WO2017021184A1

WO2017021184A1 - Pcb with pin-in-paste (pip) assembly

Info

Publication number: WO2017021184A1
Application number: PCT/EP2016/067630
Authority: WO
Inventors: Richard Owen
Original assignee: Continental Automotive Gmbh
Priority date: 2015-08-04
Filing date: 2016-07-25
Publication date: 2017-02-09
Also published as: DE102015214807A1

Abstract

The application relates to a device and a method for soldering at least one component (21) on one side (O) of a printed circuit board and at least one component (71) on a side (U) of a printed circuit board (31) opposite from this side (O), in which: (S2) soldering paste (51) is introduced in each case into one or more through-holes (41, 42; 41-49) of a printed circuit board (31), (S3) terminals (11, 12) of at least one component (21) on one side (O) of the printed circuit board (31) are each inserted into a through-hole (41, 42; 41-49) of the printed circuit board (31), (S5) the printed circuit board (31) is heated for a first time, (S6) a component (71) is placed (P2) onto the further side (U) of the printed circuit board (31) opposite from the at least one component (21), (S7) the printed circuit board (31) is heated for a second time.

Description

description

PCB With Pin-in-Paste (PIP) Mounting The invention relates to methods and apparatus for soldering using a so-called pin-in-paste (PIP) technology, sometimes referred to as through-hole technology (THT). A pin-in-paste (PIP) technology itself is already known, for example:

- DE102010052730A1 and

- http://en.wikipedia.org/wiki/Through Hole Technology An object of the invention is to optimize an application of pin-in-paste (PIP) technology. The object is achieved in each case by the subject matter of the independent patent claims. Some particularly advantageous embodiments of the invention are specified in the subclaims and the description. Embodiments of the invention can provide efficient and space saving e.g. enable two-sided assembly of a printed circuit board with a PIP.

Further features and advantages of some advantageous embodiments of the invention will become apparent from the following description of embodiments of the invention with reference to the drawing. In this case, to illustrate some possible embodiments of the invention, each simplifying schematically:

Fig. 1 as a sequence in several successive phases in section through a printed circuit board with a solder paste in through-holes a soldering of terminals of components and components on opposite sides of each one board, and

Fig. 2 as a sequence in some of several successive phases shown in section through a printed circuit board with a solder paste in through holes a soldering of terminals of a device and a component (in the form of a board module) on opposite sides of a board. As shown in FIG. 1 as a flow chart in several successive phases, each in cross-section to some embodiments of the invention, in a soldering with a pin-in-paste (PIP) technology (sometimes called through-hole technology or THT ), eg one or more terminals 11, 12 of one or more components 21 soldered to a printed circuit board 31 (also referred to as PCB or printed ciruit board) and contacts 72, 73, 74 of a component 71 on a printed circuit board 31st are fastened (in particular soldered) with, for example, the following steps (wherein a cross section through the printed circuit board 31, etc. is shown for each step in FIG.

(The terms components and components are used herein for any such as components and / or components, such as each electronic components and / or antennas and / or spacers and / or connecting elements and / or (ends = connections of a) cables, modules, etc .. The two different terms components and components are only to distinguish those on each side of a printed circuit board (also referred to as a board or PCB). In step S1, in a printed circuit board 31 (here on the one lower) Side U several pads 61, 62, 63 has) or etc. a plurality of (through) holes 41, 42, for example by e.g. Drilling or laser generated. In step S2, solder paste 51 is inserted into the one or more holes 41, 42 (here, for example, with or without coating or (interconnect) contacting on the cylindrical hole inner surface) of the circuit board 31, e.g. by painting or injecting (see, for example, http://de.wikipedia.org/wiki/Trans_Hole_Technology, the contents of which are incorporated herein by reference) (incorporated by reference), etc.

In step S3, a component 21 with one or more terminals 11, 12 is moved in the direction of the arrow PI in the direction of the printed circuit board 31, wherein one or more terminals 11, 12 of the component 21 in each case a hole 41, 42 (= in each case a through-hole) in the circuit board 31 are inserted.

In step S4, the component 21 is applied to the printed circuit board 31, wherein one or more terminals 11, 12 of the

Component 21 in each case a hole 41, 42 (here passage hole) in the circuit board 31 were plugged (here about until the upper third), and bottom of the holes 41, 42 respectively solder paste 51 was squeezed out (eg, can drain or be wiped etc. or can fall off).

In step S5, the printed circuit board (on which the component 21 rests) is heated in a furnace (a first time), wherein the solder paste 51 in the holes 41, 42 the here several terminals 11, 12 of the at least one component 21 with the circuit board 31 (ie, for example, here with the upper portion of the inside of the holes 41, 42 of the circuit board 31) soldered.

At this time, the solder paste 51 shrinks by e.g. the heat, and generates in each case a solder paste-free (or empty) area Bl, B2 without solder paste in the at least one hole 41, 42 on the side (0) with the at least one component 21 opposite another side U of the circuit board 31st

Here, in step S6, the printed circuit board 31 can be rotated so that the previously upper side 0 with the component 21 now lies below. Insofar as soldering paste or solder does not yet rest on the pads 61, 62, 63 on the printed circuit board, solder paste or solder) could be deposited on its printed circuit board remote surface by e.g. a solder bath, etc. are applied.

In step S6 are on pads 61, 62, 63 (with eg solderable eg flat connections with eg solder, eg as in SMD technology) on the side U of the circuit board 31 respectively contacts 72, 73, 74 of a component 71 in the direction of the arrow P2 put on.

Since solder paste 51 has shrunk in the furnace by, for example, the heat in step S5, the surface of FIG. 31 is planar again and may be used to apply the component 71. In step S7, the printed circuit board (on which the component 21 rests) is heated in a furnace (a second time), wherein the solder paste 51 or solder the here several contacts 72, 73, 74 of the at least component 71 each with one of the pads 61st , 62, 63 of the printed circuit board 31 soldered.

The illustration for step S7 shows after assembly the component 71 on one flat side U of the printed circuit board 31 and the component 21 on the other flat side 0 of the printed circuit board 31.

An advantage of such method or devices may be that a component 71 on the one flat side U of the printed circuit board 31 in length L and / or width B

-and / or in one direction or two mutually orthogonal directions each parallel to the printed circuit board 31 in the mounted on the circuit board Statelänger (L; B) than the distance dl two holes (for one or more components 21 on the opposite side 0) in the circuit board 31, so with more than two holes also longer than the distance d2 two holes 41, 44 or 41, 49 between which at least one further hole.

A component 71 on a side of a printed circuit board 31 opposite to a component 21 with PiP terminals 11, 12 may e.g. be a module and / or comprise a further printed circuit board on which e.g. several components 77, 78 etc. may be arranged.

In contrast, there are at least internally known embodiments in which either no components 71 on the one component 21 with PiP terminals 11, 12 opposite side of a circuit board 31 are arranged, or components 71 on a component 21 with PiP terminals 11, 12 opposite Side of a printed circuit board 31 are formed adapted to this 21. 2 illustrates an embodiment of methods and apparatus relating to soldering of components and components on opposite sides of a printed circuit board 31 (eg, the same printed circuit board 31 as a detail in FIG. 1 or a further) in comparison to at least internally known methods in plan view of a printed circuit board 31:

2, a printed circuit board 31 with a plurality of (through) holes 41-49, etc. (for reasons of clarity, not all provided with reference numerals) is shown in an at least internally known method, wherein components 77, 78 are not in the area of the holes 41 In Fig. 2 center is shown to an embodiment of the invention, as in a step SO two components 77, 78 on a second circuit board (or Board) 71 (here also referred to as a module board because it carries components 77, 78 as a module) are or are applied (eg by soldering by means of PiP or SMD etc); the component 71 in Fig. 1 corresponds in Fig. 2, e.g. a printed circuit board 71 with e.g. several arbitrary components 77, 78 etc.

In Fig. 2, bottom left, (as in step S6 in Fig. 1), component 71 (here in the form of another circuit board (and / or module board)) is placed on circuit board 31 in the direction of arrow PI, e.g. on the (not visible in Fig. 2 because located under the circuit board 31, and eg already analog S-S5 in Fig. 1 with a first heating in the oven, etc. mounted) component 21 with terminals 11, 12 opposite side U of the circuit board 31st

At step S7 in Fig. 2, the circuit board 31 (including the circuit board 71 mounted thereon) is heated in a furnace (a second time) with solder paste soldering the plural contacts of the module circuit board 71 to one of the pads on the circuit board 31, respectively ,

In FIG. 2, bottom right, a non-required area 88 of the printed circuit board 31 is indicated by dashed lines, which no longer needs to be required because the components 77, 78 are here on the module board 71 and / or in the area above the holes 41-49 may be located.

Claims

Method for soldering at least one component (21) on one side (0) of a printed circuit board and at least one component (71) on a side (U) of a printed circuit board (31) opposite this side (0) by

- (S2) solder paste (51) is introduced into one or more through holes (41, 42, 41-49) of a printed circuit board (31),

- (S3) terminals (11, 12) of at least one component (21) on one side (0) of the printed circuit board (31) are inserted into a respective through-hole (41, 42; 41-49) of the printed circuit board 31, - ( S5) the printed circuit board (31) is heated for a first time,

- (S6) a component (71) on the said at least one component (21) opposite another side (U) of the printed circuit board (31) is placed (P2),

- (S7) the printed circuit board (31) is heated a second time.

Method according to claim 1,

characterized in that

if (S4) the component (21) is applied to the printed circuit board (PI) (PI), one or more terminals (11, 12) of the component (21) being in each case a hole (41, 42; 41-49) are stuck in the circuit board (31), from the holes (41, 42, 41-49) each solder paste (51) is squeezed out.

Method according to one of the preceding claims,

characterized,

when (S5) the circuit board (31) is heated for a first time, at least one area (Bl, B2) without solder paste in the at least one hole (41, 42) on the side (0) with the at least one component (21) opposite further side (U) of the circuit board (31) is generated.

Method according to one of the preceding claims,

characterized in that

(S6) a component (71) on the said at least one component (21) opposite another side (U) of the circuit board (31) set (P2) by pads (61, 62, 63) on the circuit board (31) respectively contacts (72, 73, 74) of a component (71) are placed (P2).

Method according to one of the preceding claims,

characterized in that

if (S7) the circuit board (31) is heated a second time, solder paste or solder the at least one contact (72, 73, 74) of the at least one component (71) each with one of the pads (61, 62, 63) of the circuit board (31) soldered.

Method according to one of the preceding claims,

characterized in that

the one component (71) on the one side (U) of the printed circuit board (31) in length (L) and / or width (B)

and / or in one direction or two orthogonal directions parallel to the printed circuit board (31) in the state mounted on the printed circuit board (31) is longer than the distance (dl) of two holes (41, 42; 41-49) in the printed circuit board (31 ), in particular with more than two holes also longer than the distance (d2) of two holes (41, 44; 41, 49) between which at least one further hole (42, 43) is located.

Method according to one of the preceding claims,

characterized,

in that a component (71) is arranged on a side of a printed circuit board (31) opposite a component (21) with terminals (11, 12) in a position in which one or more holes (in particular in plan view of the printed circuit board (31) 41, 42, 41-49). (Fig. 2 bottom right)

Method according to one of the preceding claims,

characterized,

a component (71) on a component (21) having terminals (11, 12) opposite a printed circuit board (31) is a module and / or has a further printed circuit board (71) on which preferably a plurality of components (77, 78 ) arranged are .

Method according to one of the preceding claims,

characterized,

that one or more components (71; 71, 77, 78) are electronic components and / or antennas and / or spacers and / or connecting elements and / or cables and / or modules, etc., and / or.

one or more components (21) are electronic components and / or antennas and / or spacers and / or connecting elements and / or cables and / or modules, etc.

Apparatus made by a method according to any one of the preceding claims.

Device, in particular according to claim 10,

with at least one component (21) soldered on one side (0) of a printed circuit board and at least one component (71) soldered on at least one side (U) of a printed circuit board (31) on one side (0), wherein

solder paste (51) is present in one or more through-holes (41, 42, 41-49) of a printed circuit board (31), but except in a region (Bl, B2) on one side of the through holes (41, 42, 41-49),

Terminals (11, 12) of at least one component (21) on one side (0) of the printed circuit board (31) are inserted into a respective through-hole (41, 42; 41-49) of the printed circuit board 31,

- (S6) a component (71) on the said at least one component (21) opposite another side (U) of the printed circuit board (31) is placed (P2).

Device according to claim 10 or 11,

characterized in that

a component (71) on a side facing a component (21) with terminals (11, 12) of a printed circuit board (31) is a module,

and / or a further printed circuit board (71), on the preferably a plurality of components (77, 78) are arranged.

13. Device according to one of claims 10 - 12,

characterized in that

one or more components (71, 71, 77, 78) are electronic components and / or antennas and / or spacers and / or connecting elements and / or cables and / or modules, etc., and / or

that one or more components (21) are electronic components and / or antennas and / or spacers and / or connecting elements and / or cables and / or modules, etc.

14. Device according to one of claims 10 - 13,

characterized in that

a component (71) on the at least one component (21) opposite another side (U) of the printed circuit board (31) mounted (P2) by pads (61, 62, 63) on the circuit board (31) each contacts ( 72, 73, 74) of a component (71) are soldered.

15. Device according to one of claims 10 - 13,

characterized in that

and / or in one direction or two mutually orthogonal

Directions in each case parallel to the printed circuit board (31) in the state mounted on the printed circuit board (31) is longer than the distance (dl) of two holes (41, 42; 41-49) in the printed circuit board (31), and / or more than two Holes also longer than the distance (d2) of two holes (41, 44, 41, 49) between which at least one further hole (42, 43) is located.

16. Device according to one of claims 10 - 13,

characterized in that

a component (71) on a component (21) with connections

(11, 12) opposite side of a printed circuit board (31) is arranged in a position in which it is in plan view of the board (31) one or more holes (41, 42, 41-49) covered (Fig. 2 bottom right).