Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the s submount may include drive hardware, a network interface,...http://www.google.fr/patents/US20100171145?utm_source=gb-gplus-shareBrevet US20100171145 - LED PACKAGE METHODS AND SYSTEMS
Numéro de demande: 12/631,266 Numéro de publication: US 2010/0171145 A1 Date de dépôt: 4 déc. 2009 Brevet délivré: US8080819 ( Date de délivrance 20 déc. 2011)
