A method for characterizing an interconnect structure profile includes providing a wafer having a grating structure including a plurality of interconnect structures; illuminating at least a portion of the grating structure; measuring light reflected from the grating structure to generate a reflection...http://www.google.fr/patents/US6537833?utm_source=gb-gplus-shareBrevet US6537833 - Method and apparatus for characterizing an interconnect structure profile using scatterometry measurements
Method and apparatus for characterizing an interconnect structure profile ...
