A method of making a microelectronic assembly includes providing a first microelectronic element and a second microelectronic element with confronting, spaced-apart surfaces defining a space therebetween and providing one or more masses of a fusible conductive material having a melting temperature below...http://www.google.fr/patents/US6437240?utm_source=gb-gplus-shareBrevet US6437240 - Microelectronic connections with liquid conductive elements
Microelectronic connections with liquid conductive elements
