A method of manufacturing semiconductor components (200, 400, 700) includes assembling, packaging, and testing the semiconductor components (200, 400, 700) while the semiconductor components (200, 400, 700) are mounted on an adhesive layer (220). The method of can also keep the semiconductor components...http://www.google.fr/patents/US6372526?utm_source=gb-gplus-shareBrevet US6372526 - Method of manufacturing semiconductor components
