A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate...http://www.google.fr/patents/US20050056537?utm_source=gb-gplus-shareBrevet US20050056537 - Planarization of substrates using electrochemical mechanical polishing
Planarization of substrates using electrochemical mechanical polishing
