A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias,...http://www.google.fr/patents/US7235431?utm_source=gb-gplus-shareBrevet US7235431 - Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
Methods for packaging a plurality of semiconductor dice using a flowable ...
