A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes in which pre-formed strips or leads inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps include attaching...http://www.google.fr/patents/US6437452?utm_source=gb-gplus-shareBrevet US6437452 - Bumpless flip chip assembly with strips-in-via and plating
Bumpless flip chip assembly with strips-in-via and plating
