A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces, and a conductive pattern which is disposed on the bottom surface. The chip package further comprises a frame which is...http://www.google.fr/patents/US20010035572?utm_source=gb-gplus-shareBrevet US20010035572 - Stackable flex circuit chip package and method of making same
Stackable flex circuit chip package and method of making same
Numéro de demande: 09/888,785 Numéro de publication: US 2001/0035572 A1 Date de dépôt: 25 juin 2001 Brevet délivré: US6426240 ( Date de délivrance 30 juil. 2002)
