A bonding apparatus comprises a base (16) for supporting a printed circuit board (7), an atmosphere cover (1) which has a concavity (1c) covering a semiconductor device (5) mounted on the printed circuit board (7) and which is formed of laser light transmitting material, driving means (1j) for moving...http://www.google.fr/patents/US5302801?utm_source=gb-gplus-shareBrevet US5302801 - Laser bonding apparatus
