A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally...http://www.google.fr/patents/US7419839?utm_source=gb-gplus-shareBrevet US7419839 - Bonding an optical element to a light emitting device
Bonding an optical element to a light emitting device
