An interconnect routing for a card or interposer or the like, including splines of traces on a first layer and traces on a second layer, with vias connecting between the layers. Outer rows of signals are routed out from a chip on the first layer, while inner rows of signals are viad down to the second...http://www.google.fr/patents/US8125087?utm_source=gb-gplus-shareBrevet US8125087 - High-density flip-chip interconnect
