WO2016163872A1

WO2016163872A1 - Method for manufacturing an rfid tag

Info

Publication number: WO2016163872A1
Application number: PCT/MY2016/000019
Authority: WO
Inventors: Bak Cheow CHOO; Fong Teng WONG; Hon Wai SIM; Choon Lian LIEW
Original assignee: MDT Innovations SdN Bhd
Priority date: 2015-04-09
Filing date: 2016-04-08
Publication date: 2016-10-13
Also published as: CN107615098A

Abstract

A method for manufacturing an RFID tag for use with apparels, garments, laundry-related products, soft synthetic resin material products, leather products or the like is disclosed. The method includes manufacturing the RFID tag comprising an encapsulated core which can withstand high pressure. The disclosed method further comprises inserting a booster antenna across the encapsulated core to minimize poor readability. Further, the disclosed method minimizes the use of copper material in the manufacturing of the RFID tag. Further, the disclosed method produces the RFID tag which can be stitched to apparels, garments, and other products to provide seamless tagging and sustain one or more environmental conditions such as a dry clean condition, a compression dry condition, a high temperature condition, and the like.

Description

METHOD FOR MANUFACTURING AN RFID TAG

Field of Invention The present invention relates generally to radio-frequency identification (RFID) devices and, more particularly, to use of an RFID tag in fabric/laundry related products such as clothes, apparels, and/or garments.

Background of the Invention

An RFID inlay comprising an IC chip and/or an RFID antenna, operable to read/write data, may has been utilized for managing data in various fields by inserting or attaching the RFID inlay to a product of various types and thereafter, reading/writing data related to the product from/onto the tag. The RFID inlay poses a problem that a laundry RFID tag gradually becomes exposed so that a portion around the laundry RFID tag or an attachment pocket is susceptible to accumulation of damage during use, as well as during collection and through steps of cleaning and pressing of apparels/garments.

Further, the RFID antenna is composed of a thin metallic foil made of copper, aluminum, or the like, or is formed there by etching or the like. There is a problem that the RFID antenna is susceptible to disconnection. Therefore, there may be a problem that the RFID inlay may not be sewn directly on apparel/garments or the like. Further, the RFTD inlay may not be suitable to use without proper packaging and encapsulation. The RFID inlays may not be able to provide discreet tagging to apparels/garments, where fashion and aesthetic is more important.

Summary of the Invention

The present invention has been made in the view of the above problems, and in one aspect of the present invention there is provided a method for manufacturing an RFID tag for use with apparels, garments, laundry-related products, soft synthetic resin material products, leather products or the like.

In accordance with another aspect, there is provided a method for manufacturing an RFID tag which is suitable to be fitted into apparels, garments, laundry-related products, soft synthetic resin material products, leather products or the like.

In accordance with another aspect, there is provided a method for manufacturing an RFID tag comprising an encapsulated core which can withstand high pressure. In accordance with another aspect, the method further comprises inserting a booster antenna across the encapsulated core to minimize poor readability.

In accordance with another aspect, there is provided a method for manufacturing an RFID tag comprising a thread which is insulated with one or more conductive particles to boost ultra high frequency signal. Further, in accordance with another aspect, there is provided a method which minimizes the use of copper material in the manufacturing of the RFID tag.

In accordance with another aspect, there is provided a method for manufacturing an RFID tag which can be stitched to apparels, garments, and other products to provide seamless tagging and sustain one or more environmental conditions such as a dry clean condition, a compression dry condition, a high temperature condition, and the like.

Those skilled in the art will appreciate the advantages and superior features of the invention together with other important aspects thereof on reading the detailed description that follows in conjunction with the drawings.

Brief Description of drawings

Other objects, features, and advantages of the invention will be apparent from the following description when read with reference to the accompanying drawings. In the drawings, wherein like reference numerals denote corresponding parts throughout the several views: FIG. 1 illustrates a system block diagram 100 describing a method for manufacturing an RFID tag.

FIG. 2 illustrates a flowchart 200 describing conventional method for manufacturing an RFID tag.

FIG. 3 illustrates an arrangement 300 describing a thermo compress process at a first thermo compress station for manufacturing an RFID tag. FIG. 4 illustrates an arrangement 400 describing a thermo compress process at a second thermo compress station for manufacturing an RFID tag.

Detailed Description of the Preferred Embodiments Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

The present disclosure describes a method for manufacturing radio frequency identification (RFID) tag. Specifically, the present disclosure describes a method for manufacturing an RFID tag for use with apparels, garments, laundry-related products, soft synthetic resin material products, leather products or the like. In accordance with an embodiment, there is provided a method for manufacturing the RFID tag which is suitable to be fitted into the apparels, garments, laundry- related products, soft synthetic resin material products, leather products or the like. The RFID tag includes a thread, a base antenna, an encapsulated core, and a RFID chip.

In accordance with another embodiment, there is provided a method for manufacturing an RFID tag comprising the encapsulated core which can withstand high pressure. Thereafter, the method further comprises inserting a booster antenna across the encapsulated core to minimize poor readability. Further, in accordance with another embodiment, there is provided a method for manufacturing an RFID tag comprising the thread which is insulated with one or more conductive particles to boost ultra high frequency signal. Further, in accordance with another aspect, there is provided a method which minimizes the use of copper material in the manufacturing of the RFID tag.

In accordance with another embodiment, the present invention facilitates stitching of the RFID tag in the apparels, garments, and other products to provide seamless tagging and further sustaining of one or more environmental conditions such as a dry clean condition, a compression dry condition, a high temperature condition, and the like.

The objective and advantages of the disclosed invention may be realized by means of one or more elements and combinations particularly pointed out in the ciaims.

A person having ordinary skills in the art would understand that the foregoing general description and the following detailed description are exemplary and explanatory, and are not restrictive of the disclosed invention, as claimed.

Various embodiments of the disclosed invention for manufacturing the RFID tag for use with the apparels, garments, laundry related products, or the like will be described with reference to the attached drawings. FIG. 1 illustrates a system block diagram 100 describing a method for manufacturing an RFTD tag. The system block diagram 100 comprises one or more block diagrams in a sequence depicting the method for manufacturing the RFID tag. The system block diagram 100 comprises a flip chip bonder 102, a first dispensing unit 104, a first buffer station 106, and a first thermo compress stationl08. Further, the system block diagram 100 includes a second buffer station 1 10, a second dispensing unit 1 12, and a second thermo compress station 1 14. Furthermore, the system block diagram 100 comprises a customize station 1 16 to produce an RFID tag 1 18. The system block diagram further comprises a lamination unit 120 to laminate the produced RFID tag 1 18 and an outgoing station unit 122 for delivering a finished RFTD tag.

Firstly, one or more input materials are fed to the flip chip bonder 102. The one or more input materials may comprise at least one or more of, but not limited to, an antenna, a wafer (e.g. 8" bumped and sawn wafer), a chip, and a PET substrate. In an embodiment, the one or more input materials such as the antenna may comprise a copper track on top of the antenna. In an embodiment, the antenna is feed to the flip chip bonder 102. The antenna may be fed to the flip chip bonder 102 in reel form. In another embodiment, the antenna may be fed to the flip chip bonder 102 along with the wafer in reel form. Thereafter, the antenna is treated with at least one or more adhesives in the first dispensing unit 104. The one or more adhesives may comprise at least one or more of, but not limited to, AC268, MK055, and EN525. The at least one or more adhesives are dispensed at the required dice position before the dice is search (for good unit), is pick, flip and place on the required dice position and on top of the dispensed adhesive position. The first dispensing unit 104 will move to a next position to repeat the whole process again. Further, in an embodiment, the first dispenser unit 104 may index out a bonded material that may be fed to the first thermo compress station 108. In an embodiment, the first buffer station 106 may be placed between the first dispensing unit 104 and the first thermo compress station 108, when the first thermo compress station 108 refuses to accept the feeding materials such as the bonded material. A person having ordinary skills in the art would understand that a thermo compress process requires more time than placing a dice. In such a scenario, the bonded material may be temporarily stored in buffer station such as the first buffer station 106. Further, a person having ordinary skills in the art would understand that the number of units such as one or more design units to be cured in parallel will depend on the overall process flow and its design.

Further, in an embodiment, the one or more design units obtained from the first thermo compress station 108 may be temporarily stored in the second buffer station 1 10. Thereafter, the one or more design units are fed to the second dispensing unit 112 for treating with at least one or more adhesives. The one or more adhesives may comprise at least one or more of, but not limited to, AC268, MK055, and EN525. For example, the adhesive such as MK055, through a 10 cc syringe, may be applied by moving along the top of the copper track. A person having ordinary skills in the art would understand that this process will be repeated for every unit without limiting the scope of the disclosed invention.

After treating the one or more design units with at least one or more adhesives, the one or more design units are fed to the second thermo compress station 1 14. In an embodiment, at least two steps are performed at the second thermo compress station 1 14. Firstly, a silicon string is placed and secondly, the silicon string is bonded to the copper track. In an embodiment, the silicon string may be fed in parallel with the antenna. In an embodiment, the silicon string is feed into a special design jig by using pneumatic movement combined with one or more guided pins. In an embodiment, the special design jig (tool/equipment) is made to hold the silicon string in parallel with the antenna due to difference in length of the silicon string and the antenna spacing. The silicon string may be placed on top of a work station of the second thermo compress station 1 14 for lowering it down onto the antenna, when a ready signal is received by the special design jig. In an embodiment, a signal is send for the special design jig to be lower down on top of the antenna, when the antenna is moved into the position. Thereafter, the second thermo compress station 114 will perform its operation. The second thermo compress station 1 14 compresses the silicon string and the copper track with a predetermined force. The predetermined force is applied for a predetermined distance and for a predetermined time so as to avoid any damage to the silicon cover string. A person having ordinary skills in the art would understand that the process at the second thermo compress station 1 14 may be repeated without limiting the scope of the disclose invention.

The one or more design units, obtained from the second thermo compress station 1 14, in reel form are fed to the customize station 116. The customize station 1 16 may comprise one or more stations such as, but not limited to, a string cutting station, a Go and NoGo test station, and a marking station. As the one or more design units are in reel form, the silicon string is disconnected from the neighboring units so as to eliminate the interference during the Go and NoGo test which will take place at the Go and Nogo test station. The marking station identifies one or more non-functioning units before the next process of lamination, molding, or encapsulation takes place. Further, the RFID tag 1 18, obtained from the customize station 116, is laminated. In an embodiment, the lamination station 120 may be operable to laminate the RFID tag 1 18. Finally, the laminated RFID tag is fed to an outgoing station unit 122. The outgoing station unit 122 may perform one or more final quality checks and operations before dispatching the finished RFID tag.

FIG. 2 illustrates a flowchart 200 describing a conventional method for manufacturing an RFID tag. The various steps of the flowchart 200 may be utilized in a sequential order to manufacture the RFID tag. A person having ordinary skill in the art would understand that the one or more steps in the flowchart 200 may be repeated before processing the other steps in the manufacturing of the RFID tag.

At step 202, the one or more input materials are fed to the flip chip bonder 102 to obtain the bonded material. In an embodiment, the flip chip bonder 102 may receive the one or more input materials. The one or more input materials may comprise at least one or more of, but not limited to, an antenna, a wafer (e.g. 8" bumped and sawn wafer), a chip, and a PET substrate. In an embodiment, the one or more input materials may comprise the copper lamination. For example, the copper track may be applied on top of the antenna before feeding it to the flip chip bonder 102. In an embodiment, the antenna may be fed to the flip chip bonder 102 in reel form. In another embodiment, the antenna may be fed to the flip chip bonder 102 along with the wafer in reel form. A person having ordinary skills in the art would understand that the one or more input materials may be checked before they can be utilized for manufacturing the RFID tag. Further, in an embodiment, the antenna may be fed to the first dispensing unit 104. The antenna is treated with at least one or more of the one or more adhesives (e.g. AC268, MK055, and EN525). The conditioning time is approximately 30 minute at room temperature. However, a person having ordinary skills in the art would understand that appropriate time duration may be utilized for applying the one or more adhesives on to the antenna. Further, the environmental conditions such as compressed air and temperature may be checked as per requirement before treating the antenna with the one or more adhesives. Further, the whole process at the first dispensing unit 104 may be repeated for various position of the antenna for applying the one or more adhesives. Finally, the first dispenser unit 104 may index out the bonded material.

At step 204, the bonded material is fed to the first thermo compress station 108 to obtain the one or more design units. In an embodiment, the first thermo compress station 108 may receive the bonded materials (e.g. the antenna with the adhesive coating) as an input. A person having ordinary skills in the art would understand that a thermo compress process may require more time before processing the input material such as the bonded material. In such a scenario, the bonded material may be temporarily stored in the first buffer station 106. The process at the first thermo compress station 108 will be explained later in conjunction with FIG. 3. At step 206, the at least one of one or more adhesives is applied to the one or more design units. The one or more design units, obtained from the first thermo compress station 108, are fed to the second dispensing unit 1 12. The one or more design units are treated with the at least one or more adhesives (e.g. MK055) at the second dispensing unit 1 12. A 10 cc syringe may be utilized for applying the adhesives on to the one or more design units by moving along the top of the copper track/layer.

At step 208, the one or more design units are fed to the second thermo compress station 1 14. In an embodiment, the second thermo compress station 1 14 may receive the one or more design units as input, when the one or more design units may have been treated with the one or more adhesives at the second dispensing unit 1 12. In an embodiment, the one or more design units (e.g. the antenna with at least the copper track and/or the one or more adhesives) may undergo through one or more processes at the second thermo compress station 1 14. Firstly, the silicon string may be fed in parallel with the antenna. In an embodiment, the silicon string may be fed to the special design jig by using pneumatic movement combined with one or more guided pins. In an embodiment, the special design jig (tool/equipment) may be responsible for holding the silicon string in parallel with the antenna so as to overcome any limitation due to difference in length of the silicon string and the antenna spacing. The silicon string may be placed on top of the work station of the second thermo compress station 1 14 for lowering it down onto the antenna, when a ready signal is received by the special design jig. In an embodiment, the signal may be transmitted for the special design jig so as to lower down on top of the antenna, when the antenna has been moved into the position. Thereafter, the second thermo compress station 1 14 will perform one or more operations for producing the RFID tag. The second thermo compress station 1 14 compresses the silicon string and the copper track with a predetermined force. The predetermined force is applied for a predetermined distance and for a predetermined time so as to avoid any damage to the silicon cover string. A person having ordinary skills in the art would understand that the one or more processes at the second thermo compress station 1 14 may be repeated in any order without limiting the scope of the disclose invention. The process at the second thermo compress station 1 14 will be explained later in conjunction with FIG. 4.

At step 210, the one or more design units are cut into one or more singular design units. In an embodiment, the one or more design units, obtained from the second thermo compress station 1 14, are cut into one or more singular design units. In an embodiment, the string cutting station may be utilized to obtain the one or more singular design units and thereafter the one or more singular design units are fed to the Go and NoGo test station. At step 212, the one or more non-functioning units are identified among the one or more singular design units. In an embodiment, the marking station identifies the one or more non-functioning units before the next process of lamination, molding, or encapsulation takes place.

At step 214, the one or more singular design units are laminated, molded, and encapsulated to obtain the RFID tag. In an embodiment, the laminated RFTD tag is fed to an outgoing station unit 122. The outgoing station unit 122 may perform one or more final quality checks and operations before dispatching the finished RFID tag.

A person having ordinary skills in the art would appreciate that the one or more processes as described above in reference to one or more steps as described in conjunction with FIG. 2 may be repeated or implemented in any order so as to manufacture the RFID tag.

FIG. 3 illustrates an arrangement 300 describing a thermo compress process at the first thermo compress station for manufacturing an RFID tag. The arrangement 300 as shown in FIG. 3 may be utilized to perform one or more processes/operations at the first thermo compress station 108. The arrangement 300 comprises a heated tool top 302, a heated tool bottom 304, and a base 306. In an embodiment, one or more substrates such as a polyethylene terephthalate (PET) film or a polyethylene naphthalate (PEN) film, that has high strength, high heat resistance, and high hydrolysis resistance may be utilized for the base 306. In an embodiment, the antenna may be formed of a conductor foil and can be mounted on a surface portion of the base 306. The bonded material (e.g. antenna, chip, copper track, adhesives, etc.) are placed on to the base 306. The bonded material is heated from the top side using the heated tool top 302 and from the bottom side using the heated tool bottom 304 as shown in the arrangement 300. In an embodiment, the heating is performed at appropriate temperature and pressure. FIG. 4 illustrates an arrangement 400 describing a thermo compress process at a second thermo compress station for manufacturing an RFID tag. The arrangement 400 as shown in FIG. 4 may be utilized to perform one or more processes/operations at the second thermo compress station 1 14. The arrangement 400 comprises a heated tool top 402, a heated tool bottom 404, and a base. In an embodiment, one or more substrates such as a polyethylene terephthalate (PET) film or a polyethylene naphthalate (PEN) film, that has high strength, high heat resistance, and high hydrolysis resistance may be utilized for the base. The one or more design units comprising at least one or more of an antenna, a chip, a copper track, an adhesive, or a silicon string may be placed on the base (not shown). Thereafter, the arrangement may be heated from the top side and ihe bottom side. The heating arrangement has been shown in FIG. 4. In an embodiment, the heating may be performed at appropriate temperature and pressure so as to compresses the silicon string and the copper track.

A person having ordinary skills in the art would understand that the functionality of the first thermo compress station 108 and the second thermo compress station 1 14 may be realized using a single thermo compress station without limiting the scope of the disclosure.

Various embodiments of the disclosure lead to a method for manufacturing a RFID tag for use with apparels, garments, laundry-related products, and the like. Further, the disclosed method minimizes one or more input materials such as a chip, an antenna, and a PET substrate in the manufacturing of the RFID tag. The shrinkage of the input materials in the RFID tag is made by redesigning the RFID tag into smallest form factor ( 10mmx6mm) grain-like encapsulated core by minimizing the Q factor. The core is protected by cured materials such as ABS and epoxy so as to ensure strength and integrity of the core to avoid rupture. The shrunk antenna size into the grain-like encapsulated core will result in poor reading or unreadable tag. Hence, a booster antenna is inserted across the core. The booster antenna is made of thread material. The thread is not bonded to any integral part of the core, hence the design focuses on using an appropriate thread properties, appropriate thickness of base antenna, appropriate length of the thread, appropriate distance between thread and base antenna, and appropriate encapsulation material properties so to ensure high RF permeability. The disclosed method produces the RFID tag which can be stitched to apparels, garments, and other products to provide seamless tagging and sustain one or more environmental conditions such as a dry clean condition, a compression dry condition, a high temperature condition, and the like. As will be readily apparent to those skilled in the art, the present invention may easily be produced in other specific forms without departing from its essential characteristics. The present embodiments is, therefore, to be considered as merely illustrative and not restrictive, the scope of the invention being indicated by the claims rather than the foregoing description, and all changes which come within therefore intended to be embraced therein.

Claims

A method for manufacturing a radio frequency identification (RFID) tag for use with an apparel, said method comprising:

feeding one or more input materials to a flip chip bonder to obtain a bonded material, wherein said one or more input materials are fed with a wafer through a first dispensing unit to apply at least one of one or more adhesives;

feeding said bonded material to a first thermo compress station to obtain one or more design units; and

feeding said one or more design units, after applying at least one of said one or more adhesives, to a second thermo compress station where a silicon string is bonded with a copper track to obtain said RFID tag.

The method as claimed in claim 1, wherein said one or more input materials comprise at least an antenna, a chip, and a PET substrate.

The method as claimed in claim 2, wherein said one or more input materials fed to said flip chip bonder are at least in reel form.

The method as claimed in claim 3 further comprising at least a copper track on top of said one or more input materials.

The method as claimed in claim 1 , wherein said one or more adhesives comprise at least AC268, MK055, and EN525.

The method as claimed in claim 1 further comprising storing said bonded material into a buffer station when said first thermo compress station refuses to accept said bonded material.

The method as claimed in claim 1, wherein said one or more design units are fed through a second dispensing unit for applying at least one of said one or more adhesives.

8. The method as claimed in claim 7, wherein said at least one of said one or more adhesives is applied by moving along top of said copper track.

9. The method as claimed in claim 1 further comprising feeding said silicon string into a special design jig by using pneumatic movement combined with one or more guided pins.

10. The method as claimed in claim 9, wherein said special design jig receives a signal to lower down said silicon string on top of said one or more integral materials, when said one or more integral materials is moved into position.

11. The method as claimed in claim 1 further comprising compressing said silicon string and said copper track with a predetermined force for a predetermined distance and a predetermined time.

12. The method as claimed in claim 1 further comprising cutting said one or more design units into one or more singular design units for GO and/or NOGO test.

13. The method as claimed in claim 1 further comprising identifying, by a marking station, one or more non-functioning units among said one or more singular design units.

14. The method as claimed in claim 13 further comprising laminating, molding, and/or encapsulating said one or more singular design units accept said one or more nonfunctioning units to obtain said RFID tag.