A method of manufacturing a semiconductor device includes a step of providing a semiconductor chip having electrodes to face a tape having a plurality of first holes, a support member surrounded by the first holes, and leads extending across the first holes to the support member; a step of bonding the...http://www.google.fr/patents/US6593648?utm_source=gb-gplus-shareBrevet US6593648 - Semiconductor device and method of making the same, circuit board and electronic equipment
Semiconductor device and method of making the same, circuit board and ...
