. It is possible that the spacer balls are in direct contact with the cover body only when the cover body is pushed and / or deflected by an external force, such as gravity. In this case, the external force acts on the spacer balls, which are adjacent to the cover body due to the bending and / or pushing through the cover body. Furthermore, the distance between the cover body and the organic component can be further increased by the spacer balls.

According to at least one embodiment of the organic

Component, the organic component has a continuous light exit surface, each having an extent of at least 1 cm in the lateral direction. Preferably, the light exit surface is formed here simply connected. The organic component is thus formed over a large area. The light exit surface can be, for example, the component cover surface or the

Trade floor surface. In other words, that

organic device may emit in the direction of the substrate or in the direction of the cover body or in both directions. In particular, in such a large area formed organic components, the problem arises that the organic

Component slightly by pressure on the cover body

can be damaged. According to at least one embodiment of the organic

Component is the hard coating with a

applied non-contact method. For example, the hard coating is applied or sprayed on as a liquid layer. Furthermore, it is possible that the hard coating is laminated as a film.

According to at least one embodiment of the organic

Component is the hard coating with a

Liquid coating method, preferably one

Schiitz coating method (English: Slot-Die Coating), or applied to a spray coating process.

In particular, by means of the Schiitzbeschichtungsverfahrens very thin hard coatings, which typically have a thickness from about 10 ym, can be prepared. The

Hard coating then has a similar height in the stacking direction as the connection frame. For example, both the height of the hard coating and the

Verbindungsrahmens at least 10 ym and at most 20 ym. The use of a liquid or spray coating method can be detected, for example, by a particularly planar formation of the hard coating on the organic component.

It is also possible that the spacer balls with a non-contact method, preferably with a

Liquid coating method or

Spray coating method is applied. For example, the spacer balls can be introduced into the hard coating and sprayed onto the organic component at the same time. Alternatively or additionally, the

Spacer balls are introduced into a solution and sprayed with this on the hard coating. The solution may be, for example, a volatile substance act, which evaporates quickly after spraying, leaving only the spacer balls on the hard coating

remain. In the following, the organic component described here based on embodiments and the associated

Figures explained in more detail.

Figures 1, 2 and 3 show embodiments of an organic device described here with reference to schematic sectional views.

The same, similar or equivalent elements are provided in the figures with the same reference numerals. The figures and the proportions of the elements shown in the figures with each other are not to scale

consider. Rather, individual elements may be exaggerated in size for better representability and / or better understanding.

A first exemplary embodiment of an organic component described here is explained in greater detail on the basis of the schematic sectional representation of FIG. The organic

Component comprises a substrate 21 having a main surface 21a. On the main surface, an organic component 1 is applied in the stacking direction H.

The organic component 1 comprises a main surface 21a facing component bottom surface lc, and not of the

Substrate 21 covered outside surfaces la, lb, by

Component side surfaces lb and a component cover surface la

are formed. It is possible that the Component cover surface la and / or the component bottom surface lc form a light exit surface of the organic component 1.

The organic component 1 comprises a light-emitting organic functional layer stack 10. The organic functional layer stack 10 is electrically contacted by means of an electrically conductive anode 32 and an electrically conductive cathode 33. The organic functional

Layer stack 10 can in this case be arranged in the stacking direction H between the anode 32 and the cathode 33 and be covered by these almost completely. Between the anode 32 and the cathode 33, an electrically insulating isolation layer 61 is arranged laterally. The anode 32 and / or the cathode 33 can with a

radiation-transmissive oxide, such as indium-tin oxide may be formed. In this case, it is possible, in particular, for both the anode 32 and the cathode 33

are formed permeable to radiation. Alternatively or additionally, it is possible that the anode 32 or the cathode 33 with a radiopaque and / or

Radiation-reflecting material are formed. In other words, either the anode 32 or the cathode 33 may be radiopaque and / or radiation-reflective.

On the main surface 21a of the substrate 21 are further

Contact points 31 applied, by means of which the anode 32 and the cathode 33 can be electrically contacted from the outside. The contact points 31 are in this case arranged laterally from the organic component 1.

On the organic component 1, a protective layer 4 is applied, which in the present case comprises a hard coating 41. The hard coating 41 is preferably formed with a particularly hard material that can be applied without contact. The outer surfaces 1 a, 1 b of the organic component 1 which are uncovered by the substrate 21 are completely covered by the protective layer 41. The protective layer 41 directly adjoins the contact points 31 and is mechanically connected to the substrate 21 via the contact points 31. In this case, it is possible for mechanical forces acting on the protective layer 41 to be conducted away from the organic component 1 via the substrate 21.

At the substrate 21 facing away from the top surface 4a

Protective layer 4, a cover body 22 is attached. Of the

In the stacking direction H, the covering body 22 has a smallest distance d from the cover surface 4 a of the protective layer 4, which is at most 1/10, preferably at most 1/20 and particularly preferably at most 1/50, the height of the protective layer 4 in the stacking direction H. In this case, it is possible that the cover surface 4a in places, for example in the region of the component side surfaces lb, a higher distance to the

Cover body 22 have. Between the protective layer 4 and the cover body 22 is a cavity 62 which

for example, can be filled with a gas. The cover body 22 is connected via a connection frame 23

mechanically connected to the substrate 21. Of the

Connecting frame 23 encloses the organic member 1 and the protective layer 41 like a frame. The connection frame 23 may be a glass solder, for example, using a screen printing method and a

subsequent grinding or smoothing process is applied to the substrate 21 or the cover body 22. The mechanical connection between the cover body 22, the Substrate 21 and / or the connection frame 23 can then be made by fusion.

The cover body 22 forms, together with the substrate 21 and the connecting frame 23, a cavity for the organic component 1. The connecting frame 23 is mechanically connected to the cover body 22 and the substrate 21, wherein the mechanical

Connection can be made to the substrate 21 via the contact points 31.

According to the schematic sectional view of Figure 2, a further embodiment of a device described here is explained in detail. The embodiment shown differs from the previous embodiment of Figure 1 in that the protective layer 4 by the

Hard coating 41 and spacer balls 42, which on the

Hard coating 41 are applied, is formed. The

Spacer balls 42 here have in the context of

Manufacturing tolerances on an equal size. In the region of the spacer balls 42, the top surface 4a of the

Protective layer 4 a smallest distance d to the cover body 22. Unlike shown in Figure 2, it is additionally possible that the spacer balls 42 in a further

Coating are introduced, which together with the

Spacer balls 42 may be applied to the hard coating 41.

According to the schematic sectional illustration of FIG. 3, a further exemplary embodiment of an organic component described here is explained in greater detail. In contrast to the embodiments of Figures 1 and 2 is in the

Embodiment of Figure 3, the plurality of

Spacer balls 42 in the hard coating 41 of Protective layer 4 introduced. The diameter of the respective spacer balls 42 is greater in the embodiment shown than the height of the hard coating 41 in the stacking direction H. In other words, the spacer balls 42 project beyond the hard coating 41 partially in the stacking direction. The

Spacer balls 42 are preferably not in direct contact with the organic component 1, in particular with the cathode 33 of the organic component 1. Unlike shown in Figure 3, it is also possible that the spacer balls 42 are completely embedded in the hard coating 41. In other words, the hard coating 41 may project beyond the spacer balls 42 in the stacking direction. The present application claims the priority of the German application DE 10 2014 112 696.3, whose

The disclosure is hereby incorporated by reference.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes any combination of features in the patent claims, even if this feature or combination itself is not explicitly described in the claims

Claims or embodiments is given.

Claims

claims

1. comprising organic component,

a substrate (21) having a main surface (21a),

- An in a stacking direction (H) on the main surface (21 a) applied organic component (1) with a

light-emitting organic functional layer stack (10) and from the substrate (21) uncovered outer surfaces (la, lb),

a protective layer (4) applied on the outer surfaces (1a, 1b) of the organic component (1) with a cover surface (4a) facing away from the organic component (1),

- One on the substrate (21) facing away from the

organic body (1) mounted cover body (22) and - between the substrate (21) and the cover body (22) arranged connecting frame (23), wherein

- The cover body (22) together with the connecting frame (23) and the substrate (21) forms a cavity (2), in which the organic component (1) and the protective layer (4)

are arranged

- The protective layer (4) is adapted to mechanically support a part of the cover body (22) and to protect the organic component (1) from destruction.

2. Organic component according to the preceding claim, wherein the top surface (4a) and the cover body (22) in

Stacking direction (H) at least in places a minimum distance (d) of at most 1/10 of the height of the protective layer (4) in the stacking direction (H).

3. Organic component according to one of the previous

Claims, in which the protective layer (4) at least in places

mechanically connected to the substrate (21).

4. Organic component according to one of the previous

Claims,

in which the smallest distance (d) of the top surface (4a) and the cover body (22) is at most 2 ym.

5. Organic component according to one of the previous

Claims,

in which the protective layer (4) comprises a hard coating (41) whose material has a Shore D hardness of at least 60, preferably at least 65.

6. Organic component according to one of the previous

Claims,

wherein the smallest distance (d) of the top surface (4a) and the cover body (22) is at most 1/10 of the height of the hard coating (41) in the stacking direction (H).

7. Organic component according to one of the previous

Claims,

wherein the protective layer (4) further comprises a plurality of

Spacer balls (42), wherein

- The spacer balls (42) each in the context of

Manufacturing tolerances have the shape of a sphere and - the diameter of each spacer ball (42) by at most ± 5%, preferably at most ± 2.5%, deviates from an average diameter of the spacer balls (42).

8. Organic component according to one of the previous

Claims, wherein the plurality of spacer balls (42) is disposed between the hard coating (41) and the cover body (22).

9. Organic component according to one of the previous

Claims,

wherein the plurality of spacer balls (42) in the

Hard coating (41) is arranged.

10. Organic component according to one of the previous

Claims,

wherein the mean diameter of the plurality of

Spacing balls (42) is at least 1 mm.

11. Organic component according to one of the previous

Claims,

in which the organic component (1) is a continuous

Light exit surface (la, lc), each having an extent of at least 1 cm in lateral directions.

12. Organic component according to one of the previous

Claims,

wherein the hard coating (41) is applied by a non-contact method.

13. Organic component according to one of the previous

Claims,

wherein the hard coating (41) with a

Liquid coating method, preferably one

Schiitzbeschichtungsverfahren, or one

Spray coating method is applied.