A method for processing a semiconductor substrate is presented wherein an alignment mark is formed in an alignment mark area of the semiconductor substrate. The alignment mark area is contained within a window area of the semiconductor substrate. The upper surface of the semiconductor substrate within...http://www.google.fr/patents/US6271602?utm_source=gb-gplus-shareBrevet US6271602 - Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate
Method for reducing the susceptibility to chemical-mechanical polishing ...
