A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image...http://www.google.fr/patents/US7813541?utm_source=gb-gplus-shareBrevet US7813541 - Method and apparatus for detecting defects in wafers
Method and apparatus for detecting defects in wafers
